RFID-ENABLED METAL TRANSACTION CARDS WITH FOIL, SPECIAL TEXTURE, COLOR AND CARBON FIBER

Abstract

RFID-enabled composite metal transaction cards may include a security layer comprising a hologram or diffraction grating on a metal layer having a slit. The metal layer may reside on a front or rear face, or as a core layer in the construction of the card. The security layer, with or without a carrier layer, may be hot stamped to the metal layer with a protective hard coating, to camouflage the existence of a discontinuity in the metal layer. The metal layer with slit or slits may be coated with a baked-on-ink to provide color and to partially fill the slit or slits. A metal foil, holofoil or a holographic metal film may be provided with a discontinuity in the form of a slit and may be a decorative foil mounted to a card body containing a metal layer with a slit.

Claims

1. An RFID-enabled smartcard comprising: a metal layer having a scratch protection coating over a print layer on its front face, wherein the scratch protection coating comprises at least one of (i) a layer of ink, varnish or a polymer and (ii) a layer of hard coat lamination film; wherein the scratch protection coating is suitable for one or more of the following treatments: the scratch protection coating is capable of being laser marked for inscribing personalization data into or onto the coating; the scratch protection coating is capable of being laser engraved to partially remove the coating in creating a logo or a deboss feature; and the scratch protection coating is capable of being laser treated without removal of material to create thin film effects.

2. The RFID-enabled smartcard of claim 1, wherein: the metal layer is capable of being laser marked or laser engraved.

3. The RFID-enabled smartcard of claim 1, wherein: a laser for performing the laser marking, engraving or treatment has a wavelength in the UV, IR or visible, and may have a varying pulse width in the nanosecond, picosecond or femtosecond regime.

4. A multi-layered composite metal transaction card comprising: a plastic layer having top and bottom surfaces attached to a metal layer; and a metal layer with a discontinuity in the form of a micro-slit at a designated area with said metal layer residing at the front face, rear face or at the core of the transaction card; wherein a security layer is assembled to or formed on the designated area of the metal layer with said security layer camouflaging or covering the discontinuity; and wherein said metal layer acts as a radio frequency antenna and the security layer does not attenuate the field.

5. The multi-layered composite metal transaction card of claim 4, wherein: the security layer is electromagnetically transparent.

6. The multi-layered composite metal transaction card of claim 4, wherein: the security layer comprises a hologram or diffraction grating disposed on a metal foil or on a very thin metal layer which is formed or grown at the designated area on the metal layer.

7. The multi-layered composite metal transaction card of claim 4, wherein: the security layer comprises an embossed or debossed pattern.

8. The multi-layered composite metal transaction card of claim 4, wherein: the security layer, with or without a carrier layer, is mounted or assembled directly to a designated area on the metal layer by means of hot stamping, spot or laser welding.

9. The multi-layered composite metal transaction card of claim 4, further comprising: a plastic layer, which may be a clear plastic layer attached to the metal layer, having information selectively written thereon; and at least one window or opening formed within the plastic layer to enable visibility of the hologram or diffraction grating on the security layer.

10. A metal face transaction card comprising: a transaction card structure comprising a layer or layers of metal with a slit; and a plastic layer or a combination of plastic layers laminated on one of the two opposing faces of the metal layer or layers to form an RFID-enabled metal transaction card body; wherein the layer of metal of the transaction card comprises a decorative metal foil layer on a UV screen printed layer; wherein the decorative metal foil layer has a discontinuity to act as a coupling frame in order to power a transponder chip module; and wherein the decorative metal foil layer imparts texture to the card body surface.

11. The metal face transaction card of claim 10, wherein: the discontinuity is an integral part of the decorative metal foil pattern.

12. The metal face transaction card of claim 10, wherein: the metal foil layer comprise lasers etched elements for design and alphanumeric information of a cardholder.

13. The metal face transaction card of claim 10, wherein: the metal foil layer has multiple colors and design patterns.

14. The metal face transaction card of claim 10, wherein: the plastic layer or a combination of plastic layers capture a magnetic stripe.

15. The metal face transaction card of claim 10, wherein: the plastic layer or a combination of plastic layers capture security elements.

16. The metal face transaction card of claim 10, wherein: the plastic layer is protected by a laser engravable overlay layer.

17. A metal face transaction card comprising: a layer or layers of metal with a slit; and a plastic layer or a combination of plastic layers laminated on one of the two opposing faces of the metal layer or layers to form an RFID-enabled metal transaction card body; wherein the layer of metal of the transaction card comprises a decorative metal foil layer on a UV screen printed layer.

18. The metal face transaction card of claim 17, wherein: the decorative metal foil layer regulates the system frequency of the combined operation of the transponder chip module and the metal layer or layers with a slit acting as a coupling frame.

19. The metal face transaction card of claim 17, wherein: the decorative metal foil layer imparts texture to the card body surface and camouflages a slit or slits in the underlying metal layer or layers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0324] Reference will be made in detail to embodiments of the disclosure, non-limiting examples of which may be illustrated in the accompanying drawing figures (FIGs). The figures may generally be in the form of diagrams. Some elements in the figures may be stylized, simplified or exaggerated, others may be omitted, for illustrative clarity.

[0325] Although the invention is generally described in the context of various exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with one another. Any text (legends, notes, reference numerals and the like) appearing on the drawings are incorporated by reference herein.

[0326] Some elements may be referred to with letters (“AS”, “CBR”, “CF”, “MA”, “MT”, “TCM”, etc.) rather than or in addition to numerals. Some similar (including substantially identical) elements in various embodiments may be similarly numbered, with a given numeral such as “310”, followed by different letters such as “A”, “B”, “C”, etc. (resulting in “310A”, “310B”, “310C”), and may collectively (all of them at once) referred to simply by the numeral (“310”).

[0327] FIG. 1 (compare FIG. 1 62/946,990; and FIG. 1 of U.S. Pat. No. 9,390,363) is a cross sectional diagram of the layers of a subassembly of a card, according to the prior art.

[0328] FIG. 1A (compare FIG. 1A 62/946,990; and FIG. 1A of U.S. Pat. No. 9,390,363) is a cross sectional diagram of the layers of another subassembly, according to the prior art.

[0329] FIG. 1B (compare FIG. 1B 62/946,990; and FIG. 1B of U.S. Pat. No. 9,390,363) is a cross sectional diagram of the layers of the card of FIG. 1A being laser engraved, according to the prior art.

[0330] FIG. 2 (compare FIG. 2 of 62/911,236; and FIG. 9 of U.S. Pat. Nos. 10,373,920 and 10,332,846) is a cross sectional diagram of a dual interface card, according to the prior art.

[0331] FIG. 3 (compare FIG. 1 of 62/933,526; and FIG. 4 of U.S. Pat. No. 9,646,234) is a cross-sectional view of an example of a carbon fiber substructure sandwiched between two layers of clear PVC plastic of the inner core over-laminated with clear PVC plastic film for a transaction card, according to the prior art.

[0332] FIG. 4 (compare FIG. 4 of 62/911,236) is a diagram (perspective view) of a transaction card including a holographic portion, according to an aspect or embodiment of the invention.

[0333] FIG. 5 (compare FIG. 5 of 62/911,236) is a diagram (in cross-section) detailing an example of some of the steps in forming a transaction card, according to an embodiment of the invention.

[0334] FIG. 6A (compare FIG. 2 of 62/946,990) is a simplified plan view diagram of a metal transaction card with a recess to accommodate a carbon fiber layer camouflaging a slit in a metal layer or in a metal card body, according to an embodiment of the invention.

[0335] FIG. 6B is a perspective view diagram of a metal transaction card with a recess to accommodate a carbon fiber layer with an opening for an inductive coupling chip module (ICM), with the carbon fiber camouflaging the slit in the metal layer or in the metal card body, according to an embodiment of the invention.

[0336] FIG. 7A (compare FIG. 3 of 62/946,990) is a perspective view of a card embodying the invention showing a metal foil being applied to a transaction card, according to an embodiment of the invention.

[0337] FIG. 7B is a perspective view of a card embodying the invention showing a metal foil with a slit for texturing the surface of a metal card body (MCB) and the production steps in applying the foil to the card body, according to an embodiment of the invention.

[0338] FIG. 8A (compare FIG. 2 of 62/933,526) is a perspective partially cut-away view of an example of a metal core layer with slit (not shown) to function as a coupling frame sandwiched between two layers of carbon fiber structure for a metal transaction card, according to an embodiment of the invention.

[0339] FIG. 8B is a perspective partially cut-away view of an example of a metal core layer with slit to function as a coupling frame sandwiched between two layers of carbon fiber structure for a metal transaction card, according to an embodiment of the invention.

[0340] FIG. 9 (compare FIG. 3 of 62/933,526) is a cross-sectional view of the card 820 shown in FIG. 8B, an example of a metal core layer with slit (not shown) to function as a coupling frame sandwiched between two layers of carbon fiber structure laminated together using adhesive layers for a metal transaction card, according to an embodiment of the invention.

[0341] FIG. 10 (compare FIG. 4 of 62/933,526) is a perspective partially cut-away view of an example of a carbon fiber structure sandwiched between two metal layers with one having a visible slit to function as a coupling frame for a metal transaction card, according to an embodiment of the invention.

[0342] FIG. 11 is a simplified cross-sectional diagram of a “hybrid” metal card assembly for manufacturing a metal transaction card that can be personalized on the front and rear surfaces using a laser beam, according to an embodiment of the invention.

[0343] FIG. 12 is a modification of FIG. 11 illustrating a cross-sectional diagram of a “Metal Face” card assembly with a front-face ink-baked metal surface protected by a hard coat layer for manufacturing a metal transaction card that can be personalized on the front and rear surfaces using a laser beam, according to an embodiment of the invention.

DESCRIPTION

[0344] Various embodiments (or examples) may be described to illustrate teachings of the invention(s), and should be construed as illustrative rather than limiting. It should be understood that it is not intended to limit the invention(s) to these particular embodiments. It should be understood that some individual features of various embodiments may be combined in different ways than shown, with one another. Reference herein to “one embodiment”, “an embodiment”, or similar formulations, may mean that a particular feature, structure, operation, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Some embodiments may not be explicitly designated as such (“an embodiment”).

[0345] The embodiments and aspects thereof may be described and illustrated in conjunction with systems, devices and methods which are meant to be exemplary and illustrative, not limiting in scope. Specific configurations and details may be set forth in order to provide an understanding of the invention(s). However, it should be apparent to one skilled in the art that the invention(s) may be practiced without some of the specific details being presented herein.

[0346] Furthermore, some well-known steps or components may be described only generally, or even omitted, for the sake of illustrative clarity. Elements referred to in the singular (e.g., “a widget”) may be interpreted to include the possibility of plural instances of the element (e.g., “at least one widget”), unless explicitly otherwise stated (e.g., “one and only one widget”).

[0347] In the following descriptions, some specific details may be set forth in order to provide an understanding of the invention(s) disclosed herein. It should be apparent to those skilled in the art that these invention(s) may be practiced without these specific details. Any dimensions and materials or processes set forth herein should be considered to be approximate and exemplary, unless otherwise indicated. Headings (typically underlined) may be provided as an aid to the reader, and should not be construed as limiting.

[0348] Reference may be made to disclosures of prior patents, publications and applications. Some text and drawings from those sources may be presented herein, but may be modified, edited or commented to blend more smoothly with the disclosure of the present application.

[0349] FIG. 1 shows a subassembly 50 which includes a thermoplastic layer 96 over which is located an adhesive layer 98 over which is located a metal layer 100 over which is located an adhesive layer 102 over which is formed a laser reactive film layer 104. The thermoplastic layer 96, also referred to as an inlay, is shown to include a chip module 93 (also denoted as an integrated circuit, IC), a chip antenna 95 coupled to the chip and a booster antenna 97 as shown in greater detail in FIG. 1H. The chip 93 may be mounted on or within layer 96. Layer 96 may be a PVC pigmented (colored) thermoplastic layer having a color selected to be imparted to the card. The adhesive layer 98 is selected to ensure adhesion of layer 96 to the underside of metal layer 100, as shown in FIG. 1. In FIG. 1, the metal layer 100 is shown to be a “thick” metal layer (e.g., 0.0155 inches) and functions as the core layer (or substrate of the card). However, the layer 100 may be much thinner (i.e., it may be a thin foil layer of vapor deposited metal of 10 angstroms thickness) or it may even be thicker up to 0.029 inches. Alternatively, metal layer 100 may be replaced by a plastic layer which includes high density particles which simulate a metal layer. Still further, layer 100 may be a plastic core layer to produce an all plastic card.

[0350] The laser reactive film 104 is attached to the topside of metal layer 100, as shown as in FIG. 1. The layer 104 is typically made of polyvinylchloride (PVC) which is a material that is particularly well adapted to printing. Layer 104 is also made laser reactive to enable treatment by a laser to control imparting of information and certain color control. The laser reactive film 104 enables any selected information, pattern or design to be imparted to the laser reactive film 104 via a suitable laser device 120. In the making of cards, the laser reactive film 104 may be selected to have any desired, and/or suitable, color. The selected color will project this coloring to a viewer facing that side of the card. Subassemblies, such as subassembly 50, may be subjected to further processing (e.g., the addition of other layers, lamination, etc.) to form cards having desired qualities and characteristics.

[0351] A laser reactive copolymer layer may be attached to the top and/or to the bottom of subassembly 50.

[0352] FIG. 1A shows that the subassembly 50 can be modified with the addition of a laser reactive copolymer layer 106b underlying layer 96 (in FIG. 1A) to form a subassembly 60. Actually, layer 106b is normally intended to be, and function as, the front of the card. Note also that a magnetic stripe 108 is typically attached to the back of the card (on top of layer 104 in FIG. 1B).

[0353] The introduction of the laser reactive copolymer layer 106b provides significant features. The laser reactive copolymer layer 106b is preferably an amorphous thermoplastic polyester plastic material such as polyethylene terephthalate (APET) or any like material. A significant aspect of this amorphous thermoplastic material is that certain of its properties change drastically as it is heated above its glass transition temperature, Tg, and below its melting point temperature, Tm. When heat is applied to the plastic material such that it is at a selected temperature, which exceeds its Tg and is less than its Tm, the plastic material starts to cross link or crystallize and enters a thermosetting state (rather than being a thermoplastic). This means that its external shape cannot be changed without irreversible destruction from the form it assumed when it reached the selected temperature. Thus, the copolymer layer 106b can be heated to a selected temperature within this temperature range (between Tg and Tm) to cause the material to enter a crystalline state and assume a (thermo-) set condition.

[0354] The temperature dependent characteristic of the copolymer layer 106b ensures that when the layer 106b is embossed (or debossed) with a pattern at a predetermined temperature (above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm) it becomes thermoset, rather than being thermoplastic, and its external shape (the embossed form) cannot be changed from the embossed form to which it was set at the predetermined temperature without destroying the embossed pattern. The resultant embossed pattern is found to be scratch resistant and to mask scratches due to optical light reflectivity of the embossed pattern. The copolymer (e.g., APET) selected for use is stiffer than PVC and can be thermally set into the desired pattern. By way of example, a co-polyester manufactured by Eastman Chemical under the brand name Tritan was used to make some experimental cards.

[0355] Another significant aspect of layer 106b is that it is also laser reactive so it can be laser engraved to enable information to be introduced on or within the layer. In addition, the laser reactive property enables the color of the layer to be altered to shades of black or white dependent on laser settings. The laser reactive portion of the copolymer layer enables virtually any desired information or design to be laser engraved on or within the layer and to also alter the color of the layer.

[0356] FIG. 1 shows that the laser reactive copolymer layer 106b and the laser reactive film 104 may be operated upon (treated) by a suitable laser device 120a and/or 120b to form any design or pattern so the layers 106b and 104 can contain any desired information. The laser reactive copolymer layer 106b (as well as layer 106a discussed below) includes silicon and carbon particles. Applicants discovered that by controlling the power and wavelength of the lasering device (e.g., 120a, 120b) directing their energy onto the laser reactive copolymer layers 106a and/or 106b the color of the layers could be controlled from their native state. The laser reactive copolymer films may be treated with the laser to turn their surface from their native color to black or the layers may also be turned white by changing the selected laser frequency and power settings. This color change can be produced as a gradient, by altering laser power and exposure time. By controlling the color and resultant contrast, a variety of desired images may be produced in the copolymer layers 106a, 106b. The final laser effect (secure, artistic or both) may also be controlled by choosing the correct type of laser such as YAG or CO.sub.2, as well as the pulse rate and speed or combination of laser types. Note that lasers may be used to impart colored personalization, static art or other desired images to the core layer and to other selected layers before or after lamination. The imparting of images may be in the form of laser engraving, oxidizing, pattern annealing, carbon migration, layer removal or any form of laser marking known in the art.

[0357] FIG. 2 illustrates that the chip (IC) and an antenna and carrier may be formed within a layer of the card and that in addition, the chip may be accessed (read) by providing an external contact 901 along one side of the card. This type of card may be referred to as a dual interface card since it enables information on the card to be read or written via RFID and contact. Note that the metal layer 22/212 can act as a radio frequency shield to reduce reception from that side of the RFID antenna.

[0358] A layer 22 of aluminum (or any suitable metal or metal compound such as Zinc Sulfide) may be vapor deposited on a diffraction pattern to form a hologram. The use of vapor deposition is very significant in that it permits a very thin layer 22, a few atoms thick, to be formed on surface 21a and thus complete the formation of the hologram, using small amounts of metal.

[0359] A high refractive index (HRI) layer 212 can be vapor deposited on an embossed layer. Due to the HRI property of layer 212, there is no need to further metallize the layer. The HRI layer may be formed of zinc sulfide or zinc oxide or any material having like properties. Clear primer layer 23a and 23b is attached to the top and bottom of HRI layer 212.

[0360] FIG. 3 shows a cross-sectional view of an example of a carbon fiber substructure 10 sandwiched between two layers 18 of clear PVC plastic over-laminated with clear PVC plastic over-laminates 24, for a transaction card 20 such as a credit card.

[0361] The carbon fiber substructure 10 comprises carbon fiber strands or filaments which are woven into a weave pattern component 12. The weave pattern component 12 is mounted between two layers 14 of thin clear plastic and adhesive 16, such as clear PVC plastic film. The thin clear plastic layers 14 hold the carbon fibers together and keep the weave pattern 12 of the substructure 10 intact. The adhesive 16 fills the air voids around the carbon fibers and bonds the fibers to the PVC skin 14.

[0362] Materials for the carbon fiber substructure 10 include various combinations of substrates such as both amorphous and biaxially oriented forms of polyethylene terephthalate (PET) plastic or combinations of both, polyvinyl chloride (PVC) plastic, other suitable plastics, adhesives such as polyethylene, acrylic, cyanoacrylate, epoxies, and carbon fibers commonly used for extreme durability strength in airplane structures, automotive components, etc.

[0363] This specification describes different techniques as embodiments of the invention to camouflage or cover a discontinuity in a metal layer or metal card body by one or more of the following:

[0364] (i) applying a hologram on a carrier base layer to an area surrounding a discontinuity and or a module opening;

[0365] (ii) laser etching a diffraction grating directly on a metal layer with a discontinuity forming part of the resulting holographic pattern representing a security feature embedded in the card body;

[0366] (iii) forming a recess in a front face metal layer to accommodate a carbon fiber layer which covers the surrounding area of the underlying discontinuity; and

[0367] (iv) texturing the outer surface of a metal card body with a conductive foil having a discontinuity in the graphical nature of the texture to act as an antenna or coupling frame driving a transponder chip module, with said textured conductive foil laser etched to additionally create decorative designs or security features.

[0368] FIG. 4 shows a top view of a metal transaction card 400 illustrating that the hologram may be located within a designated area 401, partially camouflaging or covering a discontinuity 413 in the metal layer forming the card body 400. The hologram surrounds a transponder chip module 410 with a module antenna 412. Alternatively, the hologram may extend the full length and/or width of the card 400, completely camouflaging or covering the discontinuity 413 in the metal layer 400. Note that alpha numeric information may be produced by lasing within the holographic layer. Also, alpha numeric information may be produced by printing information on, or within the synthetic layers attached to the metal layer. The intended cardholder data 402 may also be lasered into a protective cover layer (hard coat layer) laminated to the card body. The hologram may be hot-stamped to the hard-coat layer. Compare FIG. 5 of U.S. Pat. No. 10,373,920.

[0369] FIG. 5 shows some steps in a method of forming a transaction card, commencing with a metal core comprising a metal layer 521 with a discontinuity 524 at a designated area 525. The metal layer may comprise stainless steel or any other conductive metals or alloys and/or a combination of these materials.

[0370] Step 1

[0371] The metal layer 521 is shown to have an upper (top, front) surface 521a and a lower, or bottom, surface 521b. For purpose of illustration, a diffraction pattern to be formed on, or above, surface 521a of layer 521 is shown. However, it should be understood that, alternatively, the diffraction pattern could be formed on surface 521b.

[0372] Step 2

[0373] The upper surface 521a of layer 521 may be embossed or debossed with a diffractive or holographic pattern using a laser etching technique. The pattern is prepared around the designated area 525 in preparation for camouflaging or covering the discontinuity 524.

[0374] Step 3

[0375] A layer 522 of aluminum (or any suitable metal, metal oxide or metal compound such as Zinc Sulfide) may then be vapor deposited or grown on the diffraction pattern to form a hologram, which may also be referred to as a security layer.

[0376] The use of vapor deposition is significant in that it permits a very thin layer 522, which may be only a few atoms thick, to be formed on front surface 521a and thus complete the formation of the hologram, using small amounts of metal. Using vapor deposition, the thickness of the layer can be made very thin so that it is nearly transparent and can provide a “see-through” effect. Alternatively, the metal layer can be made a little thicker so as to be more opaque.

[0377] The very thin layer 522 of metal deposited or grown around the designated area may have a thickness which is electromagnetically transparent to the ISM frequency of 13.56 MHz.

[0378] The security feature or layer may be “buried” within the structure of the card, to prevent tampering or alteration. Subsequent layers covering the security feature may be transparent (or have openings/windows) in selected areas so that the security feature is visible from the exterior of the card.

[0379] The security layer, with or without a carrier layer, may be mounted or assembled directly to a designated area on the metal layer by means of hot stamping, spot or laser welding. ??

[0380] Step 4

[0381] A clear adhesive primer layer 523a, may be coated over the patterned and metallized top surface (521a) and a similar clear adhesive primer layer 523b may be coated over the bottom surface (521b) of the layer 521. The core 520 is completed by attaching these clear adhering layers (523a, 523b) above and below the embossed or debossed metal layer 521. The primer coatings 523a, 523b are fairly thin and yet fairly strong and sturdy. They also function to promote adhesion to other synthetic layers which are attached to the core 520.

[0382] By forming the hologram at, and within, the core level, the hologram will not be easily, or inadvertently, damaged since several additional layers will be attached to the top and bottom of the holographic layer.

[0383] By forming the hologram at, and within, the core level, the hologram is also not subject to easily being tampered or altered. Forming the hologram at the center of the card structure minimizes the possibility of tampering while fully protecting the hologram.

[0384] Another significant advantage of forming the hologram at the core of the structure is that the top and bottom surfaces stay flat due to equal shrinking and/or expansion of all the layers.

[0385] Note that the card structure may be formed so as to be symmetrical about the core layer—in other words, having similar layers both above and below the core.

[0386] Alternatively, a hologram or security layer may be formed by, for example, embossing or debossing a pattern in a carrier base material (e.g., a hard polyester) or by embossing or debossing the pattern in a coating previously applied to the carrier base material, or by embossing or debossing the pattern in a metal which was previously deposited onto the base carrier material or by depositing the metal onto a soft coating and then embossing or debossing.

[0387] In the case of a security layer in which the pattern is embossed or debossed in a metal foil on a carrier material, the metal foil may be electromagnetic transparent, and may be assembled directly to the metal layer 521 by means of hot stamping, spot or laser welding. The metal foil may further camouflage or cover the discontinuity 524 at the designated area 525.

[0388] FIG. 6A shows a metal transaction card with a recess to accommodate a carbon fiber layer camouflaging a slit in a metal layer or in a metal card body.

[0389] FIG. 6B shows a metal transaction card with a recess to accommodate a carbon fiber layer with an opening for an inductive coupling chip module (ICM), with the carbon fiber camouflaging the slit in the metal layer or in the metal card body.

[0390] FIG. 7A shows a card embodying the invention showing a metal foil being applied to a transaction card.

[0391] FIG. 7B shows a card embodying the invention showing a metal foil with a slit for texturing the surface of a metal card body (MCB) and the production steps in applying the foil to the card body.

[0392] A textured conductive foil may be applied to the outer surface of a metal transaction card, with its surface acting as an antenna or coupling frame to drive a transponder chip module. Said textured conductive foil may be further laser etched to create additional decorative designs or security features.

[0393] The metal foil is located across the center of the card body with the module antenna overlapping a section of the metal foil. The metal foil may or may not have a slit to function as a coupling frame.

[0394] The metal foil may adhere to cured screen-printed UV varnish applied to the card body or to an array of card body sites (inlay), and depending upon the design, can achieve flat, tactile or 3D effects.

[0395] The design of the coupling frame antenna is integrated into the decorative areas, and all the details from the screen are printed with a UV varnish and covered by the foil.

[0396] The metal foil (in any color) may have an adhesive backing which is attached to the UV screen printed varnish, and because of surface tension, the foil only breaks-off (or releases) from the non-UV varnish screen printed areas, leaving the foil attached to the UV varnish creating the embossed effect. Alternatively, to an adhesive backing on the foil, an intermediate adhesive layer can be applied.

[0397] A laser may be used to create a slit, slot or notch in the metal foil so as to act as a coupling frame. A laser may be used to create a decorative design on the metal foil.

[0398] The screen-printed UV varnish may be applied directly to a front face metal layer (with slit), or the varnish may be applied to a synthetic layer laminated or attached to an underlying metal layer.

[0399] The metal foil may also be used to camouflage an underlying layer of metal having a slit to act as a coupling frame.

[0400] The metal foil on the outer surface of the transaction card body may also be used to regulate the system frequency of the transponder chip module coupled to a metal layer with slit within the card construction.

[0401] Patterned lamination plates may be used to create texture on a synthetic layer before the application of the UV varnish followed by the hot stamping of a metal foil layer thereon.

[0402] Metal layers in a transaction card may be provided with a decorative design using chemical etching techniques followed by laser etching to create color and to impart information on the card surface.

[0403] The exposed metal surface may be sand-blasted or highly polished and subsequently treated with a diamond-like-carbon or PVD coating.

[0404] A metal foil, holofoil or a holographic metal film (hot stamped, laminated, or pre-applied on a synthetic substrate to a card body or to an array of card bodies) may be provided with a discontinuity in the form of a slit to act as a coupling frame in order to facilitate contactless communication. The foil may be a decorative foil mounted to a card body containing a metal layer with a slit.

[0405] As a further embodiment of the invention, the decorative foil, textured foil or the holographic foil, applied to a metal layer or metal card body with a discontinuity, may not need a slit to function as a coupling frame, but rather the module antenna of the transponder chip module may only need to be partially surrounded by the foil, and not all 4 sides.

[0406] 3D Printing of Coupling Frames and Electronic Components

[0407] Dual-material fused filament fabrication (3D printing) of conductive surfaces on a metal card body using conductive thermoplastic metal based filaments is an alternative technique to the use of metal foil stamping in producing a coupling frame. Dual material 3D printing may also be used to fabricate a discrete component such as an inductor, capacitor or a resistor on a surface forming part of a transaction card. Surface mounted components may be placed and connected to 3D printed structures or traces to enhance performance

[0408] As an alternative to chemical etching of metal, a metal card body with intricate recess structures may be 3D printed.

[0409] FIG. 8A shows the following exemplary stack-up of layers for a card 820 (a metal core layer sandwiched between two layers of carbon fiber), from a front surface (side) of the card to a rear surface (side) of the card:

a front carbon (or composite) fiber layer 810f
a rear carbon (or composite) fiber layer 810r
a metal layer with slit 850 sandwiched between the two fiber layers 810f/810r

[0410] FIG. 8A shows an example of a metal transaction card 820 comprising: a metal core layer 850 sandwiched between two layers of carbon fiber structure 810f and 810r. Compare FIG. 3 of U.S. Pat. No. 9,646,234

[0411] The metal core layer 850 may have a slit (S, not shown) to function as a coupling frame. (A slit in one of two metal layers 1050f and 1050r is shown in FIG. 10.)

[0412] For a detailed discussion of metal layers having slits to function as coupling frames, reference may be made to U.S. Pat. Nos. 9,475,086 and 9,798,968, incorporated by reference herein. Coupling frames may also have module openings for accepting a transponder chip module (TCM, not shown), which has at least contactless capability, and which may also have contact pads for a contact interface.

[0413] FIG. 8B is directed to a smartcard 820 comprising: [0414] a metal layer 850 having two sides (surfaces) and a slit and a module opening to function as a coupling frame; [0415] a first composite layer 810r (or 810f) of fibrous material disposed on one side of the first metal layer; and [0416] a second composite layer 810f (or 810r) of fibrous material disposed on the other side of the first metal layer, thereby sandwiching the metal layer between the two composite layers.

[0417] Stated otherwise, a method of making a metal transaction card, may comprise: [0418] providing a metal core layer 850 with a slit and module opening acting as a coupling frame; and [0419] enclosing the metal core layer at least in part on each side by a composite layers 810f and 810r of fibrous material to form a card core.

[0420] An over-laminate film may be disposed (laminated) onto each of two opposing faces of the resulting fiber/metal/fiber card core. At least one of the over-laminate films may comprise a transparent film which is laser engravable. Alternatively, hard coat film layer may be laminated on the opposing front and rear faces of the card core.

[0421] The composite layers of fibrous material illustrated in FIGS. 8 and 10 (below) may comprise: fiber strands or filaments selected from the group consisting of mineral fiber strands or filaments, glass fiber strands or filaments, metal fiber strands or filaments, and polymer fiber strands and filaments in a certain pattern.

[0422] FIG. 9 shows an example of a metal transaction card 920 comprising: [0423] a metal core layer 950 with slit (not shown) to function as a coupling frame sandwiched between two layers of carbon fiber structure 910f and 910r, laminated together using adhesive layers 916f and 916r.

[0424] Optionally, a hard coat layer 970 or a laser engravable overlay layer may be disposed on the front carbon fiber layer 910f.

[0425] In FIG. 9, the element 940 represents the operation of laser treating the scratch protective coating, protective layer, a laser engravable overlay layer, or any laser reactive layer.

[0426] The outer (external) surfaces of the carbon fiber structures 910f and 910r can be printed with various text, graphics, logos, account numbers, and the like, and a thin layer over-laminate of clear plastic (overlay), such as PVC plastic film, can be applied to the outer surface. The overlay can be laser engraved with card holder credentials.

[0427] FIG. 10 shows a card 1020 having a carbon fiber structure (layer) 1010 sandwiched between two metal layers 1050f and 1050r. The metal layers may each have slits (s), which are visible in the front and rear metal layers 1050, so that the metal layers may function as coupling frames (as discussed hereinbefore).

[0428] FIG. 10 shows a smartcard 1020 comprising: [0429] a first metal layer 1050f having two sides (surfaces) and a slit to function as a coupling frame; [0430] a second metal layer having two sides (surfaces) and a slit to function as a coupling frame disposed on another side of the composite layer; and [0431] a composite layer 1010 of fibrous material sandwiched between the two metal layers.

[0432] FIG. 10 is illustrative of a method of making an RFID-enabled metal transaction card 1020, comprising: [0433] providing a composite layer 1010 of fibrous material arranged in a certain pattern; and [0434] enclosing the composite layer of fibrous material at least in part on both sides by metal layers 1050f and 1050r having slits to function as coupling frames; [0435] wherein the resulting sandwich structure of metal-composite-metal forms a card core.

[0436] In either of the FIG. 8 or FIG. 10 embodiments, some of the following steps may be performed (creating resulting structures) as may be applicable to the particular embodiment:

FIG. 10: the composite layer 1010 of fibrous material may be enclosed, at least in part, on each side by an adhesive film (not shown) comprising a material selected from the group consisting of polyethylene, acrylic, cyanoacrylate, and epoxy.
FIG. 10: printing on at least one of the two opposing faces of the transaction card core—i.e., on the outer, exposed surfaces of the front and back metal layers 1050f and 1050r.

[0437] It should be noted that it is not practical to print directly on the carbon fiber. Rather, the printing may be performed on a laminate or hard coat applied thereto

[0438] Although not shown, over-laminate films may be laminated to the front and back opposing faces of the resulting card core. The over-laminate films may comprise a transparent film which is laser engravable. Alternatively, a hard coat film layer may be laminated on each of opposing faces of the card core. The surface properties of the hard coat film layer may have a surface energy which is receptive to over printing and hot-stamping of a payment scheme hologram.

[0439] As an embodiment of the invention, transparent inks, varnishes and polymer coatings are applied to raw, coated/uncoated, and or ink printed metal inlays, with the films or layers of ink, varnish or polymer intended to act as a protective coating on the outer surface of a metal card body, to exhibit good abrasion, chemical resistance and scratch resistance properties. The protective coating may be laser marked or laser engraved depending on its material composition.

[0440] The laser type may be a nanosecond, picosecond or femtosecond laser firing pulses to mark or ablate a surface at wavelengths between ultraviolet (UV), visible and infrared (IR). The pulse duration may be variable and adjustable in steps. The surface of the marked or ablated coating should have well defined edges, with no carbonization (degradation) of the surface after laser treatment.

[0441] The print/coat system may be composed of coats of ink or paint, a topcoat (protective coating of ink, varnish or a polymer over the ink/paint layer) and a basecoat (primer) which have been applied sequentially on the metal inlay, with a laser beam ablating the topcoat to reveal the metal (laser engraving) to generate the characters or logos. Alternatively, the laser beam may just surface mark the topcoat with alphanumeric characters (laser personalization), with minimum material removal. Also thin film effects without material removal can be accomplished by the laser light, resulting in oxidation of the surface to form colorful patterns.

[0442] The protective coating composition may comprise of additives: a viscosity modifier, a cure accelerator (catalyst), colorants/pigments, adhesion promoters, energy transfer agents, surface tension modifying agents, crosslinking agents, plasticizers or a laser marking additive (particulates and or metallic powder) that change color under the action of the laser beam.

[0443] The opacity of the laser responsive coating may change substantially when exposed to laser irradiation which further depends on the underlying printed ink layer (pantone colors and shades), the baking cycle of the coating, and curing speed (depending on ink color, opacity, number of color components in blend and processing parameters).

[0444] The films of ink, varnish or polymer with a given thickness (multiple liquid layers) on a metal surface may exhibit different ablation etch rates of the corresponding coating material under the same irradiation conditions.

[0445] Laser marking or laser engraving of metal cards is typically performed using a 20-watt fiber laser working in the infrared range of 1064 nm with laser pulse durations in nanoseconds, but depending on the coating composition, other wavelengths and pulse durations at a given laser beam intensity may provide the best results in terms of surface morphology.

[0446] FIG. 11 is a simplified cross-sectional diagram of a “hybrid” metal card assembly for [0447] manufacturing a metal transaction card that can be personalized on the front and rear surfaces using a laser beam, according to the invention.

[0448] An exemplary stack-up of the card 1100 is illustrated (from front-to-rear), comprising: [0449] 1104 hard coat and or protective coating (ink, varnish or a polymer coating) [0450] 1108 ink (flexible ink)

[0451] The hard coat layer and or the protective coating undergoes (may receive) laser treatment 1140 to personalize the card.

[0452] Metal Inlay (2 layers of 8 mils metal with slits separated by a dielectric layer) 18 mils [0453] 1115a metal layer [0454] 1117 dielectric [0455] 1115b metal layer [0456] * the metal layers 1115a, 1115b may have slits (S) to function as coupling frames (CF) [0457] 1118 adhesive [0458] 1120 clear PVC [0459] 1122 primer [0460] 1124 ink (printed information (PI)) [0461] 1126 clear PVC [0462] 1140 represents information inscribed into and onto the clear PVC 1126 [0463] 1128 magnetic stripe

[0464] Metal cards are often desired to have a single color scheme rather than having busy graphics which require specialized printing. The metal cards can be digitally printed using UV inks and protected by a hard coat as proposed below.

[0465] The protective coating may be replaced by a powder coating. A 3D effect may be produced in the protective coating.

[0466] FIG. 12 depicts a metal face transaction card having an exposed metal surface with a flat color or a color with a grain structure which has been baked on at an elevated temperature (˜400° F.). The hard coat protects the underlying color coated metal layer which can be laser etched to personalize the transaction card. The slit in the metal layer is partially disguised by the baked-on ink. The surface can be mechanically engraved to create a payment scheme logo. The stack-up construction comprises: [0467] Hard coat layer and or protective coating (ink, varnish or a polymer coating) [0468] Metal layer with baked-on-ink having a slit for contactless communication [0469] Adhesive Layer [0470] Print Layer with a matching color to the metal layer [0471] Overlay layer with magnetic stripe which is laser engravable

[0472] An exemplary stack-up of the card 1200 is illustrated (from front-to-rear): [0473] 1204 hard coat and or protective coating (ink, varnish or a polymer coating) [0474] The hard coat layer and or the protective coating undergoes laser treatment 1140 to personalize the card. [0475] 1209 baked on ink layer (primer, ink, protective coating (polyurethane, a blend of polyester and polyurethane, acrylic or epoxy)) [0476] Metal Inlay (2 layers of metal (12 mils and 6 mils) with slits (fish hook shape) separated by a dielectric layer) 20.5 mils [0477] 1215a metal layer [0478] 1217 dielectric [0479] 1215b metal layer [0480] * the metal layers 1215a, 1215b may have slits (S) to function as coupling frames (CF) [0481] 1218 adhesive [0482] 1220 clear PVC [0483] 1222 primer [0484] 1224 ink (printed information (PI)) [0485] 1226 clear PVC [0486] 1228 magnetic stripe

[0487] Protective Coatings and Laser Treatment (Thin Film Effects, Laser Marking and Laser Engraving)

[0488] Anti-scratch protective coatings which protect an underlying print layer require laser treatment to create special thin film effects, laser markings for personalization, and laser engraving for etching features into the surfaces of a metal card such as a payment scheme logo. The material composition of the laser responsive coatings plays a crucial role in the marking and ablation processes, but equally the correct selection of the laser source in terms of fluence, wavelength, pulse duration, repetition rate and the application of gas is very important. The metal surface is typically covered with one or more layers of a protective polymer coating such as a urethane, polyester, or an acrylic base coating. The protective polymers may also be a blend of polyurethane and polyester. The gloss level (low or high) depends on the quality and smoothness of the metal surface, the color of the underlying ink or paint, the thickness and type of coatings applied and the use of any dulling agents. Transparent varnishes and inks may also be used as the protective coating.

[0489] Application in Metal Cards

[0490] Transparent inks, varnishes and polymer coatings are applied to raw, coated/uncoated, and or ink printed metal inlays, with the films or layers of ink, varnish or polymer intended to act as a protective coating on the outer surface of a metal card body, to exhibit good abrasion, chemical resistance and scratch resistance properties. The protective coating may be laser marked or laser engraved depending on its material composition.

[0491] The laser type may be a continuous wave (CW), nanosecond, picosecond or femtosecond laser firing pulses to mark or ablate a surface at wavelengths between ultraviolet (UV), visible and infrared (IR). The pulse duration may be variable and adjustable in steps. The surface of the marked or ablated coating should have well defined edges, with no carbonization (degradation), minimal heat affected zone (HAZ), delamination of the surface after laser treatment.

[0492] The print/coat system may be composed of coats of ink or paint, a topcoat (protective coating of ink, varnish or a polymer over the ink/paint layer) and a basecoat (primer) which have been applied sequentially on the metal inlay, with a laser beam ablating the topcoat to reveal the metal (laser engraving) to generate the characters or logos. Alternatively, the laser beam may just surface mark the topcoat with alphanumeric characters (laser personalization), with minimum material removal. Also, thin film effects without material removal can be accomplished by the laser light, resulting in oxidation of the surface to form colorful patterns.

[0493] The protective coating composition may comprise of additives: a viscosity modifier, a cure accelerator (catalyst), colorants/pigments, adhesion promoters, energy transfer agents, surface tension modifying agents, crosslinking agents, plasticizers or a laser marking additive (particulates and or metallic powder) that change color under the action of the laser beam.

[0494] The opacity of the laser responsive coating may change substantially when exposed to laser irradiation which further depends on the underlying printed ink layer (pantone colors and shades), the baking cycle of the coating, and curing speed (depending on ink color, opacity, number of color components in blend and processing parameters).

[0495] The films of ink, varnish or polymer with a given thickness (multiple liquid layers) on a metal surface may exhibit different ablation etch rates of the corresponding coating material under the same irradiation conditions.

[0496] Laser marking or laser engraving of metal cards is typically performed using a 20-watt fiber laser working in the infrared range of 1064 nm with laser pulse durations in nanoseconds (in the range from 20 to 200 ns), but depending on the coating composition, other wavelengths and pulse durations at a given laser beam intensity may provide the best results in terms of surface morphology.

[0497] While the invention(s) may have been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the invention(s), but rather as examples of some of the embodiments of the invention(s). Those skilled in the art may envision other possible variations, modifications, and implementations that are also within the scope of the invention(s), and claims, based on the disclosure(s) set forth herein.