Encapsulating Composition

Abstract

The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.

Claims

1. An encapsulating composition comprising an aliphatic carbobicycle compound having one or more functional groups; an epoxy compound having a cyclic structure in the molecular structure; a linear or branched aliphatic epoxy compound; and a compound having an oxetane group, wherein the aliphatic carbobicycle compound is included in a range of 1 part by weight to 50 parts by weight relative to 100 parts by weight of the encapsulating composition, the epoxy compound having a cyclic structure in the molecular structure is included in a range of 5 parts by weight to 150 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, the linear or branched aliphatic epoxy compound is included in a range of 20 parts by weight to 300 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and the compound having an oxetane group is included in a range of 40 parts by weight to 800 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound.

2. The encapsulating composition according to claim 1, wherein an organic layer formed by curing the encapsulating composition has a dielectric constant in a range of 2.0 to 3.5.

3. The encapsulating composition according to claim 1 further comprising a photoinitiator.

4. The encapsulating composition according to claim 3, wherein the photoinitiator is included in a range of 5 parts by weight to 80 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound.

5. The encapsulating composition according to claim 1, wherein the encapsulating composition has a viscosity of 50 cP or less as measured at room temperature.

6. The encapsulating composition according to claim 1, wherein the encapsulating composition is photo-cured at a light quantity of 300 mJ/cm.sup.2 to 6,000 mJ/cm.sup.2.

7. The encapsulating composition according to claim 1, wherein a cured product of the encapsulating composition has pencil hardness of 2H or more.

8. The encapsulating composition according to claim 1, wherein the encapsulating composition is an ink composition in a solventless form.

9. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the top side of the organic electronic element and formed by the encapsulating composition according to claim 1.

10. The organic electronic device according to claim 9, wherein the organic layer has a thickness of 20 μm or less.

11. A method for manufacturing an organic electronic device comprising a step of forming an organic layer on a substrate in which an organic electronic element is formed on the upper part of the substrate, so that the encapsulating composition according to claim 1 seals the top side of the organic electronic element.

12. The method for manufacturing an organic electronic device according to claim 11, wherein the step of forming an organic layer comprises applying the encapsulating composition by inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.

13. The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound has one or more functional groups selected from an epoxy group or a (meth)acryl group.

14. The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound is bicyclo[2.2.1]heptane, biscyclo[3.1.1]heptane, bicyclo[3.2.1]octane, bicyclo[4.3.2]undecane, or biscyclo[3.3.3]undecane.

15. The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound is represented by Formula 1 or Formula 2 below: ##STR00002## in Formulas 1 and 2 above, R represents a C.sub.1-6 alkylene group unsubstituted or substituted with a C.sub.1-4 alkyl group, and R.sub.1 to R.sub.6 each independently represent hydrogen, a C.sub.1-4 alkyl group, or a (meth)acryl group, or together with an adjacent substituent form an alicyclic ring or an epoxy group, where Formulas 1 and 2 comprise at least one (meth)acryl group or epoxy group.

16. The encapsulating composition according to claim 1, wherein the epoxy compound having a cyclic structure in the molecular structure is 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate, vinylcyclohexene dioxide, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate), 1,2-epoxy-4-vinylcyclohexane, 1,1′-bi-7-oxabicyclo[4.1.0]heptane, or derivatives thereof.

17. The encapsulating composition according to claim 1, wherein the linear or branched aliphatic epoxy compound is 1,4-butanediol diglycidyl ether, ethyleneglycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, propyleneglycol diglycidyl ether, diethyleneglycol diglycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether or neopentylglycol diglycidyl ether.

18. The encapsulating composition according to claim 1, wherein the compound having an oxetane group is bis[1-ethyl(3-oxetyl)]methyl ether, 3-ethyl-3-(cyclohexyl)methyl oxetane, oxetane silicate, 3-ethyl-3-hydroxymethyl-oxetane, 1,4-bis[{(3-ethyloxetan-1-yl)methoxy}methyl]benzene, 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane, 3-ethyl-3-hydroxymethyl-oxetane, 4,4′-bis[(3-ethyl-3-oxetanyl)methoxymethyl]bisphenyl, bis[(3-ethyl-3-oxetanyl)methyl] terephthalate or (3-ethyl-3-oxetanyl)methoxymethyl methacrylate.

19. The method for manufacturing an organic electronic device according to claim 11, further comprising a step of irradiating the organic layer with light.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0080] FIGS. 1 and 2 are cross-sectional diagrams illustrating an organic electronic device according to one example of the present invention.

MODE FOR INVENTION

[0081] Hereinafter, the present application will be described in detail by way of examples, but the scope of the present application is not limited by the following examples.

[0082] Dielectric Constant Evaluation of Organic Layer

[0083] After an organic layer having a thickness of about 20 μm or so was formed by depositing aluminum to about 50 nm or so on glass, coating each of the encapsulating compositions prepared in the following examples and comparative examples thereon by the inkjet printing method and UV-curing it with a light quantity of about 4,000 mJ/cm.sup.2, aluminum was deposited to about 50 nm or so on the organic layer to produce a specimen. The dielectric constant of the produced specimen was measured using an impedance/gain-phase analyzer (HP 4194A).

[0084] Viscosity of Encapsulating Composition

[0085] A viscosity was measured using each of the encapsulating compositions prepared through Examples and Comparative Example. Specifically, it was measured by Brookfield's DV-3 at about 25° C. with a torque of about 90% and a shear rate in a range of about 5 rpm to about 20 rpm.

[0086] Pencil Hardness

[0087] Pencil hardness was measured using a cured product formed by purging each of the encapsulating compositions prepared through Examples and Comparative Example with nitrogen gas for 30 minutes and then UV-curing the encapsulating composition at a light quantity of about 1,000 mJ/cm.sup.2.

[0088] The measurement of the pencil hardness was made using a pencil hardness tester. Specifically, it was measured by moving the pencil to a length of 15 mm at a speed of 273 mm/min and a pencil angle of 45 degrees with a load of 500 gf on the cured product.

Example 1

[0089] An aliphatic carbobicycle compound (dicyclopentadiene dioxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 10:10:20:54:6 (TTA27:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

[0090] In the mixing vessel, a uniform encapsulating composition was prepared using a planetary mixer (Kurabo, KK-250s).

Example 2

[0091] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (dicyclopentadiene dioxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 20:10:20:44:6 (TTA27:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 3

[0092] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (dicyclopentadiene dioxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 30:10:20:34:6 (TTA27:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 4

[0093] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (dicyclopentadiene dioxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 40:10:20:24:6 (TTA27:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 5

[0094] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (α-pinene oxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 10:10:20:54:6 (α-pinene oxide:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 6

[0095] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (α-pinene oxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 20:10:20:44:6 (α-pinene oxide: Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 7

[0096] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (α-pinene oxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 30:10:20:34:6 (α-pinene oxide:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Example 8

[0097] An encapsulating composition was prepared in the same method as in Example 1, except that an aliphatic carbobicycle compound (α-pinene oxide), an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 40:1:20:24:6 (α-pinene oxide:Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

Comparative Example

[0098] An encapsulating composition was prepared in the same method as in Example 1, except that an epoxy compound having cyclic structure in the molecular structure (Celloxide 2021P from Daicel), a linear or branched aliphatic epoxy compound (HAJIN CHEM TECH, DE203), an oxetane group-containing compound (OXT-221 from TOAGOSEI) and a photoinitiator (CPI-310B from San-Apro) were each introduced into a mixing vessel at a weight ratio of 20:20:54:6 (Celloxide 2021P:DE203:OXT-221:CPI-310B) at room temperature.

[0099] Table 1 below is results of evaluating dielectric constants of dielectric layers which are cured products of the encapsulating compositions of Examples and Comparative Example.

TABLE-US-00001 TABLE 1 Example Comparative Classification 1 2 3 4 5 6 7 8 Example Dielectric constant 2.92 2.82 2.80 2.95 3.10 3.00 2.82 3.02 3.52 Viscosity (cP) 12.5 20.1 24.8 29.5 6.2 7.5 10.36 11.9 19.8 Pencil hardness 3H 4H 5H 5H 3H 4H 5H 5H H

[0100] Through Table 1 above, in the case of Examples 1 to 8 including the aliphatic carbobicycle compound in an amount of 10 parts by weight, 20 parts by weight, 30 parts by weight or 40 parts by weight relative to 100 parts by weight of the encapsulating composition, the dielectric constants of the organic layers as the cured products were measured to be 3.5 or less, so that the occurrence of the inter-circuit interference problem could be improved; all the viscosities were also measured to be 30 cP or less, thereby indicating that the spreadability was excellent; and the cured products were found to have excellent scratch resistance with the pencil hardness of 2H or more.

[0101] In comparison with these, in the case of Comparative Example including no aliphatic carbobicycle compound in the encapsulating composition, the viscosity was excellent, but the pencil hardness was low as H, while the dielectric constant was high at 3.52 or so.