ELECTRONIC COMPONENT TRANSFER BY LEVITATION

Abstract

Aspects of the present disclosure relate to a system for transporting an electronic component. Further aspects of the present disclosure relate to a method for transporting an electronic component. According to an aspect of the present disclosure a system for transporting an electronic component is provided that includes a carrier for carrying the electronic component, and a transducer system including a plurality of transducers, the transducer system being configured for generating a levitation field in which the carrier levitates. The system also includes an input unit for arranging the electronic component onto the carrier, and an output unit for receiving the electronic component from the carrier. A controller is used for controlling the transducer system to change the levitation field for the purpose of moving the carrier from the input unit to the output unit.

Claims

1. A system for transporting an electronic component, comprising: a carrier to carry the electronic component; a transducer system comprising a plurality of transducers, the transducer system being configured to generate a levitation field in which the carrier levitates; an input unit to arrange the electronic component onto the carrier; an output unit to receive the electronic component from the carrier; and a controller to control the transducer system to change the levitation field to move the carrier from the input unit to the output unit; wherein the carrier is made from at least one material selected from the group consisting of polymers, low-density materials, low-density metals, low-density composite materials, and low-density ceramics, and wherein the low-density materials have a density less than 2000 kg/m.sup.3.

2. The system according to claim 1, wherein the input unit further comprises a first dispensing unit to dispense a first attaching agent onto the carrier, the first attaching agent being configured to attach the electronic component to the carrier when receiving the electronic component, wherein the first attaching agent is a liquid, wherein the output unit comprises a detaching unit to break the attachment of the electronic component to the carrier by the first attaching agent, wherein the first attaching agent comprises a photo-absorbing material, wherein the detaching unit comprises a light source configured to illuminate the first attaching agent for the purpose of breaking the attachment by the first attaching agent, and wherein the first attaching agent is configured to evaporate as a result of illuminating the first attaching agent.

3. The system according to claim 1, wherein the output unit comprises a holding unit to hold a substrate on which the electronic component is to be arranged, and wherein the output unit comprises a second dispensing unit to dispense a second attaching agent onto the substrate to attach the electronic component received from the carrier on the substrate.

4. The system according to claim 1, wherein the input unit further comprises a first dispensing unit to dispense a first attaching agent onto the carrier, the first attaching agent being configured to attach the electronic component to the carrier when receiving the electronic component, wherein the first attaching agent is water, wherein the output unit comprises a detaching unit to break the attachment of the electronic component to the carrier by the first attaching agent, wherein the first attaching agent comprises a photo-absorbing material, wherein the detaching unit comprises a light source configured to illuminate the first attaching agent for the purpose of breaking the attachment by the first attaching agent, and wherein the first attaching agent is configured to evaporate as a result of illuminating the first attaching agent.

5. The system according to claim 1, wherein system comprises: an input part in which the input unit is arranged in combination with some of the plurality of transducers; an output part in which the output unit is arranged in combination with some of the plurality of transducers; and a transfer part arranged in between the input part and the output part in which some transducers of the plurality of transducers are arranged; wherein the some of the plurality of transducers arranged in the transfer part are configured to rotate and/or flip the carrier while supporting the electronic component arranged thereon to cause the electronic component to face the output unit when the output unit receives the electronic component from the carrier.

6. The system according to claim 1, wherein the controller is configured to return the carrier from the output unit to the input unit after having transported the electronic component to transport another electronic component.

7. The system according to claim 3, wherein the electronic component is a semiconductor die, wherein the input unit is configured to hold a wafer comprising a plurality of physically separated semiconductor dies, the input unit further comprising a releasing unit to release a semiconductor die from the wafer causing and/or allowing the released semiconductor die to be arranged on the carrier; wherein the physically separated semiconductor dies are attached to a material selected from the group consisting of a tape, a foil, and a film, using a third attaching agent, wherein the releasing unit comprises a light source to illuminate the third attaching agent for the purpose of breaking the attachment of a semiconductor die among the physically separated semiconductor dies to the tape, foil, or tape, by the third attaching agent; wherein the input unit is arranged, relative to the Earth's gravitational field, above the carrier at a time of arranging the electronic component on the carrier, wherein the input unit is configured to cause the electronic component to fall onto the carrier, and/or wherein the output unit is arranged, relative to the Earth's gravitational field, below the carrier at a time of receiving the electronic component from the carrier, and wherein the output unit is configured to cause the electronic component to fall from the carrier.

8. The system according to claim 3, wherein the electronic component is a semiconductor die, wherein the input unit is configured to hold a wafer comprising a plurality of physically separated semiconductor dies, the input unit further comprising a releasing unit to release a semiconductor die from the wafer causing and/or allowing the released semiconductor die to be arranged on the carrier; wherein the physically separated semiconductor dies are attached to a material selected from the group consisting of a tape, a foil, and a film, using a third attaching agent that is a photo-absorbing adhesive, wherein the releasing unit comprises a light source to illuminate the third attaching agent for the purpose of breaking the attachment of a semiconductor die among the physically separated semiconductor dies to the tape, foil, or tape, by the third attaching agent; wherein the input unit is arranged, relative to the Earth's gravitational field, above the carrier at a time of arranging the electronic component on the carrier, wherein the input unit is configured to cause the electronic component to fall onto the carrier, and/or wherein the output unit is arranged, relative to the Earth's gravitational field, below the carrier at a time of receiving the electronic component from the carrier, and wherein the output unit is configured to cause the electronic component to fall from the carrier.

9. The system according to claim 7, wherein the plurality of transducers comprises a plurality of acoustic transducers configured to generate soundwaves and wherein the levitation field is an acoustic levitation field, wherein the soundwaves generated by the plurality of acoustic transducers have a frequency in a range between kHz and 200 kHz, and/or wherein the transducers are configured to generate an acoustic potential well in which the carrier and the component carried by the carrier can be trapped, and wherein the controller is configured to control the transducer system to change a position and/or orientation of the acoustic potential well to move the carrier.

10. The system according to claim 9, wherein the carrier has a first surface configured to support the electronic component, and wherein the carrier has a maximum thickness that in a direction perpendicular to the first surface is less than ⅓ times a wavelength of the soundwaves generated by the acoustic transducers; wherein the first surface has a surface area that is at least 3 times greater than a maximum cross-sectional area of the electronic component; and/or wherein the acoustic potential well and/or the carrier is elongated, and wherein the first surface is rectangular or oval.

11. The system according to claim 9, further comprising a localization system to determine a position and/or orientation of the carrier and/or the electronic component carried by the carrier, wherein the controller is configured to control the transducer system in dependence of the determined position and/or orientation, wherein the localization system comprises a vision system; and/or wherein the localization system is configured to determine the position and/or orientation of the carrier and/or the position and/or orientation of the electronic component carried by the carrier using echo-localization, wherein the plurality of transducers is further configured to generate soundwaves used to perform the echo-localization, and wherein the soundwaves have a different frequency when compared to the soundwaves for creating the levitation field.

12. The system according to claim 9, wherein the system is configured to transport a plurality of electronic components simultaneously, and wherein the transducer system is configured to trap each of the plurality of electronic components that is to be transported simultaneously in a respective acoustic potential well.

13. The system according to claim 10, wherein the transducer system comprises one or more reflectors to reflect the soundwaves emitted by the transducers to create standing waves; wherein the system comprises a housing in which the acoustic field is generated, wherein the one or more reflectors are at least partially formed by an inner wall of the housing; and/or wherein the semiconductor wafer partially forms the one or more reflectors; and/or wherein the substrate and/or the holding unit holding the substrate partially forms the one or more reflectors.

14. A method for transporting an electronic component, comprising: generating a levitation field in which a carrier is levitating; arranging the electronic component onto the carrier while the carrier is levitating; changing the levitation field to move the carrier with the electronic component carried by the carrier; and removing the electronic component from the carrier.

15. The method according to claim 14, wherein the levitation field is an acoustic levitation field, wherein the carrier and the electronic component carried by the carrier are trapped in an acoustic potential well, and wherein the moving the carrier with the electronic component carried by the carrier comprises changing a position and/or orientation of the acoustic potential well.

16. The method according to claim 15, wherein the electronic component is a semiconductor die among a plurality of physically separated semiconductor dies comprised by a wafer, and wherein arranging the electronic component onto the carrier comprises releasing a semiconductor die from the wafer causing and/or allowing the released semiconductor die to be arranged on the carrier, wherein the physically separated semiconductor dies are attached to a material selected from the group consisting of a tape, a foil, and a film, using a third attaching agent, and wherein the releasing a semiconductor die comprises illuminating the third attaching agent for the purpose of breaking the attachment of a semiconductor die among the physically separated semiconductor dies by the third attaching agent; wherein the generating a levitation field comprises using a plurality of transducers to generate soundwaves and allowing the soundwaves to be reflected by one or more reflectors to create standing waves, and wherein the one or more reflectors are at least partially formed by the wafer.

17. The method according to claim 16, further comprising dispensing a first attaching agent on the carrier prior to arrange the electronic component on the carrier, wherein the first attaching agent attaches the electronic component to the carrier, wherein the removing the electronic component comprises breaking the attachment of the electronic component to the carrier by the first attaching agent, wherein the first attaching agent comprises a photo-absorbing material, and wherein the breaking of the attachment comprises illuminating the first attaching agent using a light source; and/or wherein the method further comprises allowing a plurality of carriers and a corresponding plurality of electronic components carried by the carriers to simultaneously levitate in the levitating field, and wherein the carriers and corresponding electronic components are trapped in respective acoustic cavities, the method further comprising simultaneously moving the carriers with the electronic components carried by the carriers by changing a position and/or orientation of the acoustic cavities.

18. The method according to claim 16, wherein the third attaching agent is an adhesive.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0034] So that the manner in which the features of the present disclosure can be understood in detail, a more particular description is made with reference to embodiments, some of which are illustrated in the appended figures. It is to be noted, however, that the appended figures illustrate only typical embodiments and are therefore not to be considered limiting of its scope. The figures are for facilitating an understanding of the disclosure and thus are not necessarily drawn to scale. Advantages of the subject matter claimed will become apparent to those skilled in the art upon reading this description in conjunction with the accompanying figures, in which like reference numerals have been used to designate like elements, and in which:

[0035] FIG. 1 schematically illustrates the components of an embodiment of a system for transporting an electronic component in accordance with an aspect of the present disclosure.

[0036] FIG. 2 illustrates a first embodiment of a system for transporting an electronic component in accordance with an aspect of the present disclosure.

[0037] FIG. 3 illustrates a second embodiment of a system for transporting an electronic component in accordance with an aspect of the present disclosure.

DETAILED DESCRIPTION

[0038] FIG. 1 schematically illustrates the components of an embodiment of a system 100 for transporting an electronic component in accordance with an aspect of the present disclosure. The components shown in FIG. 1 are also illustrated in FIGS. 2 and 3. In FIGS. 1-3, the electronic component to be transferred is a semiconductor die. This semiconductor die is provided in the form of a diced semiconductor wafer that comprises a plurality of physically separated semiconductor dies. The physically separated semiconductor dies are attached to a tape, foil, or film using a photo-absorbing adhesive.

[0039] System 100 comprises an input unit 110 for arranging the electronic component to be transferred onto a carrier. Input unit 110 comprises a first dispensing unit 111 for dispensing a first attaching agent onto the carrier, and a releasing unit 112 for releasing a semiconductor die from the wafer causing and/or allowing the released semiconductor die to be arranged on the carrier.

[0040] System 100 further comprises an output unit 120 for receiving the electronic component from the carrier onto a substrate in the form of a printed circuit board. Output unit 120 comprises a detaching unit 121 for breaking the attachment of the electronic component to the carrier by the first attaching agent. Output unit 120 optionally further comprises a second dispensing unit 122 for dispensing a second attaching agent onto the substrate for the purpose of attaching the electronic component received from the carrier on the substrate.

[0041] System 100 comprises a transducer system 130 comprising a plurality of transducers 131 that each emit a soundwave having a frequency in the range between 20 kHz and 200 kHz. The transducer system is configured for generating a levitation field in which the carrier levitates. System 100 also comprises a controller 140 for controlling transducer system 130 to change the levitation field for the purpose of moving the carrier from input unit 110 to output unit 120. Controller 140 further controls first dispensing unit 111, releasing unit 112, detaching unit 121, and optionally second dispensing unit 122.

[0042] System 100 comprises a localization system 150 for determining a position and/or orientation of the carrier and/or the electronic component carried by the carrier. Controller 140 is configured to control transducer system 130 in dependence of the determined position and/or orientation. Optionally, system 100 may comprise an inspection system 160 for inspecting the electronic component and/or carrier during various stages of transporting the electronic component. Controller 140 can be configured to control transducer system 130 in dependence of an output of inspection system 160. Inspection system 160 may comprise one or more optical cameras 161.

[0043] Next, two embodiments of a system for transporting an electronic component in accordance with an aspect of the present disclosure will be described in more detail referring to FIGS. 2 and 3. Components in these embodiments that are identical or similar to the components illustrated in FIG. 1 will be referred to using the same reference signs.

[0044] FIG. 2 illustrates a system 200A that comprises an input part 201 in which input unit 110 is arranged in combination with some of the plurality of transducers 131. System 200A further comprises an output part 202 in which output unit 120 is arranged in combination with some of the plurality of transducers 131. In addition, system 200A comprises a transfer part 203 arranged in between input part 201 and output part 202.

[0045] System 200A comprises a housing 210 in which transducers 131 are arranged. Housing 210 is made from acoustically reflective material. The soundwaves emitted by transducers 131 reflect off housing 210 causing a standing wave pattern to be generated inside housing 210. The standing wave pattern comprises a plurality of acoustic cavities.

[0046] As shown, input unit 110 comprises a dispensing unit 111 that arranges a droplet 111A of liquid, such as water, on carrier 220. This shown in insert III of FIG. 2. Input unit 110 also comprises a releasing unit in the form of a laser source 112. Controlled by controller 140, laser source 120 can be activated for illuminating that part 232A of photo-absorbing adhesive 232 by which semiconductor die 230 to be transferred is attached to a wafer tape 231. After illuminating, photo-absorbing adhesive 232A will lose its attachment with semiconductor die 230 causing the latter to fall down towards carrier 220, where it is attached to carrier 220 using liquid 111A.

[0047] As shown in insert I of FIG. 2, showing a top view and side view of semiconductor die 230 attached to carrier 220 using a droplet of liquid 111A, carrier 220 has an oval flat shape. This shape may correspond to a shape of the acoustic cavities that are generated in housing 210. For example, by using elongated shapes, carrier 220 will align itself in the elongated acoustic potential well.

[0048] Inside input part 201, transducers 131 are arranged at one side of housing 210, whereas at an opposing side of housing 210 a wafer 230A is arranged that holds a plurality of semiconductor dies 230. As shown in insert II of FIG. 2, transducers 131 act as a source S of soundwaves and wafer 230A acts as a reflector R. Here, it is noted that insert II illustrates the configuration of transducers 131 at various positions in system 200A. Insert II corresponds to a cross-sectional view taken perpendicular to the horizontal direction from input part 201 to output part 202.

[0049] The soundwaves generated by transducers 131 and the soundwaves reflected off wafer 230A and housing 210 jointly create a standing wave pattern. Insert II also illustrates the Earth's gravitational force F demonstrating that if a semiconductor die 230 is released from wafer 230A it will fall towards carrier 220.

[0050] Inside second part 203, transducers 131 are arranged along an inner wall of housing 210 at various vertical positions. Moreover, the upper part of housing 210 acts as reflectors R and transducers 131 arranged in the lower part of housing 210 act as sources S. In other embodiments, transducers 131 are arranged both in the upper and lower parts of housing 210. The configuration of transducers 131 allows the acoustic cavities to be rotated and/or flipped along a rotational axis that is parallel to the horizontal direction from input part 201 to output part 202 or along a horizontal axis that is perpendicular to the horizontal direction from input part 201 to output part 202.

[0051] Output unit 120, which is arranged inside output part 202, comprises a holding unit 240 for holding a substrate 241 on which semiconductor die 230 needs to be arranged. Output unit 120 further comprises a detaching unit in the form of a laser source 121. Substrate 241, which can be in the form of a printed circuit board, is provided with an attaching agent 242. When laser source 121 illuminates the droplet of liquid 111A by which semiconductor die 230 is attached to carrier 220, the attachment between semiconductor die 230 and carrier 220 is broken and semiconductor die 230 falls on attaching agent 242 for allowing semiconductor die 230 to become fixated relative to substrate 241. It should be noted that attaching agent 242 may comprise adhesive glue, solder, or the like, which may require an additional step, such as curing and/or heating, to be performed to achieve the fixation.

[0052] As shown in insert II, the configuration of transducers 131 in output part 202 is flipped when compared to input part 201. Consequently, carrier 220 and semiconductor die 230 carried by carrier 220 need be rotated or flipped between input part 201 and output part 202. As explained before, this is performed inside transfer part 203.

[0053] Localization for determining a position and/or orientation of carrier 220 and/or semiconductor die 230 can obtained by using echo-localization. The soundwaves required for performing echo-localization can be emitted using transducers 131 albeit at a different frequency. Controller 140 is configured for controlling transducers 131 in dependence of a determined position of carrier 220 and/or semiconductor die 230. More in particular, the position and/or orientation of the acoustic potential well in which carrier 220 and semiconductor die 230 are trapped is changed. Such change can be effectuated by changing an amplitude and/or phase of the soundwaves that are generated by transducers 131.

[0054] Insert III illustrates the position of carrier 220 and semiconductor die 230 at various stages during transport from input unit 110 to output unit 120. As shown, using numerals 3A and 3B, carrier 220 is flipped when inside transfer part 203.

[0055] System 200A also comprises optical cameras 161 to monitor the transfer process and/or for performing various quality checks of carrier 220 and/or semiconductor die 230. Based on the output of cameras 161 or the output of an image processing unit that processes the images of optical cameras 161, controller 140 may control transducers 131 for performing corrective measures. For example, if a damaged and/or incorrectly placed semiconductor die 230 is detected by an optical camera 161, controller 140 may control transducers 131 to move carrier 220 to a separate location, optionally also provided with a detaching unit, for discarding semiconductor die 230 and/or carrier 220.

[0056] After semiconductor die 230 has been arranged on substrate 241, carrier 220 may return to input part 201 where it will receive a next droplet of liquid 111A for transporting a next semiconductor die 230 on wafer 230A.

[0057] Although FIG. 2 illustrates the process of transporting a single semiconductor die 230, the concept can equally be used for transporting a plurality of semiconductor dies 230 at a time. This is made possible because the standing wave pattern comprises a plurality of acoustic cavities. Optionally, releasing unit 112 may be configured to substantially simultaneously release a plurality of semiconductor dies 230 to fall on a corresponding plurality of carriers 220. The same holds for dispensing unit 111 and detaching unit 121.

[0058] FIG. 3 illustrates a system 200B that differs from system 200A in that carrier 220 with semiconductor die 230 arranged thereon is brought into contact with attaching agent 242 for the purpose of arranging semiconductor die 230 on substrate 241. Put differently, in this case, semiconductor die 230 will not fall under the influence of the Earth's gravitational field towards substrate 242. Rather, semiconductor die 230 is pushed into and/or against attaching agent 242. The adhesive power of attaching agent 242 may be superior to that of liquid 111A in which case detaching unit 111 may be omitted.

[0059] An advantage of the FIG. 3 embodiment is that no rotation or flipping of carrier 220 is required inside transfer part 203. Consequently, the arrangement of transducers 231 inside transfer part 203 can be different, but need not be, relative to transfer part 203 of system 200A.

[0060] In the above, the present disclosure has been described using detailed embodiments thereof. However, the present disclosure is not limited to these embodiments. Instead, various modifications are possible without departing from the scope of the present disclosure which is defined by the appended claims and their equivalents.

[0061] For example, the system is generally adapted for transporting an electronic component through air or another gaseous medium in case acoustic levitation is employed. However, the present disclosure does not exclude other media in which an electronic component can be transported such as a liquid. In case a liquid is used instead of air, the frequency of the generated soundwaves is generally different. For example, the frequency can be in the range between 100 kHz and 1 MHz.

[0062] Particular and preferred aspects of the disclosure are set out in the accompanying independent claims. Combinations of features from the dependent and/or independent claims may be combined as appropriate and not merely as set out in the claims.

[0063] The scope of the present disclosure includes any novel feature or combination of features disclosed therein either explicitly or implicitly or any generalization thereof irrespective of whether or not it relates to the claimed disclosure or mitigate against any or all of the problems addressed by the present disclosure. The applicant hereby gives notice that new claims may be formulated to such features during prosecution of this application or of any such further application derived therefrom. In particular, with reference to the appended claims, features from dependent claims may be combined with those of the independent claims and features from respective independent claims may be combined in any appropriate manner and not merely in specific combinations enumerated in the claims.

[0064] Features which are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub combination.

[0065] The term “comprising” does not exclude other elements or steps, the term “a” or “an” does not exclude a plurality. Reference signs in the claims shall not be construed as limiting the scope of the claims.