GAS ABATEMENT BY PLASMA
20230402260 · 2023-12-14
Inventors
- Simone Magni (Burgess Hill, Sussex, GB)
- Neil Condon (Burgess Hill, Sussex, GB)
- Erik Wagenaars (Burgess Hill, Sussex, GB)
Cpc classification
International classification
Abstract
A plasma abatement apparatus includes: a plasma device configured to generate a plasma stream from a plasma gas; an effluent stream aperture configured to convey the effluent stream into the plasma stream for treatment by the plasma stream; a first aperture positioned to deliver a reducing reactant to a first region of the plasma stream; and a second aperture positioned to deliver an oxidising reactant to a second region of the plasma stream, wherein the second region is located at a position of the plasma stream which is cooler than the first region.
Claims
1. A plasma abatement apparatus for treating an effluent stream from a semiconductor processing tool, said plasma abatement apparatus comprising: a plasma device configured to generate a plasma stream from a plasma gas; an effluent stream aperture configured to convey said effluent stream into said plasma stream for treatment by said plasma stream; a first aperture positioned to deliver a reducing reactant to a first region of said plasma stream; and a second aperture positioned to deliver an oxidising reactant to a second region of said plasma stream, wherein said second region is located at a position of said plasma stream which is cooler than said first region.
2. The apparatus of claim 1, wherein said first region is located at a position of said plasma stream which is hotter than said second region.
3. The apparatus of claim 1, wherein said first region is located at a position of said plasma stream which achieves a temperature of at least 1000° C.
4. The apparatus of claim 1, wherein said second region is located at a position of said plasma stream which achieves a temperature of no more than 1000° C.
5. The apparatus of claim 1, wherein said second region is located at a position of said plasma stream which achieves a temperature of at least 500° C.
6. The apparatus of claim 1, wherein said second region is located downstream of said first region.
7. The apparatus of claim 1, wherein said first region is located upstream of said second region.
8. The apparatus of claim 1, wherein said reducing reactant is premixed with said plasma gas prior to delivery to said plasma device.
9. The apparatus of claim 1, wherein said first region is located proximate said plasma device.
10. The apparatus of claim 1, said second region is located distal said plasma device.
11. The apparatus of claim 1, comprising a reaction chamber positioned to receive said plasma stream and wherein said second region is located within said reaction chamber.
12. The apparatus of claim 1, wherein said reducing reactant comprises at least one of: H.sub.2, NH.sub.3, a hydrocarbon such as propane, methane and the like, an alkaline earth metal such as beryllium, magnesium, calcium, strontium, barium, an alkaline earth salt an alkaline metal such as lithium, sodium, potassium, rubidium and an alkaline salt.
13. The apparatus of claim 12, comprising: a hydrogen generator configured to generate said H.sub.2 in situ by electrolysis.
14. The apparatus of claim 12, comprising at least one of: a power generator employed to generate said plasma stream; and a secondary power source configured to power said hydrogen generator.
15. The apparatus of claim 12, wherein said first aperture is configured to deliver an ammonia salt such as ammonium carbonate (NH.sub.4)2CO.sub.3, or the like to generate said NH.sub.3 by thermal decomposition within said first region.
16. The apparatus of claim 12, comprising: a heater configured to generate said NH.sub.3 by thermal decomposition of an ammonia salt such as ammonium carbonate (NH.sub.4)2CO.sub.3, or the like.
17. The apparatus of claim 1, wherein said oxidising reactant comprises at least one of O.sub.2 and O.sub.3.
18. A method of treating an effluent stream from a semiconductor processing tool, comprising: generating a plasma stream from a plasma gas; conveying said effluent stream into said plasma stream for treatment by said plasma stream; delivering a reducing reactant to a first region of said plasma stream; and delivering an oxidising reactant to a second region of said plasma stream which is located at a position of said plasma stream which is cooler than said first region.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0059] Embodiments of the present invention will now be described further, with reference to the accompanying drawings, in which:
[0060]
[0061]
[0062]
[0063]
[0064]
DESCRIPTION OF THE EMBODIMENTS
[0065] Before discussing the embodiments in any more detail, first an overview will be provided. Some embodiments provide an arrangement which improves the abatement efficiency of a plasma abatement apparatus. This is achieved by splitting the introduction of reactants into the plasma stream. In particular, a reducing reactant is delivered at a first position into the plasma stream and an oxidizing reactant is introduced at a second position in the plasma stream. The reducing reactant may be premixed with the plasma gas and so the first position may be the position where the plasma gas is first introduced or may be downstream of this position but upstream of the second position. This enables reducing reactants to be introduced at a higher temperature or more active region of the plasma stream and oxidizing reactants to be introduced at a lower temperature or less active region of the plasma stream. Introducing the oxidizing reactants at the lower temperature region of the plasma stream reduces the production of unwanted oxides while ensuring that the reduction of some compounds can still occur in the higher temperature region. Improved abatement performance is achieved with lower levels of unwanted by-products compared to introducing the reducing and oxidising reactants together.
[0066] Plasma Torch
[0067]
[0068] In operation, the controller 4 switches the power supply 1 to create a voltage difference between the cathode 2 and the anode 3 to initiate the plasma. Once the plasma is created it drives a constant direct current (DC) between the cathode 2 and the anode 3 (the power supply 1 operates as constant current power supply). The controller 4 causes the plasma gas carrier 5A to be delivered via the plasma gas carrier conduit 5B which creates a plasma plume 10 through a DC arc discharge between the cathode 2 and the anode 3. The plasma plume 10 extends into the reaction chamber 8. The discharge is sustained by the injection of the plasma gas carrier 5A.
[0069] The effluent stream 9A is conveyed to the plasma plume 10 by the effluent stream conduit 9B. The abatement reaction then takes place inside the reaction chamber 8, which is typically cylindrical in shape and provides thermal insulation. Hence, the effluent stream 9A mixes with the plasma plume 10 within the reaction chamber 8.
[0070] To assist the abatement reaction, the controller 4 controls the introduction of the reducing reactant 11A through the reducing reactant conduit 11B. Thus, the reducing reactant 11A mixes with the effluent stream 9A in a hotter zone 6 of the plasma plume 10. Typically, the hotter zone 6 experiences a temperature in excess of 1000° C. Optionally, a generating device 20 under the control of the controller 4 generates the reducing reactant 11A (such as H.sub.2 by electrolysis or NH.sub.3 by thermal decomposition).
[0071] The controller 4 controls the introduction of the oxidizing reactant 12A via the oxidizing reactant conduit 12B into a cooler zone 7 of the plasma plume 10, which is downstream of the hotter zone 6. Typically, the cooler zone 7 experiences a temperature which is greater than around 500° C. but which is lower than 1000° C.
[0072] Performance
[0073]
[0074] The arrangement such as that shown in
[0075] To illustrate this,
[0076] However, as can be seen in
[0077]
[0078] Other Arrangements
[0079]
[0080]
[0081]
[0082] Although in this example hydrogen is used as the reducing agent, it will be appreciated that other reducing agents such as an alkaline earth metal such as beryllium, magnesium, calcium, strontium, barium and the like and/or an alkaline earth salt may be used. Additionally, other reducing agents such as NH.sub.3, and/or a hydrocarbon such as propane, methane and the like may be used. As mentioned above, the NH.sub.3 may be generated by thermal decomposition of an ammonia salt such as ammonium carbonate (NH.sub.4)2CO.sub.3, or the like either within the first region 6 or in-situ by the generating device 20. Similarly, the hydrogen may be generated in-situ through electrolysis by the generating device 20.
[0083] Likewise, although in this example oxygen is used as the oxidizing reactant, it will be appreciated that other oxidizing reactants such as ozone.
[0084] Also, although the reducing reactant is shown being introduced between the anode 3 and the reaction chamber 8, it will be appreciated that this need not be the case and that the reducing reactant simply needs to be introduced at a location where the plasma stream is hotter than the location where the oxidizing reactant is introduced.
[0085] Additionally, although the embodiments have been described with reference to a DC plasma torch and an inductively coupled plasma torch, it will be appreciated that the same approach can be used for other plasma devices and sources of plasma such as, for example, a microwave plasma discharge.
[0086] Some embodiments address the optimization of thermal plasma abatement with the aim of reducing thermal NOx generation and increasing abatement reaction efficiency. Looking at thermal equilibrium simulations, it has become apparent that the abatement reactions involving the reduction of fluorinated species, F.sub.2, CFx and SFy into HF require much higher temperatures of the oxidation reaction of other abatement byproducts such as CO and CxHy. Some embodiments involve a thermal plasma abatement in two steps: 1) a hydrogen-rich reagent is injected in a much hotter reaction zone or premixed with torch plasma gas 2) the oxygen-rich reagents are injected further downstream in a relatively less hot zone. This provides for a split injection of two kinds of reagents in thermal plasma abatement.
[0087] Although illustrative embodiments of the invention have been disclosed in detail herein, with reference to the accompanying drawings, it is understood that the invention is not limited to the precise embodiment and that various changes and modifications can be effected therein by one skilled in the art without departing from the scope of the invention as defined by the appended claims and their equivalents.
REFERENCE SIGNS
[0088] power supply 1; 13 [0089] anode 2 [0090] cathode 3 [0091] controller 4 [0092] plasma gas carrier 5A [0093] plasma gas carrier conduit 5B; 15 [0094] hotter zone 6 [0095] cooler zone 7 [0096] reaction chamber 8 [0097] effluent stream 9A [0098] effluent stream conduit 9B [0099] plasma plume 10 [0100] reducing reactant 11A [0101] reducing reactant conduit 11B [0102] oxidising reactant 12A [0103] oxidising reactant conduit 12B [0104] coils 14 [0105] insulated tube 16 [0106] matching box 17 [0107] generating device 20 [0108] plasma torch 100A; 100B; 100C; 100D