APPLICATOR WITH THERMAL CONTACT SENSORS

Abstract

Disclosed is a thermal contact sensor for use in aesthetic skin by heat treatment for altering the aesthetic appearance of a subject. The thermal contact sensor measures the difference in sensor temperature when in contact or absence of contact with the skin and automatically operates a source of optical radiation to heat the skin.

Claims

1. A thermal contact sensor, comprising: a cup-like housing with a bottom thinner than housing walls; at least one temperature sensor and a heater; a flexible printed circuit board including enhanced solder coated pads configured to receive a temperature sensor and a heater; a thermally conductive glue to attach enhanced solder coated copper pads with a temperature sensor and a heater to cup-like housing.

2. The thermal contact sensor of claim 1, wherein the cup-like housing with a bottom thinner than housing walls, is a stainless steel housing.

3. The thermal contact sensor of claim 1, wherein the temperature sensor is one of a group of thermal sensors consisting of a thermistor or a thermocouple.

4. The thermal contact sensor of claim 1, wherein the heater is a resistor.

5. The thermal contact sensor of claim 1, wherein the enhanced solder coated copper pads of the flexible printed circuit board configured to receive a temperature sensor and a heater.

6. The thermal contact sensor of claim 5, wherein the enhanced solder coated copper pads are 0.089 to 0.203 mm thick.

7. The thermal contact sensor of claim 5, wherein the enhanced solder coated copper pads of the flexible printed circuit board are separate spaced-apart pads.

8. The thermal contact sensor of claim 1, wherein the thermally conductive glue further enhances thermal communication of enhanced solder coated copper pads with the bottom surface of a can-like sensor housing.

9. A method of thermal contact detection, comprising: applying to a skin of a subject an applicator containing a thermal contact sensor of claim 1; operating the applicator thermal contact sensor in at least one of the operation modes consisting of: operation of thermal contact sensor based on the temperature of the skin and stainless steel frame measurements; operation of thermal contact sensor based on a measurement of power supplied to the thermal contact sensor; and operation of thermal contact sensor based on a difference in a thermal inertia of the sensor in idle state and contact with the skin.

10. The method of thermal contact detection of claim 9, wherein the operation of thermal contact sensor based on the temperature of the skin and stainless steel frame measurements include: attaching securely and firmly applicator stainless steel frame, sapphire window, and thermal contact sensor to subject skin; operating heat-generating element to maintain a definite temperature difference between subject skin and stainless steel frame; and if the sensed sensor temperature is 20° C., the sensor indicates a presence of contact of thermal contact sensor with the subject skin; and if the sensed temperature is 15° C. or less, the sensor indicates on absence of contact of thermal contact sensor with the subject skin.

11. The method of thermal contact detection of claim 9, wherein to support rapid sensing of temperature by the thermal contact sensor, the difference between presence of contact with subject skin and absence of contact with subject skin, internal processor operates heat-generating element to maintain a definite temperature difference between subject skin and stainless steel frame.

12. The method of thermal contact detection of claim 9, wherein an internal processor operates a heat-generating element in pulse mode, in a cycle where resistor is on for 2 seconds and is off for next two seconds.

13. The method of thermal contact detection of claim 12, wherein a thermistor at the time of an off cycle, is sensing and transmitting a measured temperature.

14. The method of thermal contact detection of claim 9, wherein the operation of thermal contact sensor based on the measurement of power supplied to the thermal contact sensor includes: operating resistor in closed-loop control mode to maintain a constant thermal contact sensor temperature of 38° C.; and wherein an increase in electric power consumed by the resistor indicates presence of thermal contact sensor with the subject skin contact.

15. The method of thermal contact detection of claim 9, wherein the operation of thermal contact sensor based on the difference in the thermal inertia of the sensor in idle state and contact with the skin includes: operating a resistor and heating the can-like housing each 2.0 seconds; measuring the time it takes to a resistor to rise the thermal contact sensor temperature from 15° C. to 38° C.; if the elapsed time it takes the resistor to rise the thermal contact sensor is less than 400 msec, there is no contact of the thermal contact sensor with the subject skin; and if the elapsed time it takes the resistor to rise the thermal contact sensor is more than 600 msec, there is a contact of the thermal contact sensor with the subject skin.

16. An applicator for skin treatment, comprising: a metal frame maintained at a temperature of 15° C.; a transparent window in thermal communication with a metal frame; a matrix of optical radiation-emitting elements; at least one thermal contact sensor; and wherein the thermal contact sensor operates to detect a presence of contact between the metal frame and transparent window with a subject skin.

17. The applicator of claim 16, wherein the metal frame is a stainless steel metal frame including coolant conducting channels.

18. The applicator of claim 16, wherein the transparent window is a sapphire window.

19. The applicator of claim 16, wherein a matrix of optical radiation-emitting elements emits optical radiation of 800 to 1100 nm.

20. The applicator of claim 16, wherein the thermal contact sensor includes: a cup-like housing with a bottom thinner than housing walls; at least one temperature sensor and a heater; a flexible printed circuit board including enhanced pads configured to receive a temperature sensor and a heater; a thermally conductive glue to attach enhanced pads with a temperature sensor and a heater to cup-like housing.

21. The applicator of claim 16 further comprising an internal processor configured to measure the time it takes to a heater to raise the thermal contact sensor temperature from 15° C. to 38° C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The features and advantages of the present applicator and method of its use will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which identical referral numbers mark identical or similar elements.

[0013] FIG. 1 is a three-dimensional representation of an example the present applicator for skin treatment;

[0014] FIG. 2 is a bottom view of an example of the applicator of FIG. 1;

[0015] FIG. 3A is a cut-through of an example of the stainless steel frame and a thermal contact sensor;

[0016] FIG. 3B is a cut-through of another example of the stainless steel frame and a thermal contact sensor;

[0017] FIG. 4 is a schematic illustration of an example of a thermal contact sensor operation;

[0018] FIG. 5 is a schematic illustration of another example of a thermal contact sensor operation; and

[0019] FIG. 6 is a schematic illustration of an additional example of a thermal contact sensor operation.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0020] Definitions

[0021] As used in the current disclosure, the term “subject” is meant a human or non-human animal (e.g., a mammal).

[0022] The term “skin” or “tissue” as used in the present disclosure includes the outer skin layers such as stratum corneum, dermis, epidermis, and the deeper subcutaneous layers such as fat or adipose tissue.

[0023] The term “skin treatment energy,” as used in the present disclosure, means optical energy facilitating the achievement of a desired skin treatment effect.

[0024] The term “energy to skin applying element” as used in the present disclosure means an element operative to receive skin treatment energy from a source of such energy and couple or apply the received energy to a treated segment of skin. A source of light could be such an element.

[0025] Electromagnetic radiation application to biological tissue, and in particular optical radiation application to skin or tissue, generates heat in the tissue. The heat could be sufficient to reduce the number of fat cells in subcutaneous tissue. Optical radiation application to skin supports the selective heating of the subcutaneous fat or adipose tissue region to destroy fat tissue. The treatment could be implemented to destroy fat tissue and avoid damaging the dermis and epidermis.

[0026] Patent Cooperation Treaty application No. IL2018/050484 to the same inventor and assignee discloses a method and applicator for subcutaneous fat by light treatment. The light wavelengths selected are transmitted through the skin and almost do not affect it. Each treatment session continues for about 10 minutes. The skin and upper skin layers in the course of a skin treatment session, absorb a certain amount of light energy and a cooling arrangement cools the skin.

[0027] The period of application of light energy to the subject skin or tissue is relatively long and accompanied by some skin temperature changes, and accurate temperature control could favorably affect the skin treatment. The present application provides a thermal contact sensor and method for accurate skin temperature control.

[0028] FIG. 1 is a three-dimensional representation of an example of the present applicator for skin treatment. Applicator 100 includes a frame 104 made of a heat and cold conducting material, for example, metal. Stainless steel is a good heat/cold conductor, and when applied to a subject skin, stainless steel is biocompatible and does not cause adverse skin effects. A plastic or other similar material cover 108 covers stainless steel frame 104 and forms a volume inside which, as it will be explained below, a plurality of semiconductor light sources such as LEDs or diode lasers are mounted on a printed circuit board 204 (FIG. 2). A thermoelectric cooling unit (not shown) could also be mounted inside the volume. A transparent window 112 transmitting the light emitted by the light sources is in thermal communication with stainless steel frame 104. Sapphire or quartz are materials from which window 112 is made. Several spaced apart thermal contact sensors 116 are inserted into stainless steel frame 104. The current design illustrates four thermal contact sensors 116, although the number of thermal and contact sensors 116 could be different, for example, two or eight or any other number sufficient to fulfill the task of accurate contact temperature detection and measurement. Sensors 116 are in thermal communication with stainless steel frame 104. An umbilical cable 120 provides communication between the light sources, and their power supplies 124. Umbilical cable 120 also collects thermal contact sensors 116 readings and transmits the readings to a processor. In one example, the processor is mounted inside applicator 100. In another example, a personal computer 128 CPU could be used.

[0029] Typically, stainless steel frame 104 could include coolant conducting channels. A cooling unit 132 supplies coolant through tubing included in umbilical cable 120. The cooled stainless steel frame is in thermal contact with sapphire window 112. The stainless steel frame cools the sapphire window and the skin or tissue area with which the sapphire window is in contact.

[0030] FIG. 2 is a bottom view of an example of the applicator of FIG. 1. Beneath transparent window 112 is located a rigid printed circuit board 204. A matrix of semiconductor light sources such as LEDs is mounted on printed circuit board 204. LEDs 208 provide optical or treatment radiation. LEDs 208 arranged in a matrix could have different layouts, for example, 2×2, configuration, 3×5, 7×9, or any other layout.

[0031] LEDs 208 could be of any type and packaging, such as COB (Chip on Board) SMD (Surface Mounted Diode), or regular bulb-like packaging. In some examples, diode lasers could be used instead of LEDs. LEDs 208 emit infrared optical radiation with a wavelength of 850 nm to 1100 nm. LED 208 could provide infrared optical radiation sufficient to irradiate the skin with the power of 0.5 Watt/sq.cm to 5.0 Watt/sq.cm and typically would provide infrared optical radiation sufficient to irradiate the skin with a power of 0.8 to 1.4 Watt/sq.cm. Sapphire window 112 transmits the optical radiation to the tissue. Pressure applied to the applicator by any known means supports proper thermal contact without voids between sapphire window 112 and the tissue. The pressure also facilitated a good thermal contact between the skin or tissue and cooled sapphire window 112, and stainless steel frame 104.

[0032] In the course of the skin treatment, applicator 100 (FIG. 1) maintains the skin and outer layers of the skin or tissue at a safe temperature. The heat generated by the outer skin layers absorption of the IR radiation is removed by conduction to cold sapphire window 112 and stainless steel frame 104. Several thermal contact sensors 116 built-in stainless steel frame 104 support monitoring of skin temperature to maintain safety skin treatment temperature.

[0033] FIG. 3A is a cut-through of an example of the stainless frame and a thermal contact sensor. The thermal contact sensor 300 contains a first temperature sensor 304 and a second temperature sensor 308, and a heat-generating element 312, which could be a regular resistor. A temperature sensor could be a commercially available thermistor or a themocouple. Each of the spaced-apart temperature sensors 304 and 308 is attached to a heat-conducting substrate, which is an enhanced copper solder coated pad 320 of the flexible printed circuit board 324. Resistor 312 is also attached to a corresponding separate enhanced copper solder coated pad 320 of the flexible printed circuit board 324. The flexible printed circuit is made of standard 12.5-80 microns thick Kapton® (polyimide film). The heat-conducting substrate or enhanced copper solder coated pad could be a standard 0.5 to 2 oz thick copper layer (0.089 to 0.203 mm).

[0034] Enhanced sensor and resistor solder coated copper-pad mounting structure is further in thermal communication with surface 328 of a can-like sensor housing 300 and supports almost real-time temperature reading. A thermal conductive glue could further enhance thermal communication of enhanced pads 320 with surface 328 of a can-like sensor housing 300.

[0035] FIG. 3B is a cut-through of another example of the stainless steel frame and a thermal contact sensor. The thermal contact sensor 300 contains one temperature sensor 304, and a heat-generating element 312, which could be a regular resistor. A temperature sensor could be a commercially available thermistor or a thermocouple. The temperature sensor 304 and second temperature sensor 308 are attached to a respective heat-conducting substrate, which is an enhanced copper solder coated pad 320 of the flexible printed circuit board 324. The flexible printed circuit is made of standard 12.5-80 microns thick Kapton® (polyimide film). The heat-conducting substrate or enhanced copper solder coated pad could be standard 0.5 to 2 oz copper coating (0.089 to 0.203 mm thick).

[0036] Enhanced temperature sensor and resistor solder coated copper-pad mounting structure is further in thermal communication with surface 328 of a can-like sensor housing 300 and supports almost real-time temperature reading. A thermally conductive glue 332 could further enhance thermal communication of enhanced pads 320 with surface 328 of a can-like sensor housing 300.

[0037] The thermal contact sensor 300 can-like housing 302 is made of stainless steel and is in thermal communication with stainless steel frame 104 and skin 316. Thermally conductive contact of can-like housing 302 of sensor 300 with stainless steel frame 104 could be achieved by pressing can-like sensor housing 302 into a receiving hole of stainless frame 104 or using a thermally conductive glue to connect between them. Sensor 300 can-like housing 302 wall or bottom 328, which is in contact with flexible circuit board 324, is thinner than other housing walls and is about 60 to 100 micron or less thin, and the thermal resistance of wall 328 is relatively low. Thermally conductive adhesive 332 could be used to coat all can-like contact surfaces being in contact with stainless steel frame 104 and improve thermal communication between the surfaces.

[0038] The first temperature sensor 304 and second temperature sensor 308 are in thermal communication with subject skin or tissue 316, and at the same time with a cooled stainless steel frame 104. The thermal resistance between thermistors 304 and 308 or only thermistor 304 and sensor and skin surface 316 is relatively small, as compared to the thermal resistance between thermistors 304 and 308, and stainless steel frame 104.

[0039] The thermal contact sensor 300 could operate in three operation modes:

[0040] Operation of thermal contact sensor 300 based on the temperature of the skin and stainless steel frame 104 measurements;

[0041] Operation of thermal contact sensor 300 based on the measurement of power supplied to the thermal contact sensor; and

[0042] Operation of thermal contact sensor 300 based on the difference in the thermal inertia of the sensor 300 in idle state and contact with the skin.

[0043] Operation of thermal contact sensor 300 based on the temperature of the skin and stainless steel frame 104 measurements.

[0044] In the course of skin treatment the stainless steel frame 104, sapphire window 112, and thermal contact sensors 300 are secure and firmly attached to skin 316. When in contact with skin 316, thermal contact sensor 300 measures temperature that is higher than the temperature of stainless steel frame 104 and lower than the temperature of skin or tissue 316. When the contact between sensor 300 and skin 316 is absent, sensor 300 is in thermal contact only with stainless steel frame 104 (idle state). In the absence of contact with skin 316, sensor 300 is measuring only the stainless steel frame 104 temperature. To support rapid sensing of temperature by sensor 300, the difference between the presence of contact with skin 316 and absence of contact with skin 316, CPU 128 operates heat-generating element 312 to maintain a definite temperature difference between skin 316 and stainless steel frame 104. For example, if the sensed temperature is 20 degrees C. or more, the sensor indicates the presence of contact with skin 316. If the sensed temperature is 15 degrees C. or less, the sensor indicates on absence of contact with skin 316.

[0045] If the stainless frame 104 temperature is 15 degrees C., CPU 128 operates heat-generating element 312 to heat the thermal contact sensor to about 20 degrees C. The heat-generating element or resistor 312 operates in pulse mode, in a cycle where resistor 312 is “ON” for 2 sec and “OFF” for the next two seconds. At the time of the OFF cycle, thermistor 312 is sensing and transmitting the measured temperature.

[0046] Operation of thermal contact sensor 300 based on the measurement of power supplied to the thermal contact sensor.

[0047] In this operation mode, resistor 312 operates in closed-loop control mode to maintain, for example, a constant thermal contact sensor temperature of 38 degrees C.

[0048] When thermal contact of thermal contact sensor 300 with the skin 216 (FIG. 3) exists, the contact is characterized by the increase in electric power consumed by resistor 312. For example, in the absence of contact between thermal contact sensor 300 and skin 316, the power consumed by resistor 312 could be 0.2 Watt. When the consumed by resistor 312 power is growing, for example to 0.3 Watt, the growth in the consumed power means that thermal contact sensor 300 is in contact with skin 316. In the absence of contact between thermal contact sensor 300 and skin 316, the power supplied to resistor 312 could be reduced.

[0049] Operation of thermal contact sensor 300 based on the thermal inertia of the sensor 300 in idle state and in contact with the skin.

[0050] CPU 128 or internal processor could be built to measure the time it takes to resistor 312 to rise the thermal contact sensor 100 temperature from 15 degrees C. to 38 degrees C. CPU 128 measures the time elapsed from the activation of resistor 312 until thermal contact sensor 300 reaches the target temperature, for example, from 20 degrees C. to 35 degrees C. Heating is done every about 2 sec (it takes about 1 sec to cool from 38 degrees C. to 15 degrees C.).

[0051] The time elapsed that takes resistor 312 to heat thermal contact sensor from 15 degrees C. to 38 degrees C. is a function of heated mass thermal inertia. In the absence of contact with the skin or tissue, the thermal mass of sensor 300 is relatively low, and the temperature rise is fast numeral 604 (FIG. 6). The rise time was measured to be about 400 msec (numeral 604). When thermal contact sensor 300 is in contact with skin 316, the thermal mass includes most close to the sensor 300 skin volume, and the thermal mass is large. The thermal contact sensor temperature rise is slow 608 and was measured to be 600 msec.

[0052] The present temperature contact sensor supports increased and transparent to the user ease of use and increased accuracy as compared to other known types of sensors.

[0053] The sensor supports accurate measurement of skin temperature in the treated skin area of a subject. The thermal contact sensor measures the thermal contact of the skin if the pressure of applicator is increased or decreased, and if the skin is wet or dry, the sensor will measure these changes. The sensor operates as heatsink by accumulating or dissipating the heat produced by the resistor.