Decorated surface-structured wall or floor panel
10967671 · 2021-04-06
Assignee
Inventors
Cpc classification
B44C5/04
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
The disclosure relates to a decorated, surface-structured wall or floor panel and a method for manufacturing same. The decorated, surface-structured wall or floor panel of the disclosure comprises a substrate made of a plastic composite material, a primer coat on a surface of the substrate, a decorative coat on the primer coat, a coat of radiation-curable varnish on the decorative coat, a structured plastic film on the coat of radiation-curable varnish, and a coat of finishing varnish on the structured plastic film.
Claims
1. A decorated and surface-structured wall or floor panel comprising: a carrier made of a plastic composite material; a primer layer disposed on a surface of the carrier; a decorative layer disposed on the primer layer; a layer of a radiation-curable varnish disposed on the decorative layer; a structured plastic film disposed on the layer of a radiation-curable varnish; and a topcoat layer disposed on the structured plastic film, wherein the carrier comprises a plastic-containing matrix material in which a solid mineral material is embedded.
2. The decorated and surface-structured wall or floor panel according to claim 1, wherein the primer layer comprises a radiation-curing urethane and/or urethane acrylate.
3. The decorated and surface-structured wall or floor panel according to claim 1, wherein the decorative layer comprises at least one radiation-curing ink composition.
4. The decorated and surface-structured wall or floor panel according to claim 1, wherein the varnish applied onto the decorative layer in order to form a layer of a radiation-curable varnish comprises an acrylate, a diacrylate, a methacrylate, a urethane, urethane acrylate or mixtures thereof.
5. The decorated and surface-structured wall or floor panel according to claim 1, wherein the structured plastic film is made of a plastic selected from the group consisting of polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), polycarbonate (PC), polybutylene terephthalate (PBT), a polytrimethylene terephthalate (PTT), a copolymer or a block copolymer thereof.
6. The decorated and surface-structured wall or floor panel according to claim 1, wherein the structured plastic film has a thickness between >60 μm and ≤500 μm, preferably between ≥80 μm and ≤350 μm, in particular between ≥100 μm and ≤300 μm.
7. The decorated and surface-structured wall or floor panel according to claim 1, wherein the structures plastic film has an embossing depth between 60 μm and 180 μm.
8. The decorated and surface-structured wall or floor panel according to claim 1, wherein the varnish applied onto the structured plastic film for forming a topcoat layer comprises an acrylate, a diacrylate, a methacrylate, a urethane, urethane acrylate or mixtures thereof.
9. The decorated and surface-structured wall or floor panel according to claim 1, wherein the panel comprises complementary locking means at at least two opposite edges by means of which panels can be joined together in order to form a connected wall or floor covering.
10. A method for producing a decorated and surface-structured wall or floor panel, comprising the steps: a) providing a carrier made of a plastic composite material; b) applying a primer layer onto a surface of the provided carrier; c) applying a decorative layer onto the primer layer applied in step b) by means of a direct printing process; d) applying a layer of a radiation-curable varnish onto the decorative layer applied in step c); then either e1) applying a non-structured plastic film onto the not yet or not yet completely cured layer of the radiation-curable varnish applied in step d); e2) curing the layer of a radiation-curable varnish applied in step d) by the action of suitable electromagnetic radiation or cooling, wherein the plastic film applied in step e1) is bonded to the remaining layer structure; e3) structuring the non-structured plastic film applied in step e1) by an embossing means to form a structured plastic film; or e1′) applying a structured plastic film onto the not yet or not yet fully cured layer of the radiation-curable varnish applied in step d); e2′) curing the layer of the radiation-curable varnish applied in step d) by the action of suitable electromagnetic radiation or cooling, wherein the plastic film applied in step e1′) is bonded to the remaining layer structure; subsequently f) applying at least one covering layer of a radiation-curable varnish onto the structured plastic film; and g) curing the at least one covering layer applied in step f).
11. The method according to claim 10, wherein as the embossing means in step e3) an embossing roller, an embossing plate or an embossing die with an embossing depth is used, which is less than the thickness of the plastic film applied in step e1).
12. The method according to claim 10, wherein step e3) is carried out under the action of heat and the heat action is controlled such that the plastic film is heated to a temperature in the range between 30% and 80%, preferably 40% and 70% of the melting temperature of the plastic film material.
13. The method according to claim 10, wherein the side of the plastic film facing the carrier is subjected to a corona treatment and/or a plasma treatment prior to the application onto the not yet or not yet fully cured layer of the radiation-curable varnish applied in step d) and/or an adhesive primer is applied onto the side of the plastic film facing the carrier plate.
14. The method according to claim 13, wherein a composition comprising a swelling agent and/or a solvent suitable for the plastic film material is applied as an adhesive primer.
Description
DRAWINGS
(1) The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
(2) The disclosure is explained below in detail with reference to the figures and an exemplary embodiment.
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(6) Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
DETAILED DESCRIPTION
(7) Example embodiments will now be described more fully with reference to the accompanying drawings.
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(11) The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.