METHOD AND APPARATUS FOR MANUFACTURING A PART USING SUCCESSIVE DEPOSITION OF LAYERS

Abstract

A method for manufacturing at least one portion of a part using successive deposition of layers, involving the steps of: a) depositing a first layer of a molten metal on a substrate such that a first metal strip is formed on the substrate; b) depositing a second layer of a molten metal on the first strip such that a second metal strip is formed on the first strip; and c) repeating steps a) and then b) for each new metal layer to be deposited on a preceding strip until the at least one portion of the part has been formed. The method may further include step d) compressing the formed bead after performing n instances of step c), n being greater than or equal to 1. The step of compressing the formed bead may be performed before the complete cooling of said bead.

Claims

1. A method for manufacturing at least a portion of a part by successive depositions of layers, comprising the following steps: a) depositing a first layer of molten metal on a substrate, so as to form a first metallic bead on the substrate, b) depositing a second layer of molten metal on said first bead, so as to form a second metallic bead on said first bead, and c) repeating steps a) and then b) for each new metallic layer to be deposited on top of the previous bead, until the formation of said at least one portion of the part, d) compressing, after performing n instances of step c), n being greater than or equal to 1, the formed bead, wherein the step of compressing the formed bead is performed before the complete cooling of said bead.

2. The method of claim 1, wherein the step of compressing the formed bead is performed when the material of said bead is at a temperature of more than 30° C.

3. The method of claim 1, wherein the step of compressing the formed bead is performed by projecting a flow of gas onto said bead.

4. The method aof claim 1, wherein the step of compressing the formed bead is performed by shot peening said bead.

5. The method of claim 4, wherein shot peening is performed with particles of a powder material used for the manufacturing of the beads, the size of said particles for shot peening being different from the size of particles of said powder.

6. The method of claim 4, wherein shot peening is performed with particles of material different from material used to manufacture the beads.

7. The method of claim 1, wherein the step of compressing the formed bead is configured to enable one or more of the following: i) introduction of residual compression stress to counter the residual fusion-generated tensile stress, to minimize deformation; ii) pickling of any oxide layer that has developed on the surface of the bead; iii) modification of the initial bead microstructure by shot peening to achieve a homogeneous microstructure; and iv) densification of the deposited matter to reduce the porosity induced by the additive manufacturing process.

8. A device to implement the method of claim 1, comprising: a laser head configured to melt the filler metal to create a bead, and a nozzle configured for the compression of said bead.

9. The device of claim 8, wherein the laser head and the nozzle are supported by a shared robotic arm.

10. The method of claim 1, wherein the step of compressing the formed bead is performed when the material of said bead is at a temperature of more than 100° C.

11. The method of claim 1, wherein the step of compressing the formed bead is performed when the material of said bead is at a temperature of more than 200° C.

12. The method of claim 1, wherein the step of compressing the formed bead is performed when the material of said bead is at a temperature of about 300° C.

13. The method of claim 3, wherein the gas comprises compressed air or nitrogen.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0034] The invention will be better understood, and other details, features and advantages of this invention will become clearer upon reading the following description, provided as an example and not limited thereto, and with reference to the appended drawings, in which:

[0035] FIG. 1 is a schematic and perspective view of a device to manufacture a part using additive manufacturing according to the prior art;

[0036] FIG. 2 is a highly schematic view of the general principle of the invention;

[0037] FIG. 3 is a highly schematic view of an embodiment of the device according to the invention, and

[0038] FIG. 4 is a highly schematic view of another embodiment version of the device according to the invention.

DETAILED DESCRIPTION

[0039] Additive manufacturing has many advantages, including reduced manufacturing time, reduced costs and reduced overheads compared with moulded parts, injected parts or parts machined from a billet.

[0040] However, parts created by additive manufacturing feature some drawbacks: during solidification, residual tensile stress develops with each new layer, and can cause cracking.

[0041] The invention seeks to remedy these disadvantages with a manufacturing device as shown in FIG. 2, which comprises: [0042] a first nozzle 100 for the deposition of powder 102 on the substrate 80, [0043] a head 104 emitting a laser beam 106, and [0044] a second nozzle 108 for the compression of the bead 110 after it has been created and before it is covered by the subsequent bead.

[0045] As shown in FIG. 1, the function of the nozzle 100 could be integrated in the laser head 104. In this case, the device would feature a laser head 104 configured to deposit powder 102 on the substrate 80, as well as the nozzle 108.

[0046] The method according to the invention comprises, after each step whereby a layer or a bead is created, a step whereby the bead 110 is compressed.

[0047] Preferably, the compression of the bead 110 is achieved by shot peening or by gas-cooling of the bead, after the passage of the beam 106 on the layer to provide a layer-by-layer or a bead-by-bead treatment, and to apply compression stresses, or to achieve a required microstructure. Shot peening or cooling have different effects depending on the temperature of the substrate, the positioning of the head 104 that emits the beam 106, etc. For example, this temperature can be managed by identifying the surface isotherms of each bead 110.

[0048] In the specific case of the bead being compressed when the bead is at ambient temperature, the working distance L between the layer and the head 104 can be of approximately 150 mm. This head 104 can have a diameter of 6 mm and the shot peening can be performed by depositing particles with a diameter of approximately 100 μm at a pressure of 0.2-0.8 MPa.

[0049] In the specific case of compression being performed when the bead is at high temperature (for example of around 300° C.), shot peening can be conducted at a pressure of 0.6 MPa with shots of 1.0 mm. These shot peening operations can be followed by a treatment of the microshot peening type, which is performed at a pressure of 0.6 MPa with shots of 0.1 mm.

[0050] The application of the invention on a steel bead featuring high hardness (600-1000 HV) achieves a surface stress of approximately −350 to −500 MPa, a maximum compression stress of around −400 to −2000 MPa, a maximum stress depth of around 5 to 20 μm, and a compression depth ranging from 50 to 100 μm.

[0051] For shot peening operations, a guided microshot peening nozzle can be used, using a fine powder with a particle size of 10 to 100 μm. The impact surface can be of a few square millimetres and the affected depth can range between 50 to 150 μm.

[0052] This is compatible with direct laser deposition methods. With the direct laser deposition method, fused layers have a thickness of around 200 to 500 μm. The fused powders have the same grain size; it is possible to consider using the same powders to avoid contaminating the parts. Shot peening works on the same scale as the abovementioned additive manufacturing method.

[0053] For stress-related aspects, depth stress modifications can be modulated. It is also possible to use the cooling effect of the carrier gas to change stress values and limit oxidation.

[0054] As mentioned above, compression can also be introduced by means of a carrier gas, without using a medium such as microshot peening, in order to temper the bead of matter and introduce residual stresses therein. The expelled gas can be a neutral gas or a reagent gas. Preferably, the flow is sufficient to accelerate the cooling of the bead faster than by conduction through the support.

[0055] The microshot peening or gas flow emitting nozzle 108 must follow the head 104 to impact the hardened bead with a slight delay that is determined, for instance, based on the distance d between the nozzle and the head, d being a factor of the cooling temperature of the bead and the temperature that is suitable for the compression of the bead. In fact, the guiding of the orientation of the shot peening nozzle is preferably differentiated from the guiding of the projection nozzle.

[0056] The emitting head 104 and the second nozzle 108, and even the first nozzle 100, are preferably supported by a shared robotic arm.

[0057] FIGS. 3 to 4 each represent two embodiments of the device according to the invention. In FIG. 3, the arm 120 is rotationally mobile about an axis 122, for example a vertical axis. The head 104 is centred on the axis 122 and the outputs of the microshot peening nozzle are located on a circumference centred on the axis 122. The arm is moved along a plane that comprises the axis 122, such as the plane of the drawing, and the nozzle 108 located downstream from the beam 106, with respect to the travelling direction of the arm, is used to compress the beam.

[0058] As shown in FIG. 4, the arm 120 supports the shot peening nozzle 108 and the beam-emitting head 104, the distance between them being changeable by moving the nozzle in translation with respect to the arm. The arm is longitudinally and rotationally movable both in translation and in rotation about the axis 122 of the head 104.

[0059] If the shot peening particles are of the same nature as the powder particles, there is a risk of a greater loss of powder. One solution resides in the use of a powder with a coarser particle size, so that the particles can be retrieved by sieving, or using a powder of a different material, such as ceramic, that can be retrieved by magnetic separation.