MOTHERBOARD ARRANGEMENT METHOD FOR IMPROVING COMPUTER PERFORMANCE AND MOTHERBOARD THEREOF

Abstract

In view of the existing problems affecting computer performance due to poor CPU cooling, this disclosure provides a motherboard arrangement method for improving the performance of the computer and a motherboard thereof, CPU being arranged on the back side of the circuit board, memory slots, expansion slots, peripheral interfaces and other components being arranged on the front side of the circuit board. The heat generated by CPU is directly transferred into a space between the back side of the motherboard and the corresponding side of the case through the cooling fan, the effective cooling and insulation space is formed in the case. It is easy for air circulation, to exhaust hot air outside the case by the power fan, and to make the cold air outside the case inside to improve the cooling efficiency greatly.

Claims

1. A motherboard arrangement method for improving the stability of the computer comprising: arranging a CPU on the back side of the main circuit board opposite to the side where a memory slot, expansion slot, peripheral interface and other components arranged, forming an expansion of the ventilation cooling channel for CPU with the back side of the main circuit board and the side wall of the case, arranged a ventilation hole on the side wall of the case near the CPU.

2. The motherboard arrangement method according to the claim 1, wherein the CPU is directly welded or plugged via the carrier socket of CPU onto the back side of the main circuit board.

3. The motherboard arrangement method according to the claim 1, wherein the CPU is directly welded or plugged onto an attached circuit board via the carrier socket of CPU, the attached circuit board is connected with the main circuit board via an adapter card, and the adapter card is provided on the back side of the main circuit board.

4. The motherboard arrangement method according to the claim 3, wherein the attached circuit board is fixed to the case wall towards the back side of the motherboard.

5. A motherboard for improving computer stability comprising a main circuit board (2), a CPU (1), a memory slot (3), an expansion slot (4), and a peripheral interface (5), wherein the memory slot (3), expansion slot (4), and peripheral interface (5) are located on the front side of the main circuit board (2), the CPU is located on the back side of the main circuit board (2), an expansion of ventilation cooling channel for CPU is consisted of the back side of the main circuit board and the side wall of the case, and a ventilation hole is provided on the side wall of the case near the CPU.

6. The motherboard according to the claim 5, wherein the CPU is directly welded or plugged via the carrier socket of CPU onto the back side of the main circuit board (2).

7. The motherboard according to the claim 5, further comprising an attached circuit board (6) and an adapter card (7), wherein the CPU is located on the attached circuit board (6), the attached circuit board (6) is fixed on the case wall towards the back side of the main circuit board (2), the attached circuit board (6) is connected with the main circuit board (2) through the adapter card (7).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is the common arrangement of computer motherboard in the art;

[0009] FIG. 2 is a motherboard technical solution of the present disclosure;

[0010] FIG. 3 is another motherboard technical solution of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0011] As shown in FIG. 2, an embodiment of the present disclosure is provided. The computer motherboard includes CPU 1 and its carrier socket, a memory slot 3, an expansion slot 4, and a peripheral interface 5, etc., wherein, CPU 1 and its carrier socket are located on the back side of the main circuit board, the memory slot 3, expansion slot 4, and peripheral interface 5, etc. are located on the front side of the main circuit board, CPU carrier socket is connected to the memory slot 3, expansion slot 4, peripheral interface 5 and other components via the printed circuits on the surface or interior of the main circuit board, and CPU 1 is plugged into the CPU carrier socket.

[0012] As shown in FIG. 3, another embodiment of the present disclosure is provided. The difference from the above embodiment is that the computer motherboard further includes an attached circuit board 6 and an adapter card 7, CPU 1 and its carrier socket are located on the attached circuit board 6, the attached circuit board 6 is fixed at the wall of case where the back side of the main circuit board is located, the memory slot 3, expansion slot 4, and peripheral interface 5 are located on the front side of the main circuit board, and the attached circuit board 6 is connected to the main circuit board via the adapter card 7. Because the CPU is provided with heat sinks and fans, and with heavy weight, this embodiment can make the motherboard weight balance. When using the motherboard, the interior of the computer case should be adjusted appropriately, including the height of the bracket fixing the main circuit board of the computer should be increased, so that there is sufficient space for the corresponding CPU and the heat exchanger fan thereon to be installed in place. At the same time, the corresponding ventilation hole is drilled on the case wall near the CPU fan. Because a large space exists above the motherboard, so the height increase of computer main circuit board bracket will not affect the other components in the computer, it is also easy to achieve in the circuit technology without increasing costs, and the product competitiveness is enhanced.