High power density power supply

Abstract

A high power density power supply includes at least one power module and a cooling fan in a casing. A first filter circuit board facing upward is provided below the cooling fan. A second filter circuit board facing downward is provided above the cooling fan. The back of the second filter circuit board is provided with a plurality of buffer pads. An insulating plate is disposed on the buffer pads to completely cover the top of the second filter circuit board. Thereby, the insulating plate provided an insulating effect between an upper cover of the casing and the second filter circuit board to prevent the second filter circuit board from directly contacting the upper cover to form a short circuit, so as to improve the safety of the power supply.

Claims

1. A high power density power supply, comprising a casing, the casing being covered with an upper cover, at least one power module being provided in the casing, a cooling fan being provided in front of the power module, a first filter circuit board being provided below the cooling fan, a second filter circuit board being provided in reverse above the cooling fan so that a back of the second filter circuit board faces up, characterized in that: the high power density power supply further comprises a plurality of buffer pads and an insulating plate; the buffer pads are disposed on the back of the second filter circuit board, respectively; the insulating plate is disposed on the buffer pads, the insulating plate completely covers a top of the second filter circuit board, through the buffer pads, a distance is defined between the insulating plate and the second filter circuit board, wherein an insulating sheet is provided between the insulating plate and the second filter circuit board and located above the cooling fan, the second filter circuit board, the insulating sheet and the insulating plate are locked to the cooling fan by a plurality of bolts.

2. The high power density power supply as claimed in claim 1, wherein the second filter circuit board and the insulating plate are rectangular, and the buffer pads are adhered to four corners of the second filter circuit board, respectively.

3. The high power density power supply as claimed in claim 1, wherein the buffer pads are made of bakelite.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a perspective view of the power modules in the casing disclosed in Taiwan Utility Model Publication M558454;

(2) FIG. 2 is a side sectional view of the power supply disclosed in Taiwan Utility Model Publication M558454;

(3) FIG. 3 is a perspective view of the power supply according to a preferred embodiment of the present invention;

(4) FIG. 4 is a perspective view of the power modules in the casing according to the preferred embodiment of the present invention;

(5) FIG. 5 is a perspective view of one power module according to the preferred embodiment of the present invention;

(6) FIG. 6 is a partially exploded view of one power module according to the preferred embodiment of the present invention;

(7) FIG. 7 is a side sectional view of one power module according to the preferred embodiment of the present invention; and

(8) FIG. 8 is a partially enlarged view of FIG. 7.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(9) Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.

(10) FIG. 3 is a perspective view of the power supply according to a preferred embodiment of the present invention. FIG. 4 is a perspective view of the power modules in the casing according to the preferred embodiment of the present invention. FIG. 5 is a perspective view of one power module according to the preferred embodiment of the present invention. FIG. 6 is a partially exploded view of one power module according to the preferred embodiment of the present invention. The present invention discloses a high power density power supply which integrates power modules with filters in a casing. The high power density power supply 100 comprises a casing 101. The casing 101 has a panel 102 at a front side thereof. A plurality of power modules 103 are arranged side by side in the casing 101 and are perpendicular to the panel 102. A cooling fan 104 is provided in front of each power module 10. A first filter circuit board 105 is provided below the cooling fan 104. The first filter circuit board 105 is provided with a first filter 106 facing upward. A second filter circuit board 107 that is electrically connected to the first filter circuit board 105 is provided in reverse above the cooling fan 104, so that the back of the second filter circuit board 107 faces up. The second filter circuit board 107 is provided with a second filter 108 facing downward. The second filter circuit board 107 is formed with a plurality of fixing holes 109. The main improvement of the present invention is described below.

(11) The high power density power supply 100 further comprises an insulating sheet 10, a plurality of buffer pads 30, and an insulating plate 20.

(12) The insulating sheet 10 is formed with a plurality of through holes 11 corresponding to the fixing holes 109. The insulating sheet 10 is disposed on the second filter circuit board 107.

(13) The plurality of buffer pads 30 are made of bakelite. The buffer pads 30 are disposed on the back of the second filter circuit board 107, respectively. In this embodiment, the second filter circuit board 107 is rectangular, and the buffer pads 30 are disposed on the four corners of the second filter circuit board 107 in an adhesive manner, respectively.

(14) The insulating plate 20 is disposed on the buffer pads 30. The insulating plate 20 is also rectangular and can completely cover the top of the second filter circuit board 107. The insulating plate 20 is formed with a plurality of locking holes 21 corresponding to the through holes 11. A plurality of bolts 22 are respectively inserted through the locking holes 21, the through holes 11 and the fixing holes 109 to lock the insulating plate 20, the insulating sheet 10 and the second filter circuit board 107 to the cooling fan 104, so that the insulating sheet 10 is positioned between the insulating plate 20 and the second filter circuit board 107.

(15) In order to further understand the structural features, the technical means and the expected effect of the preset invention, the use of the preset invention is described hereinafter.

(16) FIG. 7 is a side sectional view of one power module according to the preferred embodiment of the present invention. FIG. 8 is a partially enlarged view of FIG. 7. Through the insulating sheet 10, a distance 23 is defined between the second filter circuit board 107 and the insulating plate 20, which can avoid that a protruding pin 1081 of the second filter 108 is in direct contact with the upper cover 1011 of the casing 101 to form a short circuit.

(17) Furthermore, since the insulating plate 20 covers the second filter circuit board 107, if the upper cover 1011 of the casing 101 is pressed down and deformed, the insulating plate 20 is located between the upper cover 1011 of the casing 101 and the second filter circuit board 107 to provide an insulating effect. This can prevent the exposed protruding pin 1081 of the second filter 108 from contacting the upper cover 1011 of the casing 101 to form a short circuit, so as to improve the safety of use of the power supply 100.

(18) It is worth mentioning that since the corners of the second filter circuit board 107 are provided with the buffer pads 30, the distance 23 between the second filter circuit board 107 and the insulating plate 20 can be strengthened, so that the protruding pin 1081 of the second filter 108 can be stably separated from the insulating plate 20 by the distance, and the protruding pin 1081 of the second filter 108 is prevented from breaking through the insulating plate 20 and contacting the upper cover 1011 of the casing 101 to form a short circuit, thereby improving the safety of the power supply.

(19) Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.