Assembly process for circuit carrier and circuit carrier

Abstract

The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

Claims

1. A process for the production of a circuit carrier having at least one light emitting diode, the circuit carrier for use in a motor vehicle, the process comprising: illuminating a light emitting region of a light emitting diode with light from a light source that is separated from the light emitting diode, the light having a wavelength in a range of 400 nm to 500 nm; detecting a position of the light emitting region of the light emitting diode while illuminating the light emitting region of the light diode with the light from the light source that is separated from the light emitting diode; positioning the light emitting diode in relationship to one or more reference points of the circuit carrier based at least in part on the position of the light emitting region.

2. The process of claim 1, wherein the process further comprises mounting the light emitting diode to the circuit carrier.

3. The process of claim 1, wherein detecting a position of the light emitting region comprises detecting a contour of the light emitting region using an optical camera.

4. The process of claim 1, wherein the one or more reference points comprise a hole in the circuit carrier.

5. The process of claim 4, wherein the one or more references points comprise a mounting hole.

6. The process of claim 1, wherein the light has a wavelength in a range of 420 nm to 490 nm.

7. The process of claim 1, wherein detecting a position of the light emitting region of the light emitting diode comprises detecting the position in three-dimensions.

8. The process of claim 1, wherein detecting a position of the light emitting region of the light emitting diode comprises determining an angular position relative to an axis of rotation at a right angle to a plane of light emitting diode.

9. The process of claim 2, wherein mounting the light emitting diode to the circuit carrier comprises: applying solder paste to the circuit carrier; applying an adhesive to the circuit carrier; partially hardening the adhesive; reflow soldering the solder paste.

10. A circuit carrier for use in a motor vehicle, the circuit carrier manufactured according to the process of claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.

(2) FIG. 2 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.

(3) FIG. 3 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.

(4) FIG. 4a shows a process according to the invention.

(5) FIG. 4b shows a process according to the invention.

(6) FIG. 4c shows a process according to the invention.

DETAILED DESCRIPTION

(7) FIGS. 1 to 3 show test layouts which serve to check the positional accuracy of each individual SMD-LED 2. The circuit carrier 1 has electrically conductive surfaces 5 which are insulated from each other by insulating regions 6. The conductive surfaces 5 can be supplied with electric power by way of terminals 7. FIG. 1 shows a circuit carrier 1 equipped with six SMD-LEDs 2. It is possible to see two reference points 3 which on the one hand serve to ascertain the deviation of the target positions for the SMD-LEDs 2 on the circuit carrier 1 and which on the other hand can also be used for fixing an optical system (not shown) for the SMD-LEDs 2. The optical system is oriented by way of separate reference points which are not shown in this Figure.

(8) In FIG. 1 the mounting operation was effected with a “Pick & Place” and Reflow soldering process in accordance with the state of the art. In themselves the SMD-LEDs 2 are oriented by means of their outside contours relative to the reference points 3. The Reflow soldering process involves blurring of the position of the SMD-LEDs 2 so that the situation no longer involves an ordered orientation of the outside contours of the SMD-LEDs 2. Orientation in relation to the light-emitting regions 4 of the SMD-LEDs 2 has not occurred at all.

(9) FIG. 2 shows a circuit carrier 1 equipped with six SMD-LEDs 2, the difference in relation to FIG. 1 being that the SMD-LEDs 2 are mounted on the circuit carrier 1 in the correct position in relation to the outside contour, but no mounting is effected in dependence on the light-emitting regions 4 of the SMD-LEDs 2. This circuit carrier 1 also does not meet the requirements in regard to positioning accuracy of the light-emitting regions 4.

(10) FIG. 3 in contrast shows an embodiment by way of example of the invention in which the SMD-LEDs 2 are mounted in the correct position relative to the reference points 3 of the circuit carrier 1, on the circuit carrier 1, in regard to their light-emitting regions 4. This circuit carrier 1 meets the requirements in regard to positioning accuracy of the light-emitting regions 4.

(11) FIGS. 4a, 4b and 4c show a process according to the invention including the steps: ascertaining the deviation in relation to the target position in the X-direction and the Y-direction of the reference point 3 i for all reference points 3 i (FIG. 4a), ascertaining the deviation in relation to the target position in the X,Y-direction and an angular position of the light-emitting region 4 of the SMD-LED 2 to be removed and in the Z-direction of the SMD-LED 2 to be removed (FIG. 4b), and mounting of the SMD-LED 2 to the circuit carrier 1 in the correct position relative to the reference points 3 i of the circuit carrier 1 (FIG. 4c).