Abstract
Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.
Claims
1. A method of forming an electrical circuit comprising a substrate using a metal foil, the method comprising: laminating a film to a surface of the substrate; laminating a surface of the metal foil to the film; removing the metal foil to expose a portion of the film or substrate; and depositing a first conductor to the portion of the film or substrate.
2. The method of claim 1, wherein the film is partially or fully cured.
3. The method of claim 1, wherein the film is partially or fully cured before the step of removing the metal foil.
4. The method of claim 1, further comprising the step of treating the film or substrate with a chemical.
5. The method of claim 4, wherein the chemical is selected from the group consisting of an oxidizer, a solution of permanganate salt, a solution of alkali metal hydroxide, a solution of alkali earth metal hydroxide.
6. The method of claim 4, wherein the step of laminating the surface of the metal foil to the film occurs after the step of treating the film or substrate with the chemical.
7. The method of claim 1, further comprising the step of treating the film or substrate with a chemical after the step of removing the metal foil.
8. The method of claim 1, further comprising the step of treating the film or substrate with a plasma, a corona discharge, or an electron beam.
9. The method of claim 1, wherein the film is a bonding film.
10. The method of claim 9, wherein the bonding film is selected from the group comprising a B-stage resin sheet, a reinforced B-stage resin sheet, or a prepreg.
11. The method of claim 1, further comprising the step of applying a catalyst precursor to the film or substrate and activating the catalyst precursor to a catalyst before the step of depositing the first conductor to the portion of the film or substrate.
12. The method of claim 1, wherein the surface of the metal foil bears a catalyst or a catalyst precursor.
13. The method of claim 1 or 8, wherein the surface of the metal foil bears a catalyst or a catalyst precursor before the step of laminating the surface of the metal foil to the film.
14. The method of claim 12, wherein the catalyst or catalyst precursor remains on the film or substrate after the step of removing the metal foil.
15. The method of claim 12, further comprising the step of activating the catalyst precursor before depositing the first conductor.
16. The method of claim 11 or 12, wherein the step of depositing the first conductor comprises electroless deposition of the first conductor to the catalyst.
17. The method of claim 1, further comprising the step of electrolytically depositing a second conductor on the first conductor.
18. The method of claim 1, wherein the metal foil includes at least one of aluminum, anodized aluminum, copper, tin, or alloys thereof.
19. The method of claim 1, wherein the step of removing the metal foil comprises etching the metal foil.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] FIG. 1 depicts a flow chart for producing a catalyzed metal foil of the inventive subject matter.
[0029] FIG. 2A depicts a catalyzed metal foil of the inventive subject matter.
[0030] FIG. 2B depicts another catalyzed metal foil of the inventive subject matter.
[0031] FIG. 3A depicts steps of a method of the inventive subject matter.
[0032] FIGS. 3B to 3D depict further steps in the method of FIG. 3A.
[0033] FIG. 4A depicts steps of another method of the inventive subject matter.
[0034] FIGS. 4B to 4D depict further steps in the method of FIG. 4A.
[0035] FIG. 5 depicts steps of yet another method of the inventive subject matter.
[0036] FIG. 6 depicts steps of still another method of the inventive subject matter.
[0037] FIG. 7A depicts steps of another method of the inventive subject matter.
[0038] FIGS. 7B to 7D depict further steps in the method of FIG. 7A.
[0039] FIG. 8 depicts steps of still another method of the inventive subject matter.
[0040] FIG. 9A depicts steps of another method of the inventive subject matter.
[0041] FIGS. 9B to 9D depict further steps in the method of FIG. 9A.
[0042] FIG. 10 depicts a flow chart of a process of the inventive subject matter.
[0043] FIG. 11 depicts a flow chart of another process of the inventive subject matter.
[0044] FIG. 12 depicts a flow chart of yet another process of the inventive subject matter.
[0045] FIG. 13 depicts a flow chart of still another process of the inventive subject matter.
[0046] FIG. 14 depicts starting and end product of a process of the inventive subject matter.
DETAILED DESCRIPTION
[0047] The inventive subject matter provides systems, methods, and devices related to catalyzed metal foils, as well as using such foils to form electrical circuits and the circuits formed therefrom.
[0048] FIG. 1 depicts a flow chart for producing a catalyzed metal foil of the inventive subject matter.
[0049] FIG. 2A depicts catalyzed metal foil 200A of the inventive subject matter. Catalyzed metal foil 200 includes metal foil 210, which is etchable or removable and typically one of aluminum, anodized aluminum, copper, tin, or alloys thereof, has surface 212. Catalyst 220 is deposited onto surface 212, typically by coating surface 212 with a catalyst ink having a precursor for catalyst 220 and reducing the catalyst ink to deposit catalyst 220 onto surface 212. Surface 212 is preferably roughened, for example having an Ra of at least 0.1 m, 0.15 m, 0.2 m, 0.25 m, 0.3 m, 0.35 m, 0.4 m, 0.45 m, or at least 0.5 μm. In some embodiments, optional layer 230A can be further coated over catalyst 220 (or, before reduction, over the catalyst ink, etc.). Optional layer can be one or more polymers as described herein, or can be a pre-ceramic polymer, a ceramic or a composite of metal oxides, polymers, oxidized metal particles, nitrides or borides (e.g., titanium dioxide, zirconium dioxide, cerium dioxide, Yttrium oxide, or composites of these with per-ceramic polymers, epoxies that may be A staged, B staged or C staged). In some embodiments that include optional layer 230A, for example where optional layer 230A includes one or more pre-ceramic polymer, a ceramic or a composite of metal oxides, a further optional layer 240 can be further coated over optional layer 230A. In such embodiments, further optional layer 240 typically includes one or more polymers.
[0050] FIG. 2B depicts an embodiment of catalyzed metal foil 200A, labeled 200B, where the optional layer is organic material layer 230B. Organic material 230B is a copolymer including an alkaline-reactive polymer and an alkaline-non-reactive polymer, and is typically no more than 1 μm to 0.1 μm thick. In some embodiments the copolymer further includes a functional group with a lone pair electron, for example nitrogen or sulfur. Preferred alkaline-reactive polymers have at least one polyimide, amide, ester, or thioester. Generally, the copolymer has a composition of alkaline-reactive polymer to alkaline-non-reactive polymer of between 5%:95% and 95%:5% by molecular weight, respectively.
[0051] FIG. 3A depicts method 300 for manufacturing catalyzed substrate 360A using catalyzed metal foil 310. In step 330, surface 314 (having catalyst 316) of catalyzed metal foil 310 is laminated to surface 322 of substrate 320 (e.g., prepreg, curable film, thermoplastic substrate), producing interim material 340. In step 350, removable metal foil 312 is removed (e.g., etched, etc.) from interim material 340, forming catalyzed substrate 360A having catalyst 316 deposited onto substrate 320. In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, catalyzed metal foil 360A will appear as catalyzed metal foil 360B including optional layer 230A as depicted in FIG. 3B, or catalyzed metal foil 360C including optional layer 230A and further optional layer 240 as depicted in FIG. 3C. In the embodiment of FIG. 3D, catalyzed metal foil 200B is used in place of catalyzed metal foil 310, including catalyzed metal foil 360D with organic material layer 230B as previously described.
[0052] FIG. 4A depicts method 400 for manufacturing partial circuit 460A using catalyzed substrate 310 of FIG. 3A. In step 410, temporary resist layer 430 is formed across catalyst 422, deposited on substrate 420 (e.g., dielectric substrate). Temporary resist layer 430 is formed leaving negative pattern 432 in the form of a partial circuit, which exposes portion 422a of catalyst 422. In step 440, conductor 424 is electrolytically plated to exposed portion 422a of catalyst 422, with temporary resist layer 430 preventing electrolytically plating to any portion of catalyst 422 covered by layer 430. In step 450, temporary resist layer 430 is stripped (e.g., chemically stripped) from catalyst 422, exposing catalyst 422 and leaving conductor 424 plated to portion 422a and substrate 420, and forming partial circuit 460A. In optional step 470, catalyst 422 is further removed (e.g., etched, etc.) from substrate 420, yielding partial circuit 460A.
[0053] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 460A will appear as partial circuit 460B including optional layer 230A as depicted in FIG. 4B, or partial circuit 460C including optional layer 230A and further optional layer 240 as depicted in FIG. 4C. In the embodiment of FIG. 4D, catalyzed metal foil 200B is used in place of catalyzed metal foil 310, including organic material layer 230B.
[0054] FIG. 5 depicts method 500 for manufacturing partial circuit 580 using catalyzed substrate 310 of FIG. 3. In step 510, temporary resist layer 530 is formed across catalyst 522, deposited on substrate 520 (e.g., dielectric substrate). Temporary resist layer 530 is formed leaving portions of catalyst 522a exposed, as depicted. In step 540, exposed portions of catalyst 522a are removed (e.g., etched, etc.), leaving only covered portions of catalyst 522b covered by temporary resist layer 530. In step 550, temporary resist layer 530 is stripped, exposing the remaining portion 522b of catalyst. In step 560, conductor 570 is electrolytically plated to catalyst 522b, producing partial circuit 580.
[0055] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 580 will appear as partial circuit 460B including optional layer 230A as depicted in FIG. 4B, or partial circuit 460C including optional layer 230A and further optional layer 240 as depicted in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 580 will appear as partial circuit 460D including organic material 230B as depicted in FIG. 4D.
[0056] FIG. 6 depicts method 600 for manufacturing partial circuit 680 using catalyzed substrate 310 of FIG. 3. In step 610, conductor 624 is electroless plated to catalyst 622, which is deposited on substrate 620. Conductor 624 is plated typically less than 500 μm, 400 μm, 300 μm, 200 m, 100 m, or 50 μm thick, or at least a minimum thickness to propagate electrolytic plating of a conductor. In step 630, temporary resist layer 640 is formed over conductor 624, with negative pattern 642 leaving portion 624a of conductor 624 exposed in the negative pattern of part of a circuit. In step 650, conductor 626 is electrolytically plated to portion 624a of conductor 624. In step 660, temporary resist layer 640 is stripped away, exposing conductor 624. In step 670, exposed portions of conductor 624 and underlying portions of catalyst 622 are removed (e.g., etched, etc.), producing partial circuit 680.
[0057] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 680 will appear as partial circuit 460B including optional layer 230A as depicted in FIG. 4B, or partial circuit 460C including optional layer 230A and further optional layer 240 as depicted in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 680 will appear as partial circuit 460D including organic material 230B as depicted in FIG. 4D.
[0058] FIG. 7A depicts method 700 for manufacturing partial embedded circuit 750A using catalyzed substrate 310 of FIG. 3. In step 710, permanent resist layer 730 is formed over catalyst 722, which is deposited on substrate 720. Permanent resist layer 730 is formed such that negative pattern 732 exposes portion 722a of catalyst 722. In step 740, conductor 724 is electrolytically plated to the exposed portion 722a of catalyst 722, producing partial embedded circuit 750A.
[0059] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 750A will appear as partial circuit 750B including optional layer 230A as depicted in FIG. 7B, or partial circuit 750C including optional layer 230A and further optional layer 240 as depicted in FIG. 7C. In the embodiment of FIG. 7D, catalyzed metal foil 200B is used in place of catalyzed metal foil 310, including organic material layer 230B.
[0060] FIG. 8 depicts method 800 for manufacturing partial circuit 880 using catalyzed substrate 310 of FIG. 3. In step 810, conductor 824 is electroless plated to catalyst 822, which is deposited on substrate 820. Conductor 824 is plated typically less than 500 m, 400 m, 300 m, 200 m, 100 m, or 50 μm thick, or at least a minimum thickness to propagate electrolytic plating of a conductor. In step 810, conductor 826 is electrolytically plated to conductor 824, typically to a thickness of at least 2×, 3×, 4×, 5×, 6×, 7×, 8×, 9×, 10×, or 20x or more the thickness of conductor 824. In step 840, temporary resist layer 840 is formed on conductor 826 in the pattern of a circuit, leaving exposed portions 826a of conductor 826. In step 860, exposed portions 826a of conductor 826, and portions of catalyst 822 under portions 826a, are removed (e.g., etched, etc.), leaving portions 826b of conductor 826 covered by temporary resist layer 850, and underlying portions 822b of catalyst 822. In step 870, temporary resist layer 850 is stripped, exposing portion 826b of conductor 826 in the pattern of a circuit, producing partial circuit 880.
[0061] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 880 will appear as partial circuit 460B including optional layer 230A as depicted in FIG. 4B, or partial circuit 460C including optional layer 230A and further optional layer 240 as depicted in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 880 will appear as partial circuit 460D including organic material 230B as depicted in FIG. 4D.
[0062] FIG. 9A depicts method 900 for manufacturing catalyzed substrate 970A using catalyzed metal foil 910. In step 920, surface 913 (having catalyst 914 deposited on it) of catalyzed metal foil 910 is coated with B-stage resin 916. In step 930, the B-stage resin 916, along with catalyst 914 and metal foil 912, is laminated to surface 944 of substrate 942 (e.g., prepreg, curable film, thermoplastic substrate), producing interim material 950. During the lamination step, B-stage resin 916 is cured to form C-stage resin 917. In step 960, removable metal foil 912 is etched from interim material 950, forming catalyzed substrate 970 having catalyst 914 deposited on cured C-stage resin 917, which is deposited on substrate 942.
[0063] While FIG. 9A depicts use of B and C-Stage resins, it is contemplated that other materials or resins can be used. For example, polymers, combinations of polymers, or specifically formulated polymers are used to have beneficial effect, or no effect, on the function or performance of substrate 942. In cases where substrate 942 includes electrical circuitry, polymers that bind or adhere well to the substrate are used, preferably polymers that do not alter performance of the circuitry at all or beyond a desired tolerance. Layer 916 or 917 is preferably thin, less than 100 μm, 50 μm, 20 μm, 10 μm, 5 μm, or less than 0.5 μm. In preferred embodiments a layer of such polymers or resins between 0.5 μm and 0.1 μm thick, but where practical or favorable can be less than 100 nm, less than 50 nm, or less than 10 nm.
[0064] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example including optional layer 230A or further optional layer 240 as described. In such embodiments, catalyzed substrate 970A will appear as catalyzed substrate 970B including optional layer 230A as depicted in FIG. 9B, or catalyzed substrate 970C including optional layer 230A and further optional layer 240 as depicted in FIG. 9C. In the embodiment of FIG. 9D, catalyzed metal foil 200B is used in catalyzed substrate 970D in place of catalyzed metal foil 310, including organic material layer 230B.
[0065] FIG. 10 depicts a flow chart of process 1000, which includes starting material 1010, interim material 1020, interim material 1030, and finished material 1040. Starting material 1010 includes removeable material 1012 (e.g., etchable metal, etchable aluminum, etchable copper, removeable plastic film, etc.), and catalyst layer 1014 deposited on a surface of removeable metal 1012. Polymer layer 1016 is deposited on a surface of catalyst layer 1014. Preferably, content of polymer layer 1016 is specifically selected, designed, or formulated to bind or adhere favorably to the catalyst layer, to a surface of bonding sheet 1022 (e.g., prepreg, bonding film, adhesive sheet), or both. For example, polymer layer 1016 can include a single polymer variant with high strength or binding specificity to bonding sheet 1022, can include a number of polymer variants with desirable binding or adherence traits, physical tolerance (temperature tolerances, flexibility, durability, etc.), electrical traits (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or otherwise doped with other materials to imbue polymer layer 1016 with such desirable properties. Further, in preferred embodiments polymer layer 1016 is between 1 μm and 0.01 m, but where practical or favorable can be less than 500 nm, less than 100 nm, or less than 50 nm. Reducing the separation between catalyst layer 1014 and bonding sheet 1022, or moreover between catalyst layer 1014 and substrate 1024, is absolutely critical in some embodiments.
[0066] Interim material 1020 includes removeable metal 1012, catalyst layer 1014, and polymer layer 1016, further including bonding sheet 1022 and substrate 1024. As noted, the contents of polymer layer 1016 are preferably selected to maintain strong binding or adhesion between catalyst layer 1014 and a surface of bonding sheet 1022. Likewise, bonding sheet 1022 is selected to maintain strong binding or adhesion between bonding sheet 1022 and a surface of substrate 1024. In some embodiments, polymer layer 1016 is selected to maintain strong binding or adhesion to a broad class of bonding sheets, bonding sheet 1022 is selected to maintain strong binding or adhesion to a broad class of substrates, or both.
[0067] Interim material 1030 includes removeable metal 1012, catalyst layer 1014, polymer layer 1016, bonding sheet 1022, and substrate 1024 adhered or bonded together as depicted (e.g., laminated). Finished material results from removing etchable metal 1012 and exposing a surface of catalyst layer 1014. It is contemplated that finished material 1040 can be further processed to, for example, plate a conductor (electroless, electrolytic, various combinations thereof, etc.) to finished material 1040, in a pattern, in bulk, or both. Such methods are useful for adding electrical transmission lines, circuit patterns, new or improved RF properties or capabilities, or the like to substrate 1024 or finished material 1040A, for example when substrate 1024 already includes electrical circuits or various electronic components with rated, approved, or certified performance tolerances or characteristics.
[0068] While FIG. 10 depicts methods and devices for a single sided addition of a catalyst layer or catalyst coated etchable or removable metal layer to a substrate, it is further contemplated that such teachings are applied to add catalyst layer or catalyst coated etchable or removable metal layer to more than one part of a substrate, for example multiple portions of a single side of the substrate, portions of more than one side of the substrate, or multiple portions of multiple sides of the substrate.
[0069] FIG. 11 depicts a flow chart of process 1100, which includes starting material 1110, interim material 1120, interim material 1130, interim material 1140, and finished material 1150. Starting material 1110 includes removeable material 1112 (e.g., etchable metal, etchable aluminum, etchable copper, removeable plastic film, etc.), and catalyst layer 1114 deposited on a surface of removeable metal 1112. Metal oxide layer 1116 is deposited on a surface of catalyst layer 1114. Preferably, metal oxide layer 1116 is specifically selected, designed, or formulated to bind or adhere favorably to catalyst layer 1114. Further, metal oxide layer 1116 preferably protects subsequent polymer layer 118 from diffusion and promotes good adhesion of metal oxide layer 1116, and thereby starting materials 1110, to polymer layer 1118.
[0070] Interim material 1120 further includes polymer layer 1118, which is deposited on a surface of metal oxide layer 1116. Preferably, content of polymer layer 1118 is specifically selected, designed, or formulated to bind or adhere favorably to catalyst layer 1116, to a surface of bonding sheet 1122 (e.g., prepreg, bonding film, adhesive sheet), to metal oxide layer 1116, or combinations thereof. For example, polymer layer 1118 can include a single polymer variant with high strength or binding specificity to bonding sheet 1122, can include a number of polymer variants with desirable binding or adherence traits, physical tolerance (temperature tolerances, flexibility, durability, etc.), or electrical traits (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or otherwise doped with other materials to imbue polymer layer 1118 with such desirable properties. Further, in preferred embodiments the combined thickness of metal oxide layer 1116 and polymer layer 1118 is between 1.0 μm and 0.01 m, but where practical or favorable can be less than 500 nm, less than 100 nm, or less than 50 nm. Reducing the separation between catalyst layer 1114 and bonding sheet 1122, or moreover between catalyst layer 1114 and substrate 1124, is absolutely critical in some embodiments.
[0071] Interim material 1130 includes removeable metal 1112, catalyst layer 1114, metal oxide layer 1116, and polymer layer 1118, further including bonding sheet 1122 and substrate 1124. As noted, the contents of polymer layer 1118 are preferably selected to maintain strong binding or adhesion between metal oxide layer 1116 (thereby catalyst layer 1114 and removable metal 1112) and a surface of bonding sheet 1122. Likewise, bonding sheet 1122 is selected to maintain strong binding or adhesion between bonding sheet 1122 and a surface of substrate 1124. In some embodiments, polymer layer 1118 is selected to maintain strong binding or adhesion to a broad class of bonding sheets, bonding sheet 1122 is selected to maintain strong binding or adhesion to a broad class of substrates, or both.
[0072] Interim material 1140 includes removeable metal 1112, catalyst layer 1114, metal oxide layer 1116, polymer layer 1118, bonding sheet 1122, and substrate 1124 adhered or bonded together as depicted (e.g., laminated). Finished material 1150 results from removing removeable metal 1112 and exposing a surface of catalyst layer 1114. It is contemplated that finished material 1140 can be further processed to, for example, plate a conductor (electroless, electrolytic, various combinations thereof, etc.) to finished material 1150, in a pattern, in bulk, or both. Such methods are useful for adding electrical transmission lines, circuit patterns, new or improved RF properties or capabilities, or the like to substrate 1124 or finished material 1150, for example when substrate 1124 already includes electrical circuits or various electronic components with rated, approved, or certified performance tolerances or characteristics.
[0073] While FIG. 11 depicts methods and devices for a single sided addition of a catalyst layer or catalyst coated or removable metal layer to a substrate, it is further contemplated that such teachings are applied to add catalyst layer or catalyst coated or removable metal layer to more than one part of a substrate, for example multiple portions of a single side of the substrate, portions of more than one side of the substrate, or multiple portions of multiple sides of the substrate.
[0074] FIG. 12 depicts flow chart 1200 of a method of the inventive subject matter, for example to produce an electrical circuit using an etchable metal foil. Steps 1240, 1250, 1260, and 1270 are considered core steps that are shared between alternate sets of precursor steps 1210 and 1212, 1220, and 1230, 1232, and 1234. While optional steps 1242 and 1280 are contemplated, they are not required in all embodiments. Further, while step 1242 teaches chemical treatment, it is contemplated the film or substrate is treated with a plasma, a corona discharge, or an electron beam, either alternatively or in combination with chemical treatments.
[0075] FIG. 13 depicts flow chart 1300 of a method of the inventive subject matter, for example to produce an electrical circuit using a catalyzed metal foil. Steps 1340, 1350, and 1360 are considered core steps that are shared between alternate sets of steps 1310 and 1312, 1320 and 1322, and 1330, 1332, and 1334 laminating a catalyzed metal foil over a substrate with a bonding film. While optional steps 1342 and 1370 are contemplated, they are not required in all embodiments. Further, while step 1342 teaches chemical treatment, it is contemplated the film or substrate is treated with a plasma, a corona discharge, or an electron beam, either alternatively or in combination with chemical treatments.
[0076] FIG. 14 depicts process 1400 developing starting materials 1410 in finished or interim material 1430, for example via processes depicted in FIG. 12 or 14. Starting materials 1410 include aluminum foil 1412, bonding film 1414, and laminate 1416. In some embodiments aluminum foil carries a catalyst precursor or activated catalyst, for example at the surface facing bonding film 1414. During process steps 1420, aluminum foil 1412, bonding film 1414, and laminate 1416 are laminated together, and aluminum foil 1412 is etched away leaving behind a precursor catalyst or activated catalyst on the surface of bonding film 1415.
[0077] In embodiments with a catalyst precursor on the surface of bonding film 1415, the catalyst precursor is activated, and copper 1440 is otherwise electrolessly deposited on the activated catalyst to form finished or interim material 1430. While bonding film 1414 is substantially the same as 1415, in some embodiments bonding film 1415 is partially or fully cured compared to bonding film 1414, or otherwise treated with a chemical. Likewise, laminate 1416 is substantially the same as 1417, though in some embodiments laminate 1417 is further treated with a chemical.
[0078] The following discussion provides many example embodiments of the inventive subject matter. Although each embodiment represents a single combination of inventive elements, the inventive subject matter is considered to include all possible combinations of the disclosed elements. Thus if one embodiment comprises elements A, B, and C, and a second embodiment comprises elements B and D, then the inventive subject matter is also considered to include other remaining combinations of A, B, C, or D, even if not explicitly disclosed.
[0079] As used herein, and unless the context dictates otherwise, the term “coupled to” is intended to include both direct coupling (in which two elements that are coupled to each other contact each other) and indirect coupling (in which at least one additional element is located between the two elements). Therefore, the terms “coupled to” and “coupled with” are used synonymously.
[0080] In some embodiments, the numbers expressing quantities of ingredients, properties such as concentration, reaction conditions, and so forth, used to describe and claim certain embodiments of the invention are to be understood as being modified in some instances by the term “about.” Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values presented in some embodiments of the invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
[0081] Unless the context dictates the contrary, all ranges set forth herein should be interpreted as being inclusive of their endpoints, and open-ended ranges should be interpreted to include only commercially practical values. Similarly, all lists of values should be considered as inclusive of intermediate values unless the context indicates the contrary.
[0082] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0083] All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g. “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.
[0084] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.
[0085] It should be apparent to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms “comprises” and “comprising” should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. Where the specification claims refers to at least one of something selected from the group consisting of A, B, C . . . and N, the text should be interpreted as requiring only one element from the group, not A plus N, or B plus N, etc.
