CROSS-WIRING CALIBRATION AND POSITIONING METHOD FOR SOLDER PASTE PRINTING OF SINGLE OR MULTIPLE PIECES OF PCB OR FPC

Abstract

A cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC is provided including: lifting a PCB and FPC to disengage from a lower carrier for suction positioning, recording coordinates by photographing marker points of two points on each single piece of PCB or FPC, comparing the same with absolute coordinates or relative coordinates of marker point coordinates on a solder paste printing steel plate photographed through a solder paste printer, performing compensation calculation and feeding back a signal to an XYθ calibration platform on each profiling sucker, lifting the PCB or the FPC to attach to the solder paste printing steel plate for solder paste printing, lowering the lifted platform, and moving the load to a lower workstation, and then covering the PCB or FPC with an upper steel sheet or an upper carrier.

Claims

1. A cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC, comprising the following steps of: 1) delivering a lower carrier (101) to a loading region (2) by lifting a lower turning conveying carrier-plate feeder (1); 2) grasping and transferring a PCB or FPC solder paste printing material (102) to the loading region (2), fitting the material in a positioning pin (13) of the lower carrier (101), and conveying the material to a lifted photographing workstation (3) after positioning; 3) photographing, by a printer marker camera (4) of a solder paste printer (103), a marker point of a solder paste printing steel plate, and transmitting coordinates to the lifted photographing workstation (3); 4) performing, by a high-precision electric cylinder (5) in the lifted photographing workstation (3), first-stage lifting which is to lift the PCB or FPC solder paste printing material (102) to be a position higher than the lower carrier (101) by suction mode or adhesion; and photographing, by an upper marker camera (6) in the lifted photographing workstation (3), a marker point of the PCB or FPC solder paste printing material (102); 5) according to the coordinates of the marker point of the solder paste printing steel plate photographed in the step 3), transmitting, by the lifted photographing workstation (3), a compensation value to an XYθ calibration platform (7) through coordinate signal handshaking to correct the coordinates of the marker point of the PCB or FPC solder paste printing material (102); 6) conveying the corrected PCB or FPC solder paste printing material (102) to the solder paste printer (103) through a high precision low profile linear robot (8), performing, by the high-precision electric cylinder (5) in the lifted photographing workstation (3), second-stage lifting which is to lift the PCB or FPC solder paste printing material (102) to the solder paste printing steel plate (9), and attaching the material for solder paste printing; 7) after the solder paste printing is completed, lowering the lifted photographing workstation (3) which has two stages: first, lowering the lifted photographing workstation to complete demoulding of the PCB or FPC solder paste printing material (102), and second, lowering the lifted photographing workstation to complete positioning of the PCB or FPC solder paste printing material (102) fitted in the positioning pin (13) of the lower carrier (101), and conveying the material to a steel sheet capping machine (104) to complete buffer positioning; 8) fixing and grasping, by a Y-axis servo sliding table (10) and a Z-axis servo sliding table (11), an upper steel sheet (105) and covering the upper steel sheet to an upper end of the lower carrier (101) to complete front fixing of an SMT chip.

2. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 1), the lower carriers (101) are delivered to a first AB switching-type conveying station (106) by lifting the lower turning conveying carrier-plate feeder (1), the lower carriers (101) are respectively conveyed to separate loading regions (2) in an alternating manner, and the lower carriers (101) are respectively conveyed to the lifted photographing workstation (3) in an alternating manner through a second AB switching-type conveying station (107) from the loading regions (2).

3. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 1), the PCB or FPC solder paste printing material (102) is sucked and transferred into the loading region (2) through a robotic arm equipped with suction module.

4. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 1), the PCB or FPC solder paste printing material (102) is grasped and transferred into the loading region (2) through a robotic arm equipped with a clamping claw.

5. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 1), the PCB or FPC solder paste printing material (102) is sucked and transferred into the loading region (2) through an XYZ linear sliding table (line code) equipped with suction module.

6. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 1), the PCB or FPC solder paste printing material (102) is grasped and transferred into the loading region (2) through an XYZ linear sliding table (line code) equipped with a clamping claw.

7. The cross-wiring calibration and positioning method for solder paste printing of a single or multiple pieces of PCB or FPC according to claim 1, wherein in the step 8), a suction mode or an adhesion mode and a positioning pin positioning mode are employed as the fixing modes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present disclosure is further described hereinafter with reference to the accompanying drawings and the embodiments.

[0023] FIG. 1 shows a schematic diagram of step 1 of the present disclosure;

[0024] FIG. 2 shows a schematic diagram of step 2 of the present disclosure;

[0025] FIG. 3 shows a schematic diagram of step 3 of the present disclosure;

[0026] FIG. 4 shows a schematic diagram of step 4 of the present disclosure;

[0027] FIG. 5 shows a schematic diagram of step 5 of the present disclosure;

[0028] FIG. 6 shows a schematic diagram of step 6 of the present disclosure;

[0029] FIG. 7 shows a schematic diagram of step 7 of the present disclosure;

[0030] FIG. 8 shows a schematic diagram of step 8 of the present disclosure;

[0031] FIG. 9 shows a schematic diagram of step 9 of the present disclosure; and

[0032] FIG. 10 shows a schematic diagram of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] With reference to FIG. 1 to FIG. 10, the present disclosure employs single piece correction compensation positioning high-speed transfer high-precision solder paste printing, adopts a design of a calibration compensation mode that performs online single-machine or multi-device wiring production, and provides a cross-wiring calibration platform method for solder paste printing of a single or multiple pieces of PCB or FPC. The method includes the following steps of: [0034] 1) delivering a lower carrier 101 to a loading region 2 by lifting a lower turning conveying carrier-plate feeder 1; [0035] 2) grasping and transferring a PCB or FPC solder paste printing material 102 to the loading region 2, fitting the material in a positioning pin 13 of the lower carrier 101, and conveying the material to a lifted photographing workstation 3 after positioning; [0036] 3) photographing, by a printer marker camera 4 of a solder paste printer 103, a marker point of a solder paste printing steel plate, and transmitting coordinates to the lifted photographing workstation 3; [0037] 4) performing, by a high-precision electric cylinder 5 in the lifted photographing workstation 3, first-stage lifting which is to lift the PCB or FPC solder paste printing material 102 to be a position higher than the lower carrier 101 by suction mode or adhesion; and photographing, by an upper marker camera 6 in the lifted photographing workstation 3, a marker point of the PCB or FPC solder paste printing material 102; [0038] 5) according to the coordinates of the marker point of the solder paste printing steel plate photographed in the step 3), transmitting, by the lifted photographing workstation 3, a compensation value to an XYθ calibration platform 7 through coordinate signal handshaking to correct the coordinates of the marker point of the PCB or FPC solder paste printing material 102; [0039] 6) conveying the corrected PCB or FPC solder paste printing material 102 to the solder paste printer 103 through a high precision low profile linear robot 8, performing, by the high-precision electric cylinder 5 in the lifted photographing workstation 3, second-stage lifting which is to lift the PCB or FPC solder paste printing material 102 to the solder paste printing steel plate 9, and attaching the material for solder paste printing; [0040] 7) after the solder paste printing is completed, lowering the lifted photographing workstation 3 which has two stages: first, lowering the lifted photographing workstation to complete demoulding of the PCB or FPC solder paste printing material 102, and second, lowering the lifted photographing workstation to complete positioning of the PCB or FPC solder paste printing material 102 fitted in the positioning pin 13 of the lower carrier 101, and conveying the material to a steel sheet capping machine 104 to complete buffer positioning; [0041] 8) fixing and grasping, by a Y-axis servo sliding table 10 and a Z-axis servo sliding table 11, an upper steel sheet 105 and covering the upper steel sheet to an upper end of the lower carrier 101 to complete front fixing of an SMT chip.

[0042] The method can effectively improve a production efficiency and lower costs, is environmentally friendly, shortens PASS labor-hours for processing NG plates, and has the advantages of effectively maintaining high-precision cross-wiring solder paste printing and high-quality solder paste printing, and reducing manpower and repeated work.

[0043] In the above step 8), a suction mode or an adhesion mode and a positioning pin positioning mode are employed as the fixing modes.

[0044] The PCB or FPC solder paste printing material 102 may be delivered and positioned through a robotic arm equipped with suction module or a clamping claw, and an XYZ linear sliding table equipped with suction module or the clamping claw.

[0045] In order to improve a working efficiency, the lower carrier 101 is delivered to a first AB switching-type conveying station 106 by lifting a lower turning conveying carrier-plate feeder 1. The first AB switching-type conveying station 106 alternately transports the lower carrier 101 to a first loading region or a second loading area, and the first loading area or the second loading area alternately transports the PCB or FPC solder paste printing material 102 positioned with the lower carrier 101 through a second AB switching-type conveying station 107.

[0046] According to the above principle, the above embodiments may also be appropriately changed and modified in the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present disclosure shall also fall within the scope of protection of the claims of the present disclosure.