INTERNAL BODY TEMPERATURE MEASUREMENT DEVICE AND INTERNAL BODY TEMPERATURE MEASUREMENT METHOD

Abstract

An in-vivo temperature measurement device includes a plurality of thermal resistors, temperature sensors for measuring an epidermis temperature of a living body, and temperature sensors for measuring an upper surface temperature that are provided at both ends of the thermal resistors, respectively, a memory that stores an estimation model of the core temperature of the living body that takes into consideration a non-thermal equilibrium state of the living body, and thermal resistance values of the thermal resistors, and an arithmetic circuit that estimates, based on the plurality of temperatures measured by the temperature sensors and the temperature sensors, the core temperature of the living body using the estimation model and the thermal resistance values, and the thermal resistance values are different from one another.

Claims

1.-5. (canceled)

6. An in-vivo temperature measurement device comprising: a plurality of thermal resistors; a plurality of first temperature sensors at a first end of the plurality of thermal resistors configured to face a living body; a plurality of second temperature sensors provided at a second end of the plurality of thermal resistors opposite the first end; a memory configured to store an estimation model of a core temperature of a living body according to a non-thermal equilibrium state of the living body and thermal resistance values of the plurality of thermal resistors; and an arithmetic circuit configured to estimate the core temperature of the living body based on the estimation model, the thermal resistance values, and a plurality of temperatures measured by the plurality of first temperature sensors and the plurality of second temperature sensors; wherein the first temperature sensors are configured to measure a first temperature indicating an epidermis temperature of the living body; wherein the second temperature sensors configured to measure a second temperature at a position away from the living body; and wherein the thermal resistance values of the plurality of thermal resistors are different from one another.

7. The in-vivo temperature measurement device according to claim 6, wherein the arithmetic circuit includes: a time counter configured to count measurement times at which the plurality of first temperature sensors and the plurality of second temperature sensors measure the plurality of temperatures; and an estimation circuit configured to, based on the plurality of temperatures measured by the first temperature sensors and the second temperature sensors at the measurement times, estimate the core temperature of the living body using the estimation model and the thermal resistance values of the thermal resistors; and wherein the arithmetic circuit is configured to generate time-series data associating the measurement times and the core temperature.

8. The in-vivo temperature measurement device according to claim 6, wherein the plurality of thermal resistors comprise three thermal resistors.

9. The in-vivo temperature measurement device according to claim 8, wherein the estimation model is represented by a following expression: $T_{C} = \frac{\begin{matrix} T_{1} (T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 3} - T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 2}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 1} - T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 3}) + \\ \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 2} - T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 1}) \end{matrix}}{T_{1} (T_{S .Math. .Math. 2}^{'} - T_{S .Math. .Math. 3}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} - T_{S .Math. .Math. 1}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} - T_{S .Math. .Math. 2}^{'})},$ wherein T.sub.C indicates the core temperature at a measurement time t, R.sub.Si (i=1, 2, 3) indicates a corresponding thermal resistance value of each of the plurality of thermal resistors, T.sub.Si (i=1, 2, 3) indicates a corresponding first temperature measured by each of the plurality of first temperature sensors, T.sub.i=(T.sub.Si(t)−T.sub.Ui(t)), T.sub.Ui (i=1, 2, 3) indicates a corresponding second temperature measured by each of the plurality of second temperature sensors, and T.sub.Si′=dT.sub.Si(t)/dt.

10. The in-vivo temperature measurement device according to claim 6 further comprising a communication circuit configured to transmit the core temperature estimated by the arithmetic circuit.

11. The in-vivo temperature measurement device according to claim 6, wherein thicknesses of the plurality of thermal resistors are different from one another.

12. An in-vivo temperature measurement method comprising: measuring a plurality of temperatures with first temperature sensors and second temperature sensors, wherein the first temperature sensors are provided at a first end of a plurality of thermal resistors, wherein the second temperature sensors are provided at a second end of the plurality of thermal resistors opposite the first end, and wherein the first temperature sensors are positioned facing a living body; and estimating, using an estimation model of a core temperature based on a non-thermal equilibrium state of the living body and thermal resistance values of the thermal resistors, the core temperature of the living body based on the plurality of temperatures; wherein the first temperature sensors measure a first temperature indicating an epidermis temperature of the living body; wherein the second temperature sensors measure a second temperature at a position away from the living body; and wherein the thermal resistance values of the plurality of thermal resistors are different from one another.

13. The method according to claim 12, wherein estimating the core temperature of the living body comprises: counting measurement times at which the first temperature sensors and the second temperature sensors measure the plurality of temperatures; and based on the plurality of temperatures measured by the first temperature sensors and the second temperature sensors at the measurement times, estimating the core temperature of the living body using the estimation model and the thermal resistance values of the thermal resistors; and generating time-series data associating the measurement times and the core temperature.

14. The method according to claim 12, wherein the plurality of thermal resistors comprise three thermal resistors.

15. The method according to claim 14, wherein the estimation model is represented by a following expression: $T_{C} = \frac{\begin{matrix} T_{1} (T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 3} - T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 2}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 1} - T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 3}) + \\ \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 2} - T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 1}) \end{matrix}}{T_{1} (T_{S .Math. .Math. 2}^{'} - T_{S .Math. .Math. 3}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} - T_{S .Math. .Math. 1}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} - T_{S .Math. .Math. 2}^{'})},$ wherein T.sub.C indicates the core temperature at a measurement time t, R.sub.Si (i=1, 2, 3) indicates a corresponding thermal resistance value of each of the plurality of thermal resistors, T.sub.Si (i=1, 2, 3) indicates a corresponding first temperature measured by each of the first temperature sensors, T.sub.i=(T.sub.Si(t)−T.sub.Ui(t)), T.sub.Ui (i=1, 2, 3) indicates a corresponding second temperature measured by each of the second temperature sensors, and T.sub.Si′=dT.sub.Si(t)/dt.

16. The method according to claim 12 further comprising reading the thermal resistance values from the plurality of thermal resistors.

17. The method according to claim 12, wherein the second temperature sensors measure the second temperature at an upper surface of the plurality of thermal resistors.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is a diagram schematically illustrating a temperature distribution of subcutaneous tissue of a living body.

[0019] FIG. 2 is a diagram showing a thermal model of human body for explaining a principle of embodiments of the present invention.

[0020] FIG. 3 is a diagram showing an equivalent circuit of FIG. 2.

[0021] FIG. 4 is a diagram showing a thermal model of human body for explaining a principle of embodiments of the present invention.

[0022] FIG. 5 is a diagram showing an equivalent circuit of FIG. 4.

[0023] FIG. 6 is a block diagram showing a configuration of an in-vivo temperature measurement device according to an embodiment of the present invention.

[0024] FIG. 7 is a block diagram showing the configuration of the in-vivo temperature measurement device according to the embodiment of the present invention.

[0025] FIG. 8 is a flowchart for explaining an operation of the in-vivo temperature measurement device according to the embodiment of the present invention.

[0026] FIG. 9A is a diagram for explaining measurement of a core temperature with the in-vivo temperature measurement device according to the embodiment of the present invention.

[0027] FIG. 9B is a diagram illustrating a result measured by the in-vivo temperature measurement device according to the embodiment of the present invention.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0028] A preferred embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 9B.

Principle of Embodiments of Invention

[0029] First, a principle of the an in-vivo temperature measurement device according to embodiments of the present invention will be described with reference to FIGS. 1 to 5.

[0030] FIG. 1 is a diagram schematically illustrating a temperature distribution of subcutaneous tissue of a living body. As shown in FIG. 1, a region of a core temperature exists in a part of the living body located beyond a certain depth in a depth direction from the epidermis to the subcutaneous tissue, the core temperature not being affected by a change in outside-air temperature. A temperature in such a region is measured as a core temperature T.sub.C. Usually, an epidermis temperature T.sub.S is lower than the core temperature T.sub.C, and a temperature gradient occurs from the core to the epidermis.

[0031] FIG. 2 is a diagram showing a thermal model of human body (AA′B′B). The thermal model of human body includes a region from the region where the core of the living body is located to the outside air. Specifically, the thermal model of human body shown in FIG. 2 indicates the core where a heat source of the living body exists, the subcutaneous tissue of the living body, a heat insulating material (thermal resistor) existing in contact with the outside of the living body, a temperature at each part up to the outside air of the heat insulating material, a thermal resistance, and a thermal capacity.

[0032] A temperature in the core region of the living body, in which the heat source exists, is represented by the core temperature T.sub.C. A temperature passing through the subcutaneous tissue from the heat source is represented by the epidermis temperature T.sub.S. The subcutaneous tissue includes a thermal resistance R.sub.B and a thermal capacity C.sub.B. Further, a temperature passing through the heat insulating material provided outside in contact with the epidermis of the living body is represented by an upper surface temperature T.sub.U. The heat insulating material includes the thermal resistance R.sub.S and the thermal capacity C.sub.S. In addition, a temperature in air is represented by an air temperature T.sub.A.

[0033] FIG. 3 is an equivalent circuit in which the thermal model of human body shown in FIG. 2 is depicted as an RC series circuit. As shown in FIG. 3, in a technique for measuring the core temperature T.sub.C of a conventional example, the core temperature T.sub.C is derived from the epidermis temperature T.sub.S and the upper surface temperature T.sub.U when respective capacitors in the equivalent circuit are fully charged and enter a steady state (for example, see Non-Patent Literature 2). From the thermal resistance R.sub.B of the subcutaneous tissue, the thermal resistance R.sub.S of the heat insulating material (thermal resistor), the epidermis temperature T.sub.S, and the upper surface temperature T.sub.U, the core temperature T.sub.C can be calculated using Expression (1) below.

[00002] $\begin{matrix} Formula .Math. .Math. 2 .Math. \\ T_{C} = T_{S} + \frac{R_{B}}{R_{S}} .Math. (T_{S} - T_{U}) & (1) \end{matrix}$

[0034] Using two thermal resistance values, for example, a thermal resistance value RSi of a first thermal resistor and a thermal resistance value R.sub.S2 of a second thermal resistor as known thermal resistance R.sub.S of the heat insulating material in Expression (1) described above, two expressions are created to cancel out the unknown thermal resistance R.sub.B of the subcutaneous tissue. However, as described above, the thermal resistance R.sub.B of the subcutaneous tissue, the thermal resistance R.sub.S of the heat insulating material, the epidermis temperature T.sub.S, the upper surface temperature T.sub.U, and the core temperature T.sub.C are actually not in a steady state. Therefore, it is considered that each of the values changes with time, and a new estimation model is constructed.

[0035] FIGS. 4 and 5 are diagrams showing a newly constructed thermal model of human body and an equivalent circuit thereof.

[0036] As shown in FIGS. 4 and 5, a voltage V.sub.CB(t) applied to a thermal capacity C.sub.B(t) of the subcutaneous tissue is expressed by Expression (2) below. Further, Expression (2) is modified to derive Expression (3) indicating a core temperature T.sub.C(t).

[00003] $\begin{matrix} Formula .Math. .Math. 3 .Math. \\ V_{CB} (t) = C_{B} (t) .Math. \frac{{dT}_{S} (t)}{dt} = \frac{T_{C} (t) - T_{S} (t)}{R_{B} (t)} - \frac{T_{S} (t) - T_{U} (t)}{R_{S}} & (2) \\ \Leftrightarrow T_{C} (t) = T_{S} (t) + \frac{R_{B} (t)}{R_{S}} .Math. (T_{S} (t) - T_{U} (t)) + C_{B} .Math. R_{B} (t) .Math. \frac{{dT}_{S} (t)}{dt} & (3) \end{matrix}$

[0037] Using three thermal resistance values different from one another, for example, a thermal resistance value R.sub.S1 of a first thermal resistor, a thermal resistance value R.sub.S2 of a second thermal resistor, and a thermal resistance value R.sub.S3 of a third thermal resistor as known thermal resistance R.sub.S of the heat insulating material in Expression (3) described above, three expressions are created to cancel out the unknown thermal resistance R.sub.B(t) of the subcutaneous tissue and the thermal capacity C.sub.B(t) of the subcutaneous tissue.

[0038] More specifically, using Expression (3) described above, a determinant indicated by Expression (4) below is created using an epidermis temperature T.sub.S1(t) and an upper surface temperature T.sub.U1(t) in the first thermal resistor (R.sub.S1), an epidermis temperature T.sub.S2(t) and an upper surface temperature T.sub.U2(t) in the second thermal resistor (R.sub.S2), and an epidermis temperature T.sub.S3(t) and an upper surface temperature T.sub.U3(t) in the third thermal resistor (R.sub.S3).

[00004] $\begin{matrix} Formula .Math. .Math. 4 .Math. \\ {\begin{matrix} T_{C} (t) = T_{S .Math. .Math. 1} (t) + \frac{R_{B} (t)}{R_{S .Math. .Math. 1}} .Math. (T_{S .Math. .Math. 1} (t) - T_{U .Math. .Math. 1} (t)) + C_{B} .Math. R_{B} (t) .Math. \frac{{dT}_{S .Math. .Math. 1} (t)}{dt} \\ T_{C} (t) = T_{S .Math. .Math. 2} (t) + \frac{R_{B} (t)}{R_{S .Math. .Math. 2}} .Math. (T_{S .Math. .Math. 2} (t) - T_{U .Math. .Math. 2} (t)) + C_{B} .Math. R_{B} (t) .Math. \frac{{dT}_{S .Math. .Math. 2} (t)}{dt} \\ T_{C} (t) = T_{S .Math. .Math. 3} (t) + \frac{R_{B} (t)}{T_{S .Math. .Math. 3}} .Math. (T_{S .Math. .Math. 3} (t) - T_{U .Math. .Math. 3} (t)) + C_{B} .Math. R_{B .Math.} (t) .Math. \frac{{dT}_{S .Math. .Math. 3} (t)}{dt} \end{matrix} & (4) \\ \Leftrightarrow (\begin{matrix} 1 - \frac{T_{S .Math. .Math. 1} (t) - T_{U .Math. .Math. 1} (t)}{R_{S .Math. .Math. 1}} - \frac{{dT}_{S .Math. .Math. 1} (t)}{dt} \\ 1 - \frac{T_{S .Math. .Math. 2} (t) - T_{U .Math. .Math. 2} (t)}{R_{S .Math. .Math. 2}} - \frac{{dT}_{S .Math. .Math. 2} (t)}{dt} \\ 1 - \frac{T_{S .Math. .Math. 3} (t) - T_{U .Math. .Math. 3} (t)}{R_{S .Math. .Math. 3}} - \frac{{dT}_{S .Math. .Math. 3} (t)}{dt} \end{matrix}) .Math. (\begin{matrix} T_{C} (t) \\ R_{B} (t) \\ C_{B} .Math. R_{B} (t) \end{matrix}) = (\begin{matrix} T_{S .Math. .Math. 1} (t) \\ T_{S .Math. .Math. 2} (t) \\ T_{S .Math. .Math. 3} (t) \end{matrix}) \end{matrix}$

[0039] Solving Expression (4) described above, the core temperature T.sub.C(t) is expressed by Expression (5) below. Here, Expression (5) satisfies following conditions: T.sub.i=(T.sub.Si(t)−T.sub.Ui(t)), T.sub.Si′=dT.sub.Si(t)/dt, (i=1, 2, 3).

[00005] $\begin{matrix} Formula .Math. .Math. 5 .Math. \\ T_{C} = \frac{\begin{matrix} T_{1} (T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 3} - T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 2}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} .Math. T_{S .Math. .Math. 1} - T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 3}) + \\ \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} .Math. T_{S .Math. .Math. 2} - T_{S .Math. .Math. 2}^{'} .Math. T_{S .Math. .Math. 1}) \end{matrix}}{T_{1} (T_{S .Math. .Math. 2}^{'} - T_{S .Math. .Math. 3}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 2}} .Math. T_{2} (T_{S .Math. .Math. 3}^{'} - T_{S .Math. .Math. 1}^{'}) + \frac{R_{S .Math. .Math. 1}}{R_{S .Math. .Math. 3}} .Math. T_{3} (T_{S .Math. .Math. 1}^{'} - T_{S .Math. .Math. 2}^{'})} & (5) \end{matrix}$

[0040] As described above, the in-vivo temperature measurement device according to embodiments of the present invention is configured to measure the epidermis temperatures T.sub.S1 to T.sub.S3 and the upper surface temperatures T.sub.U1 to T.sub.U3 measured by the thermal resistors (thermal resistance values R.sub.S1 to R.sub.S3) and to obtain an estimation value of the core temperature T.sub.C by applying the measured temperatures to Expression (5) which is the newly constructed estimation model of the core temperature T.sub.C.

Embodiment

[0041] An in-vivo temperature measurement device 1 according to embodiments of the present invention will be described in detail below.

[0042] FIGS. 7 and 8 are block diagrams showing a configuration of the in-vivo temperature measurement device 1 according to the present embodiment. The in-vivo temperature measurement device 1 includes, on a sheet-shaped base 15, a core temperature measurement instrument 10, an arithmetic circuit 11, a memory 12, a communication circuit 13 functioning as an I/F circuit with the outside, and a battery 14 for supplying power to the arithmetic circuit 11 and the communication circuit 13.

[0043] The core temperature measurement instrument 10 includes three heat flux sensors 101, 102, and 103. The heat flux sensors 101, 102, and 103 are devices that measure heat transfer per unit time or per unit area.

[0044] The heat flux sensors 101, 102, and 103 include thermal resistors 101r, 102r, 103r, and temperature sensors (second temperature sensors) 101u, 102u, and 103u and temperature sensors (first temperature sensors) 101s, 102s, and 103s which are provided at both ends of the thermal resistors 101r, 102r, and 103r, respectively.

[0045] The thermal resistors 101r, 102r, and 103r provided in the heat flux sensors 101, 102, and 103, respectively, are made of heat insulating materials having different thickness and materials and have different thermal resistance values R.sub.S1, R.sub.S2, and R.sub.S3, respectively.

[0046] The temperature sensors 101s, 102s, and 103s are provided on the thermal resistors 101r, 102r, and 103r to be closer to a living body 2, respectively, and measure the epidermis temperature T.sub.S (first temperature) of the living body 2.

[0047] The temperature sensors 101u, 102u, and 103u are provided on the thermal resistors 101r, 102r, and 103r to be opposite to the living body 2, respectively, and measure the upper surface temperature T.sub.U (second temperature) at a position away from the living body 2.

[0048] As the temperature sensors 101s to 103s and 101u to 103u, for example, a known thermistor or a thermopile using a thermocouple can be used.

[0049] The arithmetic circuit 11 includes a time count unit 11o and an estimation unit 11. The arithmetic circuit 11 estimates the core temperature T.sub.C(t) of the living body 2 based on the epidermis temperature T.sub.S(t) measured by the temperature sensors 101s to 103s and the upper surface temperature T.sub.U(t) measured by the temperature sensors 101u to 103u. More specifically, the estimation unit 111 estimates the core temperature T.sub.C by substituting the epidermis temperatures T.sub.S1, T.sub.S2, and T.sub.S3 measured by the temperature sensors 101s to 103s and the upper surface temperatures T.sub.U1, T.sub.U2, and T.sub.U3 measured by the temperature sensors 101u to 103u at a measurement time t of the time count unit 110 into Expression (5) representing the estimation model described above.

[0050] The arithmetic circuit 11 generates and outputs time-series data of the estimated core temperature T.sub.C of the living body 2. The time-series data is data in which the measurement time and the estimated core temperature T.sub.C are associated with each other.

[0051] The memory 12 stores information on the estimation model (Expression (5)) of the core temperature T.sub.C which is constructed in advance. In addition, the memory 12 also stores the thermal resistance values R.sub.S1, R.sub.S2, and R.sub.S3 of the heat flux sensors 101, 102, and 103. The memory 12 can be realized by a predetermined storage region in a rewritable nonvolatile storage device (for example, a flash memory) provided in the in-vivo temperature measurement device 1.

[0052] The communication circuit 13 outputs the time-series data of the core temperature T.sub.C of the living body 2 generated by the arithmetic circuit 11 to the outside. Such a communication circuit 13 is an output circuit to which an USB or other cables can be connected when outputting data or the like in a wired manner, but, for example, a wireless communication circuit compliant with Bluetooth (registered trademark) may be used.

[0053] The sheet-shaped base 15 functions as a base on which the core temperature measurement instrument 10, the arithmetic circuit 11, the memory 12, the communication circuit 13, and the battery 14 are mounted, and also includes wirings through which these elements are electrically connected to each other. Considering that the in-vivo temperature measurement device 1 is connected onto the epidermis of the living body, a deformable flexible substrate is desirably used for the sheet-shaped base 15.

[0054] Further, an opening is provided in a part of the sheet-shaped base 15, and the heat flux sensors 101, 102, and 103 are mounted on the base 15 so as to contact with the epidermis of the living body 2 through the opening.

[0055] Here, the in-vivo temperature measurement device 1 is realized by a computer. Specifically, the arithmetic circuit 11 is realized in a manner that a processor such as a CPU or a DSP executes various data processing according to a program stored in a storage device including the memory 12 such as a ROM, a RAM, and a flash memory provided in the in-vivo temperature measurement device 1. The program for causing the computer to function as the in-vivo temperature measurement device 1 can be recorded in a recording medium or can also be provided through a network.

[0056] Operation of In-vivo Temperature Measurement Device

[0057] An operation of the in-vivo temperature measurement device 1 including the above-described configuration will be described below with reference to a flowchart of FIG. 8. The memory 12 stores, in advance, the estimation model (Expression (5)) of the core temperature T.sub.C and the thermal resistance values R.sub.S1, R.sub.S2, and R.sub.S3 of the thermal resistors 101r, 102r, and 103r of the respective heat flux sensors 101, 102, and 103.

[0058] Further, the base 15 of the in-vivo temperature measurement device 1 is disposed in contact with the epidermis of the living body 2 in advance.

[0059] First, the arithmetic circuit 11 reads, from the memory 12, the estimation model (Expression (5)) of the core temperature T.sub.C and the thermal resistance values R.sub.S1, R.sub.S2, and R.sub.S3 of the thermal resistors 101r, 102r, and 103r included in the respective heat flux sensors 101, 102, and 103 (step S1). The arithmetic circuit 11 sets the read thermal resistance values R.sub.S1, R.sub.S2, and R.sub.S3 in the estimation model (Expression (5)).

[0060] Next, the temperature sensors 101s to 103s and 101u to 103u of the heat flux sensors 101, 102, and 103 measure the epidermis temperatures T.sub.S1, T.sub.S2, and T.sub.S3 and the upper surface temperatures T.sub.U1, T.sub.U2, and T.sub.U3 (step S2). The measured epidermis temperatures T.sub.S1, T.sub.S2, and T.sub.S3 and the upper surface temperatures T.sub.U1, T.sub.U2, and T.sub.U3 are sent to the arithmetic circuit 11.

[0061] Then, the estimation unit 11 substitutes the epidermis temperatures T.sub.S1, T.sub.S2, and T.sub.S3 and the upper surface temperatures T.sub.U1, T.sub.U2, and T.sub.U3 measured in step S2 into the estimation model of the above-described Expression (5) to estimate the core temperature T.sub.C (step S3). The estimated value of the core temperature T.sub.C of the living body 2 is stored in the memory 12.

[0062] Next, the arithmetic circuit 11 generates time-series data of the estimated core temperature T.sub.C (step S4). More specifically, the arithmetic circuit 11 repeatedly executes steps S2 and S3 to generate time-series data of the core temperature T.sub.C. The generated time-series data of the core temperature T.sub.C is stored in the memory 12.

[0063] Then, the arithmetic circuit 11 outputs the generated time-series data of the core temperature T.sub.C to the outside through the communication circuit 13 (step S5). For example, the time-series data of the core temperature T.sub.C is displayed on a display screen of a smartphone or a tablet terminal via a communication network (not shown).

[0064] Measurement Result of In-Vivo Temperature Measurement Device

[0065] A result of the core temperature T.sub.C measured by the in-vivo temperature measurement device 1 according to the present embodiment will be described below with reference to FIGS. 9A and 9B.

[0066] As shown in FIG. 9A, in the measurement of the core temperature T.sub.C by the in-vivo temperature measurement device 1, a reference temperature sensor T.sub.S for measuring a reference temperature of the core as a heat source is used for comparison. Further, according to the conventional example for comparison, the core temperature T.sub.C is measured based on the estimation model (for example, FIGS. 2 and 3) in which only a thermal equilibrium state is defined.

[0067] Both the in-vivo temperature measurement device 1 of the present embodiment and the in-vivo temperature measurement device of the conventional example are installed on the surface of the skin phantom under the same conditions and measure the temperature. In FIG. 9A, only the core temperature measurement instrument 10 of the in-vivo temperature measurement device 1 is schematically shown.

[0068] FIG. 9B shows measurement results. In FIG. 9B, a horizontal axis represents a measurement time (minute), and a vertical axis represents a core temperature T.sub.C (° C.). As can be seen from FIG. 9B, a measurement result “c” according to the conventional example has a large error with respect to a reference core temperature “r”. On the other hand, it can be seen that a measurement result “p” by the in-vivo temperature measurement device 1 of the present embodiment has a small error with respect to the reference core temperature “r”.

[0069] As described above, the in-vivo temperature measurement device 1 according to the present embodiment uses the estimation model in consideration with the non-thermal equilibrium state in the living body 2 to estimate the core temperature T.sub.C using the epidermis temperatures T.sub.S1, T.sub.S2, and T.sub.S3 and the upper surface temperatures T.sub.U1, T.sub.U2, and T.sub.U3 measured by the temperature sensors 101s to 103s and 101u to 103u. Therefore, it is possible to improve the measurement accuracy compared with the core temperature T.sub.C estimated by the conventional estimation model in which only the thermal equilibrium state is defined, and to more accurately estimate the core temperature that changes every moment.

[0070] As a result, it is possible to evaluate physical and mental disorders due to social jet-lag, for example, to grasp the consistency or inconsistency between the time of sleep or wake-up and the biological rhythm of an individual.

[0071] In the embodiment described above, a case has been described in which the core temperature measurement instrument 10 and the arithmetic circuit 11 are configured in the same casing, but the arithmetic circuit 11 may be configured independently of the core temperature measurement instrument 10. For example, the arithmetic circuit 11 may be configured to transmit the respective temperatures measured by the core temperature measurement instrument 10 to terminals, for example, a server device, PC, and a smartphone, through a communication network, and to perform an arithmetic process.

[0072] Although the embodiment of the in-vivo temperature measurement device and the in-vivo temperature measurement method of embodiments of the present invention has been described above, the present invention is not limited to the embodiment described above, and various modifications that can be envisioned by those skilled in the art can be made within the scope of the invention described in the claims.

REFERENCE SIGNS LIST

[0073] 1 In-vivo temperature measurement device [0074] 2 Living body [0075] 10 Core temperature measurement instrument [0076] 11 Arithmetic circuit [0077] 12 Memory [0078] 13 Communication circuit [0079] 14 Battery [0080] 15 Base [0081] 101, 102, 103 Heat flux sensor [0082] 101u, 102u, 103u, 101s, 102s, 103s Temperature sensor [0083] 110 Time count unit [0084] 111 Estimation unit.

INTERNAL BODY TEMPERATURE MEASUREMENT DEVICE AND INTERNAL BODY TEMPERATURE MEASUREMENT METHOD

Inventors

Cpc classification

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A61B2562/0276

HUMAN NECESSITIES

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A61B2562/14

HUMAN NECESSITIES

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A61B2562/043

HUMAN NECESSITIES

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G01K1/143

PHYSICS

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G01K13/20

PHYSICS

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A61B5/6844

HUMAN NECESSITIES

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G01K7/00

PHYSICS

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A61B5/7275

HUMAN NECESSITIES

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A61B2562/0271

HUMAN NECESSITIES

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A61B5/01

HUMAN NECESSITIES

International classification

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A61B5/01

HUMAN NECESSITIES

Abstract

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Description