HIGH-SPEED INPUT/OUTPUT AND HIGH-POWER TRANSMISSION CONNECTOR AND CABLE
20230402207 · 2023-12-14
Inventors
- Benjamin K. Sharfi (Rancho Cucamonga, CA, US)
- Cory Steen (Rancho Cucamonga, CA, US)
- Saul Gonzalez (Rancho Cucamonga, CA, US)
- Kadek W. Hemawan (Rancho Cucamonga, CA, US)
Cpc classification
H01B11/22
ELECTRICITY
H01B7/40
ELECTRICITY
International classification
Abstract
An interconnection cable adapted to connect two or more electronic devices comprising one or more end connectors; at least one of the one or more connectors comprising one or more data plugs, each complying with the USB or the Thunderbolt specification, and one or more power pins that are separate from the data plug; a cable assembly attached to at least one of the one or more connectors; the cable assembly comprising one or more fiber optic cores, and one or more stranded coper wires; wherein at least one of the one or more fiber optic cores is communicatively connected to at least one of the one or more data plugs; and wherein at least one of the one or more stranded copper wires is electrically connected to at least one of the one or more power pins.
Claims
1. An interconnection cable adapted to connect two or more electronic devices comprising: one or more end connectors; at least one of the one or more connectors comprising one or more data plugs, each complying with the USB or the Thunderbolt specification, and one or more power pins that are separate from the data plug; a cable assembly attached to at least one of the one or more connectors; the cable assembly comprising one or more fiber optic cores, and one or more stranded coper wires; wherein at least one of the one or more fiber optic cores is communicatively connected to at least one of the one or more data plugs; and wherein at least one of the one or more stranded copper wires is electrically connected to at least one of the one or more power pins.
2. The interconnection cable of claim 1 wherein at least one of the one or more the power pins is a pogo or spring-loaded pin.
3. The interconnection cable of claim 1 wherein at least one of the one or more data plugs is male.
4. The interconnection cable of claim 1 wherein at least one of the one or more data plugs is female.
5. The interconnection cable of claim 1 wherein at least one of the one or more power pins is male.
6. The interconnection cable of claim 1 wherein at least one of the one or more power pins is female.
7. The interconnection cable of claim 1 wherein the cable assembly is shielded.
8. The interconnection cable of claim 1 further comprising a retainer adapted to positively engage at least one of the two or more electronic devices.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0013] Following is a detailed descriptions of several aspects of the present invention, all of which relate to the high-speed input/output signal and high-power transmission connectors and cables in accordance with embodiments of the present invention.
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[0017] The plug (32), and power pins (33, 34, 35, 36), are retained by a shield housing (37) which in the shown embodiment is circular but can be of any suitable shape. The power pins (33, 34, 35, 36) are commonly connected to stranded copper wires (38) of a gauge appropriate for the application. The plug (32) is connected to a data-transmission medium comprising one or more fiber optic cores (40). The plug may also be optionally connected to one or more stranded coper wires (38) in accordance with the applicable USB4 or TBT4 specifications. The connector (31) also includes a printed circuit board (“PCB”) module (39) that is adapted to manage the transmission of data and/or power in accordance with the appropriate specification (i.e., USB4 or TBT4). For shielding purposes, a braided weaved wire layer (41) may encase the above-referenced stranded coper wires and fiber-optic cores, with the complete cable being further encased by an insulation layer (42). Finally, for mechanical and electrical protection, connector (31) comprises an over-molded insulation housing (43).
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[0021] Although described above in connection with particular hardware configurations and standards, these descriptions are not intended to be limiting as various modifications may be made therein without departing from the spirit of the invention and within the scope and range of equivalent of the described embodiments. Encompassed embodiments of the present invention can be used in all applications where efficient and high-performing electronic device interconnections are desired.
[0022] While a number of embodiments of the present invention have been described, it is understood that these embodiments are illustrative only, and not restrictive, and that many modifications may become apparent to those of ordinary skill in the art. For example, any element described herein may be provided in any desired size (e.g., any element described herein may be provided in any desired custom size or any element described herein may be provided in any desired size selected from a “family” of sizes, such as small, medium, large). Further, one or more of the components may be made from any suitable material.
[0023] In addition, various modifications and additions can be made to the exemplary embodiments discussed without departing from the scope of the present invention. For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combinations of features and embodiments that do not include all of the described features. Accordingly, the scope of the present invention is intended to embrace all such alternatives, modifications, and variations as fall within the scope of the claims, together with all equivalents thereof.