Method of fabricating graphene structure having nanobubbles
11078082 · 2021-08-03
Assignee
Inventors
Cpc classification
H01L21/02422
ELECTRICITY
International classification
H01L21/02
ELECTRICITY
C23C16/455
CHEMISTRY; METALLURGY
Abstract
Example embodiments relate to a method of manufacturing graphene structures having nanobubbles. The graphene structure includes a graphene layer on a substrate, the graphene layer having a plurality of convex portions and a band gap that is due to the plurality of convex portions. The method includes preparing the graphene layer on the substrate, and forming the plurality of convex portions on the graphene layer by irradiating a noble gas onto the graphene layer.
Claims
1. A method of manufacturing a graphene structure, the method comprising: preparing a graphene layer on a substrate; and penetrating noble gas ions through the graphene layer such that the noble gas ions remain between the graphene layer and the substrate forming at least one nanobubble.
2. The method of claim 1, wherein the preparing of the graphene layer comprises: preparing a catalyst substrate; and growing the graphene layer on the substrate by supplying a carbon source gas on the catalyst substrate.
3. The method of claim 1, wherein the preparing of the graphene layer comprises transferring the graphene layer on the substrate.
4. The method of claim 1, wherein the noble gas is Ar gas.
5. The method of claim 1, wherein the penetrating the noble gas ions through the graphene layer comprises sputtering the noble gas ions, and wherein the sputtering forms at least one noble gas ion between the substrate and the graphene layer to form the at least one nanobubble.
6. The method of claim 1, wherein each of the at least one nanobubble has a diameter in a range from about 2 nm to about 6 nm, and a height in a range from about 0.15 nm to about 1 nm.
7. The method of claim 1, wherein the penetrating the noble gas ions through the graphene layer comprises: irradiating the noble gas ions via a sputtering method.
8. The method of claim 7, wherein the penetrating the noble gas ions through the graphene layer comprises: supplying the noble gas ions with a power of 500 eV and a current of 1 μA.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) These and/or other example embodiments will become apparent and more readily appreciated from the following description, taken in conjunction with the accompanying drawings in which:
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DETAILED DESCRIPTION
(8) Reference will now be made in detail to example embodiments illustrated in the accompanying drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The example embodiments are capable of various modifications and may be embodied in many different forms. Like reference numerals in the drawings denote like elements throughout the specification, and thus their description will be omitted. In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout. The same reference numbers indicate the same components throughout the specification.
(9) It will be understood that when an element is referred to as being “on,” “connected” or “coupled” to another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on,” “directly connected” or “directly coupled” to another element, there are no intervening elements present. As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items. Further, it will be understood that when a layer is referred to as being “under” another layer, it can be directly under or one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
(10) It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
(11) Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
(12) The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
(13) Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
(14) Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, such as those defined in commonly-used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. As used herein, expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
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(16) Referring to
(17) However, the example embodiment is not limited thereto. The substrate 110 may be an insulating substrate. For example, the substrate 110 may include a silicon substrate and a silicon oxide layer on the silicon substrate. When an insulating substrate is used as the substrate 110, the graphene layer 120 may be disposed on the substrate 110 by transferring the graphene layer 120.
(18) The graphene layer 120 may include a plurality of convex portions 122. In
(19) Ar ions having a predetermined energy are intercalated between the substrate 110 and the graphene layer 120 by penetrating through the graphene layer 120. Regions of the graphene layer 120 where the Ar ions are intercalated form the convex portions 122 (nanobubbles 122) because of the volume of Ar ions. Ar ions in the nanobubbles 122 may exist as Ar atoms by doping the graphene layer 120.
(20) At least one Ar ion may exist in each of the nanobubbles 122. The Ar ion may dope the graphene layer 120 and may be transformed into an Ar atom as a result.
(21) The example embodiments are not limited thereto. For example, instead of Ar ion gas, helium (He) ion gas, neon (Ne) ion gas, krypton (Kr) ion gas, xenon (Xe) ion gas, radon (Rn) ion gas may be used.
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(23) As shown in
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(25) Referring to
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(27) Referring to
(28) Hereinafter, a method of manufacturing the graphene structure 100 according to another example embodiment will be described with reference to
(29) First, a substrate 110 is prepared. In the example embodiment, a Pt substrate having a (111) surface is used as the substrate 110. However, the example embodiment is not limited thereto. For example, an insulating substrate in which a silicon oxide layer is formed on a silicon substrate may be used. Also, a plastic substrate may be used.
(30) When the substrate 110 formed of or including Pt which is a catalyst material is used, graphene is grown by supplying a carbon source gas, for example, an ethylene gas onto the substrate 110. The graphene layer 120 may be grown at a temperature of approximately 400° C. for approximately 10 minutes. Thus, the graphene layer 120 may be formed on the substrate 110. The graphene layer 120 may have a structure of one layer or more according to the amount of the carbon source gas that is supplied onto the substrate 110 and the supplying time. In the example embodiment, the graphene layer 120 has one layer.
(31) However, the example embodiment is not limited thereto. The graphene layer 120 may be formed by transferring the graphene layer 120 on the substrate 110.
(32) According to at least one example embodiment, Ar ions are irradiated onto the graphene layer 120. The Ar irradiation may be performed via, for example, a sputtering method. Ar ions may be supplied with a power of 500 eV and a current of 1 μA. Ar ions are intercalated between the substrate 110 and the graphene layer 120 by penetrating through the graphene layer 120. As a result, a plurality of convex portions (nanobubbles 122) are formed the graphene layer 120. Ar ions in the nanobubbles 122 may dope the graphene layer 120, and as a result may become Ar atoms.
(33) In the example embodiment, Ar ions are used as a noble gas. However, the noble gas according to the example embodiment is not limited thereto. For example, instead of Ar ion gas, helium (He) ion gas, neon (Ne) ion gas, krypton (Kr) ion gas, xenon (Xe) ion gas, and radon (Rn) ion gas or another noble gas may be used as the noble gas.
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(35) Referring to
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(37) In the graphene structure having nanobubbles according to an example embodiment, Ar ions penetrate through the graphene layer, and thus, a nanobubble structure is formed as a result. Accordingly, the graphene layer having the nanobubbles may have a band gap. In the example embodiment, since a band gap is formed in graphene due to a size effect without using GNR as in the conventional art, the graphene may be used in any graphene device that requires graphene having a band gap.
(38) While one or more example embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.