Structure stamp, device and method for embossing

Abstract

A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.

Claims

1. A structure stamp, comprising: a flexible stamp having a microstructured or nanostructured stamp surface that is configured to emboss an embossing structure corresponding to the stamp surface on an embossing surface; a frame configured to clamp the flexible stamp; and an embossing element configured to apply a line force to the flexible stamp to expand the flexible stamp toward the embossing surface beyond a surface plane E, the surface plane E being defined by a top surface of the frame.

2. The structure stamp as claimed in claim 1, wherein at least two opposing clamping sides of the frame clamp the flexible stamp.

3. The structure stamp as claimed in claim 1, where at least two opposing clamping sides of the frame are spring-loaded with springs to clamp the flexible stamp.

4. The structure stamp as claimed in claim 1, wherein at least two opposing clamping sides of the frame clamp the flexible stamp with two clamping strips located on the two opposing clamping sides.

5. The structure stamp as claimed in claim 1, wherein the flexible stamp is formed from a carrier.

6. The structure stamp as claimed in claim 1, wherein the flexible stamp is formed from an elastomeric stamp layer that is hot-embossed or molded onto a carrier.

7. The structure stamp as claimed in claim 1, further comprising: a retaining frame that accommodates the frame on a side thereof that faces away from the stamp surface.

8. The structure stamp as claimed in claim 1, wherein the embossing element is guided along the frame.

9. The structure stamp as claimed in claim 7, wherein the embossing element is guided between the retaining frame and the frame.

10. The structure stamp as claimed in claim 2, wherein the embossing element is guided parallel to the two opposite clamping sides such that the embossing element can be guided along the flexible stamp, the flexible stamp being configured to apply an embossing force.

11. A structure stamp, comprising: a flexible stamp having a microstructured or nanostructured stamp surface that is configured to emboss an embossing structure corresponding to the stamp surface on an embossing surface; a frame configured to clamp the flexible stamp, the frame having two guide strips that run opposite to one another; and an embossing element configured to apply a line force to the flexible stamp to expand the flexible stamp toward the embossing surface beyond a surface plane E, the surface plane being defined by the guide strips.

12. The structure stamp as claimed in claim 11, wherein the guide strips are configured to guide the embossing element along one exposure side of the flexible stamp.

13. The structure stamp as claimed in claim 12, wherein the two guide strips run parallel to one another.

14. The structure stamp as claimed in claim 12, wherein the embossing element is an embossing roll.

15. The structure stamp as claimed in claim 12, wherein the one exposure side is located along one side of the flexible stamp facing away from the stamp surface.

16. A device for embossing an embossing pattern on an embossing surface, comprising: a structure stamp, comprising: a flexible stamp having a microstructured or nanostructured stamp surface that is configured to emboss an embossing structure corresponding to the stamp surface on the embossing surface; a frame configured to clamp the flexible stamp; and an embossing element configured to apply a line force to the flexible stamp to expand the flexible stamp toward the embossing surface beyond a surface plane E, the surface plane E being defined by a top surface of the frame; a stamp receiver configured to accommodate and move the structure stamp; and an embossing element drive configured to move the embossing element along the structure stamp.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a schematic cross sectional view of a first embodiment of this invention, and a first method step of alignment of a structure stamp relative to an embossing material which has been applied to a substrate, i.e., a first process step,

(2) FIG. 2 shows a schematic cross sectional view of a second method step of causing the structure stamp to approach the embossing material to be embossed, i.e., the second method step,

(3) FIG. 3 shows a schematic cross sectional view of a third method step of applying the embossing element to the structure stamp (start of embossing),

(4) FIG. 4 shows a schematic view of the method step according to FIG. 3 at the end of embossing,

(5) FIG. 5 shows a schematic cross sectional view of a second embodiment of the method,

(6) FIG. 6 shows a schematic perspective view of the structure stamp,

(7) FIG. 7 shows a schematic, enlarged perspective view of a cross sectional element A-A of the structure stamp

(8) FIG. 8 shows a schematic perspective view of the structure stamp in a retaining frame, with installed embossing element and guide strips.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(9) In the figures, advantages and features of the invention are labeled with the reference numbers which identify them according to embodiments of the invention, components or features with the same function or function with the same effect being labeled with identical reference numbers.

(10) In the figures, the features in FIGS. 1 to 5 are not shown to scale, in order to be able to represent the operation of the individual features at all. The ratios of the individual components are in part also disproportionate; this can be attributed especially to nanostructures 2e which are shown highly enlarged. The nanostructures 2e, which are embossed with this invention or which are used for embossing of corresponding nanostructures onto workpieces, are in the nanometer and/or micron range, while the magnitude of the size of the machine components is in the centimeter range.

(11) The dimensions of the individual nanostructures 2e of the embossing pattern 2 are preferably in the micron range and/or nanometer range. The dimensions of the individual nanostructures 2e are smaller than 1000 μm, preferably smaller than 10 μm, more preferably smaller than 100 nm, still more preferably smaller than 10 nm, most preferably smaller than 1 nm.

(12) In the first embodiment shown in FIGS. 1 to 4 and 6, a structure stamp 5 is shown which is comprised of a frame 3 and a stamp 1 clamped into the frame 3.

(13) The stamp 1 has a microstructured or nanostructured stamp surface 2 with nanostructures 2e (elevations) which project from the carrier side 2o of the stamp 1.

(14) One exposure side 2u which is opposite the stamp surface 2 is made flat so that exposure of the stamp 1 as homogeneous as possible on the exposure side 2u is enabled.

(15) An embossing element 8 is used for exposure, here in the form of an embossing roll which is lowered onto the exposure side 2u after alignment of the structure stamp 5 relative to an embossing material 6 which has been applied to a substrate 7 (see FIG. 1) and subsequently causing the structure stamp 5 to approach an embossing surface 6o of the embossing material 6.

(16) The frame 3 on two opposing clamping sides 10, 10′ has at least one pair of opposing clamping strips 4, 4′ into which the stamp 1 is clamped. The clamping strips 4, 4′ can be attached to the frame 3 rigidly or via a spring system 13 (see FIGS. 6 and 7). The use of a spring system 13 as a coupling between at least one of the clamping strips 4, 4′ and the frame 3 is used to increase the flexibility of the stamp 1 when stressed by the embossing element 8.

(17) A spring system 13 is comprised of at least two, preferably of more than five, more preferably of more than ten, most preferably of more than 20 springs 12.

(18) The two clamping sides 10, 10′ are connected by two guide strips 9, 9′ which run oppositely, parallel to one another, the guide strips 9, 9′ not coming into contact with the stamp film 1. The stamp film 1 runs preferably within and between the guide strips 9, 9′.

(19) The exposure side 2u is exposed to the embossing element 8 simultaneously with making contact or immersing the nanostructures 2e into the embossing material 6 (see FIG. 3), the structure stamp 5 approaching the embossing element 6 according to FIG. 2 parallel (optionally with minimum angling (wedge faults) of the stamp 1 or structure stamp 5). The nanostructures 2e dip (i.e., is embedded) into the embossing material 6 which is comprised of a low viscosity material and while the structure stamp 5 is approaching the embossing material 6, an embossing force is transferred to the exposure side 2u by the embossing element 8, as the stamp 1 is made parallel to the embossing material 6. In doing so, the stamp 1 deforms in the direction of the embossing material beyond a surface plane E which is defined by the frame 3, i.e., by the guide strips 9, 9′.

(20) A slightly angled approach of the structure stamp 5 to the surface of the embossing material 6 first on one of the two clamping sides 4, 4′ is also conceivable so that the nanostructures 2e are gradually immersed.

(21) The embossing element 8 as the stamp 1 approaches (and optionally as the stamp 1 is made parallel) the embossing material 6, especially caused primarily by the embossing force of the embossing element 8, is moved from the first clamping side 4 to the second clamping side 4′ located opposite, parallel to the surface of the embossing material 6.

(22) After reaching the position as shown in FIG. 4, the stamp surface 2 is immersed completely in the embossing material 6 and imaged accordingly there.

(23) Then, the embossing material 6 is cured, and after curing of the embossing material 6, the structure stamp 5 can be raised. The curing can take place by all known methods from the front or back, for example, by UV radiation, by chemicals or by heat, and by a combination of the indicated methods.

(24) Alternatively, as described above, during embossing at a defined separation distance and illumination from the opposite side, with corresponding embossing element force (and optionally tension spring adjustment) it can lead to direct separation after contact with the embossing element and illumination.

(25) The use of an embossing roll as the embossing element 8 entails the advantage of a rolling motion and pressure application with the embossing force; this leads to minimization of shearing forces on the stamp 1. Furthermore, complicated wedge fault compensation can be largely omitted which would be essential if the stamp process were to be carried out by a normal movement of the stamp and of the embossing material to one another.

(26) According to the other embodiment, which is shown in FIG. 5, the application of pressure with the embossing element 8 takes place from the opposite side, therefore from the back 6u of the embossing material 6′, a corresponding opposing force also acting here, by holding of the frame 3. The embossing material 6′ in this case would be suited for pressure transfer itself or optionally supported by a substrate 7, as is shown in the embodiment according to FIGS. 1 to 4. The illustrated embossing material 6′ can be, for example, a stable but embossable film.

(27) The embossing element 8 can also be made such that contactless power transfer takes place especially by a gas flow from a line-shaped nozzle or several point nozzles located along a line.

(28) FIG. 7 shows that the fixing of the stamp 1 on the clamping strips 4, 4′ takes place by clamping the stamp 1 between two flat profiles 14, 15. The clamping force necessary for clamping is produced by fixing means 16 (here: screws).

REFERENCE NUMBER LIST

(29) 1 stamp 2 stamp surface 2e nanostructures 2o embossing side 2u exposure side 3 frame 4, 4′ clamping strips 5 structure stamp 6, 6′ embossing material 6o embossing surface 6u back 7 substrate 8 embossing element 9, 9′ guide strips 10, 10′ clamping sides 11 retaining frame 12 spring 13 spring system 14 flat profile 15 flat profile 16 fixing means E surface plane