Method for marking workpieces and workpiece
10994320 · 2021-05-04
Assignee
Inventors
Cpc classification
B21D22/022
PERFORMING OPERATIONS; TRANSPORTING
B05D7/26
PERFORMING OPERATIONS; TRANSPORTING
B21C51/00
PERFORMING OPERATIONS; TRANSPORTING
B21D22/201
PERFORMING OPERATIONS; TRANSPORTING
B41K99/00
PERFORMING OPERATIONS; TRANSPORTING
B41M5/0058
PERFORMING OPERATIONS; TRANSPORTING
B21D22/00
PERFORMING OPERATIONS; TRANSPORTING
B21D22/208
PERFORMING OPERATIONS; TRANSPORTING
B05D7/16
PERFORMING OPERATIONS; TRANSPORTING
B05D2350/60
PERFORMING OPERATIONS; TRANSPORTING
International classification
B21C51/00
PERFORMING OPERATIONS; TRANSPORTING
B05D3/00
PERFORMING OPERATIONS; TRANSPORTING
B41K99/00
PERFORMING OPERATIONS; TRANSPORTING
B05D7/26
PERFORMING OPERATIONS; TRANSPORTING
B21D22/00
PERFORMING OPERATIONS; TRANSPORTING
B21D22/02
PERFORMING OPERATIONS; TRANSPORTING
Abstract
In an embodiment, a workpiece includes a hot-formed metal body and a marking, wherein the marking comprises a phosphor and/or pigments which are at least partly arranged on the metal body and which exhibit a reflection behavior and/or a reflectance behavior and/or an albedo behavior deviating from the metal body.
Claims
1. A workpiece comprising: a hot-formed metal body; and a marking consisting of an inorganic matrix material that is glass and of phosphor particles and/or ceramic colored particles which are at least partly arranged on the metal body and which are configured to exhibit a reflection behavior and/or a reflectance behavior and/or an albedo behavior deviating from the metal body, wherein the matrix material acts as an adhesion promoter and as an adhesive between the metal body and the phosphor particles and/or the ceramic colored particles, and wherein the phosphor particles consist of at least one of the following phosphors: Eu.sup.2+-doped nitrides; garnets from the general system (Gd,Lu,Tb,Y).sub.3(Al,Ga,D).sub.5(O,X).sub.12:RE, where X=halide, N or divalent element, D=trivalent or tetravalent element and RE=rare earth metals; Eu.sup.2+-doped SiONs; SiAlONs; beta-SiAlONs from the system Si.sub.6-xAl.sub.zO.sub.yN.sub.8-y:RE.sub.Z; nitrido-orthosilicates; orthosilicates; chlorosilicates; chlorophosphates; BAM phosphors from a BaO-MgO-Al.sub.2O.sub.3 system; halophosphates; or (Sr,Ba,Ca).sub.5(PO.sub.4).sub.3Cl:Eu.sup.2.
2. The workpiece of claim 1, further comprising an anti-scaling protective layer applied to the metal body, wherein the marking is at least partly applied to the anti-scaling protective layer, and wherein the marking is configured to exhibit the reflection behavior and/or the reflectance behavior and/or the albedo behavior deviating from the metal body as well as from the anti-scaling protective layer.
3. The workpiece according to claim 2, wherein a melting point of the marking is at least 25° C. above a melting point of the anti-scaling protective layer.
4. The workpiece according to claim 2, wherein the anti-scaling protective layer comprises aluminum, silicon, zinc, iron and/or a metal oxide.
5. The workpiece according to claim 2, wherein the marking is elevated above the anti-scaling protective layer.
6. The workpiece according to claim 2, wherein the particles of the marking at least partly penetrate through the anti-scaling protective layer, are partly in contact with the metal body and do not project from the anti-scaling protective layer.
7. The workpiece according to claim 2, wherein the marking comprises a plurality of continuous marking regions, a thickness of the marking regions being at least 0.5 μm and at most 25 μm, wherein, in the marking regions, phosphor particles are present in a manner stacked one above another, the phosphor particles being embedded into a continuous matrix material, and wherein the marking regions have a reduced surface roughness compared with the anti-scaling protective layer adjacent to the marking regions.
8. The workpiece according to claim 2, wherein the marking is applied onto the anti-scaling protective layer and does not penetrate into the anti-scaling protective layer, the marking consisting of the inorganic matrix material and of the phosphor particles.
9. The workpiece according to claim 1, wherein the marking, as seen in plan view, is formed by a plurality of punctiform, island-shaped partial regions having a mean diameter of at most 50 μm, wherein the marking, as seen in plan view and considered with all partial regions taken together, has a mean extent of at least 20 times the mean diameter, and wherein a mean roughness of a surface of the workpiece at the marking deviates from a mean roughness of remaining regions of the surface by at most a factor of 2.
10. The workpiece according to claim 1, wherein the marking comprises at least one continuous marking region, wherein the at least one marking region has a mean extent of at least 20 times a mean diameter of color pigments of the marking.
11. The workpiece according to claim 1, wherein the marking is distant from the metal body.
12. The workpiece according to claim 1, wherein the marking is completely located in a recess of the metal body.
13. The workpiece according to claim 12, wherein a depth of the recess exceeds a thickness of the metal body.
14. The workpiece according to claim 1, wherein the marking is completely located on an elevation of the metal body.
15. A workpiece comprising: a hot-formed metal body; an anti-scaling protective layer directly on the metal body and composed of aluminum oxide and configured to prevent oxidation of the workpiece in an oxygen-containing atmosphere; and a marking composed of a decarbonized matrix material and a phosphor which are at least partly arranged on the metal body and which are configured to exhibit a reflection behavior and/or a reflectance behavior and/or an albedo behavior deviating from the metal body, wherein the phosphor consists of at least one of the following phosphors: (Ca,Sr)AlSiN.sub.3:Eu.sup.2+; Sr(Ca,Sr)Si.sub.2Al.sub.2N.sub.6:Eu.sup.2+; (Sr,Ca)AlSiN.sub.3*Si.sub.2N.sub.2O:Eu.sup.2+; (Ca,Ba,Sr).sub.2Si.sub.5N.sub.8:Eu.sup.2+; (Sr,Ca)[LiAl.sub.3N.sub.4]:Eu.sup.2+; Lu.sub.3(Al.sub.1-xGa.sub.x).sub.5O.sub.12:Ce.sup.3+; Y.sub.3(Al.sub.1-xGa.sub.x).sub.5O.sub.12:Ce:.sup.3+; (Ca,Sr,Ba)S:Eu.sup.2+; (Ba,Sr,Ca)Si.sub.2O.sub.2N.sub.2:Eu.sup.2+; Li.sub.xM.sub.yLn.sub.zSi.sub.12-(m+n)Al.sub.(m+n)O.sub.nN.sub.16-n; Si.sub.6-xAl.sub.zO.sub.yN.sub.8-y:RE.sub.Z; AE.sub.2-x-nRE.sub.xEu.sub.aSiO.sub.4-xN.sub.x, AE.sub.2-x-nRE.sub.xEu.sub.aSi.sub.1-yO.sub.4-x-2yN.sub.x, where RE=rear earth metal and AE=alkaline earth metal; (Ba,Sr,Ca,Mg).sub.2SiO.sub.4:Eu.sup.2+; Ca.sub.8Mg(SiO.sub.4).sub.4Cl.sub.2:Eu.sup.2+; (Sr,Ba,Ca,Mg).sub.10(PO.sub.4).sub.6Cl.sub.2:Eu.sup.2+; BaMgAl.sub.10O.sub.17:Eu.sup.2+; M.sub.5(PO.sub.4).sub.3(Cl,F):(Eu.sup.2+, Sb.sup.3+, Mn.sup.2+); or (Sr,Ba,Ca).sub.5(PO.sub.4).sub.3Cl:Eu.sup.2+, and wherein the marking is applied directly to the anti-scaling protective layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) A method described here and a workpiece described here are explained in greater detail below on the basis of exemplary embodiments with reference to the drawing. In this case, identical reference signs indicate identical elements in the individual figures. However, relations to scale are not illustrated; rather individual elements may be illustrated with an exaggerated size in order to afford a better understanding. In the figures:
(2)
(3)
(4)
(5)
(6)
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
(7)
(8) Optionally, see
(9) In the method step in
(10) Afterward, the blank 2 with the marking 3 is heated to a deformation temperature. The deformation temperature is approximately 930° C., for example.
(11) Subsequently, see
(12) Shaping to form the metal body 11 is preferably deep-drawing. In this case, the blank 2 previously brought to the deformation temperature is introduced into a cooled mold (not illustrated) and pressed, thus giving rise to the metal body 11. In this case, a deformation temperature is preferably higher than the melting points of the anti-scaling protective layer 22 and of the marking 3, wherein a melting point of the marking 3 is higher than a melting point of the anti-scaling protective layer 22. In the cooled mold, the marking 3 then solidifies before the anti-scaling protective layer 22, thereby preventing or greatly reducing running of the marking 3 during deep-drawing.
(13) In the optional method step in
(14)
(15)
(16) In accordance with
(17) In the case of the exemplary embodiment in
(18)
(19)
(20) The individual particles of the marking 3 form partial regions 38 that are grouped. By virtue of the grouped partial regions 38, see
(21)
(22) It is possible for the marking regions 39 to be partly pressed into the anti-scaling protective layer 22. Likewise, the marking regions 39 preferably have a reduced surface roughness compared with the anti-scaling protective layer 22, as illustrated schematically in
(23) Also, analogously to
(24)
(25) Afterward, the matrix material 35, which is an acrylic lacquer, in particular, is decarbonized during the heating of the blank 2 to the deformation temperature and/or during deep-drawing, such that only the phosphor particles 33 remain. In other words, the matrix material 35 preferably disappears without residue as a result of the elevated temperature during the production method.
(26) In accordance with
(27) Since the phosphor particles 33 are thus applied to the anti-scaling protective layer 22 without matrix material, it is possible, for example, directly before lacquering, not illustrated in
(28) The invention described here is not restricted by the description on the basis of the exemplary embodiments. Rather, the invention encompasses any novel feature and also any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.