SHUNT RESISTOR FOR DETECTING THE STATUS OF AN ELECTRICAL ENERGY STORAGE UNIT
20210156888 · 2021-05-27
Inventors
Cpc classification
G01R1/203
PHYSICS
H01C7/06
ELECTRICITY
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01C1/012
ELECTRICITY
H01C1/14
ELECTRICITY
H01C1/144
ELECTRICITY
G01R31/364
PHYSICS
International classification
G01R1/20
PHYSICS
G01R31/364
PHYSICS
H01C1/012
ELECTRICITY
Abstract
The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.
Claims
1. A shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) has a first layer (4), a second layer (6) and a third layer (8), characterized in that the layers (4, 6, 8) are arranged in a layered manner in a direction of a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers are each in physical contact with one another by way of sides respectively having a largest surface area, and wherein the layers (4, 6, 8) are arranged in an at least partially overlapping manner.
2. The shunt resistor (2) as claimed in claim 1, characterized in that the individual layers (4, 6, 8) of the shunt resistor (2) are arranged in a direction of a longitudinal axis (11) of the layers and/or a transverse axis (13) of the layers in such a manner that a step profile (10) is produced when layering the individual layers (4, 6, 8) in the direction of the stacking direction (V).
3. The shunt resistor (2) as claimed in claim 2, characterized in that the individual layers (4, 6, 8) of the shunt resistor (2) have different lengths in the direction of the longitudinal axis (11) of the layers (4, 6, 8) and/or the transverse axis (13) of the layers (4, 6, 8).
4. The shunt resistor (2) as claimed in claim 1, characterized in that the shunt resistor (2) is provided with at least one recess (9).
5. The shunt resistor (2) as claimed in claim 4, characterized in that an area of the shunt resistor (2) is reduced by a size of the at least one recess (9) in such a manner that a predefined resistance value of the shunt resistor (2) is achieved.
6. The shunt resistor (2) as claimed in claim 1, characterized in that the individual layers (4, 6, 8) of the shunt resistor (2) are welded to one another.
7. The shunt resistor (2) as claimed in claim 1, characterized in that the second layer (6) has a copper-nickel-manganese alloy.
8. The shunt resistor (2) as claimed in claim 1, characterized in that the first layer (4) and the third layer (8) each comprise the materials of copper and/or aluminum.
9. An electronic energy storage unit (1) having the shunt resistor (2) as claimed in claim 1.
10. A method for producing the shunt resistor (2) for detecting the status of the electrical energy storage unit (1), wherein the shunt resistor (2) has the first layer (4), the second layer (6) and the third layer (8) and the layers (4, 6, 8) are also arranged in a layered manner in the direction of the stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are each in physical contact with one another by way of one of the sides respectively having the largest surface area of a layer in such a manner that the layers (4, 6, 8) are arranged in an at least partially overlapping manner.
11. The method as claimed in claim 10, wherein the individual layers (4, 6, 8) of the shunt resistor (2) are arranged in the direction of the longitudinal axis (11) of the layers (4, 6, 8) and/or the transverse axis (13) of the layers (4, 6, 8) in such a manner that the step profile (10) is produced when layering the individual layers (4, 6, 8) in the direction of the stacking direction (V), as a result of which surfaces of the individual layers (4, 6, 8), in particular, become at least partially accessible in the direction of the stacking direction (V).
12. The shunt resistor (2) as claimed in claim 7, characterized in that the first layer (4) and the third layer (8) each comprise the materials of copper and/or aluminum.
13. The shunt resistor (2) as claimed in claim 1, characterized in that the individual layers (4, 6, 8) of the shunt resistor (2) are arranged in a direction of a longitudinal axis (11) of the layers and/or a transverse axis (13) of the layers in such a manner that a step profile (10) is produced when layering the individual layers (4, 6, 8) in the direction of the stacking direction (V), as a result of which surfaces of the individual layers (4, 6, 8) are at least partially accessible in the direction of the stacking direction.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Further advantages and configurations of the invention emerge from the description and the accompanying drawings.
[0020] It goes without saying that the features mentioned above and the features yet to be explained below can be used not only in the respectively stated combination, but also in other combinations or alone, without departing from the scope of the present invention.
[0021]
[0022]
[0023]
[0024]
DETAILED DESCRIPTION
[0025] The invention is schematically illustrated in the drawings on the basis of embodiments and is described in detail below with reference to the drawings.
[0026]
[0027] The three layers 4, 6, 8 of the shunt resistor 2 are arranged in a layered manner in this case in the direction of a stacking direction V, wherein the second layer 6 is arranged between the first layer 4 and the third layer 8 and the layers 4, 6, 8 are each in physical contact with one another by way of one of the sides respectively having the largest surface area. In this case, the layers 4, 6, 8 can be arranged in an at least partially overlapping manner, with the result that the layers 4, 6, 8 form a step profile 10, for example. This advantageous design of the shunt resistor 2, in which the layers 4, 6, 8 form the step profile 10, has the advantage that the surfaces of the individual layers 4, 6, 8 are at least partially accessible in the direction of the stacking direction V.
[0028] In this case, the first layer 4 and the third layer 8 each have the materials of copper and/or aluminum. In one advantageous embodiment, the first layer 4 and the third layer 8 may be configured, in particular, in such a manner that a shaping aluminum plate is provided with a copper sheath, wherein the aluminum provides the respective layer with the stability and strength, whereas good electrical conductivity of the respective layer is produced by sheathing the first layer 4 and/or the third layer 8 with copper. In this case, the second layer 6 may have an alloy of copper, nickel and manganese, in particular Manganin®. With the aid of the shunt resistor 2 according to the invention, it is possible for only one layer made of a resistance material, for example made of a copper-nickel-manganese alloy, to be required, in which case the configuration of the resistance material component is determined by means of a predefined electrical resistance, for example needed to carry out a meaningful measurement. Different connection variants are possible in this case, as explained below.
[0029] In addition, a terminal 3 can be arranged on the shunt resistor 2 on that side with the largest surface area which is not in each case in contact with the energy storage unit 1, in particular the anode 7.
[0030]
[0031]
[0032] In this case,
[0033]
[0034] Further measures which improve the inventive configuration of the shunt resistor 2 are also welding and/or cohesive connection and/or form-fitting connection and/or force-fitting connection of the individual layers 4, 6, 8. This makes it possible to prevent the individual layers from shifting with respect to one another in the direction of the longitudinal axis 11 and/or the transverse axis 13 and thus the stability of the shunt resistor 2 and a possibly connected flexible film 12 being reduced and therefore the function of the shunt resistor 2 no longer being available.
[0035]
[0036]
[0037]
[0038]
[0039]