SYSTEM AND METHOD OF OPERATING BATTERIES
20210305608 · 2021-09-30
Inventors
Cpc classification
H01M8/0687
ELECTRICITY
Y02E60/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01D69/125
PERFORMING OPERATIONS; TRANSPORTING
B01D2325/20
PERFORMING OPERATIONS; TRANSPORTING
International classification
H01M8/0662
ELECTRICITY
Abstract
In one or more embodiments, a battery may include one or more cells and one or more enclosures that respectively enclose the one or more cells. For example, at least a portion of each enclosure of the one or more enclosures may include a zeolite material that is configured to permit first molecules associated with a first diameter to exit the enclosure and configured to inhibit second molecules associated with a second diameter, greater than the first diameter, from entering the enclosure. In one instance, the first molecules may include CO.sub.2 molecules. In another instance, the second molecules may include H.sub.2O molecules. In one or more embodiments, the zeolite material may be a DDR-type zeolite material. For example, the DDR-type zeolite material may be applied on a porous α-alumina substrate. In one or more embodiments, the battery may provide power to one or more components of an information handling system.
Claims
1. An information handling system, comprising: at least one processor; a memory medium, coupled to the at least one processor, that stores instructions executable by the at least one processor; and a battery configured to provide power to the at least one processor and the memory medium; wherein the battery includes: one or more cells; and one or more enclosures that respectively enclose the one or more cells, wherein at least a portion of each of the one or more enclosures includes a zeolite material that is configured to permit first molecules associated with a first diameter to exit the enclosure and to inhibit second molecules associated with a second diameter, greater than the first diameter, from entering the one or more enclosures.
2. The information handling system of claim 1, wherein the first molecules include carbon dioxide (CO.sub.2) molecules; and wherein the second molecules include water (H.sub.2O) molecules.
3. The information handling system of claim 2, wherein the battery is a lithium-ion battery; and wherein the one or more cells include one or more lithium-ion cells.
4. The information handling system of claim 1, wherein the zeolite material is a DDR-type zeolite material.
5. The information handling system of claim 4, wherein the DDR-type zeolite material is applied on the porous substrate.
6. The information handling system of claim 5, wherein the porous substrate is an α-alumina substrate.
7. The information handling system of claim 1, wherein each of the first molecules has a diameter greater than 0.01 nanometers (nm) and less than 0.27 nm; and wherein each of the second molecules has a diameter greater than 0.27 nm and less than 10 nm.
8. A method, comprising: configuring an enclosure, for a cell of a battery, with a portion of the enclosure operable for a zeolite material that is configured to permit first molecules associated with a first diameter to travel through the zeolite material and to inhibit second molecules associated with a second diameter, greater than the first diameter, from traveling through the zeolite material; fastening the zeolite material in the portion of the enclosure operable for the zeolite material; and enclosing the cell of the battery in the enclosure.
9. The method of claim 8, wherein the zeolite material includes DDR-type zeolite material.
10. The method of claim 9, wherein the zeolite material is applied on a porous substrate; and wherein the porous substrate that permits the first molecules to travel through the porous substrate.
11. The method of claim 10, further comprising: applying the zeolite material on the porous substrate.
12. The method of claim 10, wherein the porous substrate is an α-alumina substrate.
13. The method of claim 8, wherein each of the first molecules has a diameter greater than 0.01 nanometers (nm) and less than 0.27 nm; and wherein each of the second molecules has a diameter greater than 0.27 nm and less than 10 nm.
14. The method of claim 8, wherein the first molecules include carbon dioxide (CO.sub.2) molecules; and wherein the second molecules include water (H.sub.2O) molecules.
15. The method of claim 14, wherein the battery is a lithium-ion battery; and wherein the cell includes a lithium-ion cell.
16. A battery, comprising: one or more cells; and one or more enclosures that respectively enclose the one or more cells, wherein at least a portion of each of the one or more enclosures includes a zeolite material that is configured to permit first molecules associated with a first diameter to exit the enclosure and to inhibit second molecules associated with a second diameter, greater than the first diameter, from entering the one or more enclosures.
17. The battery of claim 16, wherein the first molecules include carbon dioxide (CO.sub.2) molecules; and wherein the second molecules include water (H.sub.2O) molecules.
18. The battery of claim 17, wherein the battery is a lithium-ion battery; and wherein the one or more cells include one or more lithium-ion cells.
19. The battery of claim 17, wherein the zeolite material is a DDR-type zeolite material; and wherein the DDR-type zeolite material is applied on a porous α-alumina substrate.
20. The battery of claim 17, wherein each of the first molecules has a diameter greater than 0.01 nanometers (nm) and less than 0.27 nm; and wherein each of the second molecules has a diameter greater than 0.27 nm and less than 10 nm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] For a more complete understanding of the present disclosure and its features/advantages, reference is now made to the following description, taken in conjunction with the accompanying drawings, which are not drawn to scale, and in which:
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DETAILED DESCRIPTION
[0020] In the following description, details are set forth by way of example to facilitate discussion of the disclosed subject matter. It should be apparent to a person of ordinary skill in the field, however, that the disclosed embodiments are examples and not exhaustive of all possible embodiments.
[0021] As used herein, a reference numeral refers to a class or type of entity, and any letter following such reference numeral refers to a specific instance of a particular entity of that class or type. Thus, for example, a hypothetical entity referenced by ‘12A’ may refer to a particular instance of a particular class/type, and the reference ‘12’ may refer to a collection of instances belonging to that particular class/type or any one instance of that class/type in general.
[0022] In one or more embodiments, it may be advantageous to permit the enclosure of the battery to release the gases that are emitted during operation of the battery to prevent the gases from exceeding the threshold pressure. For example, a vent may release the gases that are emitted during operation of the battery, but the vent may also permit other gases to enter the enclosure. For instance, the other gases may damage and/or degrade the one or more cells of the battery. As an example, water gas may damage and/or degrade the one or more cells of the battery. As another example, carbon dioxide (CO.sub.2) may be a gas emitted during operation of the battery. For instance, a cell of a battery may produce CO.sub.2 molecules during operation of the battery.
[0023] In one or more embodiments, it may be advantageous to configure the enclosure of the battery to include a porous material that permits the gases that are emitted during operation of the battery to exit the enclosure while inhibiting or stopping the other gases to enter the enclosure. In one example, the porous material may permit molecules associated with a first diameter to pass through the porous material. In another example, the porous material may inhibit molecules associated with a second diameter from passing through the porous material. For instance, the second diameter may be greater than the first diameter.
[0024] In one or more embodiments, the porous material may include pores that are associated with a window opening. In one example, the window opening may be associated with a length and a width. In another example, the window opening of the porous material may be associated with a diameter. In one or more embodiments, the porous material may permit molecules with a diameter less or equal to than a window opening of the porous material to pass through while inhibiting molecules with a diameter greater than the window opening of the porous material. For example, inhibiting molecules with the diameter greater than the window opening of the porous material may include rejecting molecules with the diameter greater than the window opening of the porous material.
[0025] In one or more embodiments, permitting molecules of up to a size to penetrate pores of the porous material while rejecting molecules greater than the size may be called or termed molecular sieving. As an example, a CO.sub.2 molecule may be associated with a diameter of 0.232 nanometers (nm). As another example, a water (H.sub.2O) molecule may be associated with a diameter of 0.275 nm. In one or more embodiments, H.sub.2O molecule may be in a gaseous state. In one or more embodiments, the window opening of the porous material may permit CO.sub.2 molecules to pass through the porous material. In one or more embodiments, the window opening of the porous material may inhibit H.sub.2O molecules from passing through the porous material. For example, the window opening of the porous material may reject H.sub.2O molecules from passing through the porous material. In one or more embodiments, a diameter of the window opening of the porous material may be less than 0.275 nm. In one or more embodiments, a length of the window opening of the porous material may be less than 0.275 nm. In one or more embodiments, a width of the window opening of the porous material may be less than 0.275 nm. In one or more embodiments, a diameter of the window opening of the porous material may be greater than or equal to 0.232 nm. In one or more embodiments, a length of the window opening of the porous material may be greater than or equal to 0.232 nm. In one or more embodiments, a width of the window opening of the porous material may be greater than or equal to 0.232 nm.
[0026] In one or more embodiments, the porous material may be or include a zeolite material. For example, the zeolite material may be an aluminosilicate mineral. For instance, the zeolite material may have different crystal structures that determine one or more pore diameters. In one or more embodiments, the zeolite material may be configured with one or more specific pore diameters. In one or more embodiments, the zeolite material may include all-silica decadodecasil 3 rhombohedral (DDR). For example, the porous material may be or include a DDR-type zeolite material.
[0027] Turning now to
[0028] In one or more embodiments, IHS 110 may include firmware that controls and/or communicates with one or more hard drives, network circuitry, one or more memory devices, one or more I/O devices, and/or one or more other peripheral devices. For example, firmware may include software embedded in an IHS component utilized to perform tasks. In one or more embodiments, firmware may be stored in non-volatile memory, such as storage that does not lose stored data upon loss of power. In one example, firmware associated with an IHS component may be stored in non-volatile memory that is accessible to one or more IHS components. In another example, firmware associated with an IHS component may be stored in non-volatile memory that may be dedicated to and includes part of that component. For instance, an embedded controller may include firmware that may be stored via non-volatile memory that may be dedicated to and includes part of the embedded controller.
[0029] As shown, IHS 110 may include a processor 120, a volatile memory medium 150, non-volatile memory media 160 and 170, an I/O subsystem 175, and a network interface 180. As illustrated, volatile memory medium 150, non-volatile memory media 160 and 170, I/O subsystem 175, and network interface 180 may be communicatively coupled to processor 120.
[0030] In one or more embodiments, one or more of volatile memory medium 150, non-volatile memory media 160 and 170, I/O subsystem 175, and network interface 180 may be communicatively coupled to processor 120 via one or more buses, one or more switches, and/or one or more root complexes, among others. In one example, one or more of volatile memory medium 150, non-volatile memory media 160 and 170, I/O subsystem 175, and network interface 180 may be communicatively coupled to processor 120 via one or more PCI-Express (PCIe) root complexes. In another example, one or more of an I/O subsystem 175 and a network interface 180 may be communicatively coupled to processor 120 via one or more PCIe switches.
[0031] In one or more embodiments, the term “memory medium” may mean a “storage device”, a “memory”, a “memory device”, a “tangible computer readable storage medium”, and/or a “computer-readable medium”. For example, computer-readable media may include, without limitation, storage media such as a direct access storage device (e.g., a hard disk drive, a floppy disk, etc.), a sequential access storage device (e.g., a tape disk drive), a compact disk (CD), a CD-ROM, a digital versatile disc (DVD), a random access memory (RAM), a read-only memory (ROM), a one-time programmable (OTP) memory, an electrically erasable programmable read-only memory (EEPROM), and/or a flash memory, a solid state drive (SSD), or any combination of the foregoing, among others.
[0032] In one or more embodiments, one or more protocols may be utilized in transferring data to and/or from a memory medium. For example, the one or more protocols may include one or more of small computer system interface (SCSI), Serial Attached SCSI (SAS) or another transport that operates with the SCSI protocol, advanced technology attachment (ATA), serial ATA (SATA), a USB interface, an Institute of Electrical and Electronics Engineers (IEEE) 1394 interface, a Thunderbolt interface, an advanced technology attachment packet interface (ATAPI), serial storage architecture (SSA), integrated drive electronics (IDE), or any combination thereof, among others.
[0033] Volatile memory medium 150 may include volatile storage such as, for example, RAM, DRAM (dynamic RAM), EDO RAM (extended data out RAM), SRAM (static RAM), etc. One or more of non-volatile memory media 160 and 170 may include nonvolatile storage such as, for example, a read only memory (ROM), a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM, NVRAM (non-volatile RAM), ferroelectric RAM (FRAM), a magnetic medium (e.g., a hard drive, a floppy disk, a magnetic tape, etc.), optical storage (e.g., a CD, a DVD, a BLU-RAY disc, etc.), flash memory, a SSD, etc. In one or more embodiments, a memory medium can include one or more volatile storages and/or one or more nonvolatile storages.
[0034] In one or more embodiments, network interface 180 may be utilized in communicating with one or more networks and/or one or more other information handling systems. In one example, network interface 180 may enable IHS 110 to communicate via a network utilizing a suitable transmission protocol and/or standard. In a second example, network interface 180 may be coupled to a wired network. In a third example, network interface 180 may be coupled to an optical network. In another example, network interface 180 may be coupled to a wireless network.
[0035] In one or more embodiments, network interface 180 may be communicatively coupled via a network to a network storage resource. For example, the network may be implemented as, or may be a part of, a storage area network (SAN), personal area network (PAN), local area network (LAN), a metropolitan area network (MAN), a wide area network (WAN), a wireless local area network (WLAN), a virtual private network (VPN), an intranet, an Internet or another appropriate architecture or system that facilitates the communication of signals, data and/or messages (generally referred to as data). For instance, the network may transmit data utilizing a desired storage and/or communication protocol, including one or more of Fibre Channel, Frame Relay, Asynchronous Transfer Mode (ATM), Internet protocol (IP), other packet-based protocol, Internet SCSI (iSCSI), or any combination thereof, among others.
[0036] In one or more embodiments, processor 120 may execute processor instructions in implementing one or more systems, one or more flowcharts, one or more methods, and/or one or more processes described herein. In one example, processor 120 may execute processor instructions from one or more of memory media 150, 160, and 170 in implementing one or more systems, one or more flowcharts, one or more methods, and/or one or more processes described herein. In another example, processor 120 may execute processor instructions via network interface 180 in implementing one or more systems, one or more flowcharts, one or more methods, and/or one or more processes described herein.
[0037] In one or more embodiments, processor 120 may include one or more of a system, a device, and an apparatus operable to interpret and/or execute program instructions and/or process data, among others, and may include one or more of a microprocessor, a microcontroller, a digital signal processor (DSP), an application specific integrated circuit (ASIC), and another digital or analog circuitry configured to interpret and/or execute program instructions and/or process data, among others. In one example, processor 120 may interpret and/or execute program instructions and/or process data stored locally (e.g., via memory media 150, 160, and 170 and/or another component of IHS 110). In another example, processor 120 may interpret and/or execute program instructions and/or process data stored remotely (e.g., via a network storage resource).
[0038] In one or more embodiments, I/O subsystem 175 may represent a variety of communication interfaces, graphics interfaces, video interfaces, user input interfaces, and/or peripheral interfaces, among others. For example, I/O subsystem 175 may include one or more of a touch panel and a display adapter, among others. For instance, a touch panel may include circuitry that enables touch functionality in conjunction with a display that is driven by a display adapter.
[0039] As shown, non-volatile memory medium 160 may include an operating system (OS) 162, and applications (APPs) 164-168. In one or more embodiments, one or more of OS 162 and APPs 164-168 may include processor instructions executable by processor 120. In one example, processor 120 may execute processor instructions of one or more of OS 162 and APPs 164-168 via non-volatile memory medium 160. In another example, one or more portions of the processor instructions of the one or more of OS 162 and APPs 164-168 may be transferred to volatile memory medium 150, and processor 120 may execute the one or more portions of the processor instructions of the one or more of OS 162 and APPs 164-168 via volatile memory medium 150.
[0040] As illustrated, non-volatile memory medium 170 may include information handling system firmware (IHSFW) 172. In one or more embodiments, IHSFW 172 may include processor instructions executable by processor 120. For example, IHSFW 172 may include one or more structures and/or one or more functionalities of and/or compliant with one or more of a basic input/output system (BIOS), an Extensible Firmware Interface (EFI), a Unified Extensible Firmware Interface (UEFI), and an Advanced Configuration and Power Interface (ACPI), among others. In one instance, processor 120 may execute processor instructions of IHSFW 172 via non-volatile memory medium 170. In another instance, one or more portions of the processor instructions of IHSFW 172 may be transferred to volatile memory medium 150, and processor 120 may execute the one or more portions of the processor instructions of IHSFW 172 via volatile memory medium 150.
[0041] In one or more embodiments, processor 120 and one or more components of IHS 110 may be included in a system-on-chip (SoC). For example, the SoC may include processor 120 and a platform controller hub (not specifically illustrated).
[0042] As illustrated, IHS 110 may include a battery 185. In one or more embodiments, battery 185 may provide power to one or more components of IHS 110, among others. For example, battery 185 may provide power to one or more of processor 120, volatile memory medium 150, non-volatile memory medium 160, non-volatile memory medium 170, and network interface 180, among others. In one or more embodiments, battery 185 may provide power to one or more devices and/or one or more peripheral devices coupled to IHS 110, among others.
[0043] Turning now to
[0044] In one or more embodiments, material 210 may be or include a porous material. In one or more embodiments, material 210 may permit first molecules to travel through material 210. For example, each of the first molecules may have a diameter greater than 0.01 nm and less than 0.27 nm. For instance, the first molecules may include CO.sub.2 molecules. In one or more embodiments, porous substrate 220 may permit the first molecules to travel through porous substrate 220. In one or more embodiments, porous substrate 220 may not inhibit the second molecules from traveling through porous substrate 220.
[0045] In one or more embodiments, material 210 may inhibit second molecules from traveling through material 210. For example, each of the second molecules may have a diameter greater than 0.27 nm and less than 10 nm. For instance, the second molecules may include H.sub.2O molecules. In one or more embodiments, material 210 inhibiting the second molecules from traveling through material 210 may include material 210 rejecting the second molecules. For example, material 210 inhibiting the second molecules from traveling through material 210 may include material 210 rejecting the second molecules from traveling through material 210.
[0046] Turning now to
[0047] In one or more embodiments, a portion 212 of enclosure 232 may inhibit the first molecules and the second molecules from entering and/or exiting enclosure 232. For example, portion 212 may include a plastic and/or a metal, among others. In one instance, portion 212 may be rigid. In another instance, portion 212 may be flexible. In one or more embodiments, enclosure 232 may embody a cuboid box. In one or more embodiments, enclosure 232 may embody a bag, a pouch, etc.
[0048] Turning now to
[0049] In one or more embodiments, a portion 212B of enclosure 230B may inhibit the first molecules and the second molecules from entering and/or exiting enclosure 230B. For example, portion 212B may include a plastic and/or a metal. In one instance, portion 212B may be rigid. In another instance, portion 212B may be flexible. In one or more embodiments, battery 185B and/or enclosure 230B may include a cylindrical shape.
[0050] Turning now to
[0051] In one or more embodiments, a portion 212C of enclosure 232I may inhibit the first molecules and the second molecules from entering and/or exiting enclosure 232I. For example, portion 212C may include a plastic and/or a metal. In one instance, portion 212C may be rigid. In another instance, portion 212C may be flexible. In one or more embodiments, cell 240I and/or enclosure 232I may include a cylindrical shape.
[0052] Turning now to
[0053] In one or more embodiments, a portion 212D of enclosure 232J may inhibit the first molecules and the second molecules from entering and/or exiting enclosure 232J. For example, portion 212D may include a plastic and/or a metal. In one instance, portion 212D may be rigid. In another instance, portion 212D may be flexible. In one or more embodiments, cell 240J and/or enclosure 232J may include a cylindrical shape.
[0054] In one or more embodiments, if an enclosure 230 of a battery 185 includes a material 210, a current interrupt device (CID) may not be needed and/or required. For example, the CID may include a pressure valve that may permanently ruin battery 185 if an internal pressure of battery 185 exceeds a threshold pressure (e.g., 1,000 kPa). For instance, a portion of the CID may fracture, break, and/or crack, which may break a circuit associated with battery 185 and/or may permit gas to escape battery 185. In one or more embodiments, when the portion of the CID fractures, breaks, and/or cracks, battery 185 may be ruined and/or may be permanently damaged. In one or more embodiments, the gas may include the first molecules. For example, material 210 may permit the first molecules to exit enclosure 230. For instance, when material 210 permits the first molecules to exit enclosure 230, an internal pressure of battery 185 may not exceed the threshold pressure. In one or more embodiments, when the internal pressure of battery 185 does not exceed the threshold pressure, the CID may not be needed and/or required.
[0055] In one or more embodiments, if an enclosure 232 of a cell 240 includes a material 210, a CID may not be needed and/or required. For example, the CID may include a pressure valve that may permanently ruin cell 240 if an internal pressure of cell 240 exceeds a threshold pressure (e.g., 1,000 kPa). For instance, a portion of the CID may fracture, break, and/or crack, which may break a circuit associated with cell 240 and/or may permit gas to escape cell 240. In one or more embodiments, when the portion of the CID fractures, breaks, and/or cracks, cell 240 may be ruined and/or may be permanently damaged. In one or more embodiments, the gas may include the first molecules. For example, material 210 may permit the first molecules to exit enclosure 232. For instance, when material 210 permits the first molecules to exit enclosure 232, an internal pressure of cell 240 may not exceed the threshold pressure. In one or more embodiments, when the internal pressure of cell 240 does not exceed the threshold pressure, the CID may not be needed and/or required.
[0056] Turning now to
[0057] At 315, an enclosure, for the battery, may be configured with a portion of the enclosure operable for the zeolite material that is configured to permit first molecules associated with a first diameter to travel through the zeolite material and to inhibit second molecules associated with a second diameter, greater than the first diameter, from traveling through the zeolite material. In one example, as illustrated in
[0058] In one or more embodiments, configuring the enclosure with the portion of the enclosure operable for the zeolite material may include cutting the enclosure for the portion of the enclosure operable for the porous material. In one or more embodiments, configuring the enclosure with the portion of the enclosure operable for the zeolite material may include removing material of the enclosure for the portion of the enclosure operable for the zeolite material. In one or more embodiments, each of the first molecules has a diameter greater than 0.01 nm and less than 0.27 nm. In one or more embodiments, each of the second molecules has a diameter greater than 0.27 nm and less than 10 nm. In one or more embodiments, the first molecules may include CO.sub.2 molecules. In one or more embodiments, the second molecules may include H.sub.2O molecules.
[0059] At 320, the zeolite material may be fastened in the portion of the enclosure operable for the porous material. For example, material 210 may be or include the zeolite material. For instance, material 210 may be fastened in a portion of enclosure 230 operable for material 210. At 325, one or more cells of the battery may be enclosed in the enclosure. For example, one or more cells 240 may be enclosed in enclosure 230. In one or more embodiments, the battery may be a lithium-ion battery. For example, the one or more cells of the battery may include one or more lithium-ion cells. At 330, the battery may be installed in an information handling system. For example, battery 185 may be installed in IHS 110.
[0060] In one or more embodiments, one or more of the method and/or process elements and/or one or more portions of a method and/or a process element may be performed in varying orders, may be repeated, or may be omitted. Furthermore, additional, supplementary, and/or duplicated method and/or process elements may be implemented, instantiated, and/or performed as desired, according to one or more embodiments. Moreover, one or more of system elements may be omitted and/or additional system elements may be added as desired, according to one or more embodiments.
[0061] In one or more embodiments, a memory medium may be and/or may include an article of manufacture. For example, the article of manufacture may include and/or may be a software product and/or a program product. For instance, the memory medium may be coded and/or encoded with processor-executable instructions in accordance with one or more flowcharts, one or more systems, one or more methods, and/or one or more processes described herein to produce the article of manufacture.
[0062] The above disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments which fall within the true spirit and scope of the present disclosure. Thus, to the maximum extent allowed by law, the scope of the present disclosure is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.