PRESSURE SENSOR

Abstract

A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2). This reduces the pressure receiving area of a pressure guiding passage that guides a pressure (P1) of a measured fluid to a first surface (24-1a) of a sensor diaphragm (24-1), suppresses force applied in the direction of separating the joint between the sensor chip (24) and the base body (21-1), and makes it possible to use a soft adhesive.

Claims

1. A pressure sensor comprising: a sensor chip including a sensor diaphragm configured to output a signal corresponding to a difference between pressures received by a first surface and a second surface of the sensor diaphragm, a first retaining member joined to the first surface of the sensor diaphragm, and a second retaining member joined to the second surface of the sensor diaphragm, wherein the first retaining member has a first recessed portion formed in an end surface thereof joined to the first surface of the sensor diaphragm and a first pressure guiding hole open into the first recessed portion to guide a pressure of a measured fluid to the first surface of the sensor diaphragm, and the second retaining member has a second recessed portion formed in an end surface thereof joined to the second surface of the sensor diaphragm and a second pressure guiding hole open into the second recessed portion to allow the second surface of the sensor diaphragm to be open to the atmosphere; a body to which the sensor chip is joined, the body having a pressure guiding passage configured to guide the pressure of the measured fluid to the first pressure guiding hole in the first retaining member; and a narrow tube having an inside diameter smaller than an inside diameter of the first pressure guiding hole in the first retaining member, passed through the pressure guiding passage in the body, and inserted and secured in the first pressure guiding hole in the first retaining member in such a manner as to guide the pressure of the measured fluid to the first surface of the sensor diaphragm.

2. The pressure sensor according to claim 1, wherein the sensor chip is joined to the body with an adhesive layer interposed therebetween; and the adhesive layer is a layer of an adhesive having a Young's modulus lower than a Young's modulus of a material forming the sensor diaphragm.

3. The pressure sensor according to claim 1, wherein the narrow tube is joined, at a first end thereof located in the first pressure guiding hole in the first retaining member, to an inner wall surface of the first pressure guiding hole with an adhesive having a Young's modulus higher than a Young's modulus of an adhesive layer between the sensor chip and the body; and is joined, at a second end thereof passing through the pressure guiding passage in the body, to an inlet of the pressure guiding passage in the body by welding or with an adhesive having the same Young's modulus as the first end.

4. A pressure sensor comprising: a sensor chip including a sensor diaphragm configured to output a signal corresponding to a difference between pressures received by a first surface and a second surface of the sensor diaphragm, a first retaining member joined to the first surface of the sensor diaphragm, and a second retaining member joined to the second surface of the sensor diaphragm, wherein the first retaining member has a first recessed portion formed in an end surface thereof joined to the first surface of the sensor diaphragm and a first pressure guiding hole open into the first recessed portion to guide a pressure of a first measured fluid to the first surface of the sensor diaphragm, and the second retaining member has a second recessed portion formed in an end surface thereof joined to the second surface of the sensor diaphragm and a second pressure guiding hole open into the second recessed portion to guide a pressure of a second measured fluid to the second surface of the sensor diaphragm; a body to which the sensor chip is joined, the body having a first pressure guiding passage configured to guide the pressure of the first measured fluid to the first pressure guiding hole in the first retaining member and a second pressure guiding passage configured to guide the pressure of the second measured fluid to the second pressure guiding hole in the second retaining member; a first narrow tube having an inside diameter smaller than an inside diameter of the first pressure guiding hole in the first retaining member, passed through the first pressure guiding passage in the body, and inserted and secured in the first pressure guiding hole in the first retaining member in such a manner as to guide the pressure of the first measured fluid to the first surface of the sensor diaphragm; and a second narrow tube having an inside diameter smaller than an inside diameter of the second pressure guiding hole in the second retaining member, passed through the second pressure guiding passage in the body, and inserted and secured in the second pressure guiding hole in the second retaining member in such a manner as to guide the pressure of the second measured fluid to the second surface of the sensor diaphragm.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0030] FIG. 1 is a cross-sectional view illustrating a configuration of a main part of a pressure sensor according to an embodiment of the present invention.

[0031] FIG. 2 is a plan view of a relay terminal provided with electrode pins (i.e., a connecting member for connection to wires extending from a sensor diaphragm) in the pressure sensor.

[0032] FIG. 3 is a plan view illustrating an example where a substrate having a circuit formed thereon serves as a connecting member for connection to the wires extending from the sensor diaphragm.

[0033] FIG. 4 illustrates an example where a sensor chip has a stepped structure in which the area of a first retaining member (lower retaining member) is smaller than the area of a second retaining member (upper retaining member).

[0034] FIG. 5 illustrates an example without a cover body.

[0035] FIG. 6 illustrates an example where pressure guiding passages on both sides of the sensor diaphragm are provided with narrow tubes.

[0036] FIG. 7 is a cross-sectional view illustrating a configuration of a main part of a conventional pressure sensor.

[0037] FIG. 8 is a cross-sectional view illustrating a configuration of a main part of a pressure sensor considered by the applicant in the process leading to the present invention.

[0038] FIG. 9 illustrates an example where a thermal stress reducing base is provided between the bottom surface of the sensor chip and the bottom surface of the sensor chamber.

DESCRIPTION OF EMBODIMENTS

[0039] Embodiments of the present invention will now be described in detail on the basis of the drawings. FIG. 1 illustrates a configuration of a main part of a pressure sensor according to an embodiment of the present invention.

[0040] In FIG. 1, reference numeral 21 denotes a body made of metal, reference numeral 22 denotes a pressure receiving diaphragm, reference numeral 23 denotes an enclosing chamber in the body 21, reference numeral 24 denotes a sensor chip, reference numeral 25 (25-1, 25-2) denotes an electrode pin, and reference numeral 26 denotes a relay terminal provided with the electrode pins 25 (25-1, 25-2).

[0041] In a pressure sensor 200 (200A), the body 21 is formed by a base body 21-1 and a cover body 21-2, and the base body 21-1 has an enclosing chamber 23 formed by a pressure receiving chamber 23-1 and a pressure guiding passage 23-2. The sensor chip 24 is in a sensor chamber 20 surrounded by the base body 21-1 and the cover body 21-2. The sensor chamber 20 is open to the atmosphere via through holes 21a, 21b, and 21c formed in the cover body 21-2.

[0042] The pressure receiving diaphragm 22 is secured by welding an outer edge thereof to the lower surface of the base body 21-1. The pressure receiving chamber 23-1 is formed on the back surface of the pressure receiving diaphragm 22, and the pressure guiding passage 23-2 is formed in the center of the pressure receiving chamber 23-1.

[0043] The sensor chip 24 is formed by a sensor diaphragm 24-1, and a first retaining member 24-2 and a second retaining member 24-3 joined to each other with the sensor diaphragm 24-1 interposed therebetween. The sensor diaphragm 24-1 is a sheet-like diaphragm made of, for example, silicon or glass and having a strain resistance gauge formed on a surface thereof. In FIG. 1, the surface of the sensor diaphragm 24-1 having the strain resistance gauge formed thereon is indicated by diagonal lines.

[0044] The retaining members 24-2 and 24-3 are also made of silicon, glass, or the like. The first retaining member 24-2 has a recessed portion 24-2a and a pressure introducing hole (pressure guiding hole) 24-2b communicating with the recessed portion 24-2a, and the second retaining member 24-3 has a recessed portion 24-3a and a pressure introducing hole (pressure guiding hole) 24-3b communicating with the recessed portion 24-3a. The recessed portion 24-2a of the first retaining member 24-2 has a flat bottom surface, whereas the recessed portion 24-3a of the second retaining member 24-3 has a curved (aspheric) bottom surface along displacement of the sensor diaphragm 24-1.

[0045] The first retaining member 24-2 is joined to one surface (first surface) 24-1a of the sensor diaphragm 24-1, with a surrounding region 24-2c of the recessed portion 24-2a facing the first surface 24-1a of the sensor diaphragm 24-1. The second retaining member 24-3 is joined to the other surface (second surface) 24-1b of the sensor diaphragm 24-1, with a surrounding region 24-3c of the recessed portion 24-3a facing the second surface 24-1b of the sensor diaphragm 24-1.

[0046] In the pressure sensor 200A, the sensor chip 24 is joined to a bottom surface 20a of the sensor chamber 20 (or an inner wall surface of the base body 21-1), with the first retaining member 24-2 positioned on the lower side thereof. That is, a lower surface 24a of the first retaining member 24-2 (i.e., the bottom surface 24a of the sensor chip 24) and the bottom surface 20a of the sensor chamber 20 are joined to each other, with a layer of an adhesive material (adhesive layer) 28 interposed therebetween.

[0047] In the present embodiment, the adhesive layer 28 is a layer of a soft adhesive having a Young's modulus lower than or equal to 1/1000 of the Young's modulus of a material forming the sensor diaphragm 24-1 (i.e., a layer of an adhesive with a low Young's modulus). In this example, the material forming the sensor diaphragm 24-1 is silicon, and the adhesive layer 28 is a layer of a cured fluorine adhesive.

[0048] The Young's modulus of silicon is 190 GPa, and the Young's modulus of cured fluorocarbon resin is 10 MPa. That is, the Young's modulus of cured fluorocarbon resin is about 1/19000 of the Young's modulus of silicon. The linear expansion coefficient of a fluorine (silicon) adhesive is several times that of an epoxy adhesive, and the Young's modulus of a cured fluorine (silicon) adhesive is 1/100 to 1/1000 of that of a cured epoxy adhesive. In other words, the linear expansion coefficient of an epoxy adhesive is a fraction of that of a fluorine (silicon) adhesive, and the Young's modulus of a cured epoxy adhesive is 100 to 1000 times that of a cured fluorine (silicon) adhesive. Hereinafter, the adhesive layer 28 will be referred to as a soft adhesive layer.

[0049] The bottom surface 24a of the sensor chip 24 is joined to the bottom surface 20a of the sensor chamber 20, with the pressure guiding passage 23-2 in the base body 21-1 coinciding with the pressure guiding hole 24-2b in the first retaining member 24-2 of the sensor chip 24. This allows the enclosing chamber 23 formed in the base body 21-1 by the pressure receiving chamber 23-1 and the pressure guiding passage 23-2 to communicate with the space (sensor portion) S1 formed by the recessed portion 24-2a and the pressure guiding hole 24-2b in the sensor chip 24.

[0050] With the bottom surface 24a of the sensor chip 24 joined to the bottom surface 20a of the sensor chamber 20, a narrow tube (very small diameter pipe) 31 made of stainless steel is passed through the pressure guiding passage 23-2 in the base body 21-1 and inserted and secured in the pressure guiding hole 24-2b in the first retaining member 24-2.

[0051] The narrow tube 31 has an inside diameter smaller than the inside diameter of the pressure guiding hole 24-2b in the first retaining member 24-2. The narrow tube 31 is joined, at one end (first end) thereof located in the pressure guiding hole 24-2b in the first retaining member 24-2, to the inner wall surface of the pressure guiding hole 24-2b with an adhesive (epoxy adhesive in this example) having a Young's modulus higher than the Young's modulus of the soft adhesive layer 28 between the sensor chip 24 and the base body 21-1. At the same time, the narrow tube 31 is joined, at the other end (second end) thereof passing through the pressure guiding passage 23-2 in the base body 24-1, to an inlet of the pressure guiding passage 23-2 in the base body 21-1 by welding or with an adhesive (epoxy adhesive in this example) having the same Young's modulus as the first end.

[0052] Thus, the pressure receiving chamber 23-1 on the back surface of the pressure receiving diaphragm 22 communicates through the narrow tube 31 with the recessed portion 24-2a of the first retaining member 24-2 of the sensor chip 24, and an enclosed liquid 27 is enclosed in the enclosing chamber 23 formed by the pressure receiving chamber 23-1 and the pressure guiding passage 23-2 having the narrow tube 31 inserted therein and is also enclosed in the sensor portion S1 in the sensor chip 24.

[0053] In the present embodiment, the narrow tube 31 has an outside diameter of 0.3 mm, an inside diameter of 0.15 mm, and a length of 15 mm. The size of the narrow tube 31 described here is merely an example and is not limited to this.

[0054] An upper surface 24b of the sensor chip 24 (or an upper surface of the second retaining member 24-3) is in an open state. That is, the pressure guiding hole 24-3b in the second retaining member 24-3 of the sensor chip 24 is open to the atmosphere via the through holes 21a, 21b, and 21c in the cover body 21-2.

[0055] In the pressure sensor 200A, the areas of the surfaces of the first retaining member 24-2 and the second retaining member 24-3 facing each other, with the sensor diaphragm 24-1 interposed therebetween, are different. In this example, the sensor chip 24 has a stepped structure in which the area of the second retaining member (upper retaining member) 24-3 is smaller than the area of the first retaining member (lower retaining member) 24-2.

[0056] In the stepped structure of the sensor chip 24, wires 29 (29-1, 29-2) are extended from the surface of the sensor diaphragm 24-1 having the strain resistance gauge thereon and located at an outer edge of one of the first retaining member 24-2 and the second retaining member 24-3, the one (first retaining member 24-2) extending outward from the other retaining member. The wires 29 (29-1, 29-2) extended from the sensor diaphragm 24-1 are connected to the respective electrode pins 25 (25-1, 25-2) in the relay terminal 26.

[0057] FIG. 2 is a plan view of the relay terminal 26. The relay terminal 26 has a U-shaped terminal block 26a made of an insulating material, and the electrode pins 25 (25-1, 25-2) passing through the terminal block 26a. The relay terminal 26 is secured by bonding to the bottom surface 20a of the sensor chamber 20. The electrode pins 25-1 and 25-2 are extended through the through holes 21a and 21b, respectively, in the cover body 21-2 to the outside of the sensor chamber 20. The sensor chamber 20 is open to the atmosphere and has no enclosed liquid therein.

[0058] In the pressure sensor 200A, a pressure P1 from a measured fluid (fluid, gas) is received by the pressure receiving diaphragm 22. The pressure P1 of the measured fluid received by the pressure receiving diaphragm 22 is transmitted to the enclosed liquid 27 in the enclosing chamber 23, passed through the narrow tube 31 in the pressure guiding passage 23-2, and guided to the first surface 24-1a of the sensor diaphragm 24-1. The second surface 24-1b of the sensor diaphragm 24-1 is open to the atmosphere through the pressure guiding hole 24-3b in the second retaining member 24-3.

[0059] This causes a strain in the sensor diaphragm 24-1. The strain in the sensor diaphragm 24-1 is detected as a change in resistance value in the strain resistance gauge. The change in resistance value is converted to an electric signal (i.e., a signal corresponding to a pressure difference), transmitted through the wires 29 (29-1, 29-2), and extracted from the electrode pins 25 (25-1, 25-2) in the relay terminal 26.

[0060] If the sensor diaphragm 24-1 is displaced by an excessive pressure applied to the first surface 24-1a of the sensor diaphragm 24-1, the entire displaced surface is received by the curved surface of the recessed portion 24-3a of the second retaining member 24-3. This prevents excessive displacement caused by the excessive pressure applied to the sensor diaphragm 24-1, prevents stress concentration on the outer region of the sensor diaphragm 24-1 to avoid breakage of the sensor diaphragm 24-1 caused by the application of the excessive pressure, and improves resistance of the sensor diaphragm 24-1 to pressure.

[0061] In the pressure sensor 200A, the sensor chip 24 is joined to the base body 21-1, with the surface 24a thereof (or the lower surface of the first retaining member 24-2) on the side of introducing the pressure of the measured fluid serving as a joint surface. In the base body 21-1, the enclosing chamber 23 is formed between the joint surface 24a of the sensor chip 24 and the pressure receiving diaphragm 22. By the enclosed liquid 27 in the enclosing chamber 23, the pressure P1 from the measured fluid received by the pressure receiving diaphragm 22 is guided through the narrow tube 31 to the first surface 24-1a of the sensor diaphragm 24-1.

[0062] That is, in the pressure sensor 200A, a passage in the narrow tube 31 having an inside diameter smaller than the inside diameter of the pressure guiding hole 24-2b in the first retaining member 24-2 serves as an actual pressure guiding passage that guides the measured fluid to the first surface 24-1a of the sensor diaphragm 24-1. This reduces the pressure receiving area of the pressure guiding passage that guides the pressure P1 of the measured fluid to the first surface 24-1a of the sensor diaphragm 24-1 and suppresses force applied in the direction of separating the joint between the sensor chip 24 and the base body 21-1. In this example, the pressure receiving area of the pressure guiding passage that guides the pressure P1 of the measured fluid is smaller than or equal to 1/10 of that in the structure without the narrow tube 31, illustrated in FIG. 8. Thus, the force applied in the direction of separating the joint between the sensor chip 24 and the base body 21-1 is significantly reduced, and a structure more resistant to high pressure is provided.

[0063] In the structure with the narrow tube 31, a force applied in the direction of separating the joint between the sensor chip 24 and the base body 21-1 is suppressed. This allows the sensor chip 24 and the base body 24-1 to be joined with an adhesive having a low Young's modulus. By the soft adhesive layer 28, which is a layer of the adhesive with this low Young's modulus, thermal stress in the shear direction is reduced. It is thus possible to avoid separation of the joint between the sensor chip 24 and the base body 24-1, not only under high pressure but also when the ambient temperature changes.

[0064] An epoxy adhesive is used to secure the narrow tube 31, whereas a fluorine adhesive is used to secure the sensor chip 24. By thus effectively using two types of adhesives, a portion required to be pressure-resistant can provide a structure that maintains its strength and minimizes the impact of heat generated by securing the sensor chip 24.

[0065] In the pressure sensor 200A, only the sensor portion S1 in the sensor chip 24 is in contact with the enclosed liquid 27 and the entire sensor chip 24 is positioned outside the enclosing chamber 23. This is to minimize the amount of the enclosed liquid 27 used. With the narrow tube 31, the amount of the enclosed liquid 27 used is further reduced. By inserting a fine wire into the narrow tube 31, a further reduction of the enclosed liquid 27 is possible.

[0066] In the embodiment described above, the relay terminal 26 having the electrode pins 25 is provided as a connecting member for connection to the wires 29 extended from the sensor diaphragm 24-1. Alternatively, for example, as illustrated in FIG. 3, a substrate 30 having a circuit connected to the wires 29 may be provided.

[0067] Also, in the embodiment described above, the sensor chip 24 has a stepped structure in which the area of the second retaining member (upper retaining member) 24-3 is smaller than the area of the first retaining member (lower retaining member) 24-2. Alternatively, for example, as in the pressure sensor 200 (200B) illustrated in FIG. 4, the sensor chip 24 may have a stepped structure in which the area of the first retaining member (lower retaining member) 24-2 is smaller than the area of the second retaining member (upper retaining member) 24-3.

[0068] In this case, the wires 29 (29-1, 29-2) are extended from the surface of the sensor diaphragm 24-1 having the strain resistance gauge thereon and located at an outer edge of one of the first retaining member 24-2 and the second retaining member 24-3, the one (second retaining member 24-3) extending outward from the other retaining member. The wires 29 (29-1, 29-2) extended from the sensor diaphragm 24-1 are connected to the respective electrode pins 25 (25-1, 25-2) in the relay terminal 26.

[0069] In the pressure sensor 200A structured as illustrated in FIG. 1, that is, when the sensor chip 24 has a stepped structure in which the area of the second retaining member (upper retaining member) 24-3 is smaller than the area of the first retaining member (lower retaining member) 24-2, the surface of the sensor diaphragm 24-1 having the strain resistance gauge (i.e., a sensor resistance pattern or an electrode pad) thereon is face up. This facilitates assembly, because wire bonding can be performed after the sensor chip 24 is bonded. However, the surface of the sensor diaphragm 24-1 having the sensor resistance pattern thereon is open to the atmosphere and not protected by the enclosed liquid 27. Therefore, if the side of the sensor diaphragm 24-1 open to the atmosphere is not clean, the characteristics of the sensor diaphragm 24-1 may be affected. That is, the use environment is limited and the installation environment needs to be clean.

[0070] In the pressure sensor 200B structured as illustrated in FIG. 4, that is, when the sensor chip 24 has a stepped structure in which the area of the first retaining member (lower retaining member) 24-2 is smaller than the area of the second retaining member (upper retaining member) 24-3, the surface of the sensor diaphragm 24-1 having the strain resistance gauge (i.e., a sensor resistance pattern or an electrode pad) thereon is face down. This makes assembly difficult, because wire bonding needs to be performed before the sensor chip 24 is bonded. However, the surface of the sensor diaphragm 24-1 having the sensor resistance pattern thereon is covered by the enclosed liquid 27 and thus is not exposed to the use environment (atmosphere). This allows use in any environment and gives flexibility in selecting an installation environment.

[0071] In the embodiments described above, the sensor chip 24 is joined to the bottom surface 20a of the sensor chamber 20, with the lower surface of the first retaining member 24-2 serving as the joint surface 24a thereof. Alternatively, the sensor chip 24 may be joined to the bottom surface 20a of the sensor chamber 20, with a base provided on the lower surface of the first retaining member 24-2 serving as a joint surface thereof.

[0072] Although the base body 21-1 and the cover body 21-2 are provided to form the body 21 in the embodiments described above, the cover body 21-2 may be removed as in the pressure sensor 200 (200C) illustrated in FIG. 5. The pressure sensor 200A illustrated in FIG. 1 does not necessarily require the cover body 21-2, because the entire sensor chip 24 is positioned outside the enclosing chamber 23. Without the cover body 21-2, as in the pressure sensor 200C illustrated in FIG. 5, it is possible to further reduce size and cost.

[0073] In the embodiments described above, a soft adhesive layer (fluorine adhesive layer) is used as the adhesive layer 28 between the sensor chip 24 and the base body 21-1 to reduce thermal stress in the shear direction. However, the adhesive layer 28 does not necessarily need to be a soft adhesive layer and may be an epoxy adhesive layer. That is, with the narrow tube 31, it is possible to suppress force applied in the direction of separating the joint between the sensor chip 24 and the base body 21-1. Although thermal stress in the shear direction may not be reduced in this case, it is possible to improve resistance to pressure.

[0074] The second surface 24-1b of the sensor diaphragm 24-1 is made open to the atmosphere in the embodiments described above. However, for example, as in the pressure sensor 200 (200D) illustrated in FIG. 6, the lower surface of the first retaining member 24-2 may be joined to the bottom surface 20a of the sensor chamber 20 (or the inner wall surface of the base body 21-1) with a soft adhesive layer 28-1 interposed therebetween, the upper surface of the second retaining member 24-3 may be joined to an upper surface 20b of the sensor chamber 20 (or an inner wall surface of the cover body 21-2) with a soft adhesive layer 28-2 interposed therebetween, and narrow tubes 31-1 and 31-2 may be provided in pressure guiding passages on both sides of the sensor diaphragm 24-1.

[0075] While the side of the narrow tube 31-2 is not shown in FIG. 6, a pressure P2 from the measured fluid (second measured fluid) received by a pressure receiving diaphragm on the side of the narrow tube 31-2 is transmitted to an enclosed liquid 27-2, passed through the narrow tube 31-2, and guided to the second surface 24-1b of the sensor diaphragm 24-1, as on the side of the narrow tube 31-1. This allows detection of a difference between the pressure P1 of the measured fluid (first measured fluid) applied to the first surface 24-1a of the sensor diaphragm 24-1 and the pressure P2 of the measured fluid (second measured fluid) applied to the second surface 24-1b of the sensor diaphragm 24-1.

[0076] In the configuration illustrated in FIG. 6, the soft adhesive layers 28-1 and 28-2 have the function of securing the sensor chip 24 in place, rather than the function of retaining airtightness. One of the soft adhesive layers 28-1 and 28-2 may be removed, as long as the sensor chip 24 is reliably secured in place.

Expansion of Embodiments

[0077] The present invention has been described with reference to the embodiments, but the present invention is not limited to the embodiments described above. Various changes that can be understood by those skilled in the art can be made to the configurations and details of the present invention within the scope of the technical ideas of the present invention.

INDUSTRIAL APPLICABILITY

[0078] The present invention is applicable to industrial pressure sensors.

REFERENCE SIGNS LIST

[0079] 20: sensor chamber, 20a: bottom surface, 20b: front surface, 21: body, 21-1: base body, 21-2: cover body, 22: pressure receiving diaphragm, 23: enclosing chamber, 23-1: pressure receiving chamber, 23-2: pressure guiding passage, 24: sensor chip, 24a: bottom surface (joint surface), 24-1: sensor diaphragm, 24-1a: first surface, 24-1b: second surface, 24-2: first retaining member, 24-2a: recessed portion, 24-2b: pressure introducing hole (pressure guiding hole), 24-2c: surrounding region, 24-3: second retaining member, 24-3a: recessed portion, 24-3b: pressure introducing hole (pressure guiding hole), 24-3c: surrounding region, 25 (25-1, 25-2): electrode pin, 26: relay terminal, 27 (27-1, 27-2): enclosed liquid, 28 (28-1, 28-2): adhesive layer (soft adhesive layer), 29 (29-1, 29-2): wire, 30: substrate, (31-1, 31-2): narrow tube, 200 (200A to 200D): pressure sensor