Field-emission type electron source and charged particle beam device using the same
11848169 · 2023-12-19
Inventors
Cpc classification
International classification
Abstract
A field-emission type electron source includes (i) a single-crystal tungsten rod having a sharpened terminus and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus. In preferred design, the single-crystal tungsten rod is placed in a gaseous medium that consists of oxygen and a non-oxygen gas. The molar ratio between oxygen and the non-oxygen gas is greater than 1:1.
Claims
1. A field-emission type electron source comprising: (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein (1) the rod body immediately adjacent to the terminus has a diameter D.sub.b, (2) the terminus has a length Lt along an elongation direction of the tungsten rod; and (3) the terminus is so sharpened that its diameter D.sub.t (D.sub.t<D.sub.b) is decreased non-linearly along the length Lt from a value that is slightly smaller than D.sub.b to a minimal value D.sub.t0 at the apex of the terminus; and (ii) a mass of ZrO formed on a portion of the surface, or the entire surface, of the sharpened terminus, so as to shorten the distance that the mass of ZrO needs to diffuse to the apex.
2. The field-emission type electron source according to claim 1, wherein the mass of ZrO is formed only on a portion of the surface, or the entire surface, of the sharpened terminus; and wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus.
3. The field-emission type electron source according to claim 1, wherein the diameter D.sub.t at any position P of the terminus is smaller than the would-be D.sub.t at the same position P if the terminus's diameter D.sub.t is decreased linearly along the length L.sub.t from a value that is slightly smaller than D.sub.b to a minimal value D.sub.t0 at the apex of the terminus (e.g. when the terminus is sharpened by AC electrolytic polishing).
4. The field-emission type electron source according to claim 1, wherein the terminus is sharpened by DC electrolytic polishing.
5. The field-emission type electron source according to claim 4, wherein the DC electrolytic polishing is W(100) DC electrolytic polishing, and the electron source is configured for thermal field emission.
6. The field-emission type electron source according to claim 1, wherein D.sub.b is in the range of from 0.1 mm to 0.2 mm, and L.sub.t is in the range of from 0.15 mm to 0.2 mm.
7. The field-emission type electron source according to claim 1, wherein the mass of ZrO is on the surface of a segment of the sharpened terminus immediately adjacent to the rod body, and wherein the segment has a length of (30˜80)%×L.sub.t along the elongation direction of the tungsten rod.
8. The field-emission type electron source according to claim 1, wherein the single-crystal tungsten rod is placed in a gaseous medium, the gaseous medium consists of oxygen and a non-oxygen gas, and a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
9. A field-emission type electron source comprising: (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein the rod body immediately adjacent to the terminus has a diameter D.sub.b, and the terminus is so sharpened that its diameter D.sub.t (D.sub.t<D.sub.b) is decreased to a minimal value D.sub.t0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus.
10. The field-emission type electron source according to claim 9, wherein the terminus has a length L.sub.t along an elongation direction of the tungsten rod; and wherein the diameter D.sub.t is decreased non-linearly along the length L.sub.t from a value that is slightly smaller than D.sub.b to a minimal value D.sub.t0 at the apex of the terminus.
11. The field-emission type electron source according to claim 10, wherein the terminus is sharpened by DC electrolytic polishing.
12. The field-emission type electron source according to claim 10, wherein the diameter D.sub.t at any position of the terminus is smaller than the would-be D.sub.t at the same position if the terminus's diameter D.sub.t is decreased linearly along the length L.sub.t from a value that is slightly smaller than D.sub.b to a minimal value D.sub.t0 at the apex of the terminus.
13. The field-emission type electron source according to claim 12, wherein the terminus is sharpened by W(100) DC electrolytic polishing, and wherein the electron source is configured for thermal field emission.
14. The field-emission type electron source according to claim 9, wherein D.sub.b is in the range of from 0.1 mm to 0.2 mm, wherein D.sub.t0 is in the range of from 4 nm (DC electrolytic polishing) to 300 nm (AC electrolytic polishing), and wherein the terminus has a length L.sub.t along an elongation direction of the tungsten rod and L.sub.t is in the range of from 0.15 mm to 0.2 mm.
15. The field-emission type electron source according to claim 9, wherein the terminus has a length L.sub.t along an elongation direction of the tungsten rod; and wherein the diameter D.sub.t is decreased linearly along the length L.sub.t from a value that is slightly smaller than D.sub.b to a minimal value D.sub.t0 at the apex of the terminus.
16. The field-emission type electron source according to claim 15, wherein the terminus is sharpened by AC electrolytic polishing.
17. The field-emission type electron source according to claim 9, wherein the mass of ZrO is on the surface of a segment of the sharpened terminus immediately adjacent to the rod body, and wherein the segment has a length of (30˜80)%×L.sub.t along the elongation direction of the tungsten rod.
18. The field-emission type electron source according to claim 9, wherein the single-crystal tungsten rod is placed in a gaseous medium, wherein the gaseous medium consists of oxygen and a non-oxygen gas, and wherein a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
19. A charged particle beam device comprising a field-emission type electron source, (A) wherein the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein (1) the rod body immediately adjacent to the terminus has a diameter D.sub.b, (2) the terminus has a length L.sub.t along an elongation direction of the tungsten rod; and (3) the terminus is so sharpened that its diameter D.sub.t (D.sub.t<D.sub.b) is decreased non-linearly along the length L.sub.t from a value that is slightly smaller than D.sub.b to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO formed on a portion of the surface, or the entire surface, of the sharpened terminus, so as to shorten the distance that the mass of ZrO needs to diffuse to the apex; or (B) wherein the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein the rod body immediately adjacent to the terminus has a diameter D.sub.b, and the terminus is so sharpened that its diameter D.sub.t (D.sub.t<D.sub.b) is decreased to a minimal value D.sub.t0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus.
20. The charged particle beam device according to claim 19, which is an electron microscope, a semiconductor electron microscope equipment, a critical dimension examine tool, an electron beam tester, an Auger electron spectrometer, an electron beam lithography apparatus, or other electron beam related systems.
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
(1) The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements. All the figures are schematic and generally only show parts which are necessary in order to elucidate the invention. For simplicity and clarity of illustration, elements shown in the figures and discussed below have not necessarily been drawn to scale. Well-known structures and devices are shown in simplified form, omitted, or merely suggested, in order to avoid unnecessarily obscuring the present invention.
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
(15) In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent, however, to one skilled in the art that the present invention may be practiced without these specific details or with an equivalent arrangement.
(16) Where a numerical range is disclosed herein, unless otherwise specified, such range is continuous, inclusive of both the minimum and maximum values of the range as well as every value between such minimum and maximum values. Still further, where a range refers to integers, only the integers from the minimum value to and including the maximum value of such range are included. In addition, where multiple ranges are provided to describe a feature or characteristic, such ranges can be combined.
(17) It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the invention. For example, when an element is referred to as being “on”, “connected to”, or “coupled to” another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element, there are no intervening elements present.
(18) Throughout the specification and claims, the following terms take the meanings explicitly associated herein, unless the context clearly dictates otherwise. The phrase “in one embodiment” does not necessarily refer to the same embodiment, although it may. Furthermore, the phrase “in another embodiment” does not necessarily refer to a different embodiment, although it may. Thus, as described below, various embodiments of the invention may be readily combined without departing from the scope or spirit of the invention.
(19) In addition, as used herein, the term “or” is an inclusive “or” operator, and is equivalent to the term “and/or,” unless the context clearly dictates otherwise. The term “based on” is not exclusive and allows for being based on additional factors not described, unless the context clearly dictates otherwise. In addition, throughout the specification, the meaning of “a,” “an,” and “the” include plural references. The meaning of “in” includes “in” and “on.”
(20) Referring again to
(21) The conventional Schottky emitter 12 in
(22) We have solved these problems. With reference to
(23) With reference to
(24) Any known methods may be employed to form ZrO 06 on a portion of the surface, or the entire surface, of the sharpened terminus 04. For example, a slurry-like gel where zirconia or zirconium fine particles or zirconium hydride is mixed in an organic solvent or the like is adhered to the sharpened terminus 04, using a tool like an ink brush, a dropper, or a syringe, and then is heated in a vacuum state and sintered. In the case of zirconium or zirconium hydride, the process of performing oxidization by, for example, heating in oxygen gas is added thereafter.
(25) After being coated, ZrO 06 may be supplied onto a tungsten crystal plane such as plane (100) on apex 05 by diffusion (such as thermal diffusion) to form a region with a low work function. By applying a strong electric field, thermoelectrons that surpass a potential barrier and electrons transmitted by the tunnel effect can be extracted.
(26) Referring to
(27) In preferred embodiments as shown in
(28) The profile of “linearly tapered terminus” may be obtained or sharpened by AC electrolytic polishing. In contrast, the profile of “non-linearly tapered terminus” as shown in
(29) Electrolytic polishing is a technique of soaking a thin wire into electrolyte solution, followed by application of voltage, thus fabricating a sharpened tip end or terminus 04. The terminus 04 may have different shapes between DC voltage and AC voltage applied (hereinafter polishing by DC voltage is called DC electrolytic polishing and polishing by AC voltage is called AC electrolytic polishing). When a tungsten monocrystal thin wire having axial orientation of <100> polished, the resultant tip end has a different angle at a conical part (cone angle) between the DC electrolytic polishing and the AC electrolytic polishing. When the tip end is sharpened by DC electrolytic polishing, the tip end is polished like a curve, and the cone angle alpha is 10 degree or less. On the other hand, when the tip end is sharpened by AC electrolytic polishing, the cone angle of the tip can be made large of 15 degree or more. When a tip having the cone angle of 10 degree or less is used as an electron source, deformation of the tip end due to atoms moving at the surface is less, meaning good stability of the emission current. When the cone angle is small, electric field generated around the tip is easily concentrated on the tip when voltage is applied to the tip. That is, this has advantages that a power supply of small capacity is enough to emit a certain amount of current. For more details related to DC and AC electrolytic polishings, please see US Published Application 2015/0255240A1, which is incorporated herein by reference.
(30) As shown in
(31) Various embodiments of the invention provide a field-emission type electron source 01 as shown in
(32) As shown in
(33) In preferred embodiments, the diameter Dt at any position of the terminus 04 is smaller than the would-be Dt at the same position if the terminus's diameter Dt is decreased linearly along the length Lt from a value that is slightly smaller than Db to a minimal value Dt0 at the apex of the terminus. Such a terminus may be sharpened by W(100) or W(310) DC electrolytic polishing, and the electron source is configured for thermal field emission.
(34) In other embodiments, the terminus 04 may have a length Lt along an elongation direction of the tungsten rod 02; and the diameter Dt is decreased linearly along the length Lt from a value that is slightly smaller than Db to a minimal value Dt0 at the apex 05 of the terminus 04. Such a terminus may be sharpened by AC electrolytic polishing.
(35) In preferred embodiments as shown in
(36) In various embodiments, Db may be in the range of from 0.1 mm to 0.2 mm. Dt0 may be in the range of from 4 nm (DC electrolytic polishing) to 300 nm (AC electrolytic polishing). The terminus 04 may have a length Lt along an elongation direction of the tungsten rod 02 and Lt may be in the range of from 0.15 mm to 0.2 mm.
(37) Referring to
(38) Hexaborides such as lanthanum hexaboride (LaB.sub.6) and cerium hexaboride (CeB.sub.6) are refractory ceramic materials with low work functions, around 2.5 eV. They are also somewhat resistant to cathode poisoning. As such, the principal use of these hexaborides is in hot cathodes, either as a single crystal or as a coating deposited by physical vapor deposition. Cerium hexaboride cathodes have a lower evaporation rate at 1700 K than lanthanum hexaboride, but they become equal at temperatures above 1850 K. Cerium hexaboride cathodes have one and half the lifetime of lanthanum hexaboride, due to the former's higher resistance to carbon contamination. Hexaboride cathodes are about ten times “brighter” than tungsten cathodes, and they have 10-15 times longer lifetime. CeB.sub.6 has proven to be more resistant to the negative impact of carbon contamination than LaB.sub.6.
(39) Examples of the non-oxygen gas in the gaseous medium include, but are not limited to, H.sub.2, N.sub.2, CO, or any mixture thereof. The gaseous medium may maintain a pressure of from about 10.sup.−11 torr to 10.sup.−8 torr within the electron source 01. In some embodiments as shown in
(40) As shown in
(41) The crystal rod may be selected from a single-crystal tungsten rod with a W(110) tip facet (or apex facet) in the sharpened terminus, a single-crystal tungsten rod with a W(310) tip facet (or apex facet) in the sharpened terminus, a LaB.sub.6 crystal rod, and a CeB.sub.6 crystal rod; and the electron source is configured for cold field emission.
(42) As shown in
(43) Referring again to
(44) As previously described, the mass of ZrO 06 may be formed on the surface of a segment 51 of the sharpened terminus 04 immediately adjacent to the rod body 03. The segment 51 may have a length of (30˜80)%×Lt along the elongation direction of the tungsten rod 02. Db is in the range of from 0.1 mm to 0.2 mm. Dt0 is in the range of from 4 nm (DC electrolytic polishing) to 300 nm (AC electrolytic polishing). The terminus 04 may have a length Lt along an elongation direction of the tungsten rod and Lt is in the range of from 0.15 mm to 0.2 mm.
(45) As shown in
(46) In (B), the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein the rod body immediately adjacent to the terminus has a diameter Db, and the terminus is so sharpened that its diameter Dt (Dt<Db) is decreased to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus.
(47) In (C), the field-emission type electron source comprises a crystal rod placed in a gaseous medium, wherein the crystal rod is a single-crystal tungsten rod, a LaB.sub.6 crystal rod, or a CeB.sub.6 crystal rod; wherein the gaseous medium consists of oxygen and a non-oxygen gas, and wherein a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
(48) In some embodiments, the charged particle beam device 10 may include two of the field-emission type electron sources such as (A+B). Specifically, the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein (1) the rod body immediately adjacent to the terminus has a diameter Db, (2) the terminus has a length Lt along an elongation direction of the tungsten rod; and (3) the terminus is so sharpened that its diameter Dt (Dt<Db) is decreased non-linearly along the length Lt from a value that is slightly smaller than Db to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus.
(49) In some embodiments, the charged particle beam device 10 may include two of the field-emission type electron sources such as (A+C). Specifically, the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein (1) the rod body immediately adjacent to the terminus has a diameter Db, (2) the terminus has a length Lt along an elongation direction of the tungsten rod; and (3) the terminus is so sharpened that its diameter Dt (Dt<Db) is decreased non-linearly along the length Lt from a value that is slightly smaller than Db to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO on a portion of the surface, or the entire surface, of the sharpened terminus; wherein the single-crystal tungsten rod is placed in a gaseous medium; and wherein the gaseous medium consists of oxygen and a non-oxygen gas, and wherein a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
(50) In some embodiments, the charged particle beam device 10 may include two of the field-emission type electron sources such as (B+C). Specifically, the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein the rod body immediately adjacent to the terminus has a diameter Db, and the terminus is so sharpened that its diameter Dt (Dt<Db) is decreased to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus; wherein the single-crystal tungsten rod is placed in a gaseous medium; and wherein the gaseous medium consists of oxygen and a non-oxygen gas, and wherein a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
(51) In some embodiments, the charged particle beam device 10 may include all the three field-emission type electron sources as described above (A+B+C). Specifically, the field-emission type electron source comprises (i) a single-crystal tungsten rod having a sharpened terminus extending from a rod body, wherein (1) the rod body immediately adjacent to the terminus has a diameter Db, (2) the terminus has a length Lt along an elongation direction of the tungsten rod; and (3) the terminus is so sharpened that its diameter Dt (Dt<Db) is decreased non-linearly along the length Lt from a value that is slightly smaller than Db to a minimal value Dt0 at the apex of the terminus; and (ii) a mass of ZrO formed only on a portion of the surface, or the entire surface, of the sharpened terminus; wherein no ZrO is formed on the single-crystal tungsten rod except the sharpened terminus; wherein the single-crystal tungsten rod is placed in a gaseous medium; and wherein the gaseous medium consists of oxygen and a non-oxygen gas, and wherein a molar ratio between oxygen and the non-oxygen gas is greater than 1:1, 10:1, 50:1, or 100:1.
(52) For the charged particle beam device 10, effects of said ZrO include one or more of the following: (1) making the ZrO diffusion to the apex more easily to happen; (2) shorter diffusion distance for ZrO; (3) preventing or alleviating the formation of chips or cracks on the ZrO; (4) less loss of ZrO; (5) extending the practical life of the thermal field-emission type electron source; (6) lower temperature within the thermal field-emission type electron source; (7) smaller apex size under lower temperature within the electron source; (8) higher resolution; and (9) higher angular intensity, for example greater than 50%, 100%, 150% or even 200% improvement of angular intensity (e.g. from 1 mA/sr to 3 mA/sr). Effects of said oxygen in the gaseous medium (if any) include one or more of the following: (1) facilitating the ZrO diffusion for thermal field-emission type electron source; (2) cleaning containments caused by H.sub.2 and CO on the tip of LaB.sub.6 crystal rod and the CeB.sub.6 crystal rod for cold field-emission type electron source; (3) cleaning containments caused by H.sub.2 and CO on the tip of the tungsten rod (110) and (310) for cold field-emission type electron source; (4) lower temperature within the electron source for thermal field-emission type electron source; (5) smaller apex size under lower temperature within the electron source field-emission type electron source; (6) higher resolution; and (7) higher angular intensity, for example greater than 50%, 100%, 150% or even 200% improvement of angular intensity (e.g. from 1 mA/sr to 3 mA/sr).
(53) Examples of the charged particle beam device 10 include, but are not limited to, an electron microscope, a semiconductor electron microscope equipment, a critical dimension examine tool, an electron beam tester, an Auger electron spectrometer, an electron beam lithography apparatus, or other electron beam related systems.
(54) As shown in
(55) In the foregoing specification, embodiments of the present invention have been described with reference to numerous specific details that may vary from implementation to implementation. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. The sole and exclusive indicator of the scope of the invention, and what is intended by the applicant to be the scope of the invention, is the literal and equivalent scope of the set of claims that issue from this application, in the specific form in which such claims issue, including any subsequent correction.