Method using Embossing Tamper and Method for Earth Mount Utility Scale Photovoltaic Array

Abstract

A site is prepared for the installation of solar panels by preparing a ground area by smoothing or grading and contouring to provide a surface sufficiently level to permit resting the solar panels in direct contact with and supported on the ground so as to establish an azimuth-independent earth orientation of the solar panels. The soil is embossed in a pattern corresponding to a desired pattern by repeatedly stamping the soil in a pattern with a soil stamping device capable of impressing the desired pattern on the soil. The pattern is sized such that the solar panels fit into the impressed pattern resulting from the embossing of the soil.

Claims

1. A method for preparing a site for the installation of solar panels, the method comprising: preparing a ground area, said preparing comprising smoothing or grading and contouring to provide a surface sufficiently level to permit resting the solar panels in direct contact with and supported on the ground or supported on the ground through an interstitial layer by supporting the solar panels or edge frames of the solar panels so as to establish an azimuth-independent earth orientation of the solar panels and positioned in a closely-adjacent arrangement or an abutting arrangement of plural rows of the solar panels, wherein the array of solar panels achieve contact without an intermediate structure other than an interstitial layer between the solar panels and the ground for structural support; embossing soil at the ground area in a pattern corresponding to a desired pattern of soil beneath the solar panels, by repeatedly stamping the soil in a pattern with a soil stamping device capable of impressing the desired pattern on the soil, the pattern sized such that the solar panels fit into the impressed pattern resulting from the embossing of the soil; and placing at least a subset of the solar panels on the ground by direct contact with the ground or supported on the ground through an interstitial layer by supporting the solar panels or edge frames of the solar panels.

2. The method of claim 1, wherein the preparing a ground area comprises creating a loose soil condition using a soil tilling technique.

3. The method of claim 1, wherein the preparing a ground area comprises: in cases in which the soil condition precludes embossing, creating a loose soil condition using a soil tilling technique; and in cases in which the soil condition permits embossing, preparing the ground area without fully tilling the soil.

4. The method of claim 1, further comprising: using a cylindrical or drum roller as the soil stamping device.

5. The method of claim 1, further comprising: using a flat stamp as the soil stamping device.

6. The method of claim 1, further comprising: embossing the soil with a pattern that comprises shapes for module wires and a module junction box for the respective solar panels, allowing for placements of components having those shapes when installing the solar panels.

7. A tamper for preparing a site for the installation of solar panels comprising: a tamping form having ridges corresponding to predetermined portions of the solar panels, the ridges creating embossed depressions in the ground corresponding to predetermined portions of the solar panels edge frames of the solar panels upon tamping engagement by the tamping form on the ground at the site, the predetermined portions comprising solar panel structures and related solar panel array hardware chosen from the group consisting of one or more of edge frames, harness connectors and harness cabling; and a tamping driver capable of applying pressure on the ground through the tamping form for said creating embossed depressions in the ground.

8. The tamper of claim 7, further comprising: a tamping roller having a surface comprising the tamping form.

9. The tamper of claim 7, further comprising: a tamping machine driving the tamping form to cause said tamping engagement by applying pressure by weight, by vibration or impulse.

10. A method for installing an array of solar panels, the method comprising: a step of preparing a ground area, said preparing comprising smoothing or grading and contouring to provide a surface sufficiently level to permit resting the solar panels in direct contact with and supported on the ground or supported on the ground through an interstitial layer by supporting the solar panels or edge frames of the solar panels so as to establish an azimuth-independent earth orientation of the solar panels and positioned in a closely-adjacent arrangement or an abutting arrangement of plural rows of the solar panels, wherein the array of solar panels achieve contact without an intermediate structure other than an interstitial layer between the solar panels and the ground for structural support; a step of embossing soil at the ground area in a pattern corresponding to a desired pattern of soil beneath the solar panels, by repeatedly stamping the soil in a pattern with a soil stamping device capable of impressing the desired pattern on the soil, the pattern sized such that the solar panels fit into the impressed pattern resulting from the embossing of the soil; and a step of placing at least a subset of the solar panels on the ground by direct contact with the ground or supported on the ground through an interstitial layer by supporting the solar panels or edge frames of the solar panels.

11. The method of claim 10, wherein the preparing a ground area comprises creating a loose soil condition using a soil tilling technique.

12. The method of claim 10, wherein the preparing a ground area comprises: in cases in which the soil condition precludes embossing, creating a loose soil condition using a soil tilling technique; and in cases in which the soil condition permits embossing, preparing the ground area without fully tilling the soil.

13. The method of claim 10, further comprising: using a cylindrical or drum roller as the soil stamping device.

14. The method of claim 10, further comprising: using a flat stamp as the soil stamping device.

15. The method of claim 10, further comprising: embossing the soil with a pattern that comprises shapes for module wires and a module junction box for the respective solar panels, allowing for placements of components having those shapes when installing the solar panels.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is a schematic diagram showing a partial layout of a solar array for a commercial solar power plant.

[0019] FIGS. 2A-2C are schematic diagrams showing a spring clip arrangement for mechanically linking solar panels. FIG. 2A shows a spring clip. FIG. 2B shows the attachment of the clip to a module, and FIG. 2C shows the connection of two modules with the clip.

[0020] FIG. 3 is a schematic diagram showing a corner bracket arrangement for mechanically linking solar panels.

[0021] FIG. 4 is a schematic diagram showing a solar panel 201 with its edge frame 205 resting on the ground.

[0022] FIG. 5 is a diagram showing a tamping device in the form of a tamping roller.

[0023] FIG. 6 is a diagram showing a tamping device in the form of a tamping roller with additional ridges corresponding to edge frames, junction boxes and wire ways found on solar panels.

[0024] FIG. 7 is a schematic diagram of a horizontal tamping form.

[0025] FIG. 8 is a schematic diagram showing the use of tamper to create a repeat pattern in the ground

DETAILED DESCRIPTION

[0026] FIG. 1 is a schematic diagram showing a partial layout of a solar array for a commercial solar power plant, comprising multiple solar panels 115. Shown is a string array comprising 18 strings with each string containing 24 modules connected in series within that string and a string inverter 117 depicted in the center. The inverter 117 is connected to the strings for purposes of converting the DC power from the strings to AC power. Multiple string arrays and inverters are connected to establish a complete solar array. A utility scale solar power plant typically comprises 1 or more of these arrays.

[0027] FIGS. 2A-2C are schematic diagrams showing a spring clip arrangement for mechanically linking solar panels 201. In this non-limiting example, solar panels 201 have edge frames 205, which conveniently permit attachment of supporting brackets. FIG. 2A shows a spring clip 211. FIG. 2B shows the attachment of the clip to a module 201. FIG. 2C shows the connection of two modules 201 with the clip 211. Spring clip 211 comprises a flat sheet, folded to outer frame support 213 (for the outer frame sides of solar panels 201), with raised retainer lips 214, and two inner frame supports 217 (for inner frame edges of the solar panels 201), with raised retainer lips 218. The spring clip arrangement holds panels 201 with a fixed gap between panels, and in a fixed alignment with each other.

[0028] FIG. 3 is a schematic diagram showing a corner bracket arrangement for mechanically linking solar panels 201. Corner brackets 311 receives edge frames 205 of the panels 201, with clamp flanges 314 engaging linking flanges 315 on brackets 311, and the arrangement holds panels 201 with a fixed gap between panels.

[0029] It is also possible to place panels 201 directly on the ground without clamps, but with the panels 201 positioned with a fixed gap between panels or with no substantial gap between panels 201.

[0030] The earth oriented mounting lends to directly placing the panels on the ground without the use of corner brackets or other external bracing. In the case of solar panels with frames, the frame can be rested on the ground, which, in turn, provides mechanical support for the panels. FIG. 4 is a schematic diagram showing a solar panels 201 with edge frames 205 resting on the ground.

[0031] Referring to FIG. 4, the ground is prepared by generally smoothing the ground to desired contours for the panels 201. Furrows 421 are dug or impressed by mechanical means, and the panels 201 are placed on the ground with their edge frames 205 resting against the sides of furrows 421. Furrows 421 serve to positionally stabilize the panels 201, and provide the mechanical support for the panels 201. While it is possible for the panels 201 to directly rest on the ground on parts of the panels 201 other than the edge frames 205, the support by the frames 205 reduces mechanical force applied to the active parts of the panels 201 and leaves additional room for electrical connections. Thus, furrows 421 are formed as grooves, depressions or channels dug into the ground to receive the edge frames 205.

[0032] Furrows 421 are given by way of non-limiting example. In many installations, it is possible to directly support the panels 201 or the edge frames 205 directly on the ground without digging furrows. In some soil conditions, the edge frames 205 will sink into the soil, whereas in other conditions, the edge frames 205 will remain substantially at the top surface of the ground. It is further expected that the panels 201 will rest against the ground without the use of the edge frames 205, either because the edge frames 205 are allowed to sink below a level at which the panels will rest on the ground, or in cases in which panels are constructed without edge frames.

[0033] Prior to positioning the panels 201 on the ground, the ground is prepared by smoothing or grading and contouring to provide a surface sufficiently level to permit resting the solar panels in direct contact or upon an interstitial layer. The ground preparation may also include tilling the ground.

[0034] The support can be by supporting the solar panels 201 directly, or by supporting the panels with edge frames 205 of the solar panels. The support establishes an azimuth-independent earth orientation of the solar panels and positioned in a closely-adjacent arrangement or an abutting arrangement of plural rows of the solar panels 201. As a result, the array of solar panels is directly supported by the ground without an intermediate structure other than an optional interstitial layer between the solar panels and the ground.

[0035] The soil at the ground area is embossed in a pattern corresponding to a desired pattern of soil beneath the solar panels, shaped by repeatedly stamping the soil in a pattern with a soil stamping device. The soil stamping device is capable of impressing the desired pattern on the soil, and the pattern is sized such that the solar panels fit into an embossed stamp resulting from the embossing of the soil.

[0036] After embossing, the solar panels 201 are placed on the ground by direct contact with the ground or supported on the ground through an interstitial layer by supporting the solar panels or edge frames of the solar panels.

[0037] FIG. 5 is a diagram showing a tamping device in the form of a tamping roller 501. Tamping roller 501 has a cylindrical surface 505, with raised ridges 507. Surface 505 with raised edges engages the ground as a tamping form. The spacing of raised ridges 507 corresponds to the physical size of panels 201 (FIG. 2), and the spacing of panels 201 in the array. The spacing of panels 201 is established as mechanically fixed to each other, for example, by spring clips 211. Alternatively, the spacing of panels 201 is established by the pattern of the tamping device itself. In this non-limiting example, ridges 507 accommodate edge frames 205.

[0038] FIG. 6 is a diagram showing a tamping device, also in the form of a tamping roller 601, having additional ridges or raised portions corresponding to edge frames, junction boxes and wire ways found on solar panels. Tamping roller 601 has a surface 605 having raised portions which engage the ground as a tamping form. Tamping roller 601 has ridges 607 corresponding to edge frames 205 on panels 201 (FIG. 2). Additionally ridges 611 for junction boxes and wire leads of the modules are provided, which emboss the soil in order to provide clearance for these components. Ridges 607 and harnessing connector ridges 611 form some or all of the raised ridges on surface 605.

[0039] The embossing can be used for solar panels with or without edge frames 205. In the case of panels without edge frames, the embossing can be used to allow the panels 201 to rest directly on the ground. The embossed features can correspond to portions of the solar panels 201 corresponding to one or more of edge frames, harness connectors and harness cabling, although other features of the solar array hardware can be accommodated. It is alternatively possible to configure the tamping roller to create a recess for each entire panel 201, with or without further embossing for the harness connectors.

[0040] FIG. 7 is a schematic diagram of a horizontal tamping form 711 of a tamper. Horizontal tamping form 711 is incrementally moved to progressively emboss the soil, with spacing determined by a sequence of movement and stamping sequential regions of the ground.

[0041] The tamping may be achieved by any of a variety of tamping machines, using conventional tamping drivers. This can, by way of non-limiting examples, include applying pressure by weight, by vibration or impulse. FIG. 8 is a schematic diagram showing the use of tamping form 711 to create a repeat pattern in the ground for accepting an array of photovoltaic solar panels. Tamping form 711 is used to impress the pattern on the ground 810 by use of a ground tamping crane 815.

[0042] Closing Statement

[0043] It will be understood that many additional changes in the details, materials, steps and arrangement of parts, which have been herein described and illustrated to explain the nature of the subject matter, may be made by those skilled in the art within the principle and scope of the invention as expressed in the appended claims.