Ceramic SMT chip antennas for UWB operation, methods of operation and kits therefor
11050147 · 2021-06-29
Assignee
Inventors
Cpc classification
H01P5/022
ELECTRICITY
H01Q5/50
ELECTRICITY
H01Q5/25
ELECTRICITY
International classification
H01Q5/25
ELECTRICITY
H01Q5/50
ELECTRICITY
Abstract
Disclosed are devices, systems and methods regarding ceramic-substrate ultra-wideband (UWB) antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Numerous configurations are disclosed for elements comprising each antenna. This ensures that the disclosed antennas may be configured in design to address varying performance requirements as well as to optimize performance across portions of the UWB spectrum.
Claims
1. An ultra-wideband antenna comprising: a ceramic dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, and a third surface, a fourth surface, a fifth surface, and a sixth surface, the ceramic dielectric substrate further comprising a first edge defined by an intersection of the first surface and the third surface; a radiator positioned on at least a portion of the first surface of the ceramic dielectric substrate, wherein the radiator comprises a semi-circular radiator, the semi-circular radiator having a curved side facing the first edge of the ceramic dielectric substrate, the semi-circular radiator further comprising a chord line that is parallel with the first edge, the chord line having a length which is less than the substrate width, the chord line length also being less than a diameter dimension for the semi-circular radiator; and a feed positioned on the third surface of the ceramic dielectric substrate.
2. The ultra-wideband antenna of claim 1 wherein the ultra-wideband antenna operates within a range of frequencies from 3.1 GHz to 10 GHz.
3. The ultra-wideband antenna of claim 1 wherein the first surface of the ceramic dielectric substrate has a two-dimensional shape selected from square, rectangular, and parallelogram.
4. The ultra-wideband antenna of claim 1 wherein the first surface of the ceramic dielectric substrate is at least one of planar and substantially planar.
5. The ultra-wideband antenna of claim 1 wherein the feed is centered on the third surface of the ceramic dielectric substrate and occupies an entire substrate thickness and less than one-third of the substrate width or the substrate length.
6. The ultra-wideband antenna of claim 1 wherein the feed has a shape selected from circular, semi-circular, triangular, trapezoidal, square and rectangular.
7. The ultra-wideband antenna of claim 1 wherein the feed is centered on a bottom surface along a length and adjacent to an edge shared with one of the third surface, the fourth surface, the fifth surface, and the sixth surface.
8. The ultra-wideband antenna of claim 1 wherein the antenna is positioned on a substrate in electrical communication with a feed line.
9. The ultra-wideband antenna of claim 8 wherein feed line is in electrical communication with a connector.
10. The ultra-wideband antenna of claim 1 further comprising a first connection pad and a second connection pad positioned on the second surface of the ceramic dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad.
11. The ultra-wideband antenna of claim 10 further comprising a third connection pad positioned on the second surface of the ceramic dielectric substrate.
12. An ultra-wideband antenna system comprising: an ultra-wideband antenna comprising: a ceramic dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, the ceramic dielectric substrate further comprising a first edge defined by an intersection of the first surface and the third surface; a radiator positioned on at least a portion of the first surface of the ceramic dielectric substrate, wherein the radiator comprises a semi-circular radiator, the semi-circular radiator having a curved side facing the first edge of the ceramic dielectric substrate, the semi-circular radiator further comprising a chord line that is parallel with the first edge, the chord line having a length which is less than the substrate width, the chord line length also being less than a diameter dimension for the semi-circular radiator; a feed positioned on the third surface of the ceramic dielectric substrate; and a ground plane having a feed line in electrical communication with the ultra-wideband antenna.
13. The ultra-wideband antenna system of claim 12 further comprising one or more ground plane fingers.
14. The ultra-wideband antenna system of claim 12 further comprising a coaxial RF connector.
15. The ultra-wideband antenna system of claim 12 wherein the feed line terminates on the ground plane within a perimeter of the feed of the antenna.
16. The ultra-wideband antenna system of claim 12 further comprising two metallic elements positioned either side of the feed line on the ground plane separated by gaps which form a coplanar waveguide.
17. The ultra-wideband antenna system of claim 12 wherein the antenna transmits a large amount of digital data over a wide spectrum of frequency bands spanning more than 500 MHz at a low power for short distances.
18. The ultra-wideband antenna system of claim 12 wherein the antenna covers UWB band 1 through UWB band 10 simultaneously.
19. The ultra-wideband antenna system of claim 12 wherein the ultra-wideband antenna further comprises a first connection pad and a second connection pad positioned on the second surface of the ceramic dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad.
20. The ultra-wideband antenna system of claim 19 wherein the ultra-wideband antenna further comprises a third connection pad positioned on the second surface of the ceramic dielectric substrate.
21. An ultra-wideband antenna method comprising the steps of: providing an ultra-wideband antenna comprising a ceramic dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, the ceramic dielectric substrate further comprising a first edge defined by an intersection of the first surface and the third surface, a semi-circular radiator positioned on at least a portion of the first surface of the ceramic dielectric substrate, the semi-circular radiator having a curved side facing the first edge of the ceramic dielectric substrate, the semi-circular radiator further comprising a chord line that is parallel with the first edge, the chord line having a length which is less than the substrate width, the chord line length also being less than a diameter dimension for the semi-circular radiator and a feed positioned on the third surface of the ceramic dielectric substrate; and operating the ultra-wideband antenna at radio-frequency communications from 3.1 GHz to 10 GHz.
22. The method of claim 21 further comprising operating the ultrawideband antenna at a peak gain of 4 dBi.
23. The method of claim 21 further comprising operating the ultra-wideband antenna at an efficiency of more than 60% across UWB band 1 through UWB band 10.
24. The method of claim 23 wherein the operating of the ultrawideband antenna at an efficiency of more than 60% across UWB band 1 through UWB band 10 occurs simultaneously.
25. The method of claim 23 wherein the ultra-wide antenna further comprises a first connection pad and a second connection pad positioned on the second surface of the ceramic dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad.
26. The method of claim 25 wherein the ultra-wide antenna further comprises a third connection pad positioned on the second surface of the ceramic dielectric substrate.
27. An ultra-wideband antenna kit comprising: one or more ultra-wideband antennas comprising a ceramic dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, the ceramic dielectric substrate further comprising a first edge defined by an intersection of the first surface and the third surface, a semi-circular radiator positioned on at least a portion of the first surface of the ceramic dielectric substrate, the semi-circular radiator having a curved side facing the first edge of the ceramic dielectric substrate, the semi-circular radiator further comprising a chord line that is parallel with the first edge, the chord line having a length which is less than the substrate width, the chord line length also being less than a diameter dimension for the semi-circular radiator, and a feed positioned on the third surface of the ceramic dielectric substrate; and one or more of each of a ground plane, a PCB, a connector, and a cable.
28. The kit of claim 27 wherein the one or more ultra-wideband antennas further comprises a first connection pad and a second connection pad positioned on the second surface of the ceramic dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad.
29. The kit of claim 28 wherein the one or more ultra-wideband antennas further comprises a third connection pad positioned on the second surface of the ceramic dielectric substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The novel features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings of which:
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DETAILED DESCRIPTION
(9) Disclosed are a series of antennas and antenna systems which are suitable for UWB radio-frequency communications from 3.1 GHz to 10 GHz. The antennas and antenna systems achieve a small form factor and are configurable to utilize surface-mount technology (SMT) to facilitate integration and connection to external devices and electronics. Additionally, the antennas and antenna systems are configurable to utilize a dielectric ceramic-substrate.
(10) Turning to
(11) The antenna 100 comprises a dielectric-ceramic substrate 112, and a number of areas within which lie metallic elements including: a generic radiator 120, a generic side feed area 122, a generic bottom feed area (not visible in
(12) The top surface 114 of the antenna can be rectangular-shaped or square-shaped and planar or substantially planar. The generic radiator 120 can be positioned on or within the top surface 114 of the antenna 100. Visible in
(13) Centered on the first side surface 116 of the antenna 100 and occupying the entire thickness t and approximately one-quarter to one-third of the width S1 is generic side feed area 122. In various embodiments of the disclosure, a metallic element lying within the perimeter of generic side feed area 122 completes the connection between a feed line 106 on the ground plane 102 and the generic radiator 120 on the top surface 114 of the antenna 100. The feed line 106 lies on ground plane 102 and extends from a part beneath the first side surface 116 of the antenna 100 in a perpendicular direction from the first side surface 116. The feed line 106 provides a connection from the antenna 100 to external electronics or devices. Lying on either side of feed line 106 on ground plane 102 and separated by first ground plane gap 105, and second ground plane gap 105′ are metal elements which together form a coplanar waveguide 104.
(14) Optionally, extending from the coplanar waveguide 104, and positioned on the ground plane 102 on either side of antenna 100 separated by a first ground plane finger gap 109 is an area forming a first generic ground plane finger 108 which is adjacent a third ground plane side 134. One or more ground plane fingers can be used without departing from the scope of the disclosure. An area forming a second generic ground plane finger 110 is positioned adjacent a first ground plane side 130 and separated by second ground plane finger gap 111 from the antenna 100. As viewed in
(15) The antenna 100 viewed from a bottom surface 115 can have many different embodiments of the number and position of connection pads, two of the generic configurations are illustrated in
(16) As will be appreciated by those skilled in the art, the various components illustrated in
(17) Turning now to
(18) In the corner of the bottom surface 215, sharing an edge with the first side surface 216 and the fourth side surface 218 of antenna 100 in
(19) Also on the bottom surface of antenna 100 is the third connection pad 250. The third connection pad 250 lies along the opposite edge of bottom surface 215 shared by the bottom feed area 262, first connection pad 260 and second connection pad 264. The third connection pad 250 extends along the entire length of antenna 100 in at least one direction along the third side surface 216′, e.g. from a first edge to an opposite edge. Thus, the third connection pad 250 has a long side length equal to width S1 shown in
(20) Numerous radiator geometries are possible and may be employed depending upon the desired performance characteristics of the antenna 100 disclosed herein. Turning to
(21) As will be appreciated by those skilled in the art, although the surface of
(22) The first radiator configuration depicted in
(23) The second radiator configuration illustrated in
(24) The third radiator configuration illustrated in
(25) Similar to the third radiator configuration in
(26) The fifth radiator configuration in
(27) The sixth radiator configuration depicted in
(28) The seventh radiator configuration in
(29) Similar in form to the seventh radiator configuration in
(30) Comparable to the eighth radiator configuration of
(31) As with radiator geometries, numerous side feed geometries are possible.
(32) As with radiator and side feed geometries, numerous bottom feed and connection pad geometries are also possible.
(33) Turning to
(34) In the corner formed by first bottom edge 404 and second bottom edge 506, resides a configuration of a first connection pad 514. The first connection pad 514 is rectangular with one side coincident with first bottom edge 404 and an adjacent side coincident with second bottom edge 506. The length of the side of the rectangle of the first connection pad 514 that is coincident with first bottom edge 404 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the first connection pad 514 that is coincident with second bottom edge 506 and that of its opposite side is substantially less than length S2.
(35) In the corner formed by first bottom edge 404 and fourth bottom edge 510, resides a configuration of a second connection pad 516. The second connection pad 516 is rectangular with one side coincident with first bottom edge 404 and an adjacent side coincident with fourth bottom edge 510. The width of the side of the rectangle of the second connection pad 516 that is coincident with first bottom edge 404 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the second connection pad 516 that is coincident with fourth bottom edge 510 and that of its opposite side is substantially less than length S2. A configuration of a third connection pad 518 located on the first bottom surface configuration 502 is rectangular in shape, coincident with third bottom edge 508 and runs the entire length of third bottom edge 508. The length of the sides of the rectangle of the third connection pad 518 that are coincident with second bottom edge 506 and fourth bottom edge 510 is substantially less than length S2. The width along the third bottom edge 508 can be the same as the substrate, as illustrated.
(36) The second bottom surface configuration 504 shown in
(37) In the corner formed by the second bottom edge 506 and third bottom edge 508, resides a configuration of a sixth connection pad 526. The sixth connection pad 526 is rectangular with one side coincident with second bottom edge 506 and an adjacent side coincident with third bottom edge 508. The length of the side of the rectangle of the sixth connection pad 526 that is coincident with second bottom edge 506 and that of its opposite side is substantially less than length S2. The length of the side of the rectangle of the sixth connection pad 526 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1.
(38) Centered along third bottom edge 508, is a configuration of a seventh connection pad 528 is rectangular with one side coincident with third bottom edge 508. The width of the side of the rectangle of the seventh connection pad 528 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1. The length of the sides of the rectangle of the seventh connection pad 528 parallel to second bottom edge 506 is substantially less than length S2.
(39) In a corner formed by third bottom edge 508 and fourth bottom edge 510, resides a configuration of an eighth connection pad 530. The eighth connection pad 530 is rectangular with one side coincident with third bottom edge 508 and an adjacent side coincident with fourth bottom edge 510. The width of the side of the rectangle of the eighth connection pad 530 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the eighth connection pad 530 that is coincident with fourth bottom edge 510 and that of its opposite side is substantially less than length S2. As will be appreciated by those skilled in the art, the various embodiments illustrated in
(40) One specific embodiment of a suitable UWB ceramic antenna according to the disclosure is shown in
(41) Turning to
(42) The antennas of this disclosure are passive devices that do not consume power. The antennas operate for short distances when transmitting large amount of digital data over a wide spectrum of frequency bands typically spanning more than 500 MHz. One such antenna covers all common UWB commercial bands, namely bands 1 through 10 simultaneously. The antenna typically has a peak gain of 4 dBi, an efficiency of more than 60% across the bands and is designed to be mounted directly onto a substrate such as a PCB. The antennas are typically mounted at least 3 mm from metal components or surfaces, and ideally 5 mm for optimal radiation efficiency. Placing two antennas of the disclosure at a far-field distance of from about 0.1 m to about 0.4 m, more preferably 0.3 m, and keeping one of the antennas stationary, while the other antenna is rotating in 45° intervals shows group delay variation smaller than 100 ps (as a benchmark) from 3 GHz to 5 GHz and from 6.4 GHz to 9 GHz spanning UWB channels 1-4 and 6-15. For channel 5 (6-7 GHz) the group delay variation is between 220 ps (at edge) and 50 ps, which is still acceptable. The length of ground plane can be taken into consideration when choosing a PCB size. Increase in the ground plane length in both lower band (3-5 GHz) and higher band (6-9 GHz) influences efficiency of the antenna.
(43) Antennas according to the disclosure can be provided in kits which include one or more antennas, one or more PCBs, one or more connectors, and one or more cables.
(44) While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.