Phase change material based reconfigurable intelligent reflective surfaces

Abstract

Ultra-reconfigurable reflectarrays using vanadium dioxide (VO.sub.2) are provided, as well as methods of fabricating and using the same. The ultra-reconfigurable reflectarrays operate based on the unique phase-change properties of VO.sub.2, by including a heating element configured to heat desired areas of a VO.sub.2 layer/reflector, such that the VO.sub.2 reflector/layer can be reconfigured to have a desired pattern heated (and therefore changed to a conducting state) at a given time, with a good spatial resolution of the desired pattern.

Claims

1. A reflectarray, comprising: a substrate monolithically formed of a same material, the substrate comprising an upper surface and a lower surface opposite from the upper surface; a micro-heater matrix disposed on and facing the upper surface of the substrate and comprising a micro-heater layer and a plurality of micro-heaters, the plurality of micro-heaters being configured to be controlled to turn on or off individually; a vanadium dioxide (VO.sub.2) layer disposed on the micro-heater matrix, the VO.sub.2 layer comprising a lower surface facing the micro-heater matrix and an upper surface opposite from the lower surface, the upper surface of the VO.sub.2 layer being exposed to an outside; and a ground plane disposed below and in direct physical contact with the lower surface of the substrate, the ground plane comprising an upper surface facing the micro-heater matrix and a lower surface opposite from the upper surface, the lower surface of the around plane being exposed to the outside, the VO.sub.2 layer configured such that specific areas of the VO.sub.2 layer, corresponding to micro-heaters of the plurality of micro-heaters that are turned on and heated to a predetermined temperature, heat up and cause the specific areas of the VO.sub.2 layer to change from insulating to conducting.

2. The reflectarray according to claim 1, further comprising an intermediate layer disposed between the VO.sub.2 layer and the micro-heater matrix.

3. The reflectarray according to claim 2, the intermediate layer being a silicon carbide (SiC) layer.

4. The reflectarray according to claim 3, the intermediate layer being a hexagonal SiC (6H—SiC) layer.

5. The reflectarray according to claim 2, a dielectric constant of the intermediate layer being higher than that of the substrate.

6. The reflectarray according to claim 1, the micro-heater layer being an insulating layer.

7. The reflectarray according to claim 1, the plurality of micro-heaters being configured to be controlled to turn on or off individually via electronic control.

8. The reflectarray according to claim 1, further comprising a ground plane disposed below the substrate.

9. The reflectarray according to claim 1, further comprising a plurality of conductive lines disposed on the substrate, the plurality of conductive lines comprising a ground line and a plurality of voltage lines.

10. The reflectarray according to claim 1, the plurality of micro-heaters being contained within a patch area on the micro-heater layer, and the patch area having a width of no more than 100 μm and a length of no more than 100 μm.

11. The reflectarray according to claim 1, the predetermined temperature being at least 480 Kelvin (K).

12. A method of steering a beam using a reflectarray, the method comprising: providing the reflectarray, the reflectarray comprising: a substrate monolithically formed of a same material, the substrate comprising an upper surface and a lower surface opposite from the upper surface; a micro-heater matrix disposed on and facing the upper surface of the substrate and comprising a micro-heater layer and a plurality of micro-heaters, the plurality of micro-heaters being configured to be controlled to turn on or off individually; and a vanadium dioxide (VO.sub.2) layer disposed on the micro-heater matrix, the VO.sub.2 layer comprising a lower surface facing the micro-heater matrix and an upper surface opposite from the lower surface, the upper surface of the VO.sub.2 layer being exposed to an outside, and a ground plane disposed below and in direct physical contact with the lower surface of the substrate, the ground plane comprising an upper surface facing the micro-heater matrix and a lower surface opposite from the upper surface, the lower surface of the around plane being exposed to the outside, the VO.sub.2 layer configured such that specific areas of the VO.sub.2 layer, corresponding to micro-heaters of the plurality of micro-heaters that are turned on and heated to a predetermined temperature, heat up and cause the specific areas of the VO.sub.2 layer to change from insulating to conducting; controlling the plurality of micro-heaters to turn on a subset of micro-heaters of the plurality of micro-heaters and allow the subset of micro-heaters to heat to the predetermined temperature, such that the specific areas of the VO.sub.2 layer change from insulating to conducting in a desired pattern for steering the beam; and providing the beam from a feed antenna towards the reflectarray such that the VO.sub.2 layer with the specific areas forming the desired pattern reflects and steers the beam.

13. The method according to claim 12, the reflectarray further comprising an intermediate layer disposed between the VO.sub.2 layer and the micro-heater matrix, and a dielectric constant of the intermediate layer being higher than that of the substrate.

14. The method according to claim 13, the intermediate layer being a hexagonal silicon carbide (6H—SiC) layer.

15. The method according to claim 12, the micro-heater layer being an insulating layer.

16. The method according to claim 12, the plurality of micro-heaters being configured to be controlled to turn on or off individually via electronic control.

17. The method according to claim 12, the reflectarray further comprising: a ground plane disposed below the substrate; and a plurality of conductive lines disposed on the substrate, the plurality of conductive lines comprising a ground line and a plurality of voltage lines.

18. The method according to claim 12, the plurality of micro-heaters being contained within a patch area on the micro-heater layer, and the patch area having a width of no more than 100 μm and a length of no more than 100 μm.

19. The method according to claim 12, the predetermined temperature being at least 480 Kelvin (K).

20. A reflectarray, comprising: a substrate monolithically formed of a same material, the substrate comprising an upper surface and a lower surface opposite from the upper surface; a micro-heater matrix disposed on and facing the upper surface of the substrate and comprising a micro-heater layer and a plurality of micro-heaters, the plurality of micro-heaters being configured to be controlled to turn on or off individually; and a vanadium dioxide (VO.sub.2) layer disposed on the micro-heater matrix, the VO.sub.2 layer comprising a lower surface facing the micro-heater matrix and an upper surface opposite from the lower surface, the upper surface of the VO.sub.2 layer being exposed to an outside; an intermediate layer disposed between the VO.sub.2 layer and the micro-heater matrix; a ground plane disposed below and in direct physical contact with the lower surface of the substrate, the ground plane comprising an upper surface facing the micro-heater matrix and a lower surface opposite from the upper surface, the lower surface of the ground plane being exposed to the outside; and a plurality of conductive lines disposed on the substrate, the plurality of conductive lines comprising a ground line and a plurality of voltage lines, the VO.sub.2 layer configured such that specific areas of the VO.sub.2 layer, corresponding to micro-heaters of the plurality of micro-heaters that are turned on and heated to a predetermined temperature, heat up and cause the specific areas of the VO.sub.2 layer to change from insulating to conducting, a dielectric constant of the intermediate layer being higher than that of the substrate, the intermediate layer being a hexagonal silicon carbide (SiC) layer, the micro-heater layer being an insulating layer, the plurality of micro-heaters being configured to be controlled to turn on or off individually via electronic control, the plurality of micro-heaters being contained within a patch area on the micro-heater layer, and the patch area having a width of no more than 100 μm and a length of no more than 100 μm, and the predetermined temperature being at least 480 Kelvin (K).

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 shows an exploded schematic view of a reflectarray, according to an embodiment of the subject invention.

(2) FIG. 2 shows a cross-sectional view of a reflectarray, according to an embodiment of the subject invention. The enlarged portion shows a close-up of a heating element.

(3) FIG. 3(a) shows a schematic view of a hybrid simulation with master and slave boundaries. The scale bar is 4 millimeters (mm) at the halfway point and 8 mm at the end of the black section.

(4) FIG. 3(b) shows a cross-sectional view of a reflectarray, according to an embodiment of the subject invention, with a gap representing air and bonding laminate. The scale bar is 0.25 mm at the halfway point and 0.5 mm at the end of the black section.

(5) FIG. 4 shows a plot of reflection phase (in degrees) versus square patch size (in mm), showing simulated reflection phase curves of three different hybrid structures at a frequency of 32 gigahertz (GHz). The curve with the square data points is for the hybrid design, with the intermediate layer directly bonded to the substrate; the curve with the circular data points is for the hybrid design with an airgap (an imperfect bond between the intermediate layer and the substrate); and the curve with the triangular data points is for the hybrid design with a thermal bonding film between the intermediate layer and the substrate.

(6) FIG. 5 shows a plot of losses (in decibels (dB)) versus square patch size (in mm), showing simulated reflection loss curves of three different hybrid structures at a frequency of 32 GHz. The curve with the square data points is for the hybrid design, with the intermediate layer directly bonded to the substrate; the curve with the circular data points is for the hybrid design with an airgap (an imperfect bond between the intermediate layer and the substrate); and the curve with the triangular data points is for the hybrid design with a thermal bonding film between the intermediate layer and the substrate.

(7) FIG. 6 shows surface temperature (in Kelvin (K)) in a cross-sectional view of an intermediate layer (of hexagonal silicon carbide (6H—SiC)), illustrating how thermal evolution propagates to the surface.

(8) FIG. 7 shows line graph temperature (in K) in a cross-sectional view of a reflectarray, illustrating heat propagation from a rear of a heating element to the surface of a vanadium dioxide (VO.sub.2) layer.

(9) FIG. 8 shows line graph temperature (in K) in a cross-sectional view of a reflectarray, illustrating a thermal spot created at the surface of a VO.sub.2 layer, with a 100 μm patch size.

(10) FIG. 9(a) shows a plot of temperature (in K) versus time (in seconds (s)), illustrating high resolution time-dependent analysis at the center of the patch, the edge of the patch, and at the midpoint between patch edges. The (black) line with the square data points is for the center; the (red) line with the circular data points is for the edge; and the (blue) line with the triangular data points is for the midpoint.

(11) FIG. 9(b) shows a plot of temperature (in K) versus time (in s), illustrating high resolution time-dependent analysis, for an on-off-on cycle, at the center of the patch, the edge of the patch, and at the midpoint between patch edges. The (black) line with the square data points is for the center; the (red) line with the circular data points is for the edge; and the (blue) line with the triangular data points is for the midpoint.

(12) FIG. 10 shows a plot of reflection phase (in degrees) versus square patch size (in mm), illustrating reflection phase curves for a base design with varying materials. The (black) line with the square data points is for a Rogers material; the (red) line with the circular data points is for SiC; the (blue) line with the right-side-up triangular data points is for beryllium oxide (BeO); and the (pink) line with the upside-down triangular data points is for aluminium nitride (AlN).

(13) FIG. 11(a) shows a cross-sectional view of a conventional reflectarray with only metal and Rogers 5880®.

(14) FIG. 11(b) shows a cross-sectional view of a reflectarray according to an embodiment of the subject invention. Although FIG. 11(b) lists certain materials and thicknesses, these are for exemplary purposes only, and embodiments of the subject invention are not limited thereto.

(15) FIG. 12(a) shows a plot of reflection phase (in degrees) versus square patch size (in mm) illustrating reflection phase curves of three different simulated hybrid structures at a frequency of 32 GHz. The (black) line with the square data points is for a non-hybrid; the (red) line with the circular data points is for the ideal case; the (blue) line with the right-side-up triangular data points is for an air gap; the (pink) line with the upside-down triangular data points is for bond-SiC; the (green) line with the diamond data points is for bond-BeO; and the (dark blue) line with the left-pointing triangular data points is for bond-AlN.

(16) FIG. 12(b) shows a plot of losses (in dB) versus square patch size (in mm) illustrating reflection loss curves of three different simulated hybrid structures at a frequency of 32 GHz. The (black) line with the square data points is for a non-hybrid; the (red) line with the circular data points is for the ideal case; the (blue) line with the right-side-up triangular data points is for an air gap; the (pink) line with the upside-down triangular data points is for bond-SiC; the (green) line with the diamond data points is for bond-BeO; and the (dark blue) line with the left-pointing triangular data points is for bond-AlN.

(17) FIG. 12(c) shows a plot of reflection phase (in degrees) versus square patch size (in mm) illustrating reflection phase curves of a simulated standard structure and hybrid structure (see FIG. 11(b)) at a frequency of 5 GHz. The (black) line with the square data points is for the non-hybrid; and the (red) line with the circular data points is for the hybrid.

(18) FIG. 12(d) shows a plot of losses (in dB) versus square patch size (in mm) illustrating reflection loss curves of a simulated standard structure and hybrid structure (see FIG. 11(b)) at a frequency of 5 GHz. The (black) line with the square data points is for the non-hybrid; and the (red) line with the circular data points is for the hybrid.

DETAILED DESCRIPTION

(19) Embodiments of the subject invention provide novel and advantageous ultra-reconfigurable reconfigurable intelligent surfaces (RISs) (e.g., reflectarrays) and metasurfaces using phase change materials (e.g., vanadium dioxide (VO.sub.2)), and methods of fabricating and using the same. VO.sub.2 is discussed extensively herein as an example, but embodiments are not limited thereto; the devices and methods of embodiments of the subject invention can be realized using any phase change material with suitable characteristics. The ultra-reconfigurable RISs (e.g., reflectarrays) and metasurfaces operate based on the unique phase-change properties of the phase change material (e.g., VO.sub.2), by including a heating element configured to heat desired areas of a phase change material layer/reflector (e.g., a VO.sub.2 layer/reflector), such that the phase change material layer/reflector (e.g., VO.sub.2 layer/reflector) can be reconfigured to have a desired pattern heated (and therefore activated) at a given time, with a good spatial resolution of the desired pattern. Reflectarrays using VO.sub.2 as the main reflector do not exist in the art, and an ultra-reconfigurable metasurface reflectarray antenna utilizing VO.sub.2 can mitigate the limitations that currently exist with respect to highly reconfigurable reflectarrays.

(20) As a metal-to-insulator transition (MIT) material, VO.sub.2 transitions to a metallic state when it is heated above a critical temperature of about 69° C. (343 K). This transition occurs due to a change in its crystal structure, which changes from monoclinic to a tetragonal structure. In order to achieve this transition, various methods can be used such as conductive heating, photo-thermal heating, Joule heating, and optical stimuli. This transition has also been attained using static electric fields. Due to the changes in resistivity and permittivity brought about by the transition, VO.sub.2 is an attractive material for applications in switching, optics, thermal diodes, antennas, waveguides, and resonators.

(21) FIG. 1 shows an exploded schematic view of a reflectarray 100 of an embodiment of the subject invention. Referring to FIG. 1 a phase change material layer 110 (e.g., a VO.sub.2 layer) can be disposed on a high-density micro-heater matrix 120 comprising micro-heaters (or pixels) 125 that can be switched on or off (e.g., via electronic control) and a micro-heater layer 127 (e.g., an insulating layer). The phase change material layer 110 can be referred to herein as the VO2 layer, but it is to be understood that it can be another phase change material with suitable characteristics. By controlling the micro-heaters 125 in this manner, the heat can be transferred to the VO.sub.2 110 layer and heat specific pixels of the VO.sub.2 layer 110 to change the resistivity of the VO.sub.2 in a desired pattern. That is, by activating certain micro-heaters 125 in a desired pattern, the VO.sub.2 can be heated in the same desired pattern, thereby changing the properties in the desired pattern within the VO.sub.2 layer 110 (or “activating” the VO.sub.2 layer 110 in the desired pattern (e.g., by changing from insulator to conductor when heated). The VO.sub.2 layer 110 can function as a reflector or main reflector, and this “activation” can change the reflecting properties of the VO.sub.2 layer 110 in whatever pattern is desired, down to the resolution of the size of the micro-heaters 125. FIG. 2 shows a cross-sectional view of the reflectarray 100, with a close-up of the micro-heaters 125. FIG. 11(b) shows a cross-sectional view of the reflectarray, while FIG. 11(a) shows a cross-sectional view of a conventional design for comparison.

(22) Referring still to FIG. 1, the micro-heater matrix 120 can be disposed on a substrate 130. Any suitable substrate can be used, such as a glass or laminate substrate. For example, the substrate 130 can comprise glass microfiber and/or polytetrafluoroethylene (PTFE) (e.g., a Duroid® substrate, such as Rogers 5880®). The substrate 130 can optionally include conductive lines 135 (e.g., one or more voltage lines and/or one or more ground lines) disposed thereon or therein. The reflectarray 100 can optionally further include an intermediate layer 160 disposed between the VO2 layer 110 and the micro-heater matrix 120. The intermediate layer 160 may function as a secondary substrate and can have a lower dielectric constant than the substrate 130 does. The reflectarray 100 can optionally further include a conductive ground plane 150 disposed below the substrate 130. An adhesive (not shown) can optionally be present between two or more of the adjacent elements (e.g., in one embodiment an adhesive (e.g., a thermal bonding film such as Rogers 3001® thermal bonding film) can be present between the substrate 130 and the intermediate layer 160).

(23) The thickness of the VO.sub.2 layer 110 can be any of the following values, about any of the following values, at least any of the following values, or greater than any of the following values (all values are in micrometers (μm)): 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 80, 90, or 100. For example, the thickness of the VO.sub.2 layer 110 can be 1 μm or about 1 μm.

(24) The micro-heater layer 127 can be, for example, an insulating layer. The material of the micro-heater layer 127 can be any suitable material known in the art (e.g., silicon dioxide (SiO.sub.2). The micro-heaters 125 can be any suitable heating element material known in the art (e.g., nickel chromium (NiCr)). The width and/or length of each micro-heater 125 can be any of the following values, about any of the following values, at least any of the following values, or greater than any of the following values (all values are in μm): 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 15, 20, 25, or 30. For example, the width and/or length of each micro-heater 125 can be 5 μm or about 5 μm.

(25) 6H—SiC could not be used directly as a substrate material due to its high dielectric constant of ˜10.03, compared to conventional substrates like Rogers 5880 (2.2), Taconic TLX (2.4) or FR4 (4.4). Considering that it is necessary to have both high thermal conductivity and lower dielectric constant to transfer heat efficiently, as well as not attenuating the wave, we decided to go with a hybrid substrate approach that combined the 6H—SiC with Rogers 5880. The substrate 130 should have a dielectric constant of less than 10, and preferably less than 5. The substrate 130 can be, for example, Rogers 5880® (dielectric constant of 2.2), Taconic TLX® (dielectric constant of 2.4), or FR4 (dielectric constant of 4.4). This also means that hexagonal silicon carbide (6H—SiC) does not make for a good direct substrate 130 (though it may be used as an intermediate layer 160). The thickness of the substrate 130 can be any of the following values, about any of the following values, at least any of the following values, or greater than any of the following values (all values are in μm): 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 150, 200, 250, 300, 350, 360, 370, 380, 390, 395, 400, 405, 410, 420, 430, 440, 450, 500, 550, 600, 650, 700, 750, 800, 900, or 1000. For example, the thickness of the substrate 130 can be 400 μm or about 400 μm.

(26) The conductive lines 135 can be any suitable material known in the art (e.g., nickel). The width of the conductive lines (if present) can be any of the following values, about any of the following values, at least any of the following values, or greater than any of the following values (all values are in μm): 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 15, 20, 25, or 30. For example, the width of the conductive lines (if present) can be 5 μm or about 5 μm.

(27) The intermediate layer 160 can be, for example, a semiconductor layer, though embodiments are not limited thereto. In some embodiments, the intermediate layer can be a silicon-containing layer, such as a silicon carbide layer (e.g., 6H—SiC). The thickness of the intermediate layer (if present) can be any of the following values, about any of the following values, at least any of the following values, or greater than any of the following values (all values are in μm): 10, 20, 30, 40, 50, 60, 70, 80, 90, 95, 100, 105, 110, 120, 130, 140, 150, 200, 250, 300, 350, 400, 500, 600, 700, 800, 900, or 1000. For example, the thickness of the intermediate layer (if present) can be 100 μm or about 100 Also, the conductive ground plane 150 (if present) can be any conductive material (e.g., copper (Cu), aluminium (Al), silver (Ag), gold (Au), platinum (Pt), or palladium (Pd)).

(28) When the term “about” is used herein, in conjunction with a numerical value, it is understood that the value can be in a range of 95% of the value to 105% of the value, i.e. the value can be +/−5% of the stated value. For example, “about 1 kg” means from 0.95 kg to 1.05 kg.

(29) Embodiments of the subject invention provide advantages over related art devices, which are fixed designs for reflectarrays. The limitations due to the fixed designs are narrow bandwidth on patch elements and differential spatial phase delay. With the ability to reconfigure the reflecting surface in a high-speed manner, embodiments of the subject invention can expand and/or tailor bandwidth as needed, as well as account for changes in the spatial phase delay.

(30) Embodiments of the subject invention can be used for tailoring signals around objects that would undermine signal quality/strength. Smart RF environments could also use reflectarrays of embodiments to tailor high strength signals to specific areas around hallways, offices, neighborhoods, and city blocks all in real-time.

(31) Embodiments of the subject invention provide ultra-reconfigurable devices based on the MIT property of VO.sub.2. A VO.sub.2 layer can be disposed on a high-density micro-heater matrix comprising pixels that can be switched on or off as desired (e.g., via electronic control). Controlling the pixels in this manner, heat can be transferred to the selected areas of the VO.sub.2 layer, converting the selected areas to the highly conductive metallic phase of VO.sub.2. This technique allows dynamic changing of the shape of the reflection antenna surface with high speed. The reflectarray is useful for 5G applications operating in a wide bandwidth (e.g., 32 to 86 GHz). Devices of embodiments of the subject invention can serve as a novel platform for ultra-reconfigurable reflectarrays and metasurfaces for various radio frequency (RF) applications in a wide spectral range.

(32) A greater understanding of the embodiments of the subject invention and of their many advantages may be had from the following examples, given by way of illustration. The following examples are illustrative of some of the methods, applications, embodiments, and variants of the present invention. They are, of course, not to be considered as limiting the invention. Numerous changes and modifications can be made with respect to the invention.

Example 1

(33) A unit cell of a reflectarray antenna was designed and simulated to examine characteristics of the unit cell. The unit cell is the fundamental unit that makes the whole of the reflectarray, and by changing the physical characteristics of the unit cell, the phase response can provide the phase design curve. The numerical analysis results were obtained by using Ansys HFSS. The master and slave boundaries were used as the periodic boundary conditions, and the fields ports were implemented using Floquet ports. In order to verify the simulations, results were replicated for an existing design using conventional RF materials and for 32 GHz operation (Nayeri et al., Reflectarray Antennas: Theory, Designs, and Applications, John Wiley & Sons Ltd, 2018; which is hereby incorporated by reference herein in its entirety). Because it is necessary to have high thermal conductivity and low dielectric constant to transfer heat efficiently, as well as not attenuating the wave, a hybrid substrate approach was used with a substrate of Rogers 5880® and an intermediate layer of 6H—SiC with Rogers 5880. FIGS. 3(a) and 3(b) show the structure of this hybrid approach (including the intermediate layer 160) in HFSS. Three versions of the simulation were considered: one assuming an ideal bond (direct attachment of 6H—SiC on the Rogers 5880®); one assuming an imperfect bond including a 5 μm air gap; and one using Rogers 3001® thermal bonding film. The thickness of the substrate was 400 μm, and the thickness of the 6H—SiC intermediate layer was 100 μm. The inter-element spacing was selected as 0.5λ, where λ is the free-space wavelength at 32 gigahertz (GHz). The heating element comprised a square patch that varied in length and width from 0.5 millimeters (mm) to 4.5 mm at an interval of 0.1 mm. The resistivity of the VO.sub.2 layer was assumed to be ρ=10.sup.−5 Ohm-meters (Ω-m), which is a conservative value compared to experimentally achieved ones, and the thickness of the VO.sub.2 layer was 1 μm.

(34) FIG. 4 shows a plot of reflection phase (in degrees) versus square patch size (in mm), showing simulated reflection phase curves of the three different hybrid structures at a frequency of 32 GHz. The characteristics show well-defined S-curves typical for reflection arrays covering a large phase range of about 310°. There is practically no difference between the three investigated hybrid cases, which indicates flexibility in physical implementation.

(35) FIG. 5 shows a plot of losses (in decibels (dB)) versus square patch size (in mm), showing simulated reflection loss curves of the three different hybrid structures at a frequency of 32 GHz. The results show practically the same loss characteristics with a reflection loss no greater than −0.17 dB for all three cases. It's important to note that for the sake of efficiency, the micro-heater matrix was left out from the HFSS simulations, as it is only 66 μm and makes up less than 0.01λ, which would be expected to have minimal impact (if any) on the s-curve.

Example 2

(36) In order to verify thermal propagation through the 6H—SiC intermediate layer, as well as verify patch size, thermal simulations were performed using a commercial multiphysics finite element model (FEM) (COMSOL™) with the joule heating module with an electromagnetic heat source and physics of heat transfer in solids.

(37) FIG. 6 shows the design in COMSOL™ after a steady state solution, and also shows surface temperature (in Kelvin (K)) in a cross-sectional view of the intermediate layer (of 6H—SiC), illustrating how thermal evolution propagates to the surface. This analysis allowed for fine tuning of the distance between the micro-heaters such that the pixels' transition edges just overlap enough to create a seamless and thermally homogeneous connection between pixels. Thermal analysis also allowed for fine tuning of the micro-heater serpentine parameters so that it could be made as efficient as possible. The meandered heating element is 66 μm×65 μm and has a 15.5 Volt (V) potential applied across it. The rear of the device is kept at room temperature, a condition which could be easily satisfied physically by using a cooling element.

(38) FIGS. 7 and 8 show plots of heat propagating from the bottom up to the surface, and from the center of the VO.sub.2 surface towards the outer edge, respectively. These are for a reflectarray as described in Example 1. Referring to FIGS. 7 and 8, the data prove that it is possible to heat up the top VO.sub.2 layer to 345 K and thereby convert from insulating phase to highly conductive metallic phase by heating the matrix elements to 490 K. The lateral temperature distribution data verifies that a 100 μm×100 μm patch size can be attained by using the structure of embodiments of the subject invention and the thermal conditions described in this example.

Example 3

(39) A simulation was performed similar to Example 1, using a reflectarray as described in Example 1, but with heating of a pixel size of 615 μm×615 μm to generate metallic VO.sub.2 patches or arbitrary shapes with the same spatial resolution. A large phase range of about 360° and low loss between −0.13 dB and −0.48 dB were obtained.

Example 4

(40) A time-dependent analysis was also conducted on a reflectarray as described in Example 1. The time-dependent solution is given by:

(41) $\begin{array}{cc}\rho C_p\frac{\partial T}{\partial t}+\rho C_{p}u.Math.\nabla T=\nabla .Math.\left(k\nabla T\right)+Q,& \left(1\right)\end{array}$
where T, t, ρ, Cp, u, k represent the temperature, time, mass density, heat capacity, velocity vector, and thermal conductivity of the medium, respectively. FIG. 9(a) shows the temperature at three different positions: the center of the patch; the edge of the patch; and at the midpoint between patch edges. The time-dependent analysis shows that the device can reach the transition temperature threshold within 5 milliseconds (ms).

(42) The same points on the patch were also analyzed during an on-off-on cycle to understand the complete cycle turnaround time for the unit cell, with results shown in FIG. 9(b). The time for the cell to completely reach room temperature, using passive cooling via radiative and atmospheric losses, then back to its transition temperature was about 15 ms. This transient time could be further improved if thermal management methods are employed. These results show that fast transition times can be achieved, and these are important for real-time reconfiguring of the patch size, shape, and distribution.

Example 5

(43) Ansys HFSS was used for numerical analysis of the radio frequency (RF) reflection characteristics of a unit cell. The master and slave boundaries were used as the periodic boundary conditions, and the fields ports were implemented using Floquet ports. In order to verify the simulations, results of an existing design using conventional RF materials and for 32 GHz operation were replicated. FIG. 10 shows the replicated reflection phase curve, as well as the curve when Rogers is replaced with various materials. This design was used to verify the simulation integrity.

Example 6

(44) FIGS. 11(b) and 11(a) show the structure of the hybrid approach in contrast to the conventional design, respectively. Three versions of the simulation were considered: one assuming an ideal bond (direct attachment of SiC on the Rogers 5880®); an imperfect bond including a 5 μm air gap; and one using 5 μm of Rogers 3001® thermal bonding film. For the hybrid analysis, 400 μm-thick Rogers 5880® and 100 μm-thick 6H—SiC were used. As alternatives to 6H—SiC, 100 μm-thick BeO and AlN were also analyzed with the hybrid approach. The inter-element spacing was selected as 0.5λ, where λ is the free-space wavelength at 32 GHz.

(45) The element included square patch that varies in length and width from 0.5 mm to 4.5 mm at an interval of 0.1 mm. ρ=10.sup.−5 Ohm-meters (Ω-m), which is a conservative value compared to experimentally achieved ones, and the thickness of the VO.sub.2 layer was 1 μm.

(46) FIG. 12(a) shows the reflection angle as a function of the square patch size of the investigated structures with the ideal bond, imperfect bond, and Rogers 3001® cases. The results showed a well-defined S-curve typical for reflection arrays covering a large phase range of about 310°. There was practically no difference between the investigated three hybrid cases, which indicates flexible physical implementation.

(47) FIG. 12(b) shows the losses in dB for the same designs. The results showed practically the same loss characteristics with a reflection loss no greater than −0.17 dB for all three cases. It is important to note that for the sake of efficiency, the heating matrix was left out from the HFSS simulations, as each is only 66 μm and makes up less than 0.01λ, which would be expected to have little to no impact on the S-curve.

(48) Mid-band 5G range, which is current communications technology, was also probed. This range is considered to be between 1 GHz to 6 GHz. A reflectarray unit cell was designed using both standard design structure and the hybrid structure to achieve the ultra-reconfigurability using VO.sub.2. Due to the change in frequency, the dimensions of the reflectarray patch would have to change. The inter-element spacing was selected as 0.5λ, where λ is the free-space wavelength at 5 GHz. The element included a square patch that varies in length and width from 10 mm to 28 mm at an interval of 0.5 mm. For the hybrid analysis, 3 mm-thick Rogers 5880® and 100 μm-thick 6H—SiC were used. FIG. 12(c) shows the reflection phase curves, and FIG. 12(d) shows the reflection loss curves.

(49) It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application.

(50) All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification.