Crimp interconnect device, crimped arrangement and method for making a crimped arrangement

Abstract

A crimp interconnect device, a crimped arrangement and a method for making a crimped arrangement are disclosed. In an embodiment a crimp interconnect device includes a deformable barrel body having an inner side and an outer side and a first material, and a second material that is softer than the first material, wherein the second material is arranged on the inner side.

Claims

1. A crimped arrangement comprising: a crimp interconnect device comprising: a deformable barrel body having an inner side and an outer side and being made of a first material; and a second material that is softer than the first material, the second material being arranged on the inner side and the outer side, wherein the crimp interconnect device is crimped to a plurality of conductors, the plurality of conductors comprising at least one conductor made of a third material and at least one conductor made of a fourth material differing from the third material, wherein the second material is tin with a thickness of 1-2 mm on the inner side, wherein the thickness of the second material arranged on the inner side is larger than a thickness of a layer of the second material arranged on the outer side, and wherein the first material is copper.

2. The crimp arrangement according to claim 1, wherein an inner sleeve made of the second material is arranged inside the barrel body.

3. The crimp arrangement according to claim 1, wherein the barrel body is sleeve-shaped.

4. The crimp arrangement according to claim 1, wherein the barrel body has a chamfer.

5. The crimped arrangement according to claim 1, wherein the first material and either the third material or the fourth material are the same material.

6. The crimped arrangement according to claim 1, wherein the third material comprises copper and the fourth material comprises aluminum.

7. A method for making the crimped arrangement according to claim 1, the method comprising: inserting the plurality of conductors into the barrel body of the crimp interconnect device, the plurality of conductors comprising the at least one conductor made of the third material and the at least one conductor made of the fourth material differing from the third material; deforming the barrel body such that the plurality of conductors and the barrel body are connected; and flowing the second material into a void between the barrel body and at least one of the plurality of conductors.

8. The method according to claim 7, wherein the first material and either the third material or the fourth material are the same material.

9. The method according to claim 7, wherein the third material comprises copper and the fourth material comprises aluminum.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Non-limiting, exemplary embodiments of the invention will now be described with reference to the accompanying drawings, in which:

(2) FIG. 1 shows a three-dimensional view of an embodiment of a crimped arrangement connecting several conductors;

(3) FIG. 2 shows an embodiment of a crimp interconnect device;

(4) FIG. 3 shows a cross-sectional view of a crimped conventional press ring; and

(5) FIG. 4 shows a detailed sectional view of a crimped connection.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(6) FIG. 1 shows a three-dimensional view of an embodiment of a crimped arrangement connecting several conductors. The arrangement comprises a crimp interconnect device including a barrel, which is embodied as a press ring 2 connecting two aluminum wires 4, a copper wire 6 and a soft copper wire 8 having a stripped end to a further wire 10. The aluminum wires 4, the copper wire 6 and the soft copper wire 8 have been inserted into one end of the press ring 2; the further wire 10 has been inserted into the other end of the press ring 2. The press ring 2 is deformed by an indent crimp 22 (not visible in FIG. 1), which forms a connection of the wires 4, 6, 8, 10 and the press ring 2. A single indent crimp 22 may be formed by an indentor ram, which causes a crescent cross-section deformation. The barrel 12 may be deformed by a suitable means, e.g., a hand tool or an automatic wire processing system.

(7) FIG. 2 shows an embodiment of a crimp interconnect device being a press ring 2. It comprises a barrel body 12, also referred to as a press ring body, having a sleeve-shaped form with a chamfered edge 14. The barrel body 12 has an inner side 16 and an outer side 18 and is made of a first material, which may be copper. A second material is applied to the inner side 16 of the barrel body 12.

(8) The press ring 2 is adapted to hold the conductors 4, 6, 8, 10 after mechanical deformation of the press ring 2, which forms the crimp connection. The press ring body 12 may be made from an ordinary copper pipe. During pipe cutting, a cutter forms small flanges or chamfers 14 in order to provide stronger mechanical stability for the press ring 2. Then the press ring body 12 is over-tinned and filled with tin 20, thereby adding a tin layer 20 of 1-2 mm width to the inner side 16 of the press ring body 12.

(9) In an alternative embodiment, a sleeve made of the second material, e.g. tin, is inserted into the sleeve-shaped barrel body 12. The second material 20 is softer than the first material and the material the conductors 4, 6, 8, 10 are made of.

(10) The use of additional material 20 between the press ring body 12 and the pressed wires 4, 6, 8, 10 prevents cross-sectional reduction of at least the softest wire. FIG. 3 shows a cross-sectional view of a crimped conventional press ring 2 connecting copper wires 6 and an aluminum wire 4. Since aluminum is softer than copper, crimping has the strongest impact on the aluminum wire 4. The aluminum cross section has been reduced from 40 mm.sup.2 to 16 mm.sup.2.

(11) The press ring 2 described in connection with FIG. 2 allows crimping together materials of different hardness in one common joint, wherein a cross-section reduction of the softer material is prevented during mechanical crimping. Since the second material is softer than the conductors, the strongest deformation impact occurs on the second material. In other words, since tin is softer than aluminum and copper, crimping has the strongest deformation impact on the tin 20 arranged inside the barrel body 12. The tin material flows into voids between the ring sleeve 2 and the conductors 4, 6, 8, 10, thereby reducing conductor deformation.

(12) FIG. 4 shows a detailed sectional view of a crimped connection between the press ring 2 described in connection with FIG. 2 and the aluminum wires 4, the soft copper wire 8 and the copper wire 6 as described in connection with FIG. 1. The tin layer 20 located inside the press ring body 12 has been flown towards the conductors 4, 6, 8, which are significantly less deformed than in FIG. 3. The tin filling 20 of the press ring 2 having a proper thickness prevents mechanical cross-section reduction of the softer aluminum wires 4. The described technology allows crimping together aluminum and copper or any other combination of materials having different hardness by applying mechanical force without cross-section reduction of the softer material. Hardness in Vickers of the materials is: aluminum 160, copper 345, lead-free tin max. 40.

(13) The above-mentioned crimp interconnect device 2 having a tin layer 20 inside allows to form connections between different material combinations. Copper-copper-connections can be formed, wherein the barrel body 12 as well as the conductors 4, 6, 8, 10 are made of copper. Copper-aluminum-connections can be formed, wherein one of the barrel body 12 and the conductors 4, 6, 8, 10 is made of copper; another one is made of aluminum. Aluminum-aluminum-connections can be formed, wherein the barrel body 12 as well as the conductors 4, 6, 8, 10 are made of aluminum. The crimp interconnect device 2 may also be suitable for connecting different wires, e.g., a solid wire to a solid wire, or a solid wire to a solid wire and a litz wire, or a solid wire to a litz wire.

(14) The scope of protection is not limited to the examples given herein above. The invention is embodied in each novel characteristic and each combination of characteristics, which particularly includes every combination of any features which are stated in the claims, even if this feature or this combination of features is not explicitly stated in the claims or in the examples.