BONDING ARRANGEMENT AND BONDING TOOL

Abstract

The invention relates to a bonding arrangement comprising a bonding tool including a tool shank, which is designed as elongated in a tool longitudinal direction, and including a tool tip, which adjoins the tool shank, and comprising a light guide designed to conduct a laser beam, the light guide being provided in a longitudinal recess of the bonding tool, the longitudinal recess extending from an end face of the bonding tool opposite the tool tip in the direction of the tool tip, a functional recess being formed on the lateral surface of the bonding tool, and the longitudinal recess being made to extend up to the functional recess. The invention further relates to a bonding tool having a functional application as well as the use of the bonding arrangement according to the invention and/or the bonding tool for ultrasonic bonding.

Claims

1. A bonding arrangement comprising: a bonding tool having a tool shank, which is designed as elongated in a tool longitudinal direction and having a tool tip, which adjoins the tool shank; a light guide designed to conduct a laser beam, the light guide being provided in a longitudinal recess of the bonding tool, the longitudinal recess extending from an end face of the bonding tool opposite the tool tip in a direction of the tool tip; and a functional recess formed on a lateral surface of the bonding tool, the longitudinal recess extending towards the functional recess.

2. The bonding arrangement according to claim 1, wherein the functional recess is a radiation trap such that at least one boundary surface of the functional recess is designed as a deflecting surface for the laser beam; and wherein the functional recess has a positioning angle deviating by 0° and by 90° with respect to the tool longitudinal direction and/or is provided with a curved design.

3. The bonding arrangement according to claim 1, wherein the longitudinal recess is made to extend up to the tool tip, and/or the functional recess is at least partially formed on the tool tip.

4. The bonding arrangement according to claim 1, wherein a width of the functional recess defined transversely to the tool longitudinal direction and a depth of the functional recess defined transversely to the tool longitudinal direction as well as orthogonally to the width of the functional recess are dimensioned such that a diagnostic tool is insertable into the functional recess to test a function of the light guide.

5. The bonding arrangement according to claim 1, wherein a bonding contact surface is formed on the tool tip, and wherein the functional recess tapers in a direction of the bonding contact surface, and/or wherein the bonding contact surface is provided with a closed flat design.

6. The bonding arrangement according to claim 1, wherein the functional recess is manufactured by wire-cut EDM and/or by die-sink EDM or by additive manufacturing methods and/or by primary forming.

7. The bonding arrangement according to claim 1, wherein the light guide includes a glass fiber or a glass fiber bundle, and/or the light guide is coated from the outside with a reflective coating, at least in sections.

8. The bonding arrangement according to claim 1, wherein the width of the functional recess is smaller than two-thirds of a corresponding width of the bonding tool.

9. The bonding arrangement according to claim 1, wherein a cross-section of the functional recess is larger than a cross-section of the longitudinal recess at least in sections or adjacent to the longitudinal recess, and/or wherein the cross-section of the functional recess is constant, at least in sections.

10. T The bonding arrangement according to claim 1, wherein the functional recess is provided with a pocket-shaped design.

11. The bonding arrangement according to claim 1, wherein the functional recess is designed as a through-recess.

12. The bonding arrangement according to claim 1, wherein the light guide is inserted into the functional recess.

13. The bonding arrangement according to claim 1, wherein a free end of the light guide assigned to the tool tip is provided in the longitudinal recess.

14. A bonding tool comprising: a bonding arrangement according to claim 1; a tool shank elongated in a tool longitudinal direction; a tool tip, which adjoins the tool shank; a longitudinal recess, which extends from an end face of the bonding tool opposite the tool tip in the direction of the tool tip; and a functional recess formed on the lateral surface of the bonding tool, the longitudinal recess being made to extend up to the functional recess.

15. The of a bonding arrangement according to claim 1, wherein the bonding arrangement is adapted for laser-supported ultrasonic bonding and/or for laser-supported ultrasonic wire bonding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus, are not limitive of the present invention, and wherein:

[0031] FIG. 1 shows a front side view of a bonding tool according to the invention, including a longitudinal recess and a functional recess arranged orthogonally thereto, which is designed as a through-recess in the area of a tool tip of the bonding tool;

[0032] FIG. 2 shows a detail X of the bonding tool according to FIG. 1 in an enlarged representation;

[0033] FIG. 3 shows an longitudinal side view of the bonding tool according to FIG. 1;

[0034] FIG. 4 shows a underside view of the bonding tool according to FIG. 1;

[0035] FIG. 5 shows a first alternative specific embodiment of a bonding arrangement according to the invention in a front side view;

[0036] FIG. 6 shows the bonding arrangement according to FIG. 5 in a longitudinal side view;

[0037] FIG. 7 shows the bonding arrangement according to FIG. 5 in an underside view;

[0038] FIG. 8 shows a second alternative specific embodiment of a bonding arrangement according to the invention in a front side view;

[0039] FIG. 9 shows a third alternative specific embodiment of a bonding arrangement according to the invention in a front side view;

[0040] FIG. 10 shows a fourth alternative specific embodiment of a bonding arrangement according to the invention in a front side view;

[0041] FIG. 11 shows a fifth alternative specific embodiment of a bonding arrangement according to the invention in a front side view; and

[0042] FIG. 12 shows a sixth alternative specific embodiment of a bonding arrangement according to the invention in a front side view.

DETAILED DESCRIPTION

[0043] The figures show different exemplary embodiments of the bonding arrangement according to the invention. The same elements, or those having the same functions, are marked by the same reference numerals. Only the features which differ from those of the first exemplary embodiment are explained for the exemplary embodiments following the first exemplary embodiment. The exemplary embodiments otherwise correspond to each other.

[0044] According to FIGS. 1 through 4, a bonding arrangement according to the invention comprises a bonding tool 1 and a light guide 2, which is conducted in a longitudinal recess 5 of bonding tool 1 and is implemented, for example, as a glass fiber or plastic rod. Bonding tool 1 provides a tool shank 3, which is designed as elongated in a tool longitudinal direction 10. Bonding tool 1 further provides a tool tip 4, which adjoins tool shank 3. Longitudinal recess 5 of the bonding tool extends in tool longitudinal direction 10 from an end face 6 of bonding tool 1 opposite tool tip 4 in the direction of tool tip 4. At tool tip 4, end face 6 is provided with an oppositely situated underside 17, including a guide groove extending transversely to tool longitudinal direction 10. The guide groove is designed to receive a bonding wire, which is not illustrated. In the area of the guide groove, bonding tool 1 adjoins the bonding wire on the lateral side with a bonding contact surface 7 during the establishment of the bond connection.

[0045] Moreover, a functional recess 8 is formed on tool tip 4. Functional recess 8 is formed on a tool lateral surface 16 of bonding tool 1, which connects end face 6 to underside 17. Functional recess 8 is designed as a through-recess. It is oriented orthogonally to tool longitudinal direction 10.

[0046] Longitudinal recess 5 of bonding tool 1 extends up to functional recess 8 and opens thereinto. Light guide 2 conducted in longitudinal recess 5 projects into functional recess 8 with a free end 14 facing tool tip 4.

[0047] In an area adjacent to longitudinal recess 5, functional recess 8 provides a constant width 12 and then tapers in a wedge-shaped manner in the direction of underside 17 of tool tip 4. In the area of the wedge-shaped tapering, two oppositely situated boundary surfaces 9 of functional recess 8 are designed as absorption or deflecting surfaces for the laser beam, which is guided in light guide 2. Deflecting surfaces 9 are provided with a flat design and are arranged in an inclined manner at an acute positioning angle 15 with respect to tool longitudinal direction 10.

[0048] In the present exemplary embodiment of the invention, width 12 of functional recess 8 defined orthogonally to tool longitudinal direction 10 is smaller in each case than two-thirds of a corresponding outer width 11 of bonding tool 1. Bonding tool 1 is thus always provided with a sufficient amount of material to ensure an adequate mechanical stability even in the area of functional recess 8.

[0049] Bonding tool 1 is provided with a symmetrical design with respect to a longitudinal center plane 13 thereof. The symmetry favors the vibration characteristics of bonding tool 1.

[0050] A first alternative specific embodiment of the bonding arrangement according to the invention is illustrated in FIGS. 5 through 7. The bonding tool provides a functional recess 8 of the same shape but now designed in a pocket-like or trough-like manner, viewed from above. Functional recess 8 is thus not designed as a through-recess. It is limited by a wall 18 on the front side. Otherwise, the bonding arrangement corresponds to the one discussed above. In particular, the depth of the functional recess is further defined in such a way that longitudinal recess 5 opens into functional recess 8.

[0051] According to FIG. 8, a second alternative specific embodiment of the bonding arrangement according to the invention provides that light guide 2 is arranged in longitudinal recess 5 of bonding tool 1 in such a way that an outlet surface facing underside 17 is arranged exactly where longitudinal recess 5 ends or opens into functional recess 8. Free end 14 of light guide 2 thus does not project into functional recess 8.

[0052] According to FIG. 9, according to a third alternative specific embodiment of the bonding arrangement according to the invention, it is provided that free end 14 of light guide 2 is withdrawn and arranged in longitudinal recess 5 at a distance from functional recess 8.

[0053] In each case, an improved protection against contamination of light guide 2 results due to the arrangement of free end 14 of light guide 2 in longitudinal recess 5. In addition, light guide 2 is provided in longitudinal recess 5, protected against mechanical influences and damage.

[0054] While functional recess 8 according to the first three exemplary embodiments of the invention tapers in a wedge-shaped manner in the direction of underside 17 of tool tip 4, the further exemplary embodiments four, five and six of the invention in FIGS. 10 through 12 provide a rectangular functional recess 8 in cross-section. As before, functional recess 8 is arranged completely in the area of tool tip 4 and is implemented in each case as a through-recess. Of course, it may be alternatively provided that functional recess 8 is provided with a pocket-shaped design.

[0055] As discussed above, light guides 2 may either extend into functional recess 8 (FIG. 10) or—as shown in FIGS. 11 and 12—the outlet surface for the laser beam may be arranged in alignment with an opening of longitudinal recess 5 assigned to functional recess 8, or free end 14 of light guide 2 may be provided in a withdrawn manner in longitudinal recess 5.

[0056] According to an alternative specific embodiment of the invention, which is not illustrated, width 12 of functional recess 8 may increase in size, at least in sections, in the direction of underside 17. For example, functional recess 8 may be provided with a conical or frustoconical design. For example, width 12 of functional recess 8 may be defined in such a way that the laser beam does not strike the lateral limiting surfaces of functional recess 8 but rather a lower boundary surface of functional recess 8 assigned to underside 17 of bonding tool 1 and situated opposite free end 14 of light guide 2. An outflow of thermal energy in the direction of the tool shank and/or a clamping point of bonding tool 1 may then be reduced.

[0057] The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are to be included within the scope of the following claims.