Probe, measuring system as well as test setup

Abstract

A probe for measurements on a device under test with low source impedance is described. The probe has a resistor coupled in series between a probe tip and a probe cable connected to a measuring apparatus. The resistor having an impedance equal to a characteristic impedance of the probe cable or equal to the difference between the characteristic impedance of the probe cable and an output resistance of the device under test. Further, a measuring system and a test setup are described.

Claims

1. A probe for measurements on a device under test with low source impedance, comprising: a probe tip for connecting said probe to said device under test; a probe cable coupled with said probe tip; an output connector for connecting said probe cable to a measuring apparatus; and, a resistor coupled in series between said probe tip and said probe cable, said probe being a passive probe, said probe cable having a characteristic impedance, said resistor having an impedance equal to said characteristic impedance of said probe cable.

2. The probe according to claim 1, wherein said characteristic impedance of said probe cable is selected from a group consisting of 50 Ohm, 75 Ohm, 100 Ohm and 150 Ohm.

3. The probe according to claim 1, wherein said resistor is located adjacent to said probe tip.

4. The probe according to claim 1, wherein said probe cable comprises an inner conductor, said resistor being connected to said inner conductor.

5. The probe according to claim 4, wherein said probe cable is a coaxial cable.

6. The probe according to claim 1, wherein said probe tip is adapted to be connected to said device under test via a socket or a rigid solder joint.

7. The probe according to claim 1, wherein said passive probe comprises a housing, said housing comprising said resistor, said housing being connected to said probe cable via a detachable connector or a rigid solder joint.

8. The probe according to claim 1, wherein said probe comprises an inductive component being located between said probe cable and said output connector.

9. A measuring system comprising a measuring apparatus with a high impedance input and a passive probe according to claim 1, said output connector of said passive probe being connected to said high impedance input.

10. The measuring system according to claim 9, wherein said measuring apparatus is an oscilloscope.

Description

DESCRIPTION OF THE DRAWINGS

(1) The foregoing aspects and many of the attendant advantages of the claimed subject matter will become more readily appreciated as the same become better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawing, wherein

(2) FIG. 1 shows a schematic overview of a first embodiment of a test setup according to an aspect of the disclosure comprising a measurement system according to an aspect of the disclosure having a probe according to an aspect of the disclosure; and

(3) FIG. 2 shows a second embodiment of a test setup according to an aspect of the disclosure comprising a measurement system according to an aspect of the disclosure having a probe according an aspect of the disclosure.

DETAILED DESCRIPTION

(4) The detailed description set forth below in connection with the appended drawing, where like numerals reference like elements, is intended as a description of various embodiments of the disclosed subject matter and is not intended to represent the only embodiments. Each embodiment described in this disclosure is provided merely as an example or illustration and should not be construed as preferred or advantageous over other embodiments. The illustrative examples provided herein are not intended to be exhaustive or to limit the claimed subject matter to the precise forms disclosed.

(5) In the following description, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments of the present disclosure. It will be apparent to one skilled in the art, however, that many embodiments of the present disclosure may be practiced without some or all of the specific details. In some instances, well-known process steps have not been described in detail in order not to unnecessarily obscure various aspects of the present disclosure. Further, it will be appreciated that embodiments of the present disclosure may employ any combination of features described herein.

(6) FIG. 1 shows a test setup 10 schematically, comprising a device under test 12 and a measuring system 14. The measuring system 14 has a measuring apparatus 16, for example an oscilloscope, and a probe 18, for example a passive probe.

(7) The device under test 12 has a low source impedance. In the shown embodiment, the device under test 12 is illustrated as a signal line 20 with a test resistor 22 having a source impedance or resistance R.sub.S, for example 1Ω.

(8) The test resistor 22 may be a shunt or current sense resistor. It is also possible that measurements are performed on the device under test 12 on power rails, at power supplies or on transistor outputs, for example.

(9) The measuring apparatus 16, on the other hand, has a high-impedance input 23 for measurements. The high input impedance is illustrated by input resistor 24 having a resistance R.sub.I of, for example, 1 MΩ and an input capacitor having a capacitance C.sub.I of, for example, 10 pF.

(10) For measurements, the device under test 12 is connected to the measuring apparatus 16 using the probe 18.

(11) The probe 18 comprises a first probe tip 28, a second probe tip 29, a resistor 30, a probe cable 32, an output connector 34, and a housing 36. The first probe tip 28 is connected to the signal line 20 of the device under test 12 at one end of the test resistor 22. The second probe tip 29 is connected to the signal line 20 at the other end of the test resistor 22. These connections may be rigid solder joints 38. It is also possible, that the connections are sockets.

(12) Adjacent to the first probe tip 28, the resistor 30 is located meaning that no other components are provided between the first probe tip 28 and the resistor 30. In the exemplary embodiment of FIG. 1, the resistor 30 is received in the housing 36.

(13) The housing 36, or more precisely the resistor 30, is connected to the probe cable 32. The probe cable has a characteristic impedance I of, for example, 501. The probe cable 32 may be a coaxial cable having an inner conductor 40 and an outer conductor 42.

(14) The resistor 30 is electrically connected to the inner conductor 40 providing an electrical connection between the first probe tip 28 and the inner conductor 40. The second probe tip 29 is electrically connected to the outer conductor 42.

(15) At the end of the probe cable 32 not connected to the resistor 30, the output connector 34 of the probe 18 is located. The output connector 34 is connected to the high-impedance input 23 of the measuring apparatus 16 in order to connect the probe cable 32 to the measuring apparatus 16.

(16) The second probe tip 29 may also be connected to the measuring apparatus 16, for example ground or a second input of the measuring apparatus 16.

(17) In some embodiments, the high-impedance input 23 is a coaxial one such that both probe tips 28, 29 are connected with a single input of the measuring apparatus 16.

(18) In order to perform a high-bandwidth measurement (bandwidth of more than 50 MHz), the impedance, i.e. the resistance R.sub.P of the resistor 30 of the probe 18 may be chosen to match the characteristic impedance I of the probe cable 32. For example, the resistance R.sub.P may be 50Ω, 75Ω, 100Ω or 150Ω.

(19) In the described example, however, the resistor 30 has an impedance or resistance R.sub.P being the difference between the characteristic impedance I of the probe cable 32 and the source impedance, i.e. output resistance of the device under test 12, in this case the resistance R.sub.S of the test resistor 22. Therefore, for the above mentioned values (I=50Ω, R.sub.S=1Ω), the impedance or resistance R.sub.P of the resistor 30 is 49Ω.

(20) Thus, the resistor 30 adapts the impedance of the device under test 12 to the impedance of the probe cable 32 and absorbs reflected signals coming from the other end of the probe cable 32. Accordingly, high quality measurements are possible over a broad bandwidth with an attenuation of 1:1 using the probe 18. Thus, a 1:1 passive probe is provided.

(21) FIG. 2 shows a second embodiment of the test setup 10, the measuring system 14 and the probe 18 being essentially the same as the first embodiment shown in FIG. 1. Thus, identical parts or parts with the same function are referenced to using the same numerals and only the differences between the embodiments are described in the following.

(22) In the second embodiment, the first probe tip 28 and the second probe tip 29 are connected to the device under test using sockets 44.

(23) The connection between the resistor 30 and the probe cable 32 is provided using a detachable connector 46.

(24) Further, the test setup 10 of the second embodiment comprises a housing 48 that is separately formed from the probe 18. The housing 48 holds the resistor 30, wherein the housing 48 can be connected to the probe cable 32 and/or the housing 36 using the same or another detachable connector.

(25) It is also possible that the connections between the housing 48 and the probe cable 32, between the resistor 30 and the probe cable 32, or between the housing 36 and the housing 48 are rigid solder joints.

(26) In addition, the probe 18 of the second embodiment comprises an inductive component 52, for example a coil. The inductive component 52 is located between the output connector 34 and the probe cable 32, and in embodiment at the end of the probe cable 32 not being connected to the resistor 30. The inductive component 52 improves the measurement over a broad bandwidth.

(27) In the shown embodiment of FIG. 2, the resistor 30 has an impedance or resistance R.sub.P corresponding to the impedance I of the probe cable 32, namely 50Ω.

(28) In general, the resistor 30 has an impedance equal to the characteristic impedance of the probe cable 32 (embodiment according to FIG. 2) or an impedance equal to the difference between the characteristic impedance of the probe cable 32 and the output resistance Rs of the device under test 12 (embodiment according to FIG. 1).

(29) Of course, the features of the two embodiments can be combined and interchanged. Especially the way of connecting the probe tips 28, 29 to the device under test 12 and the way of connecting the resistor 30 to the probe cable 32 may be either detachable connections using sockets, detachable connectors, rigid solder joints or other common connections.

(30) The principles, representative embodiments, and modes of operation of the present disclosure have been described in the foregoing description. However, aspects of the present disclosure which are intended to be protected are not to be construed as limited to the particular embodiments disclosed. Further, the embodiments described herein are to be regarded as illustrative rather than restrictive. It will be appreciated that variations and changes may be made by others, and equivalents employed, without departing from the spirit of the present disclosure. Accordingly, it is expressly intended that all such variations, changes, and equivalents fall within the spirit and scope of the present disclosure, as claimed.