CERAMIC STRUCTURAL BODY
20210292247 · 2021-09-23
Inventors
Cpc classification
C04B37/028
CHEMISTRY; METALLURGY
C04B2237/84
CHEMISTRY; METALLURGY
C04B2237/88
CHEMISTRY; METALLURGY
C04B37/008
CHEMISTRY; METALLURGY
C04B2237/76
CHEMISTRY; METALLURGY
C04B37/003
CHEMISTRY; METALLURGY
C04B2237/62
CHEMISTRY; METALLURGY
International classification
Abstract
A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.
Claims
1. A ceramic structural body, comprising: a substrate that is composed of a ceramic(s); a hole that is opened on a surface of the substrate; and a seal material that is positioned at an opening portion of the hole.
2. The ceramic structural body according to claim 1, wherein the seal material includes a first member that contains at least one of a resin, a metal particle(s), and a ceramic particle(s).
3. The ceramic structural body according to claim 2, wherein the seal material includes a second member that is composed of a ceramic(s) or a metal, and the first member is positioned at, at least, a part between a wall surface of the hole and the second member.
4. The ceramic structural body according to claim 3, wherein the second member is a columnar body, and at least one of a surface that faces the second member on a wall surface of the hole and a surface that faces a wall surface of the hole on the second member includes a step in an axial direction of the columnar body.
5. The ceramic structural body according to claim 3, wherein the second member is a columnar body, and includes a part where a point of contact with the substrate is provided to circle on an opposite surface for a wall surface of the hole.
6. The ceramic structural body according to claim 1, wherein the hole includes a gas with a gas pressure that is less than an atmospheric pressure.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
[0021] Hereinafter, a ceramic structural body according to the present disclosure will be explained in detail with reference to the drawing(s).
[0022] As illustrated in
[0023] Herein, the substrate 1 is composed of a ceramic(s). A ceramic(s) is/are an aluminum-oxide-based ceramic(s), a zirconium-oxide-based ceramic(s), a silicon-nitride-based ceramic(s), an aluminum-nitride-based ceramic(s), a silicon-carbide-based ceramic(s), a cordierite-based ceramic(s), a mullite-based ceramic(s), or the like.
[0024] Then, for example, an aluminum-oxide-based ceramic(s) contain(s) 70% by mass or more of aluminum oxide among 100% by mass of all components that compose such a ceramic(s). Additionally, another ceramic/other ceramics is/are also similar thereto.
[0025] Furthermore, it is possible to confirm a material of the substrate 1 by an undermentioned method. First, the substrate 1 is measured by using an X-ray diffractometer (XRD) and a value of an obtained 2θ (where 2θ is a diffraction angle) is identified by a JCPDS card. Herein, a case where presence of aluminum oxide in a substrate is confirmed by an XRD will be explained by providing it as an example. Then, quantitative analysis of aluminum (Al) is executed by using an ICP emission spectrophotometer (ICP) or an X-ray fluorescence spectrometer (XRF). Then, if a content of aluminum oxide (Al.sub.2O.sub.3) that is converted from a content of aluminum (Al) that is measured by an ICP or an XRF is 70% by mass or more, the substrate 1 is composed of an aluminum-oxide-based ceramic(s).
[0026] Additionally, although
[0027] Furthermore, the hole 2 is to discharge a binder of the substrate 1 to an outside in a degreasing step. Herein, although a shape of the hole 2 may be any shape, it may have a grid-like part as illustrated in
[0028] Furthermore, the hole 2 may be positioned at a whole inside of the substrate 1 in such a manner that there is no problem in a strength of the ceramic structural body 10. For example,
[0029] Herein, a width of a grid-like part in the hole 2 is, for example, 0.1 mm or greater and 1.0 mm or less. Furthermore, a maximum width of an opening portion that is sealed by the seal material 3 in the hole 2 is, for example, 0.1 mm or greater and 20 mm or less. Additionally, although
[0030] Then, as illustrated in
[0031] As such a configuration is satisfied, an opening portion of a hole 2 is sealed by the seal material 3 that has the first member 4 and the first member 4 is composed of a component that is solidified by heat treatment at a low temperature (300° C. or lower), so that, in the ceramic structural body 10 according to the present disclosure, a particle(s) is/are not generated from the opening portion and an amount of deformation at a time of sealing is small.
[0032] Furthermore, a resin that composes the first member 4 is, for example, an epoxy resin, a cyanate resin, an acryl resin, a maleimide resin, or the like.
[0033] Furthermore, a metal particle(s) that compose(s) the first member 4 is/are, for example, a particle(s) that is/are composed of a metal such as nickel, copper, gold, silver, ruthenium, rhodium, palladium, osmium, iridium, or platinum.
[0034] Furthermore, the first member 4 may also contain, for example, a ceramic particle(s) or the like, other than a resin or a metal particle(s).
[0035] Furthermore, it is sufficient that each component that composes the first member 4 and a content thereof are measured by an undermentioned method. First, the first member 4 is scraped or the like and a resin that is included in the first member 4 is identified by using a Fourier transform infrared spectrophotometer (FTIR). Then, the ceramic structural body 10 is cut so as to provide a cross section as illustrated in
[0036] Furthermore, as illustrated in
[0037] If such a configuration is satisfied, it is possible to seal an opening portion of the hole 2 more tightly than a case where the seal material 3 is composed of only the first member 4, so that, in the ceramic structural body 10 according to the present disclosure, a possibility of generating a particle(s) from the opening portion is low over a long period of use and reliability is improved.
[0038] Herein, if the second member 5 is composed of a ceramic(s), a substrate 1 and the second member 5 may be composed of an identical ceramic(s). Herein, the substrate 1 and the second member 5 that are composed of a ceramic(s) refer to, for example, the second member 5 that is also composed of an aluminum-oxide-based ceramic(s) in a case where the substrate 1 is composed of an aluminum-oxide-based ceramic(s). Then, if such a configuration is satisfied, thermal expansion coefficients of the substrate 1 and the second member 5 are identical and a possibility of generating a crack on the seal material 3 due to a difference between the thermal expansion coefficients is low, so that reliability under an environment with a temperature change is improved.
[0039] Furthermore, if the second member 5 is composed of a metal, the second member 5 may be a bush that has a hole that is capable of coupling with another member. If such a configuration is satisfied, it is possible to couple the ceramic structural body 10 with another member via the second member 5. Additionally, a metal that composes the second member 5 is, for example, a stainless one, titanium, or the like.
[0040] Furthermore, as illustrated in
[0041] Herein,
[0042] Then, if such a configuration is satisfied, a contact surface area for a first member 4 is increased by presence of the step 6, so that an opening portion of the hole 2 is sealed more tightly, and in the ceramic structural body 10 according to the present disclosure, a possibility of generating a particle(s) from the opening portion is low over a long period of use, so that reliability is improved.
[0043] Furthermore, as illustrated in
[0044] As illustrated in
[0045] Then, if such a configuration is satisfied, an opening portion of the hole 2 is sealed by the second member 5, and in the ceramic structural body 10 according to the present disclosure, a possibility of generating a particle(s) from the opening portion is low over a long period of use, so that reliability is improved.
[0046] As illustrated in
[0047] Additionally, a part of the second member 5f may be positioned outside a surface 1a of a substrate. Furthermore, it is assumed that an imaginary plane that is positioned on a plane that is identical to the surface 1a of a substrate is positioned above the hole 2. A part of the second member 5f may be positioned so as to be more distant from the hole 2 than an imaginary plane. Furthermore, the whole of the second member 5f may be positioned in the hole 2. Furthermore, an end part of the second member 5f may be positioned on a plane that is identical to an imaginary plane.
[0048] As illustrated in
[0049] Additionally, a part of the second member 5g may be positioned outside a surface 1a of a substrate. Furthermore, it is assumed that an imaginary plane that is positioned on a plane that is identical to the surface 1a of a substrate is positioned above the hole 2. A part of the second member 5g may be positioned so as to be more distant from the hole 2 than an imaginary plane. Furthermore, the whole of the second member 5g may be positioned in the hole 2. Furthermore, an end part of the second member 5g may be positioned on a plane that is identical to an imaginary plane.
[0050] As illustrated in
[0051] Furthermore, as illustrated in
[0052] As illustrated in
[0053] As illustrated in
[0054] Furthermore, a hole 2 in a ceramic structural body 10 according to the present disclosure may have a gas with a gas pressure that is less than an atmospheric pressure. If such a configuration is satisfied, the hole 2 serves as a heat insulation layer, so that it is possible to utilize the ceramic structural body 10 as a heat insulation material preferably.
[0055] Furthermore, a substrate 1 in a ceramic structural body 10 according to the present disclosure may have a flow path, an electrode, or the like, at a part other than a hole 2. If such a configuration is satisfied, it is possible to utilize the ceramic structural body 10 as a component of a heat exchanger, a reactor, or the like.
[0056] Hereinafter, an example of a manufacturing method for a ceramic structural body according to the present disclosure will be explained.
[0057] First, predetermined amounts of a sintering aid, a binder, a solvent, a dispersant, and the like are added to, and mixed with, a raw material powder such as an aluminum oxide (Al.sub.2O.sub.3) powder, a silicon nitride (Si.sub.3N.sub.4) powder, an aluminum nitride (AlN) powder, or a silicon carbide (SiC) powder, so as to fabricate a slurry.
[0058] Then, a green sheet is formed by using such a slurry in a doctor blade method. Alternatively, a slurry is sprayed and dried by a spray granulation method (a spray drying method) so as to execute granulation and a green sheet is formed by a roll compaction method.
[0059] Then, processing is executed for an obtained green sheet by using a publicly known method such as laser and a mold so as to provide a desired shape. Herein, a groove for degreasing is formed on a green sheet.
[0060] Then, both green sheets are laminated by a lamination method so as to obtain a molded body. Herein, if lamination is executed in such a manner that positions of both grooves of adjacent green sheets are shifted, it is possible to form a step on a surface that faces a second member in a substrate. Additionally, a slurry as described above may be used as a bonding material that is used at the time when green sheets are laminated.
[0061] Then, after an obtained molded body is dried and degreased, firing is executed in accordance with a firing condition(s) for each raw material powder so as to obtain a substrate.
[0062] Then, a site that is connected to an outside of a groove on a substrate is filled with a paste that provides a first member and contains at least one of a resin and a metal particle(s) where a total content of the resin and the metal particle(s) is 70% by mass or more. Alternatively, after a second member that is composed of a ceramic(s) or a metal is inserted into a site that is connected to an outside of a groove on a substrate, a space between the second member and the groove is filled with a paste that provides a first member.
[0063] Then, heat treatment is executed at a temperature of 80° C. or higher and 300° C. or lower, so as to obtain a ceramic structural body according to the present disclosure.
[0064] Furthermore, in order to provide a groove that has a gas with a gas pressure that is less than an atmospheric pressure, it is sufficient that a substrate is heated to 100° C. or higher and a gas that is present in a groove is discharged to an outside of the substrate, at a step of sealing a site that is connected to an outside of the groove as described above. Alternatively, it is sufficient that a step of sealing a site that is connected to an outside of the groove as described above is executed in a glove box that is filled with a gas with a gas pressure that is less than an atmospheric pressure.
[0065] Additionally, the present disclosure is not limited to an embodiment(s) as described above and a variety of modifications, improvements, and the like are possible without departing from an essence of the present disclosure.
REFERENCE SIGNS LIST
[0066] 1: substrate
[0067] 1a, 1b: surface of substrate
[0068] 2: hole
[0069] 3: seal material
[0070] 4: first member
[0071] 5: second member
[0072] 6: step
[0073] 7: recess
[0074] 8: first surface
[0075] 10: ceramic structural body