HYBRID MATERIAL AIRCRAFT SENSORS AND METHOD OF MANUFACTURING
20210172973 · 2021-06-10
Inventors
- Robin Jacob (Bangalore, IN)
- Guru Prasad Mahapatra (Bangalore, IN)
- Paul Robert Johnson (Prior Lake, MN, US)
- Greg Seidel (Farmington, MN, US)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/25
PERFORMING OPERATIONS; TRANSPORTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/25
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
G01P13/025
PHYSICS
Y02P10/25
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B29C64/153
PERFORMING OPERATIONS; TRANSPORTING
B22F7/062
PERFORMING OPERATIONS; TRANSPORTING
B22F7/062
PERFORMING OPERATIONS; TRANSPORTING
International classification
G01K13/02
PHYSICS
Abstract
An air data probe includes a probe body including a probe wall. The probe body is formed from a first material by direct energy metal deposition. An insert is positioned in the probe wall. The insert is formed from a second material different from the first material. The insert is encapsulated in the probe wall via the direct energy metal deposition. A method of forming an air data probe includes forming one or more thermally conductive inserts, and encapsulating the one or more inserts into a wall of an air data probe via direct energy metal deposition. The air data probe is formed from a first material and the one or more inserts are formed from a second material different from the first material.
Claims
1. A method of forming an air data probe, comprising: forming one or more thermally conductive inserts; and encapsulating the one or more inserts within a wall of an air data probe via direct energy metal deposition, the air data probe formed from a first material and the one or more inserts formed from a second material different from the first material.
2. The method of claim 1, wherein forming the one or more inserts includes: forming a base insert portion; and applying a coating portion over the base portion.
3. The method of claim 2, further comprising forming the base insert portion from a second material having a higher thermal conductivity than the first material.
4. The method of claim 2, wherein the base insert portion is formed from one of annealed pyrolytic graphite (APG), graphite or copper.
5. The method of claim 2, wherein the coating portion is formed from one of a chromium or nickel material.
6. The method of claim 1, further comprising heating treating or hot isostatic pressing the air data probe after encapsulating the one or more inserts.
7. The method of claim 1, further comprising performing one or more machining operations on the air data probe after encapsulating the one or more inserts.
8. The method of claim 1, wherein the direct energy metal deposition process is laser metal deposition.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
[0021]
[0022]
[0023]
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[0025]
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[0027]
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DETAILED DESCRIPTION
[0029] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
[0030] Referring to
[0031] As shown, the tip portion 14 has a tip length L. The length of the tip may be limited by an ability of a heating element or coils disposed inside the tip to provide heat to it. That is, if the tip is too long, the heater may not be able to heat a distal end thereof such that ice does not form or otherwise accumulate in or on the tip 14.
[0032] Referring now to
[0033] One or more thermally conductive inserts 42 are located in the tube wall 36, radially between the tube inner surface 32 and the tube outer surface 34. The inserts 42 are utilized to improve heat transfer rates and performance from the heating element 40 throughout the pitot tube 10. As shown in
[0034] Referring now to
[0035] While the description above relates to pitot tubes 10, the present disclosure may be readily applied to other air data probes and sensors, such as a total air temperature (TAT) probe 50, shown in
[0036] Referring now to
[0037] The sensors disclosed herein, including the inserts 42, improves heat transfer of the sensors to prevent and/or alleviate icing conditions at the sensor. Further, forming the sensor via direct energy metal deposition allows the inserts to be readily embedded into the sensors, and the coating of the inserts 42 improves adhesion of the base metal to the inserts 42, and also prevents oxidation of the inserts 42.
[0038] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.
[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
[0040] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.