MOLDING DEVICE
20210146584 · 2021-05-20
Inventors
Cpc classification
B29C45/7331
PERFORMING OPERATIONS; TRANSPORTING
B29C45/2673
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A molding device includes an insert mold and a base mold. The insert mold is attached to the base mold in a replaceable manner. The base mold includes a frame and a pipe. Inside the frame, the insert mold is inserted. Inside the pipe, a fluid for temperature adjustment flows. Between the insert mold and the base mold, an elastically deformable heat transfer member is arranged. The heat transfer member is in contact with both the insert mold and the base mold at least during molding.
Claims
1. A molding device comprising: an insert mold; and a base mold to which the insert mold is attached in a replaceable manner, wherein the base mold includes: a frame where the insert mold is inserted; and a pipe where a fluid for temperature adjustment flows, and an elastically deformable heat transfer member that is in contact with both the insert mold and the base mold at least during molding is arranged between the insert mold and the base mold.
2. The molding device according to claim 1, wherein the base mold includes the frame including the pipe, and the heat transfer member is in surface contact with both the frame and the insert mold.
3. The molding device according to claim 1, wherein the heat transfer member is a sheet or a film made of rubber or resin.
4. The molding device according to claim 1, wherein a formula below is satisfied:
t>E/Em×L (1) wherein t represents a thickness (mm) of the heat transfer member, E represents an elastic modulus (GPa) of the heat transfer member, Em represents an elastic modulus (GPa) of the insert mold, and L represents a dimension (mm) of the insert mold in a direction of the thickness of the heat transfer member.
5. The molding device according to claim 1, wherein the heat transfer member has a thickness of between 0.1 mm and 5 mm both inclusive, a thermal conductivity of 2 W/m.Math.K or more, and an elastic modulus of 1 GPa or less.
6. The molding device according to claim 1, wherein the insert mold has a thermal conductivity of 100 W/m.Math.K or more.
7. The molding device according to claim 1, wherein the insert mold is made of any one of an aluminum alloy, a beryllium copper alloy, a zinc alloy, and an aluminum-ceramic composite.
8. The molding device according to claim 1, wherein the molding device is an injection molding device.
9. A molded product manufacturing method using the molding device according to claim 1, comprising: attaching the insert mold to the base mold and performing mold clamping; and injecting molten resin into a cavity formed by the mold clamping.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
DESCRIPTION OF EMBODIMENTS
[0028] Hereinafter, one or more embodiments of the present invention will be described with reference to the accompanying drawings.
[0029] The fixed-side base mold 10 made of steel has a fixed-side retainer plate 11, a first frame 12 attached to the fixed-side retainer plate 11, and a second frame 13 attached to the first frame 12. Inside the first frame 12, a pair of guide shafts 14 is implanted in the fixed-side retainer plate 11, and a slider plate 15 is arranged so as to be movable along the guide shafts 14. In the slider plate 15, ejector pins 16 are implanted. In the second frame 13, a pipe 13a extending in the circumferential direction is spirally formed, and both ends thereof are connected to the temperature adjustment unit 50, which is provided outside, via a connecting pipe 17.
[0030] The fixed-side insert mold 20 has a first block 21 and a second block 22 that are inserted inside the second frame 13 of the fixed-side base mold 10. On the movable-side surface of the second block 22, a molding surface 22a is formed. In the first block 21 and the second block 22, through holes 21a and through holes 22b through which the ejector pins 16 are inserted are formed. The through holes 22b are open on the molding surface 22a.
[0031] Between (i) the second frame 13 of the fixed-side base mold 10 and (ii) the first block 21 and the second block 22 of the fixed-side insert mold 20, a space having a thickness t is formed on the entire circumference, and in the space, the fixed-side elastic member 60 is arranged so as to be in close contact with the inner circumferential surface of the second frame 13 and the outer circumferential surface(s) of the first block 21 and the second block 22.
[0032] The movable-side base mold 30 made of steel has a movable-side retainer plate 31 and a third frame 32 attached to the movable-side retainer plate 31. In the third frame 32, a pipe 32a extending in the circumferential direction is spirally formed, and both ends thereof are connected to the temperature adjustment unit 50, which is provided outside, via a connecting pipe 33.
[0033] The movable-side insert mold 40 has a third block 41 that is inserted inside the third frame 32 of the movable-side base mold 30. On the fixed-side surface of the third block 41, a molding surface 41a is formed. It is preferable that the fixed-side insert mold 20 and the movable-side insert mold 40 be each formed of one of an aluminum alloy, a beryllium copper alloy, a zinc alloy, and an aluminum-ceramic composite because these materials have a thermal conductivity of 100 W/m.Math.K or more and satisfy strength required as molds for injection molding. The thermal conductivity of 100 W/m.Math.K or more improves efficiency of heat transfer from contact surfaces of insert molds to molding surfaces of the insert molds and quickly stabilizes the mold temperature, and hence is effective even for large insert molds.
[0034] Between (i) the third frame 32 of the movable-side base mold 30 and (ii) the third block 41 of the movable-side insert mold 40, a space having a thickness t is formed on the entire circumference, and in the space, the movable-side elastic member 70 is arranged so as to be in close contact with the inner circumferential surface of the third frame 32 and the outer circumferential surface of the third block 41.
[0035] As shown in
[0036] The fixed-side elastic member 60 and the movable-side elastic member 70 are preferably rubber-like sheets or films, particularly preferably heat-conductive sheets made of silicone, because they are easily processed and brought into surface contact with others. The fixed-side elastic member 60 and the movable-side elastic member 70 preferably have a thickness of between 0.1 mm and 5 mm both inclusive, a thermal conductivity of 2 W/m.Math.K or more, and an elastic modulus of 1 GPa or less. If the fixed-side elastic member 60 and the movable-side elastic member 70 have a thickness of more than 5 mm, which is too thick, or have a thermal conductivity of less than 2 W/m.Math.K, which is too low, they may inhibit heat transfer between the base mold and the insert mold by their own heat insulation. On the other hand, if the fixed-side elastic member 60 and the movable-side elastic member 70 have an elastic modulus of more than 1 GPa, which is too high, or have a thickness of less than 0.1 mm, which is too thin, they may be unable to absorb disagreement (gap) between contact surfaces. The above specifications of the elastic members can absorb the disagreement between the contact surfaces while minimizing influence of the inhibition of the heat transfer.
[0037]
[0038] When the temperature of the insert mold is increased from T1 to T2, thermal stress P generated in the insert mold is expressed as follows:
P=Em×(δ/L), where δ=a×(T2−T1)×L/2.
[0039] If force F required to deform the elastic members is less than the thermal stress P of the insert mold (F<P), the elastic members can absorb the thermal expansion of the insert mold. From this condition, the following formula holds:
E×(δ/t)<Em×(δ/L), and hence
t>E/Em×L (1).
[0040] Next, operation of the molding device according to this embodiment will be described.
[0041] In this state, as shown in
[0042] After the resin in the cavity solidifies, as shown in
[0043] In an example that was produced by the present inventor (with specifications below), dimensions before and after temperature change were as follows. Dimensions A, B and t correspond to those shown in
(a) Material of Insert Mold: aluminum alloy A7075 (linear expansion coefficient of 23.6×10.sup.−6/K, thermal conductivity of 130 W/m.Math.K)
[0044] Outer Dimension A of Insert Mold: 600 mm (measured at 25° C.)
[0045] Outer Dimension A of Insert Mold: 600.8 mm (measured at 80° C.)
(b) Material of Base Mold: steel S55C (linear expansion coefficient of 11.7×10.sup.−6/K, thermal conductivity of 46 W/m.Math.K)
[0046] Inner Dimension B of Base Mold: 603 mm (measured at 25° C.)
[0047] Inner Dimension B of Base Mold: 603.4 mm (measured at 80° C.)
(c) Material of Elastic Member silicone rubber heat-conductive sheet (linear expansion coefficient of 2×10.sup.−4/K, thermal conductivity of 5 W/m.Math.K)
[0048] Thickness t of Elastic Member: 3 mm (measured at 25° C.)
[0049] Thickness t of Elastic Member: 2.8 mm (measured after thermal expansion of base mold and insert mold at 80° C.)
[0050] According to the above example, due to the difference in thermal expansion between the base mold and the insert mold, the distance between the base mold and the insert mold was shortened 0.2 mm. However, the elastic member(s) absorbed this change. Thus, an insert mold can be in close contact with a base mold without being squeezed in the base mold, and hence they can exchange heat efficiently.
[0051] Hereinafter, a simulation that was performed by the present inventor will be described. As shown in
[0052] First, in the ideal contact state as shown in (a) of
[0053] In the embodiment described above, the fixed-side elastic member 60 is arranged between the fixed-side base mold 10 and the fixed-side insert mold 20, and the movable-side elastic member 70 is arranged between the movable-side base mold 30 and the movable-side insert mold 40. However, an elastic member may be provided only on the movable side or the fixed side.
INDUSTRIAL APPLICABILITY
[0054] The present invention is suitable for providing a molding device including a pipe(s) for temperature adjustment.
REFERENCE SIGNS LIST
[0055] 10 Fixed-side Base Mold [0056] 11 Fixed-side Retainer Plate [0057] 12 First Frame [0058] 13 Second Frame [0059] 13a Pipe [0060] 14 Guide Shaft [0061] 15 Slider Plate [0062] 16 Ejector Pin [0063] 17 Connecting Pipe [0064] 20 Fixed-side Insert Mold [0065] 21 First Block [0066] 21a Through Hole [0067] 22 Second Block [0068] 22a Molding Surface [0069] 22b Through Hole [0070] 30 Movable-side Base Mold [0071] 31 Movable-side Retainer Plate [0072] 32 Third Frame [0073] 32a Pipe [0074] 33 Connecting Pipe [0075] 40 Movable-side Insert Mold [0076] 41 Third Block [0077] 41a Molding Surface [0078] 50 Temperature Adjustment Unit [0079] 60 Fixed-side Elastic Member [0080] 70 Movable-side elastic Member