Circuit employing MOSFETs and corresponding method
11082018 · 2021-08-03
Assignee
Inventors
Cpc classification
H03F2203/45352
ELECTRICITY
H03F3/45179
ELECTRICITY
H03F2200/78
ELECTRICITY
H03F2203/45342
ELECTRICITY
International classification
H03F1/02
ELECTRICITY
Abstract
A MOSFET has a current conduction path between source and drain terminals. A gate terminal of the MOSFET receives an input signal to facilitate current conduction in the current conduction path as a result of a gate-to-source voltage reaching a threshold voltage. A body terminal of the MOSFET is coupled to body voltage control circuitry that is sensitive to the voltage at the gate terminal of the MOSFET. The body voltage control circuitry responds to a reduction in the voltage at the gate terminal of the MOSFET by increasing the body voltage of the MOSFET at the body terminal of the MOSFET. As a result, there is reduction in the threshold voltage. The circuit configuration is applicable to amplifier circuits, comparator circuits and current mirror circuits.
Claims
1. A circuit, comprising: a first MOSFET having a current conduction path between a first source terminal and a first drain terminal, a first gate terminal configured to receive a first input signal and a first body terminal; a second MOSFET having a current conduction path between a second source terminal and a second drain terminal, a second gate terminal configured to receive a second input signal and a second body terminal; wherein said first and second MOSFETs are coupled with each other in a differential MOSFET pair and the first and second input signals are a differential input signal; body voltage control circuitry, comprising: a first body voltage control MOSFET having a gate terminal coupled to the first gate terminal of said first MOSFET and configured to receive the first input signal of the differential input signal, and a first source-drain current path; a second body voltage control MOSFET having a gate terminal coupled to the second gate terminal of said second MOSFET and configured to receive the second input signal of the differential input signal and a second source-drain current path; wherein the first and second source-drain current paths are coupled in series with each other between the first body terminal of the first MOSFET and a reference node.
2. The circuit of claim 1, wherein the first and second source-drain current paths are coupled in series with each other between the second body terminal of the second MOSFET and the reference node.
3. The circuit of claim 2, wherein the first and second body terminals are directly electrically connected.
4. The circuit of claim 1, wherein the reference node is ground.
5. The circuit of claim 1, wherein body terminals of the first and second body voltage control MOSFETs are directly electrically connected to the first body terminal of the first MOSFET.
6. The circuit of claim 1, wherein body terminals of the first and second body voltage control MOSFETs are directly electrically connected to the second body terminal of the second MOSFET.
7. The circuit of claim 1, wherein a polarity type of the first and second body voltage control MOSFETs is same as a polarity type of said first MOSFET.
8. The circuit of claim 1, further comprising a current source configured to apply a bias current to the first body terminal of the first MOSFET.
9. The circuit of claim 1, wherein the body voltage control circuitry is configured to respond to change of the differential input signal by changing a body voltage at the first body terminal of the first MOSFET in order to adjust a threshold voltage of the first MOSFET.
10. The circuit of claim 9, wherein the adjustment of the threshold voltage is a reduction of the threshold voltage.
11. The circuit of claim 1, wherein the body voltage control circuitry is configured to respond to change of the differential input signal by changing a body voltage at the second body terminal of the second MOSFET in order to adjust a threshold voltage of the second MOSFET.
12. The circuit of claim 11, wherein the adjustment of the threshold voltage is a reduction of the threshold voltage.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) One or more embodiments will now be described, by way of example only, with reference to the annexed figures, wherein:
(2)
(3)
(4)
(5)
(6)
(7)
DETAILED DESCRIPTION
(8) In the ensuing description, one or more specific details are illustrated, aimed at providing an in-depth understanding of examples of embodiments of this description. The embodiments may be obtained without one or more of the specific details, or with other methods, components, materials, etc. In other cases, known structures, materials, or operations are not illustrated or described in detail so that certain aspects of embodiments will not be obscured.
(9) Reference to “an embodiment” or “one embodiment” in the framework of the present description is configured to indicate that a particular configuration, structure, or characteristic described in relation to the embodiment is comprised in at least one embodiment. Hence, phrases such as “in an embodiment” or “in one embodiment” that may be present in one or more points of the present description do not necessarily refer to one and the same embodiment. Moreover, particular conformations, structures, or characteristics may be combined in any adequate way in one or more embodiments.
(10) The references used herein are provided merely for convenience and hence do not define the extent of protection or the scope of the embodiments.
(11) By way of background to the presentation of examples of embodiments, one may refer to
(12)
(13) In
(14) The same symbols G, S, D, B introduced previously will be adopted throughout this description to denote, respectively, the gate, source, drain and body terminals of the various MOSFETS discussed with suffixes 1, 2, 3, . . . identifying the respective MOSFET.
(15) The simple one-transistor amplifier stage (working in a common source configuration loaded by a current generator D3 generating an identically-named current) exemplified
(16) If the input signal level is below VTH, the drain current is not sufficient and the MOSFET transistor MN1 is not able to “pull down” the drain node. This means that the output node VOUT stays in a high saturation condition and does not reflect the input signal VIN as desired.
(17) The same also applies mutatis mutandis to a MOSFET-based differential stage supplied by VDD and GND rails as exemplified in
(18) As exemplified herein MOSFETs MP1 and MP2 are configured as a current mirror, with: MOSFET MP1, having shorted drain and gate terminals, which acts as feeding input of the mirror, and MOSFET MP2, having the same gate-to-source voltage as MP1, which acts as output, mirroring the drain current of MN1.
(19) This solution facilitates transforming differential drain currents into a single-ended output voltage (VOUT).
(20) It will be appreciated that, as exemplified herein, the transistors MP1, MP2 are of a complementary type, p-channel when MN1 and MN2 are n-channel, for instance.
(21) For that reason the MOSFET designations used herein may adopt names with N and P to distinguish n-channel and p-channel MOSFET types.
(22) In an embodiment as exemplified in
(23) As exemplified herein, MP1 and MP2 form a current mirror, which mirrors current from the drain of MP1 to the drain of MP2. The drain current of MP2 is compared with the current of MN2 at the VOUT node, with the result of comparison being the VOUT potential. The node VOUT can thus be regarded as a voltage gain node.
(24) Again, correct operation of such a differential amplifier stage is facilitated by input voltages applied at IN+, IN− being higher than the threshold voltages VTH of the MOSFETs MN1, MN2 plus some (minimum) voltage associated with the tail current generator IBTail.
(25) For instance, the tail current IBTail can be provided by a current mirror with 50 mV to 100 mV (minimum) to provide a stable IBTail current. If the input voltages at IN+, IN− are below the minimum voltage, the IBTail current generator is unable to provide a stable current and performance of the differential stage is degraded with complete malfunction eventually revealed.
(26) One or more embodiments that address the issues discussed in the foregoing are exemplified in
(27)
(28) Such a body control sensing capability is configured to reduce (lower) the threshold VTH when the input voltages, VIN or IN+, IN− drop near or below the threshold VTH.
(29)
(30)
(31) Throughout the figures like elements are indicated with like references/symbols thus making it unnecessary to repeat a detailed description for each figure. For instance, as already indicated, the same symbols G, S, D, B will be adopted throughout this description to denote the gate, source, drain and body terminals of the various MOSFETS discussed with suffixes 1, 2, 3, . . . identifying the respective MOSFET.
(32) Also, for simplicity: specific references for the gate, source, drain and body terminals of the certain MOSFETS will not be unnecessarily repeated in certain figures, a same designation may be used for a certain circuit node/terminal and a signal applied/sensed/collected at that node/terminal.
(33) One or more embodiments may rely on the recognition that the threshold voltage VTH of the input transistor can be reduced if a lowest (minimum) input signal level is not sufficient for a particular application.
(34) For instance, in an embodiment as exemplified in
(35) The MOSFET MN3 has its body terminal B3 shorted to its drain terminal D3 and to the body terminal B1 of MN1.
(36) In one or more embodiments, the two MOSFETs MN1 and MN3 may be of the same type so their electrical characteristics are matched, even with different W/L (width/length) sizing applied.
(37) If the input voltage is higher than the threshold voltage VTH of both MOSFETs MN1 and MN3, the body of both these transistors (namely B1 and B3) is tied to GND by MN3.
(38) In the case of MN3, as a result of input voltage VIN dropping near the threshold voltage VTH, the drain current through MN3 will not be sufficient for sinking all the current provided by IBAux and the drain potential of MN3 will start to increase. Because this (drain) node D3 is connected to the bodies (bulks) B1 and B3 of both MOSFETs MN1 and MN3, the potential of these bulk nodes will start to increase.
(39) Due to a resulting body effect the threshold voltage VTH for both the MOSFETs MN1, MN3 will decrease.
(40) As noted, good practice may suggest to size the MOSFETs MN1 and MN3 differently, for instance with the W/L (width/length) ratio of MN1 higher than the W/L ratio for MN3. This will facilitate and early detection of a low input level and application of a body effect as discussed.
(41) The effect of body polarization can be described by the following equation:
(42)
(43) Where: V.sub.TB is the threshold with body effect V.sub.T0 is the threshold with body and source shorted
(44)
is a constant V.sub.SB is source-to-body voltage Φ.sub.F is a potential
(45) The equation reported above proves that applying a positive voltage between the source S and the body B of a MOSFET increases the threshold value VTH, while applying a negative voltage decreases VTH.
(46) One or more embodiments may apply negative polarization (bias) of a source node versus the body. Such a polarization cannot be increased indefinitely insofar as this is limited by the presence of body-source PN junction which becomes forward-polarized when the source terminal is about 0.7V lower than body terminal (at room temperature).
(47) This may put a limit on the amount the body effect can be applied to decrease of VTH.
(48) For instance, in the case of a circuit supplied with VDD=1V and the input voltage VIN swept from 0 to 1V, monitoring the output voltage VOUT in both cases (without body control and with body control) shows the following.
(49) For a standard amplifier without body control (see
(50) If body control is applied (see
(51) It is observed that for high values of VIN (near VDD, for instance, the body voltage or potential Vbody is nearly zero. At input voltage levels around 600 mV the body potential starts to increase and to apply a body effect to the amplifier. At low levels for VIN the body voltage saturates at about 620 mV due to the forward polarization of body-source junction in the MOSFET. In fact, elementary single-MOSFET amplifiers are used in active mode around the voltage VTH. For (much) higher values of VIN, the amplifier output will saturate near zero voltage.
(52) As exemplified in
(53) In that respect, it is again recalled that like elements are indicated with like symbols (for instance G, S, D, B) throughout the figures, thus making it unnecessary to repeat (in respect of
(54) As exemplified in
(55) As exemplified in
(56) As exemplified in
(57) If the IN+ voltage is sufficiently high for normal operation, the bodies MN1, MN2 and MN3 are tied to GND via the current path (drain D3) of MN3 and the circuit operates without body polarization.
(58) If the voltage at IN+ drops near the threshold VTH of MN3, the drain current of MN3 is not able to sink all the IBAux current and the drain potential of MN3 starts to increase. Also, the body potential (Vbody) of all the three MOSFETs MN1, MN2 and MN3 is increased, thus inducing a body effect which reduces the threshold VTH and facilitates normal operation of the amplifier.
(59) Here again, the body effect has a limit in the forward polarization of the body-source PN junctions in the MOSFETs, with the MOSFET MN3 being of the same type as MN1. Again, good practice may suggest to size MN3 differently from MN1, for instance with W/L of MN1 higher than W/L of MN3. The difference in size will result in a certain difference (delta VGS) in the gate-source voltages of the MOSFETs MN1 and MN3, with the voltage VGS of MN1 being lower. Such a delta voltage will occur at the common tail node (sources of MN1 and MN2), facilitating normal current biasing by the tail generator IBTail.
(60) Operation of a circuit as exemplified in
(61) In case the body effect is not applied (see
(62) In case the body effect is relied upon (see
(63)
(64) In a circuit as exemplified in
(65) A circuit as exemplified in
(66)
(67) Once again, elements like elements already discussed in connection with the previous figures are indicated with like symbols, and a corresponding description will not be repeated here for brevity.
(68) In embodiments as exemplified in
(69) In those circumstances where such a voltage drop at MN1 is found to be insufficient to facilitate correct current mirroring (which, for instance, may be due to VDD being insufficient, that is undesirably low) the possibility again exists of resorting to the body effect in order to increase the body voltage (Vbody) and inducing a reduction in the threshold voltage VTH.
(70) A circuit as exemplified herein may comprise: a MOSFET (for instance, MN1) having source (for instance, S1) and drain (for instance, D1) terminals with a (source-drain) current conduction path therebetween, a gate terminal (for instance, G1) configured to receive an input signal (for instance, VIN) to facilitate current conduction (for instance, IBMain) in said current conduction path as a result of the gate-to-source voltage reaching a threshold (for instance, VTH), as well as a body terminal (for instance, B1), body voltage control circuitry (for instance, MN3; MN3′, MN3″) sensitive to the voltage at the gate terminal of said MOSFET, the body voltage control circuitry coupled to the body terminal of said MOSFET and configured to increase the body voltage of said MOSFET as a result of a reduction in the voltage at the gate terminal of said MOSFET, wherein said threshold is reduced.
(71) In a circuit as exemplified herein (see, for instance,
(72) In a circuit as exemplified herein (see again, for instance,
(73) In a circuit as exemplified herein the at least one body voltage control MOSFET may be of a same type, n-channel or p-channel, of said MOSFET.
(74) A circuit as exemplified herein (see, for instance, the differential arrangement of
(75) wherein: the gate terminal of said MOSFET and the further gate terminal of said further MOSFET are configured to receive a differential input signal (for instance, IN+,IN−) therebetween to facilitate current conduction (for instance, IBTail) in said current conduction path and said further current conduction path as a result of the gate-to-source voltages in said MOSFET and said further MOSFET reaching a threshold (VTH), said body voltage control circuitry is sensitive to the voltage (for instance, IN+) at the gate terminal of said MOSFET and is coupled to the body terminal of said MOSFET and to the further body terminal of said further MOSFET and configured to increase the body voltage of said MOSFET and said further MOSFET as a result of a reduction in the voltage at the gate terminal of said MOSFET wherein said threshold is reduced.
(76) In a circuit as exemplified herein (see, for instance,
(77) In a circuit as exemplified herein (see again for instance
(78) wherein the first body voltage control MOSFET and the second body voltage control MOSFET have respective first (for instance, B3′) and second (for instance, B3″) body terminals jointly coupled to the body terminal of said MOSFET and to the further body terminal of said further MOSFET (MN2).
(79) In a circuit as exemplified herein (see again, for instance,
(80) In a circuit as exemplified herein the first body voltage control MOSFET and the second body voltage control MOSFET may be of a same type, n-channel or p-channel, of said MOSFET.
(81) A circuit as exemplified herein (see, for instance, the current-mirror arrangement of
(82) wherein: the gate terminal of said MOSFET and the second gate terminal of said second MOSFET are mutually coupled to provide a current mirror arrangement of said MOSFET and said second MOSFET, said body voltage control circuitry is sensitive to the voltage at the gate terminal of said MOSFET and the second gate terminal of said second MOSFET, said body voltage control circuitry is coupled to the body terminal of said MOSFET and to the second body terminal of said second MOSFET and configured to increase the body voltage of said MOSFET and said second MOSFET as a result of a reduction in the voltage at the gate terminal of said MOSFET wherein said threshold is reduced.
(83) In a method of operating a MOSFET as exemplified herein, having source and drain terminals with a current conduction path therebetween, a gate terminal configured to receive an input signal to facilitate current conduction in said current conduction path as a result of the gate-to-source voltage reaching a threshold, as well as a body terminal,
(84) the method may comprise: sensing the voltage at the gate terminal of said MOSFET, increasing the body voltage of said MOSFET as a function of a decrease in the voltage sensed at the gate terminal of said MOSFET, wherein said threshold is reduced as a result of the reduction in the voltage at the gate terminal of said MOSFET.
(85) Without prejudice to the underlying principles, the details and embodiments may vary, even significantly, with respect to what has been described by way of example only, without departing from the extent of protection.
(86) For instance, the exemplary embodiments presented here are not exhaustive. Additional embodiments can be identified by skilled person: just to mention one (non-limiting) case in point, one may consider “complementary” embodiments where n-channel MOSFETs are replaced by p-channel MOSFETs and vice versa, that is, one or more embodiments are applicable to complementary solutions replacing n-channel MOSFETS with p-channel MOSFETs and vice versa.
(87) Also, it will be appreciated that the body effect pursued in the embodiments has been explained in connection with the threshold voltage VTH for simplicity, while the gate-source voltage VGS of the MOSFET, which facilitates conduction of a certain drain current, may be considered.
(88) The extent of protection is determined by the annexed claims.
(89) The claims are an integral part of the technical teaching provided herein in respect of the embodiments.