DETACHMENT DEVICE
20210197543 · 2021-07-01
Assignee
Inventors
Cpc classification
B65H41/00
PERFORMING OPERATIONS; TRANSPORTING
B65H29/56
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
This detachment device is provided with: a collet including a contact surface that comes into surface contact with a surface of a protective film adhering to an adhesion member attached on a workpiece, and including a suction hole that is provided in the contact surface and that sucks the protective film; and a movement mechanism that moves the collet relative to the workpiece, wherein while the protective film is being sucked by the suction hole, the collet is separated from the workpiece so that the protective film is detached from the adhesion member. Accordingly, the detachment device capable of more assuredly detaching the protective film from the workpiece is provided.
Claims
1. A detachment device that detaches a protective film protecting a surface of an adhesion member from the adhesion member attached to a workpiece, and the detachment device comprising: a collet, including an contact surface that comes in contact with a periphery of an end side of a surface of the protective film adhered to the adhesion member in a planar shape, and a suction hole that is provided within the contact surface and sucks the protective film; and a movement mechanism that moves the collet with respect to the workpiece, wherein the protective film is detached from the adhesion member by separating the collet from the workpiece in a state in which the protective film is sucked by the suction hole; the contact surface is tilted toward a surface of the workpiece, such that an inner end of the contact surface is set to be lower than an outer end of the contact surface in a range in which a leak during a suction does not occur; a difference in heights of the outer end and the inner end of the contact surface falls into a range of a sinking amount of the protective film.
2. (canceled)
3. (canceled)
4. The detachment device according to claim 1, wherein an area of the contact surface is smaller than the protective film.
5. A detachment device that detaches a protective film protecting a surface of an adhesion member from the adhesion member attached to a workpiece, and the detachment device comprising: a collet, including an contact surface that comes in contact with a surface of the protective film adhered to the adhesion member in a planar shape, and a suction hole that is provided within the contact surface and sucks the protective film; and a movement mechanism that moves the collet with respect to the workpiece, wherein the protective film is detached from the adhesion member by separating the collet from the workpiece in a state in which the protective film is sucked by the suction hole; the contact surface comes in contact with a periphery of an end of the protective film and in a direction substantially orthogonal to a transport direction of the workpiece.
6. (canceled)
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
[0024] Configurations of a detachment device will be described below with reference to drawings.
[0025] The detachment device 10 is a device for detaching the protective film 100 from an adhesion member (a DAF 104) attached to the workpiece 102. The workpiece 102 is, for example, a semiconductor chip mounted on a substrate 110. The DAF 104 is attached to a surface of the workpiece 102 as an adhesion member. The DAF 104 is a film with the function of a die attach agent (a bonding agent) as is known, and the DAF 104 is cured by heating and bonded to a semiconductor chip. Normally, such a DAF 104 is laminated on the back surface of a semiconductor chip or attached to the substrate 110. In the present example, in order to gain a so-called package-on-package (PoP) structure in which a semiconductor chip is bonded onto an upper surface of another semiconductor chip, the DAF 104 is attached to an upper surface of a semiconductor chip (the workpiece 102) mounted on the substrate 110. An outer surface of the DAF 104 (the surface thereof that is not attached to the semiconductor chip) is an adhesive surface to which another semiconductor chip adheres. The adhesive surface of the DAF 104 is covered and protected by the protective film 100 to prevent contamination or attachment of foreign substances.
[0026] The protective film 100 is a film formed of, for example, a resin material such as PET and covers the entire adhesive surface of the DAF 104. Before the DAF 104 is used, that is, when the semiconductor chip is mounted via the DAF 104, or the like, the protective film 100 is detached from the DAF 104 beforehand. The detachment device 10 disclosed in the present specification is a device that detaches the protective film 100 protecting the surface of the DAF 104 from the DAF 104. Note that, the protective film 100 is normally thicker than the DAF 104 in most cases, and the protective film 100 has a thickness of, for example, 35 μm to 100 μm, and the DAF 104 has a thickness of 15 μm to 30 μm.
[0027] The detachment device 10 is broadly divided into a workpiece transport mechanism 14 that transports the workpiece 102 and a detachment mechanism 12 that detaches the protective film 100. The workpiece transport mechanism 14 is a mechanism that transports the workpiece 102 mounted on the substrate 110 in one direction (an X axis direction in the present example). The workpiece 102 is transported in a state in which it is placed on a transport table 22. The transport table 22 is moved by a mechanism constituted by, for example, a motor, ball screws, a slide rail, and the like in the X axis direction. Note that, a plurality of workpieces 102 are two-dimensionally arrayed on one substrate 110.
[0028] The detachment mechanism 12 has the collet 16 that sucks the protective film 100, a movement mechanism 18 that moves the collet 16 relative to the workpiece 102, a vacuum source 20 that generates suction power, and the like. The movement mechanism 18 has a plurality of motors, ball screws that convert motions of the motor into straight movements, and the like, and moves the collet 16 in three directions of the X, Y and Z axes.
[0029] The collet 16 is a member that sucks and holds the protective film 100. The bottom surface of the collet 16 functions as a contact surface 30 that comes in contact with a surface of the workpiece 102 (i.e., an outer surface of protective film 100 attached to the workpiece 102). Although a shape of the contact surface 30 is not particularly limited, it is a rectangular shape that is long in the Y axis direction (a direction orthogonal to the workpiece transport direction) as illustrated in
[0030] When the protective film 100 is detached, the contact surface 30 comes in contact with a position in the protective film 100 that is deviated in the X axis direction, rather than a position at the center thereof. Specifically, the collet 16 is positioned such that one end side of the contact surface 30 in the X axis direction is in proximity to one end side of the protective film 100 in the X axis direction. As will be described in detail below, an end of the protective film 100 in the deflection direction (X axis direction) of the contact surface 30 is a detachment start end 120 at which detachment first occurs.
[0031] Here, in the present example, the central axis Cw of the collet 16 is slightly tilted from the vertical direction as illustrated in
[0032] A suction hole 32 for sucking the protective film 100 is open within the contact surface 30. The suction hole 32 has a substantially rectangular shape so as to offset the external form of the contact surface 30 inward. The suction hole 32 is connected to the vacuum source 20.
[0033] Next, a workflow of detachment of the protective film 100 using the detachment device 10 will be described. When the protective film 100 is to be detached, the movement mechanism 18 is driven to position the collet 16 directly above the target protective film 100. Then, the vacuum source 20 is driven to lower the collet 16 while starting suction with the suction hole 32, and the contact surface 30 is brought in contact with a surface of the protective film 100.
[0034]
[0035] As is apparent from the above description, the collet 16 of the present example comes in contact with the protective film 100 in a planar shape and sucks a periphery of the detachment start end 120 of the protective film 100. The reason for this configuration will be described by comparing the configuration with the prior art. Conventionally, an adhesive tape is mostly used for detachment of the protective film 100. That is, a conventional technology of detaching the protective film 100 by bringing an adhesive tape wound around a roll in contact with the protective film 100 and separating the adhesive tape from the workpiece 102 has mostly been used. However, in the case of the technology using such an adhesive tape, there is concern of the adhesive of the adhesive tape causing contamination or the like adhering to the substrate 110 or the like.
[0036] Therefore, there are some proposals for technologies of sucking and detaching such a protective film 100.
[0037] In the case of the configuration in which the roll member 50 is used, however, the roll member 50 and the protective film 100 are only in linear contact. In addition, in order to prevent a leak in suction, the suction hole 32 needs to be a very small hole having a size that fits in the linear contact portion. When the suction hole 32 is small like this, there are cases in which the power of the entire roll member 50 to hold the protective film 100 tends to be small and sufficient detachment power would not be obtained.
[0038] In addition, the suction hole 32 is positioned at the linear contact portion of the roll member 50 as described above. The linear contact portion is a position at which the protective film 100 and the DAF 104 are in close contact with each other due to receiving a pressing force from the roll member 50. Since the portion at which the protective film 100 and the DAF 104 are in close contact with each other is sucked by the suction hole 32 in the prior art, it is hard to separate the protective film 100 from the DAF 104 and the protective film 100 may not be properly detached.
[0039] Meanwhile, in the present example, the contact surface 30 of the collet 16 comes in contact with the protective film 100 in a planar shape and the suction hole 32 is provided within the contact surface 30 as described above. Thus, it is possible to design a position and a shape of the suction hole 32 more freely than in the case of
[0040] In addition, in the present example, the contact surface 30 is set to be smaller than the protective film 100 and comes in contact with a portion adjacent to an end of the protective film 100 (the detachment start end 120). In addition, the suction hole 32 sucks the periphery of the end of the protective film 100 (the detachment start end 120). Accordingly, warping or peeling of the protective film 100 easily occurs, and thus the protective film 100 can be detached more reliably. That is, while the protective film 100 hardly peels off from the center in general, it peels off mostly from an end thereof. Therefore, it can be said that it is desirable for the suction hole 32 to suck the periphery of an end of the protective film 100, rather than the center thereof.
[0041] Furthermore, in the present example, the contact surface 30 is slightly tilted toward the surface of the workpiece 102 such that the inner end of the contact surface 30 is set to be lower than the outer end of the contact surface 30. When this configuration is employed, the protective film 100 receives a maximum force from the inner end of the contact surface 30 as illustrated in
[0042] Note that, the configurations described so far are all examples, and another configuration may be appropriately changed as long as the contact surface 30 that comes in contact with the protective film 100 in a planar shape and the suction hole 32 provided within the contact surface 30 are included. For example, although the suction hole 32 is set to have a substantially rectangular shape in which the contact surface 30 is offset inside in the above description, another shape is possible as long as sufficient holding power can be obtained. The suction hole 32 may be, for example, a round hole. In addition, the number of the suction holes 32 may be one or more. Thus, the suction hole 32 may be set to multiple holes arrayed in two rows as illustrated in
[0043] In addition, although the contact surface 30 is set to have a substantially rectangular shape smaller than the protective film 100 in the above description, a shape and a size of the contact surface 30 are not particularly limited as long as the contact surface can come in contact with the protective film 100 in a planar shape. Thus, the contact surface 30 may have a circular shape, an elliptical shape, a square shape, or the like. In addition, the contact surface 30 may have a size in which the contact surface can come in contact with nearly the entire surface of the protective film 100 as illustrated in
[0044] In addition, the contact surface 30 is brought in contact with the protective film 100 at a position close to an end in the X axis direction (an end in the transport direction) and the periphery of the end in the X direction is sucked by the suction hole 32 in the above description. In the case of the configuration, the end of the protective film 100 in the transport direction is the detachment start end 120. However, another part may be the detachment start end 120. For example, the end in the Y axis direction substantially orthogonal to the transport direction may be the detachment start end 120 as illustrated in
[0045] That is, in the case of the configuration of
[0046] In addition, the protective film 100 is separated from the workpiece 102 after the protective film is sucked by the suction hole 32 and the collet 16 is moved in the above description. However, either of the workpiece 102 and the collet 16 may be moved if the collet 16 and the workpiece 102 are relatively moved after the protective film 100 is sucked.
REFERENCE SIGNS LIST
[0047] 10 Detachment device [0048] 12 Detachment mechanism [0049] 14 Workpiece transport mechanism [0050] 16 Collet [0051] 18 Movement mechanism [0052] 20 Vacuum source [0053] 22 Transport table [0054] 30 Abutting surface [0055] 32 Absorption hole [0056] 50 Roll member [0057] 100 Protective film [0058] 102 Workpiece [0059] 104 DAF [0060] 110 Substrate [0061] 120 Detachment start end