LOW ARTIFACT, HIGH SPEED, BALANCED OPTICAL DETECTOR ARRAY
20210239921 · 2021-08-05
Inventors
- Janis A. Valdmanis (Ann Arbor, MI, US)
- Charles Patrick Caputo, II (Brighton, MI, US)
- Patrick Bachor (Luebeck, DE)
- Patrick Grant (Ann Arbor, MI, US)
Cpc classification
G02B6/43
PHYSICS
G01J1/0295
PHYSICS
G01J1/1626
PHYSICS
G02B6/4214
PHYSICS
International classification
Abstract
Disclosed herein is a particular type of fiber-optic, high-speed, balanced detector array designed to have very low artifacts, compact design, and low cost. The design is easily expandable to multiple channels of individual or detector pairs and the addition of transimpedance amplifiers to amplify the detected optical signals. The bandwidth of these devices is currently in the range up to 10 GHz with higher speeds being conceivable.
Claims
1. A fiber optic detector, comprising: an array of photodetectors; an array of optic fibers configured to guide light beams into the array of photodetectors; wherein each optic fiber in the array of optic fibers comprises an output end that is beveled at an angle such that exiting light beam travels at an angle relative to an optic fiber axis and impinges on a corresponding photodetector in the array of photodetectors along a main beam path which is not normal to a surface of the photodetector; wherein the bevel angle is chosen such that reflections from surfaces in the path of the light beam are directed out of the main beam path and avoid being detected by the photodetector or being sent in a reverse direction along the optic fiber axis.
2. The fiber optic detector of claim 1, wherein the output ends of the optic fibers are embedded in a support structure that holds the optic fibers in an array with a fiber-to-fiber pitch that substantially matches a detector-to-detector pitch of the array of photodetectors.
3. The fiber optic detector of claim 1, wherein at least one surface in the path of the light beam has an anti-reflection coating (ARC) to improve coupling efficiency between fibers and active areas of the photodetectors.
4. The fiber optic detector of claim 1, wherein the photodetectors are electrically connected in balanced pairs such that the photocurrents from a given pair subtract.
5. The fiber optic detector of claim 1, wherein one or more transimpedance amplifiers (TIA) are incorporated to amplify photocurrents and convert the photocurrents into voltage signals.
6. The fiber optic detector of claim 1, wherein an area of the photodetectors is restricted to a small area with a mesa structure, impregnated oxide layer, or hard aperture.
7. The fiber optic detector of claim 1, wherein substantially resistive terminations between output signals and ground are incorporated.
8. The fiber optic detector of claim 1, wherein DC blocking capacitors are incorporated.
9. The fiber optic detector of claim 1, wherein the array of photodetectors and/or array of optic fibers is reduced to a single photodetector and/or a single optic fiber.
10. The fiber optic detector of claim 1, wherein a conventional hermetic package is utilized.
11. The fiber optic detector of claim 1, wherein the fiber optic detector is constructed with a package, comprising: a printed circuit board (PCB) substrate and an LCP lid.
12. The fiber optic detector of claim 11, wherein the lid is attached to the substrate with epoxy.
13. The fiber optic detector of claim 11, wherein the optic fibers pass through a tunnel in the lid and the tunnel is filled with epoxy.
14. The fiber optic detector of claim 13, wherein the epoxy in the tunnel is injected through a hole in the substrate.
15. The fiber optic detector of claim 11, wherein the output signals go to castellated vias around the edges of the substrate.
16. The fiber optic detector of claim 11, wherein output signals pass though the substrate with filled vias and then go to pads either adjacent to or covering a via on a bottom side of the substrate.
17. The fiber optic detector of claim 16, wherein solder balls or pins are added to the pads.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] The description of illustrative embodiments according to principles of the present invention is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description. In the description of embodiments of the invention disclosed herein, any reference to direction or orientation is merely intended for convenience of description and is not intended in any way to limit the scope of the present invention. Relative terms such as “lower,” “upper,” “horizontal,” “vertical,” “above,” “below,” “up,” “down,” “top” and “bottom” as well as derivative thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description only and do not require that the apparatus be constructed or operated in a particular orientation unless explicitly indicated as such. Terms such as “attached,” “affixed,” “connected,” “coupled,” “interconnected,” and similar refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. Moreover, the features and benefits of the invention are illustrated by reference to the exemplified embodiments. Accordingly, the invention expressly should not be limited to such exemplary embodiments illustrating some possible non-limiting combination of features that may exist alone or in other combinations of features; the scope of the invention being defined by the claims appended hereto.
[0020] This disclosure describes the best mode or modes of practicing the invention as presently contemplated. This description is not intended to be understood in a limiting sense, but provides an example of the invention presented solely for illustrative purposes by reference to the accompanying drawings to advise one of ordinary skill in the art of the advantages and construction of the invention. In the various views of the drawings, like reference characters designate like or similar parts.
[0021] An embodiment of the present invention is a matched, high-speed photodetector array (PDA) that offers very low optical artifacts in both forward and reverse directions is shown in
[0022] As shown in
[0023] As shown in
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[0025] The fiber array enables easier length matching of fibers for applications that are sensitive to phase differences between the balanced detectors (e.g., OCT). Fiber array alignment to the PDA is assured because both components are fabricated using micro-fabrication techniques that typically have tolerance of less than 1 μm. The prism holding the fibers allows for precision polishing of the reflection angle at the fiber ends that enables low-artifact performance. In one embodiment, the bevel angle of the fiber end is chosen such that reflections from surfaces in the path of the light beam are directed out of the main beam path and avoid being detected by the photodetector or being sent in a reverse direction along the fiber axis. The bevel angle depends on one or more of the following: component spacing, fiber emission angle, detector size, etc. In one embodiment, coatings are included in the package so as to absorb some of the stray light that is typically found in optical devices.
[0026] The use of arrayed optical components allows for precision alignment of small detectors that offer high-speed, balanced performance. In
[0027] Returning to
[0028] This geometry also enables the straight-forward addition of amplifiers at the output of the PDA within the same compact package. This geometry also enables an arrayed electrical output such as vias or ball-grid array.
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[0030] While the present invention has been described at some length and with some particularity with respect to the several described embodiments, it is not intended that it should be limited to any such particulars or embodiments or any particular embodiment, but it is to be construed so as to provide the broadest possible interpretation in view of the prior art and, therefore, to effectively encompass the intended scope of the invention. Furthermore, the foregoing describes the invention in terms of embodiments foreseen by the inventor for which an enabling description was available, notwithstanding that insubstantial modifications of the invention, not presently foreseen, may nonetheless represent equivalents thereto.