LASER PROCESSING APPARATUS
20210268603 ยท 2021-09-02
Inventors
- Hiroki Tokuichi (Tochigi, JP)
- Shin Yoshida (Tochigi, JP)
- Takanori Sato (Tochigi, JP)
- Yuichi Hirata (Tochigi, JP)
- Naruhiko Okubo (Tochigi, JP)
- Koki Mizutani (Tochigi, JP)
Cpc classification
B23K26/0838
PERFORMING OPERATIONS; TRANSPORTING
B23K26/16
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0869
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23K26/08
PERFORMING OPERATIONS; TRANSPORTING
B23K26/16
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.
Claims
1. A laser processing apparatus comprising: a laser irradiation unit; a drive unit that moves the laser irradiation unit above a plate material which is conveyed along a conveying direction; and a dust collecting unit that moves below the plate material and follows the laser irradiation unit such that the dust collecting unit is disposed directly below the laser irradiation unit, wherein a non-contact support unit is provided at an opening of the dust collecting unit, and the non-contact support unit suctions a lower surface of the plate material toward a suction surface and supports the plate material without bringing the lower surface of the plate material and the suction surface into contact with each other.
2. The laser processing apparatus according to claim 1, wherein the non-contact support unit and a roller that is rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to the conveying direction are provided at the opening, and the lower surface of the plate material is in contact with an outer peripheral surface of the roller.
3. The laser processing apparatus according to claim 2, wherein the opening includes an upstream-side opening edge extending along the width direction, and a downstream-side opening edge extending along the width direction on a downstream side of the upstream-side opening edge in the conveying direction, in a plan view, and the roller includes a plurality of rollers, and the non-contact support portion includes a plurality of non-contact support portions, and one or more of the rollers and one or more of the non-contact support portions are provided alternately along the width direction at each of the upstream-side opening edge and the downstream-side opening edge.
4. The laser processing apparatus according to claim 2, further comprising a shielding plate that covers a periphery of the roller and the suction surface, wherein the non-contact support unit suctions the lower surface of the plate material toward the suction surface by a negative pressure generated between the lower surface of the plate material and the suction surface when a swirling flow of air from a nozzle provided at an outer peripheral edge of the suction surface is ejected, a portion of the outer peripheral surface of the roller protrudes from an upper surface of the shielding plate, and the suction surface is buried from the upper surface of the shielding plate.
5. The laser processing apparatus according to claim 3, further comprising a shielding plate that covers a periphery of the roller and the suction surface, wherein the non-contact support unit suctions the lower surface of the plate material toward the suction surface by a negative pressure generated between the lower surface of the plate material and the suction surface when a swirling flow of air from a nozzle provided at an outer peripheral edge of the suction surface is ejected, a portion of the outer peripheral surface of the roller protrudes from an upper surface of the shielding plate, and the suction surface is buried from the upper surface of the shielding plate.
6. The laser processing apparatus according to claim 4, wherein the shielding plate covers at least a portion of the outer peripheral edge, and a gap is provided between the outer peripheral edge and a lower surface of the shielding plate.
7. The laser processing apparatus according to claim 5, wherein the shielding plate covers at least a portion of the outer peripheral edge, and a gap is provided between the outer peripheral edge and a lower surface of the shielding plate.
8. The laser processing apparatus according to claim 4, wherein a groove extending radially about the suction surface is provided at a lower surface of the shielding plate.
9. The laser processing apparatus according to claim 5, wherein a groove extending radially about the suction surface is provided at a lower surface of the shielding plate.
10. The laser processing apparatus according Co claim 6, wherein a groove extending radially about the suction surface is provided at a lower surface of the shielding plate.
11. The laser processing apparatus according to claim 7, wherein a groove extending radially about the suction surface is provided at a lower surface of the shielding plate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028]
DETAILED DESCRIPTION OF THE INVENTION
[0029] Hereinafter, a laser processing apparatus 3 according to an embodiment of the present invention will be described with reference to the drawings.
[0030]
[0031] The leveler device 2 includes a plurality of upper rollers 21 provided on the upper side in the vertical direction with respect to the workpiece W to be fed from the coil material C (in the example of
[0032]
[0033] The conveying device 4 is a belt conveyor, and includes a plurality of belt rollers 41, 42, 43, and 44 which are rotatable about an axis parallel to a width direction Fx orthogonal to the conveying direction Fy (only four rollers are illustrated in
[0034] The first to fourth belt rollers 41 to 44 are provided in this order from the upstream side to the downstream side along the conveying direction Fy. Between the second belt roller 42 and the third belt roller 43, a dust collecting box 60 to be described later is provided. Furthermore, the belt 45 is stretched over the first to fourth belt rollers 41 to 44 so as to avoid the dust collecting box 60. Furthermore, the second belt roller 42 and the third belt roller 43 are slidable to the downstream side or to the upstream side along the conveying direction Fy together with the dust collecting box 60 by a box driving mechanism to be described later.
[0035] The head driving mechanism 5 includes an X-axis rail 51 extending along the width direction Fx above the belt 45, and a Y-axis rail 52 extending along the conveying direction Fy at the side portion of the belt 45. The X-axis rail 51 slidably supports the laser head H along its extending direction (i.e., the width direction Fx). The Y-axis rail 52 slidably supports the X-axis rail 51 along its extending direction (i.e., the conveying direction Fy). This allows the head driving mechanism 5 to move the laser head H along the conveying direction Fy and the width direction Fx above the workpiece W conveyed by the conveying device 4.
[0036] The dust collector 6 includes a box-shaped dust collecting box 60 extending along the width direction Fx, and a box driving mechanism (not shown) for moving the dust collecting box 60 along the conveying direction Fy.
[0037] The dust collecting box 60 is provided between the second belt roller 42 and the third belt roller 43 below the workpiece W. A rectangular opening 61 extending along the width direction Fx in a plan view is provided above the dust collecting box 60. The spatter caused by irradiating the workpiece W with a laser beam from the laser head H is collected in the dust collecting box 60 through the opening 61. The spatter collected in the dust collecting box 60 is appropriately discharged from a discharge unit 63 provided on a side cover 62.
[0038] The box driving mechanism moves the dust collecting box 60, the second belt roller 42, and the third belt roller 43 to follow the movement of the laser head H along the conveying direction Fy, such that the opening 61 of the dust collecting box 60 is disposed directly below the laser head H.
[0039]
[0040] The upstream-side opening edge 64 includes a plurality of disk-shaped non-contact support pads 7 (in the example of
[0041] In the upstream-side opening edge 64, one non-contact support pad 7 and the pair of the support rollers 8 are provided in rows and alternately along the width direction Fx. It should be noted that
[0042] The downstream-side opening edge 65 includes a plurality of disk-shaped non-contact support pads 7 (in the example of
[0043] In the downstream-side opening edge 65, one non-contact support pad 7 and a pair of the support rollers 8 are provided in rows and alternately along the width direction Fx. It should be noted that
[0044]
[0045] At the upstream cover 66, a plurality of upstream-side roller windows 66a which are each a substantially rectangular opening in a plan view are provided at predetermined intervals along the width direction Fx (in the example of
[0046] Furthermore, as shown in
[0047] Therefore, a part of the power for conveying the workpiece W along the conveying direction Fy in the conveying device 4 as a belt conveyor is transmitted to the outer support roller 81 via the counter roller 9. This allows the outer support roller 81 to rotate in synchronization with the conveying operation of the workpiece W by the conveying device 4. It should be noted that
[0048] At the downstream cover 67, a plurality of downstream-side roller windows 67a, which are each a substantially rectangular opening in a plan view, are provided at predetermined intervals along the width direction Fx (in the example of
[0049] Furthermore, as shown in
[0050]
[0051]
[0052] The non-contact support pad 7 has a cylindrical shape. An annular groove 73 in a plan view is provided at an outer peripheral edge 72 of the suction surface 71 of the non-contact support pad 7. A plurality of nozzle holes 74 (in the example of
[0053] Therefore, in the non-contact support pad 7, when supplying air compressed by the air pump to the air supply hole 76, the swirling flow of air extending radially outward as indicated by a broken line arrow in
[0054]
[0055] As shown in
[0056] As described above, the portion of the outer peripheral surface of the outer support roller 81 and the inner support roller 82 protrudes from the upper surface of the upstream cover 66 to the side of the workpiece W, while the suction surface 71 of the non-contact support pad 7 is buried from the upper surface of the upstream cover 66. As shown in
[0057]
[0058] Next, a description will be given of a procedure for cutting the workpiece W by the laser head H while removing the waviness of the workpiece W in the laser processing apparatus 3 as described above. First, when supplying compressed air to the air supply hole 76 of the non-contact support pad 7, the swirling flow of air extending radially outward from the nozzle hole 74 provided in the suction surface 71 is generated. As shown schematically by a broken line arrow in
[0059] The laser processing apparatus 3 according to the present embodiment has the following effects.
(1) The laser processing apparatus 3 includes: a head driving mechanism 5 that moves the laser head H above the workpiece W which is conveyed along the conveying direction Fy; and the dust collecting box 60 that moves below the workpiece W and follows the laser head H such that the dust collecting box 60 is disposed directly below the laser head H. With such a configuration, it is possible to collect spatter material generated by irradiating a laser beam from the laser head H to the workpiece W. Furthermore, in the laser processing apparatus 3, the non-contact support unit 7 is provided at the opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions the lower surface of the workpiece W toward the suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. With such a configuration, it is possible to suction a portion of the workpiece W to which the laser beam is irradiated to the suction surface 71 of the non-contact support pad 7. Therefore, even when there is waviness in the workpiece W to be conveyed, it is possible to irradiate the laser beam while removing this waviness, making it possible to cut the workpiece W with good precision. Furthermore, in the laser processing apparatus 3, the non-contact support pad 7 supporting the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other is used as a means for supporting the workpiece W, thereby making it possible to remove the waviness without causing damage to the surface of the workpiece W.
[0060] (2) In the laser processing apparatus 3, the non-contact support pad 7, and the outer support roller 81 and the inner support roller 82 that are each rotatable about an axis parallel to the width direction Fx are provided at the opening 61 of the dust collecting box 60. Furthermore, in the laser processing apparatus 3, the lower surface of the workpiece W is in non-contact with the suction surface 71 of the non-contact support pad 7, but in contact with the outer peripheral surfaces of the support rollers 81 and 82. Therefore, according to the laser processing apparatus 3, it is possible to remove the waviness of the workpiece W by the non-contact support pad 7 suctioning the lower surface of the workpiece W toward the suction surface 71 and pressing the lower surface of the workpiece W against the outer peripheral surfaces of the support rollers 81 and 82. Furthermore, in this situation, it is also possible to convey the workpiece W along the conveying direction Fy without causing any damage by pressing the lower surface of the workpiece W against the outer peripheral surfaces of the support rollers 81 and 82.
[0061] (3) In the laser processing apparatus 3, one or more of the support rollers 81 and 82, and one or more of the non-contact support pad 7 are provided alternately along the width direction Fx for each of the upstream-side opening edge 64 and the downstream-side opening edge 65 extending along the width direction Fx. With such a configuration, it is possible to suction and support the portion of the workpiece W to which the laser beam from the laser head H is applied, a result of which it is possible to reliably remove the waviness in the portion to which the laser beam is irradiated.
[0062] (4) In the laser processing apparatus 3, the non-contact support pad 7 suctions the lower surface of the workpiece W toward the suction surface 71 by a negative pressure generated between the lower surface of the workpiece W and the suction surface 71 when a swirling flow of air from a nozzle hole 74 provided at the outer peripheral edge 72 of the suction surface 71 is ejected. Furthermore, in the laser processing apparatus 3, the upstream cover 66 and the downstream cover 67 cover the peripheries of the support rollers 81 and 82, and the suction surface 71, a portion of the outer peripheral surface of the support rollers 81 and 82 protrudes from the upper surface of the upstream cover 66 and the downstream cover 67, and the suction surface 71 is buried from the upper surface of the upstream cover 66 and the downstream cover 67. With such a configuration, it is possible to provide the gap 69 that discharges the swirling flow of air between the lower surface of the workpiece W and the suction surface 71. Therefore, a negative pressure is generated between the lower surface of the workpiece W and the suction surface 71 due to the Bernoulli effect while the workpiece W is prevented from rising by the air. By using this negative pressure, it is possible to suction the lower surface of the workpiece W toward the suction surface 71 to remove the waviness in the workpiece W.
[0063] (5) In the laser processing apparatus 3, the upstream cover 66 and the downstream cover 67 cover at least a portion of the outer peripheral edge 72 of the suction surface 71, and a gap 69 is provided between the outer peripheral edge 72 and the lower surfaces of the upstream cover 66 and the downstream cover 67. With such a configuration, it is possible to lead a portion of the swirling flow of air ejecting from the nozzle hole 74 of the suction surface 71 to the lower surfaces of the upstream cover 66 and the downstream cover 67. Therefore, it is possible to cool the upstream cover 66 and the downstream cover 67 while generating the negative pressure between the lower surface of the workpiece W and the suction surface 71 due to the Bernoulli effect. Furthermore, by cooling the upstream cover 66 and the downstream cover 67 by the portion of the swirling flow of air as described above, it is possible to cool the spatter generated by irradiating the laser beam, a result of which it is possible to prevent the spatter from bonding to the support rollers 81 and 82, the covers 66 and 67, and the like. Furthermore, with such a configuration, it is possible to prevent the spatter from bonding to the workpiece W.
[0064] (6) In the laser processing apparatus 3, a groove 66c extending radially about the suction surface 71 is provided at a lower surface of the covers 66 and 67. With such a configuration, it is possible to improve the cooling effect of the covers 66 and 67 due to the swirling flow of air ejected from the nozzle hole 74 of the suction surface 71.
[0065] While an embodiment of the present invention has been described above, the present invention is not intended to be limited thereto. Within the spirit of the present invention, the configuration of detailed parts may be changed as appropriate.
[0066] For example, in the above embodiment, the case has been described in which the counter roller 9 is used as a power transmission mechanism for transmitting the power of the conveying device 4 as a belt conveyor to the upstream-side support roller 81; however, the present invention is not limited thereto. The power transmission mechanism is not limited to the counter roller 9, and may be configured by combining components such as a shaft and a belt.
[0067] Furthermore, for example, in the above embodiment, the case has been described in which the counter roller 9 is used as a driving mechanism for rotating the upstream-side support roller 81 in synchronization with the conveying operation of the workpiece W by the conveying device 4; however, the present invention is not limited thereto. For example, an actuator for rotating the upstream-side support roller 81 may be provided to drive this actuator in synchronization with the conveying operation by the conveying device 4, thereby rotating the upstream-side support roller 81 in synchronization with the conveying operation of the workpiece W by the conveying device 4.