Irradiating a machining field
11007576 · 2021-05-18
Assignee
Inventors
- Frank Peter Wuest (Herrenberg, DE)
- Frederik Schaal (Fellbach, DE)
- Matthias Allenberg-Rabe (Stuttgart, DE)
Cpc classification
B22F10/32
PERFORMING OPERATIONS; TRANSPORTING
B22F10/28
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/034
PERFORMING OPERATIONS; TRANSPORTING
B22F2203/11
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
B22F10/368
PERFORMING OPERATIONS; TRANSPORTING
B22F10/28
PERFORMING OPERATIONS; TRANSPORTING
B22F12/44
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
B22F12/90
PERFORMING OPERATIONS; TRANSPORTING
G01J5/20
PHYSICS
B22F12/44
PERFORMING OPERATIONS; TRANSPORTING
B29C64/20
PERFORMING OPERATIONS; TRANSPORTING
Y02P10/25
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
B29C67/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B22F12/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/20
PERFORMING OPERATIONS; TRANSPORTING
B23K26/03
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An irradiating device for irradiating a machining field with a machining beam, in particular with a laser beam, for carrying out a welding process, is provided. The irradiating device includes a beam scanner for aligning the machining beam to a machining position in the machining field. The irradiating device has an imaging device for imaging a part-region of the machining field on a pyrometer which has at least two pyrometer segments. The imaging device images thermal radiation which emanates from the machining position in the machining field on a first pyrometer segment, and images thermal radiation which emanates from a position in the machining field being situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field on at least one second pyrometer segment. A machine tool having such an irradiating device is also provided.
Claims
1. An irradiating device for irradiating a machining field with a machining beam for carrying out a welding process, the irradiation device comprising: a beam scanner configured to align the machining beam along a machining beam path to a machining position in the machining field; and an imaging device configured to image a part-region of the machining field on a pyrometer having at least two pyrometer segments, wherein the imaging device is configured to image thermal radiation emanating from the machining position in the machining field and being aligned by the beam scanner along an observation beam path on a first pyrometer segment of the pyrometer, and image thermal radiation emanating from at least one position in the machining field situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field and being aligned by the beam scanner along the observation beam path on at least one second pyrometer segment of the pyrometer, wherein the observation beam path is at least partially coaxial with the machining beam path in an opposing direction, and wherein the first pyrometer segment and the at least one second pyrometer segment are associated with different responsive characteristics in relation to the thermal radiation emanating from the machining field.
2. The irradiating device of claim 1, wherein the first pyrometer segment and the at least one second pyrometer segment are formed on a surface of a structured diode.
3. The irradiating device of claim 2, wherein at least two of the pyrometer segments on the surface of the structured diode have different wavelength-dependent sensitivities in relation to the thermal radiation emanating from the machining field.
4. The irradiating device of claim 3, wherein the first pyrometer segment of the structured diode has a maximum sensitivity at a first maximum wavelength that is less than a second maximum wavelength of the at least one second pyrometer segment of the structured diode.
5. The irradiating device of claim 1, wherein each of the first pyrometer segment and the at least one second pyrometer segment is connected to a respective detector by a respective radiation transporter.
6. The irradiating device of claim 5, wherein at least two of the detectors have different wavelength-dependent sensitivities in relation to the thermal radiation emanating from the machining field.
7. The irradiating device of claim 6, wherein a first detector connected to the first pyrometer segment has a maximum sensitivity at a first maximum wavelength that is less than a second maximum wavelength of at least one second detector connected to the at least second pyrometer segment.
8. The irradiating device of claim 1, further comprising a filter disposed between the machining field and at least one of the first pyrometer segment or the at least one second pyrometer segment, wherein the filter is configured for wavelength-dependent attenuation of the thermal radiation emanating from the machining field.
9. The irradiating device of claim 1, wherein at least one of the first pyrometer segment or the at least one second pyrometer segment has at least one curved external edge.
10. The irradiating device of claim 1, wherein the first pyrometer segment is circular.
11. The irradiating device of claim 1, which the pyrometer has at least two second pyrometer segments configured as annular segments.
12. The irradiating device of claim 11, wherein the at least two second pyrometer segments are disposed to be rotationally symmetrical about the first pyrometer segment.
13. The irradiating device of claim 11, wherein the at least two second pyrometer segments are disposed in a plurality of concentric rings.
14. The irradiating device of claim 1, wherein the pyrometer is disposed in an observation beam path running coaxially with the machining beam.
15. The irradiating device of claim 1, further comprising: a loop controller configured to predefine the advancing direction in a movement of the machining beam across the machining field.
16. The irradiating device of claim 15, further comprising: an evaluator configured to identify at least one of second pyrometer segments disposed ahead of the machining position in the advancing direction or second pyrometer segments disposed behind the machining position in the advancing direction.
17. The irradiating device of claim 16, wherein the evaluator is configured to: determine a temperature at the machining position and at least one of a temperature at a position in the machining field ahead of the machining position or a temperature at a position in the machining field behind the machining position; and determine at least one temperature gradient by at least two of the temperatures.
18. The irradiating device of claim 17, wherein the loop controller is configured to regulate, based on at least one of the determined temperature gradient or at least one of the determined temperatures, at least one of an output of the machining beam in the machining field or an advancing speed.
19. A machine tool for producing three-dimensional components by irradiating powder layers by a machining beam, comprising: a machining chamber having a support for applying the powder layers; and an irradiating device configured to irradiate the powder layers in the machining chamber with the machining beam, the irradiating device comprising: a beam scanner configured to align the machining beam to a machining position in a machining field in the machining chamber; an imaging device configured to image a part-region of the machining field on a pyrometer having at least two pyrometer segments, wherein the imaging device is configured to image thermal radiation emanating from the machining position in the machining field on a first pyrometer segment of the pyrometer, and image thermal radiation emanating from at least one position in the machining field situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field on at least one second pyrometer segment of the pyrometer; a loop controller configured to predefine the advancing direction in a movement of the machining beam across the machining field; and an evaluator configured to identify at least one of second pyrometer segments disposed ahead of the machining position in the advancing direction or second pyrometer segments disposed behind the machining position in the advancing direction.
20. The machine tool of claim 19, wherein the irradiating device is disposed in relation to the machining chamber such that the machining field of the beam scanner in which the machining beam is focused is congruent with a position of one of the powder layers to be irradiated by the machining beam.
21. An irradiating device for irradiating a machining field with a machining beam for carrying out a welding process, the irradiation device comprising: a beam scanner configured to align the machining beam to a machining position in the machining field; an imaging device configured to image a part-region of the machining field on a pyrometer having at least two pyrometer segments, wherein the imaging device is configured to image thermal radiation emanating from the machining position in the machining field on a first pyrometer segment of the pyrometer, and image thermal radiation emanating from at least one position in the machining field situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field on at least one second pyrometer segment of the pyrometer; a loop controller configured to predefine the advancing direction in a movement of the machining beam across the machining field; and an evaluator configured to identify at least one of second pyrometer segments disposed ahead of the machining position in the advancing direction or second pyrometer segments disposed behind the machining position in the advancing direction.
22. The irradiating device of claim 21, wherein the evaluator is configured to: determine a temperature at the machining position and at least one of a temperature at a position in the machining field ahead of the machining position or a temperature at a position in the machining field behind the machining position; and determine at least one temperature gradient by at least two of the temperatures.
23. The irradiating device of claim 22, wherein the loop controller is configured to regulate, based on at least one of the determined temperature gradient or at least one of the determined temperatures, at least one of an output of the machining beam in the machining field and an advancing speed.
24. An irradiating device for irradiating a machining field with a machining beam for carrying out a welding process, the irradiation device comprising: a beam scanner configured to align the machining beam to a machining position in the machining field; and an imaging device configured to image a part-region of the machining field on a pyrometer having at least two pyrometer segments, wherein the imaging device is configured to image thermal radiation emanating from the machining position in the machining field on a first pyrometer segment of the pyrometer, and image thermal radiation emanating from at least one position in the machining field situated ahead of or behind the machining position along an advancing direction of the machining beam in the machining field on at least one second pyrometer segment of the pyrometer, and wherein the first pyrometer segment and the at least one second pyrometer segment are formed on a surface of a structured diode.
25. The irradiating device of claim 24, wherein the beam scanner is configured to: align the machining beam along a machining beam path to the machining position in the machining field, align the thermal radiation emanating from the machining position in the machining field along an observation beam path on the first pyrometer segment of the pyrometer, and align the thermal radiation emanating from the at least one position in the machining field along the observation beam path on the at least one second pyrometer segment of the pyrometer, and wherein the observation beam path is at least partially coaxial with the machining beam path in an opposing direction.
Description
DESCRIPTION OF DRAWINGS
(1)
(2)
(3)
(4)
DETAILED DESCRIPTION
(5) In the following description of the drawings, identical reference signs are used for the same or functionally equivalent components.
(6)
(7) The irradiating device 1 is part of a machine tool 10 which is used for producing three-dimensional components 11. The machining field 8 corresponds to an XY plane in which a topmost powder layer 12, shown in
(8) The (adaptive) focusing device 7 serves inter alia for aligning the beam axis Z of the laser beam 3 exiting the focusing device 7 so as to be substantially perpendicular to the XY plane or to the powder layer 12, respectively, independently of the machining position XP, YP on the machining field 8 which in the case of a suitable positioning of the irradiating device 1 coincides with the XY plane of the powder layer 12 that is disposed at a predefined height H above the support 13. It is understood that the powder layer 12, other than is shown in
(9) The powder layer 12, more specifically the region of the powder layer 12 that is shown in
(10) As is indicated in
(11) The first pyrometer segment 20 is surrounded by a plurality of second pyrometer segments 21a-d, 22a-d, 23a-d, 24a-d which are disposed in four concentric rings R1 to R4 about the first pyrometer segment 20. The part-region 16 of the machining field 8 shown in
(12) The second pyrometer segments 21a-d, 22a-d, 23a-d, 24a-d are in each case configured as annular segments and extend in each case across an angle of 90° in the circumferential direction, that is to say in each case across a quadrant. The second pyrometer segments 21a-d, 22a-d, 23a-d, 24a-d are disposed so as to be rotationally symmetrical about the first pyrometer segment 20.
(13) As is shown in an exemplary manner for the second pyrometer segment 21a (illustrated on the left in
(14) In of the example shown in
(15) The monitored region 16 shown in
(16) The temperature T.sub.P at the machining position X.sub.P, Y.sub.P is typically in the magnitude of approx. 2000° C. and represents the maximum temperature of the welding process, while the temperature in the environment of the focal spot B is significantly lower, which is why the intensity of the thermal radiation 19 meeting the pyrometer 17 is also significantly lower than at the focal spot B. It can be favorable for a filter device for attenuating the thermal radiation 19 that emanates from the part-region 16, or from the machining field 8, respectively, to be disposed in the beam path between the machining field 8 and the first pyrometer segment 20 and/or at least one of the second pyrometer segments 21a-d, 22a-d, 23a-d, 24a-d.
(17) In the case of the pyrometer in the form of the structured diode 17, filter devices of this type can be applied in the form of a coating to a few of the pyrometer segments 20, 21a-d, 22a-d, 23a-d, 24a-d. Such a filter device 26 which in the form of a coating is applied to the first, central, pyrometer segment 20 is indicated by a hatched area in
(18) Filtering can accordingly also be optionally performed at the second pyrometer segments 21a-d, 22a-d, 23a-d, 24a-d. For the determination of the temperature T.sub.P at the machining position X.sub.P, Y.sub.P as well as at further positions (see below) in the illustrated part-region 16 of the machining field 8 it can be favorable for the filter device 26 to be configured as a bandpass filter which is designed such that the latter transmits thermal radiation 19 at two different wavelengths which are detected separately for a respective pyrometer segment 20, 21a-d, 22a-d, 23a-d, 24a-d so as to make a direct conclusion, that is to say without any knowledge of the emissivity, pertaining to the temperature T.sub.P at the machining position X.sub.P, Y.sub.P or at other positions.
(19) Alternatively or additionally to the use of filter devices 26, the pyrometer segments 20, 21a-d, 22a-d, 23a-d, 24a-d of the structured diode 17 can also be produced from different materials, more specifically from materials which have a different wavelength-dependent sensitivity in relation to the thermal radiation 19 which emanates from the part-region 16 of the machining field 8. In the example shown in
(20) Four positions X.sub.P+4, Y.sub.P, X.sub.P+3, Y.sub.P, X.sub.P+2, Y.sub.P, X.sub.P+1, Y.sub.P which in the advancing direction V.sub.R are situated ahead of the machining position X.sub.P, Y.sub.P, as well as four positions X.sub.P−1, Y.sub.P, X.sub.P−2, Y.sub.P, X.sub.P−3, Y.sub.P, X.sub.P−4, Y.sub.P which along the advancing direction (corresponding to the scanning direction) V.sub.R are situated behind the machining position X.sub.P, Y.sub.P, are illustrated in
(21) The evaluation device 28, based on the advancing direction V.sub.R which is predefined by the open-loop and/or closed-loop control device 29, is configured to identify those second pyrometer segments 21a, 22a, 23a, 24a which in the momentary advancing direction V.sub.R are positioned ahead of the machining position X.sub.P, Y.sub.P, as well as those second pyrometer segments 21c, 22c, 23c, 24c which in the momentary advancing direction V.sub.R are disposed behind the machining position X.sub.P, Y.sub.P. It is understood that, for example, in a rotation of the advancing direction V.sub.R by 90° in relation to the advancing direction V.sub.R shown in
(22) The evaluation device 28 can also be used for determining temperature gradients ΔT by means of the respective temperatures T.sub.P+4, T.sub.P+3, T.sub.P+2, T.sub.P+1, T.sub.P, T.sub.P−1, T.sub.P−2, T.sub.P−3, T.sub.P−4, for example in that the difference between two of the temperatures, for example T.sub.P+4-T.sub.P+3, is formed and said difference is divided by the spacing A (known by virtue of the imaging scale of the imaging device 9) between the two associated positions X.sub.P+4, X.sub.P+3 in the machining field 8: ΔT=(T.sub.P+4−T.sub.P+3)/A.
(23) With the aid of the open-loop and/or closed-loop control device 29, the welding process can be controlled in a closed-loop manner by means of the at least one temperature T.sub.P+4, T.sub.P+3, T.sub.P+2, T.sub.P+1, T.sub.P, T.sub.P−1, T.sub.P−2, T.sub.P−3, T.sub.P−4 determined by the evaluation unit 28 and/or of a respective temperature gradient ΔT, for example in that the output P of the laser beam 3 and/or the advancing speed V.sub.R are/is set such that one or a plurality of the temperatures T.sub.P+4, T.sub.P+3, T.sub.P+2, T.sub.P+1, T.sub.P, T.sub.P−1, T.sub.P−2, T.sub.P−3, T.sub.P−4, or one or a plurality of temperature gradients ΔT, respectively, are in a predefined value range. The determination of temperature gradients ΔT in particular in the region of the thermal track has proven favorable in order for the thermal history and thus the microstructure of the material structure of the three-dimensional workpiece to be determined. The closed-loop control of the welding process with the aid of the open-loop and/or closed-loop control device 29 can be performed in real time; however, it is also possible for the closed-loop control to be performed layer-by-layer, that is to say that the temperature gradient ΔT, for example in the form of the cooling rate, is determined for an entire applied powder layer 12 so as to determine how much heat is stored in the component, or in the powder bed, when melting a powder layer 12 of the powder bed. Other machining parameters can be used for melting the following powder layer 12, that is to say that the laser output P and/or the advancing speed V.sub.R can be suitably adapted, for example.
(24) In particular in the case of the pyrometer 17 having a multiplicity of second pyrometer segments 25, the open-loop and/or closed-loop control device 29 can also serve for using the pieces of information which are delivered by the evaluation device 28 and pertain to the not yet completely cooled neighboring thermal tracks, in order for the closed-loop control of machining parameters, for example the powder P of the machining laser beam 3 and/or the advancing speed V.sub.R, to be used when generating the momentary thermal track. Such a closed-loop control is not performed in real time and can therefore be easily implemented.
(25) It is understood that the part-region 16 of the irradiating region 8 which is imaged on the pyrometer 17 by the imaging device 9 can also be larger than that is illustrated in
(26)
(27) The segmented diode 17 shown in
(28)
(29) The radiation transporting devices 31, 31a, 31b, . . . are suitably disposed in geometric terms so as to form light-guiding cones, or a light conductor, respectively, to the respective diode 32, 32a, 32b, . . . and can be based, for example, on reflection, total reflection, refraction, or on diffractive optics. In the example shown, optical waveguides in the form of fibers are used as radiation transporting devices 31, 31a, 31b, . . . which serve for the spatially separated collection and relaying of the thermal radiation 19 from the surface 32 to the, in this case, fiber-coupled standard diodes 32, 32a, 32b, . . . . The surface 30 on which the imaging device 9 images the thermal radiation 19 can, for example, form the end side of a multicore optical waveguide, for example in the form of a fiber bundle, the cores thereof at the end side of said cores being disposed in an annular manner about a center, as is shown in
(30) As has been described further above in the context of