METAL ADDITIVE MANUFACTURING DEVICE AND METAL ADDITIVE MANUFACTURING METHOD
20210197278 · 2021-07-01
Inventors
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B23K15/0086
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0006
PERFORMING OPERATIONS; TRANSPORTING
B22F10/28
PERFORMING OPERATIONS; TRANSPORTING
B23K9/042
PERFORMING OPERATIONS; TRANSPORTING
B22F10/50
PERFORMING OPERATIONS; TRANSPORTING
B22F12/50
PERFORMING OPERATIONS; TRANSPORTING
B22F10/25
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/50
PERFORMING OPERATIONS; TRANSPORTING
Y02P10/25
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
B22F10/28
PERFORMING OPERATIONS; TRANSPORTING
B22F12/50
PERFORMING OPERATIONS; TRANSPORTING
B23K26/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A metal additive manufacturing technique is provided to improve various characteristics by irradiation of a pulse laser without disposing a transparent medium. A metal additive manufacturing device includes: a material supply source configured to supply a material to be deposited; a heat source configured to melt the material by outputting an energy beam; a moving driver configured to scan at least the energy beam; and a laser irradiator configured to irradiate a solidified portion of the material in a temperature lowering process with a pulse laser.
Claims
1. A metal additive manufacturing device comprising: a material supply source configured to supply a material to be deposited; a heat source configured to melt the material by outputting an energy beam; a moving driver configured to scan at least the energy beam; and a laser irradiator configured to irradiate a solidified portion of the material with a pulse laser having a power density of 10.sup.7 W/cm.sup.2 or more, the solidified portion being in a temperature lowering process after being melted and solidified and in a temperature range of 0.4T.sub.m≤T<T.sub.m, wherein T is a temperature of the material and T.sub.m is a melting point of the material.
2. The metal additive manufacturing device according to claim 1, wherein the material is supplied to an output destination of the energy beam.
3. The metal additive manufacturing device according to claim 1, wherein the material supply source includes: a first receptor that spreads powder as the material on a descending first stage and inputs the energy beam and the pulse laser; a second receptor that holds the powder together with an ascending second stage; and a transfer driver that transfers the powder having protruded from top of the second receptor onto the first stage of the first receptor.
4. The metal additive manufacturing device according to claim 1, wherein irradiation of the pulse laser is performed simultaneously with output of the energy beam.
5. (canceled)
6. The metal additive manufacturing device according to claim 1, wherein the pulse laser has a power density of 10.sup.12 W/cm.sup.2 or more at an irradiation position.
7. The metal additive manufacturing device according to claim 1, wherein the pulsed laser is scanned while maintaining a predetermined interval from the energy beam.
8. The metal additive manufacturing device according to claim 1, wherein: the material is supplied as powder; and the energy beam is a laser beam or an electron beam.
9. The metal additive manufacturing device according to claim 2, wherein: the material is supplied as a wire; and the energy beam is a laser beam, an arc discharge, or an electron beam.
10. The metal additive manufacturing device according to claim 1, wherein a solidified portion of the material is further deposited with respect to a deposited solidified portion of the material.
11. A metal additive manufacturing method comprising: supplying a material to be deposited; melting the material by outputting an energy beam while the energy beam is being scanned; and irradiating a solidified portion of the material with a pulse laser having a power density of 10.sup.7 W/cm.sup.2 or more, the solidified portion being in a temperature lowering process after being melted and solidified and in a temperature range of 0.4T.sub.m≤T<T.sub.m, wherein T is a temperature of the material and T.sub.m is a melting point of the material.
12. The metal additive manufacturing method according to claim 11, wherein the material is supplied to an output destination of the energy beam.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0013]
[0014]
[0015]
[0016]
[0017]
[0018]
DETAILED DESCRIPTION
First Embodiment
[0019] Hereinafter, embodiments of the present invention will be described by referring to the accompanying drawings.
[0020] The metal additive manufacturing device 10 includes: a material supply source 11 that supplies a material 21 to be deposited; a heat source 12 that outputs an energy beam 16 so as to melt the material 21; a moving driver 18 that scans at least the energy beam 16; a laser irradiator 15 that irradiates a solidified portion 21a of the material 21 in a temperature lowering process with a pulse laser 17.
[0021] The moving driver 18 drives the heat source 12, the laser irradiator 15, and the material supply source 11 such that the energy beam 16, the pulse laser 17 and the material 21 are scanned along the object to be deposited. The operation of the moving driver 18 includes: a case where the heat source 12, the laser irradiator 15, and the material supply source 11 are moved two-dimensionally or three-dimensionally; a case where each of them is rotationally driven; and a case where a reflecting mirror of the laser is rotationally driven.
[0022] In this embodiment, the moving driver 18 is illustrated to keep the object to be deposited stationary and move the heat source 12, the laser irradiator 15, and the material supply source 11, but this relationship may be reversed. Further, it is not an essential requirement that the pulsed laser 17 is used for scanning. The pulsed laser 17 may be stopped and radiated or may be discretely moved and radiated.
[0023] Although
[0024] When the material 21 melts on the surface of the base substance 23, a part of the base substance 23 is also entangled and melted to form a molten portion 21b. A solidified portion 21a in which the molten portion 21b is solidified is deposited along the scanning locus on the surface of the base substance 23. Further, of the base substance 23, the portion that does not melt but is affected by heat is formed as a heat-affected portion 24.
[0025] Although the drawings illustrate the case where the solidified portion 21a of the material 21 of the first layer is deposited on the base substance 23, the same applies to the case where the n-th layer (n≥2) of the solidified portion 21a of the material 21 is deposited. In this case, the above-described “base substance 23” will be displaced with “the (n−1)th layer (n≥2) of the solidified portion 21a”.
[0026] The pulsed laser 17 to be radiated from the laser irradiator 15 has a predetermined pulse energy [J] and a pulse width [s]. A focused optical system (not shown) composed of a lens or a concave mirror converges the beam diameter of the pulse laser and outputs the pulse laser 17 having an enhanced power density [W/cm.sup.2]. Here, when the pulse peak power is defined as P[W], the pulse width is defined as i[s], the pulse energy is defined as E[J], and the beam diameter is defined as φ[cm], the power density I is expressed by Expression 1 as follows.
I=P/S=E/τS Expression 1
[0027] (wherein P=E/τ, S=πφ.sup.2/4)
[0028] When the solidified portion 21a of the material 21 is irradiated by the pulsed laser 17, a shock wave is propagated inside the solidified portion 21a. The irradiation of the pulse laser 17 may be performed on each layer respectively or may be performed on a plurality of layers at once.
[0029] The pulse laser 17 preferably has a power density of 10.sup.7 W/cm.sup.2 or more at the irradiation position. When the power density of the pulsed laser 17 is set in such a range, at least an elastic shock wave can be internally propagated in the solidified portion 21a. When this elastic shock wave internally propagates to the solidified portion 21a and reaches a solid-liquid interface 22 with the molten portion 21b, the crystals growing at the solid-liquid interface 22 can be miniaturized.
[0030] In general, when a substance is irradiated by the pulsed laser 17 having a high power density, a high-temperature and high-pressure state is momentarily formed on the surface, and thereby, ablation, i.e., explosive evaporation due to violent ionization and/or plasma formation, occurs. When ablation occurs on the surface of a material, the shock wave generated by the evaporation recoil-force propagates inside the material. When the power density of the pulse laser 17 is smaller than 10.sup.7 W/cm.sup.2, sufficient laser ablation for generating a shock wave does not occur at the irradiation spot of the pulse laser 17.
[0031] A shock wave propagates in a solid substance at a speed faster than the speed of sound and faster than an ultrasonic wave propagating at the speed of sound. A shock wave having a pressure below a certain value is classified as an elastic shock wave that causes reversible deformation of a solid substance but does not cause permanent deformation. A shock wave having a pressure of a certain value or more is classified as a plastic shock wave that causes permanent deformation of a substance. This plastic shock wave follows the elastic shock wave and propagates in the solid substance.
[0032] When the elastic shock wave internally propagating from the irradiation spot of the solidified portion 21a reaches a part of the solid-liquid interface 22 with the molten portion 21b, it becomes a Rayleigh wave and propagates uniformly over the entire surface of the solid-liquid interface 22. The elastic shock wave having reached the solid-liquid interface 22 further causes cavitation in the process of propagating the molten portion 21b, divides dendrite branches, and suppresses generation of columnar crystals that try to grow in the same direction. Consequently, the solidified nucleation in the molten portion 21b is activated, and the metallographic structure of the solidified portion 21a is refined (
Second Embodiment
[0033] In the metal additive manufacturing device 10 according to the second embodiment, the pulse laser 17 to be outputted by the laser irradiator 15 has a power density of 10.sup.12 W/cm.sup.2 or more at the irradiation position. In the second embodiment, a plastic shock wave is generated in addition to the elastic shock wave by radiating the pulse laser 17 having a power density higher than that in the first embodiment.
[0034] When the generated plastic shock wave propagates in a solid phase such as the solidified portion 21a and the heat-affected portion 24, new dislocations are introduced and the dislocation density in the crystal increases. The dislocations accumulated in the solidified portion 21a, which is in the hot state after solidification of the molten portion 21b, move to be rearranged in the crystal grains so as to become a low energy structure. As a result, new grain boundaries are generated in the crystal grains, the metallographic structure is refined, and the mechanical characteristics of the solidified portion 21a and the heat-affected portion 24 are improved.
[0035] The rearrangement of dislocations in the crystal grains is completed in a short time at a temperature of 40% or more of the absolute temperature value of the melting point T.sub.m of the material 21. In consideration of this fact, it is preferred that irradiation of the pulse laser 17 is performed in the temperature lowering process in which the temperature T of the solidified portion 21a is in the range of 0.4T.sub.m≤T<T.sub.m after stopping the output of the energy beam 16.
[0036] Here, a case where a new solidified portion (not shown) is further laminated on the existing solidified portion 21a will be discussed. Also in this case, when the pulse laser 17 is radiated, a plastic shock wave is induced and propagates to the further lower layer while miniaturizing the metallographic structure of the new solidified portion (not shown). Consequently, the metallographic structure of the existing solidified portion 21a is further refined (miniaturized).
[0037] As shown in the parentheses of Expression 1, the pulse laser 17 can instantaneously realize a high peak power P by shortening the pulse width τ corresponding to the oscillation duration. Specifically, short pulse lasers such as a nanosecond pulse laser, a picosecond pulse laser, and a femtosecond pulse laser are preferably used.
[0038] Specifications (A) of a short pulse laser that induces at least an elastic shock wave as in the first embodiment and specifications (B) of a short pulse laser that induces an elastic shock wave and a plastic shock wave as in the second embodiment are as follows.
(A) Specifications of a short pulse laser that induces at least an elastic shock wave in a solidified portion 21a
[0039] Pulse Width: 100 [ns] or less
[0040] Power Density: 1×10.sup.7 [W/cm.sup.2] or more
(B) Specifications of a short pulse laser that induces an elastic shock wave and a plastic shock wave in the solidified portion 21a
[0041] Pulse Width: 100 [ps] or less
[0042] Power Density: 1×10.sup.12 [W/cm.sup.2] or more
[0043] When the material 21 and the base substance 23 are precipitation hardening alloys such as duralumin, due to the heat input of the energy beam 16, the precipitated phase in the solidified portion 21a is solid-solved in the parent phase, and the mechanical characteristics of the solidified portion 21a and the heat-affected portion 24 are deteriorated as compared with the base metal.
[0044] In such a state, when the plastic shock wave is propagated to the solidified portion 21a and the heat-affected portion 24 which are in a hot state with sufficient residual heat remaining immediately after solidification, lattice defects are induced in the parent phase at high density, and these lattice defects become nucleation sites, and precipitation hardening elements having been supersaturated in the parent phase are precipitated. As a result, the precipitation hardening that once disappeared in the solidified portion 21a and the heat-affected portion 24 is restored and the mechanical characteristics are improved.
[0045] Materials of the material 21 expected to have the above-described effects of work hardening and precipitation hardening include materials that soften due to heat input, such as aluminum alloys, high-strength steels, and work-hardened austenitic stainless steels. In particular, materials of precipitation-hardened alloys to be used include Al alloys (2000 series, 6000 series, 7000 series), Ni-based heat-resistant superalloys (Inconel 718, and the like), and precipitation hardening stainless steels (SUS630, SUS631, maraging steel, and the like).
Third Embodiment
[0046] In the metal additive manufacturing device 10 according to the third embodiment, the pulse laser 17 is scanned while maintaining a predetermined interval L from the energy beam 16. At this time, the temperature of the solid-liquid interface 22 between the solidified portion 21a and the molten portion 21b is the melting point T.sub.m of the material 21. The distance between the upstream end irradiated with the pulse laser 17 and the solid-liquid interface 22 is expressed as “L-d”. Here, “d” is the distance between the heat source center of the energy beam 16 and the solid-liquid interface 22, and is measured in advance. The scanning speed v is determined in such a manner that the solidified portion 21a is in the best state when the pulse laser 17 is not radiated. The cooling speed g(v) of the solidified portion 21a with respect to the scanning speed v is measured in advance.
[0047] The temperature T at the upstream end where the pulse laser 17 is radiated is expressed by Expression 2.
T=T.sub.m−g(v).Math.(L−d)/v Expression 2
[0048] Since T.sub.m, d, g(v), and v are known in Expression 2, the temperature T at the upstream end onto which the pulse laser 17 is radiated can be determined by changing L. Further, it can be said from Expression 2 that the solidified portion 21a irradiated with the pulse laser 17 is in the process of lowering the temperature as long as the energy beam 16 is scanned.
[0049] The elastic shock wave induced by the pulse laser 17 propagates in the solidified portion 21a and is greatly attenuated. Hence, the interval L between the pulse laser 17 and the energy beam 16 is kept constant, and thus, the pressure of the elastic shock wave reaching the solid-liquid interface 22 is kept constant. As a result, the miniaturization of the metallographic structure in the solidified portion 21a can be made uniform.
[0050] In addition, amount of dislocations to be introduced due to the plastic shock wave induced by the pulse laser 17 depends on the temperature of the solidified portion 21a, and miniaturization of the metallographic structure largely also depends on the temperature of the solidified portion 21a. Since the interval L between the pulse laser 17 and the energy beam 16 is kept constant, the temperature of the solidified portion 21a at the irradiation spot of the pulse laser 17 is controlled so as to be constant. As a result, the amount of dislocations to be introduced in the solidified portion 21a and the miniaturization of the metallographic structure can be made uniform.
[0051] An X-ray residual stress measuring device (not shown) may be included in the metal additive manufacturing device 10, and thereby, the state of the residual stress can be measured in real time in the process of forming the solidified portion 21a. The distance L between the pulse laser 17 and the energy beam 16 can be adjusted to be optimized on the basis of the measurement result of the residual stress state. When the residual stress is measured by the X-ray residual stress measuring device after stacking one or more layers of the solidified portion 21a, if the tensile residual stress remains above a certain value, only the pulse laser 17 may be radiated such that the stress becomes below the certain value.
[0052]
[0053]
[0054]
[0055]
Fourth Embodiment
[0056]
[0057] The moving driver 18 of the fourth embodiment drives the heat source 12 and the laser irradiator 15 such that the energy beam 16 and the pulse laser 17 are scanned along the material 21 having been thinly spread over. The operation of the moving driver 18 includes: the case where the heat source 12 and the laser irradiator 15 are moved in a plane; the case where each of them is rotationally driven; and the case where the laser reflector is rotationally driven.
[0058] The material supply source 11 of the metal additive manufacturing device 10 according to the fourth embodiment includes: a first receptor 31 that spreads over the powder as the material 21 on a descending first stage 35 and inputs the energy beam 16 and the pulse laser 17; a second receptor 32 that holds the powder as the material 21 together with an ascending second stage 34; and a transfer driver 36 that transfers the powder (i.e., material 21) having protruded from the top of the second receptor 32 onto the first stage 35 of the first receptor 31.
[0059] As shown in
[0060]
[0061] When the scanning of the energy beam 16 and the pulse laser 17 for the first layer is completed, the first stage 35 is lowered by the thickness of one layer (i.e., stacking pitch), a new material 21 is spread over there, and the energy beam 16 and the pulse laser 17 circularly scan to form the solidified portion 21a.
[0062] Afterward, as shown in
[0063]
[0064] According to the metal additive manufacturing device of at least one embodiment as described above, a metallographic structure can be miniaturized by radiating a pulse laser to propagate a shock wave without using a transparent medium (for example, water).
[0065] While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. These embodiments may be embodied in a variety of other forms, and various omissions, substitutions, and changes may be made without departing from the spirit of the inventions. These embodiments and their modifications are included in the accompanying claims and their equivalents as well as included in the scope and gist of the inventions.
REFERENCE SIGNS LIST
[0066] 10 metal additive manufacturing device [0067] 11 material supply source [0068] 12 heat source [0069] 15 laser irradiator [0070] 16 energy beam (laser beam, electron beam, arc discharge) [0071] 17 pulse laser [0072] 18 moving drive [0073] 21 material (metal powder, wire) [0074] 21a solidified portion [0075] 21b molten portion [0076] 22 solid-liquid interface [0077] 23 base substance [0078] 24 heat-affected portion [0079] 25 probe tip [0080] 26 purge [0081] 27 nozzle [0082] 31 first receptor [0083] 32 second receptor [0084] 33 third receptor [0085] 34 second stage [0086] 35 first stage [0087] 36 transfer driver