Connecting unit for connecting to first and second interfaces, where the connecting unit comprises an internal conductor disposed within a housing formed by half-shell construction

10998605 · 2021-05-04

Assignee

Inventors

Cpc classification

International classification

Abstract

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

Claims

1. A connecting unit for radio-frequency components, comprising: a housing; a first interface and a second interface arranged on the housing and configured to be coupled to a first radio-frequency component and a second radio-frequency component, respectively; an internal conductor located within the housing and connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; and a spacer surrounding the internal conductor and extending at least along a portion of the length of the internal conductor, wherein the housing is manufactured from a first electrically conductive and rigid material, wherein the spacer is arranged such that the internal conductor is at a distance from the housing, wherein the internal conductor comprises at least two subsections connected to one another by a connection, wherein the connection is a force-fitting or frictional connection, and wherein the housing comprises two half-shells connected to one another along a joint.

2. The connecting unit according to claim 1, wherein the first electrically conductive and rigid material of the housing is at least partially composed of aluminum.

3. The connecting unit according to claim 1, wherein the internal conductor is composed of a second electrically conductive material, and wherein the second electrically conductive material of the internal conductor contains at least one of the following materials or a combination of the said materials: aluminum, brass, copper, silver, or gold.

4. The connecting unit according to claim 3, wherein a surface of the internal conductor is coated with a layer of silver or gold.

5. A radio-frequency unit, comprising: the first radio-frequency component and the second radio-frequency component; and the connecting unit according to claim 1; wherein the connecting unit electrically connects the first radio-frequency component and the second radio-frequency component to one another.

6. The radio-frequency unit according to claim 5, wherein the first radio-frequency component is a preamplifier and the second radio-frequency component is a power amplifier.

7. A satellite comprising a radio-frequency unit according to claim 5.

8. The connecting unit according to claim 1, wherein the spacer contains an electrically insulating material.

9. The connecting unit according to claim 8, wherein the electrically insulating material of the spacer is a plastic, a polyether ketone or a polytetrafluoroethylene.

10. The connecting unit according to claim 1, further comprising a third radio-frequency component located in the housing and arranged between two of the at least two subsections of the internal conductor and also electrically connected to the two of the at least two subsections.

11. The connecting unit according to claim 1, wherein the first interface is a coaxial connector or a waveguide, and wherein the second interface is a coaxial connector or a waveguide.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Exemplary embodiments of the invention will be discussed in more detail below with reference to the appended drawings. The illustrations are schematic and not to scale. Identical reference symbols relate to identical or similar elements. In the drawings:

(2) FIG. 1 shows a schematic isometric illustration of a connecting unit according to one exemplary embodiment.

(3) FIG. 2 shows a schematic illustration of a plan view of a connecting unit according to a further exemplary embodiment.

(4) FIG. 3 shows a schematic illustration of a side view of a connecting unit according to a further exemplary embodiment.

(5) FIG. 4 shows a schematic illustration of a front view of a connecting unit according to a further exemplary embodiment.

(6) FIG. 5 shows a schematic illustration of a plan view of a connecting unit according to a further exemplary embodiment.

(7) FIG. 6 shows a schematic illustration of a half-shell of a connecting unit according to a further exemplary embodiment.

(8) FIG. 7 shows a schematic illustration of a radio-frequency unit according to a further exemplary embodiment.

(9) FIG. 8 shows a schematic illustration of a satellite according to a further exemplary embodiment.

(10) FIG. 9 shows a schematic illustration of a connection between two sections of an internal conductor according to an embodiment.

(11) FIG. 10 shows a schematic illustration of a connecting unit having a waveguide as an interface according to an embodiment.

(12) FIG. 11 shows a schematic illustration the connecting unit of FIG. 1 connecting a preamplifier and a power amplifier.

DETAILED DESCRIPTION OF THE INVENTION

(13) FIG. 1 shows a connecting unit 100. The connecting unit 100 has a housing 130, a first interface 110 and a second interface 120. The first interface and the second interface are arranged on a wall or outer side of the housing 130 and are respectively mechanically coupled thereto. The connecting unit 100 further has an internal conductor 140, wherein the internal conductor 140 extends within the housing 130 and electrically connects the first interface 110 to the second interface 120, so that electrical signals can be transmitted from the first interface to the second interface.

(14) Although FIG. 1 illustrates that the first interface and the second interface are located on the same side or face of the housing 130, it should be noted that the first interface and the second interface can be located on different sides of the housing 130. The location in which the first interface and the second interface are located with respect to the housing 130 can depend on where and/or how the radio-frequency components to be connected to one another are arranged.

(15) It should further be noted that the housing 130 can assume different outer shapes. In FIG. 1, the housing is shown as a cuboid, however it can equally be L-shaped or U-shaped. The housing 130 is manufactured from an electrically conductive material or contains a material of this kind. As a result, the interior of the housing 130 is shielded against electromagnetic fields.

(16) The internal conductor 140 is located within the housing 130 and is illustrated using dashed lines in FIG. 1. The internal conductor 140 is electrically and mechanically coupled to the first interface 110 and the second interface 120. The internal conductor 140 is manufactured from metal or contains a metal, in particular aluminum, brass or copper, and can be silver-plated or gold-plated.

(17) The internal conductor 140 can have a plurality of subsections. In the example of FIG. 1, the internal conductor 140 has a first section 142, a second section 144 and a third section 146. These sections are mechanically and also electrically coupled to one another. The division of the internal conductor into a plurality of sections allows for the internal conductor to be assembled in a modular manner. The internal conductor can be assembled such that it corresponds to the shape of the housing 130.

(18) Connections 143, 145 are provided between the sections 142, 144, 146 of the internal conductor 140. These connections may be, for example, a plug-in connection, a clamping connection or a screw connection, as schematically represented by connection 145 in FIG. 9. A plug-in connection and a clamping connection in particular have the advantage that the connection can absorb thermally-induced expansions or any other movement of the internal conductor 140, of the housing 130 or of the radio-frequency components to be connected to one another since they allow relative movement of the connected sections, without the electrical connection being released or disconnected in the process.

(19) In the case of a plug-in connection, the section 142 can have, for example, a recess (not shown) and the section 144 can have a pin (not shown) which is inserted into the recess. A screw connection can be of similar construction, wherein the pin can be provided with an external thread and the recess in the other section is a hole through which the pin is routed. In this case, the pin is longer than the material thickness of the other section, so that a nut can be screwed onto the external thread of the pin.

(20) The first interface 110 and the second interface 120 can be arranged and fixed, for example, in a bore or in another aperture of the wall of the housing 130. This is done in such a way that the first interface 110 and the second interface 120 are electrically insulated with respect to the housing 130.

(21) In other words, the connecting unit 100 can be described as follows: the connecting unit 100 substantially comprises a metal external housing which is provided as a separate housing 130 or can be integrated into the housing of the existing radio-frequency components. An internal conductor 140 which is held and routed either completely or at irregular intervals by spacers 150 (see FIG. 2) is routed in this housing 130. The internal conductor can be connected to microstrip substrates by direct bonding (see FIG. 5). The internal conductor 140 can be connected to a waveguide or to a coaxial connection by means of the first and the second interface 110, 120. A simple plug can be fitted for the purpose of connecting coaxial conductors or coaxial lines. The first interface and the second interface can have a flange at their coupling points to the external radio-frequency components to be connected and can be connected to the radio-frequency components by means of plug-in or screw connections. FIG. 10 illustrates a connecting unit 1000, wherein a first interface 1010 is a waveguide, whereas the second interface 120 may be similar to the second interface of the connecting unit 100 of FIG. 1. Likewise, the housing 130, the internal conductor 140 including the sections 142, 144, 146 and the connections 143, 145, may be similar to the corresponding elements of the connecting unit 100 of FIG. 1.

(22) The connecting unit 100 is mechanically very robust and the connection of horizontal and vertical modules is possible without problems. In this case, the connecting unit is distinguished by low losses which are, in particular, lower than the losses of a cable. The connecting unit is suitable for directly connecting two radio-frequency components or else for distributing power from an input to two outputs (see FIG. 5). Therefore, the connecting unit is suitable for modular structures because the connecting unit allows any desired number of devices to be connected. The internal conductor 140 can also be divided at appropriate points in order to allow simpler construction (for example bonding to radio components). The sections of the internal conductor can be connected to one another with the aid of plug-in or screw contacts.

(23) FIG. 2 shows a plan view of the connecting unit 100 from FIG. 1, wherein FIG. 2 shows a view into the housing 130. However, spacers 150, which are not illustrated in FIG. 1 for reasons of clarity, are also shown in FIG. 2.

(24) The second section 144 of the internal conductor 140 extends from left to right in the longitudinal direction of the housing 130. Two spacers 150 are provided and arranged to hold and to fix the internal conductor in a desired position. The two spacers 150 are spaced apart from one another in the longitudinal direction of the second section 144. The spacers 150 ensure that the second section 144 (and respectively the internal conductor 140 in general) is kept at a distance 152 from the two opposite side walls 132 of the housing 130. The internal conductor 140 is preferably routed centrally between the two side walls 132, that is to say that the distance 152 between the internal conductor and the two side walls is the same.

(25) It can be seen that the spacers 150 have a width which corresponds to the distance between the two opposite side walls of the housing 130. The spacers 150 can be manufactured from an elastically deformable material. In this case, the spacers 150, in an initial state, can have a greater extent than the distance between the opposite side walls. In a subsequent step, the internal conductor is routed through a recess of the spacer and the spacer is laterally compressed and placed in the housing 130.

(26) In principle, a spacer can be formed in a disc shape or plate shape and have a central recess or an aperture through which the internal conductor is routed. The outline, that is to say the outer shape, of the spacer preferably corresponds substantially to a shape of the cross section of the housing 130. Spacers can be arranged on each section of the internal conductor 140. However, a spacer which is arranged on the first section 142 (FIG. 1) or third section 146 (FIG. 1) of the internal conductor has a different orientation to that of the spacers which are arranged on the second section 144.

(27) FIG. 3 shows a side view of the illustration from FIG. 2. The internal conductor is illustrated using dashed lines. The spacers 150 are shown using solid lines, even if they are located behind the front side wall of the housing 130 in the side view.

(28) The spacers 150 hold the internal conductor such that a distance 152 is kept between the second section 144 and the bottom wall 134 of the housing 130.

(29) FIG. 4 shows a front view from the left and, respectively, from the right in relation to the illustrations of FIG. 2 and FIG. 3. For reasons of clarity, only the cross section of the second section 144 of the internal conductor 140 is shown in FIG. 4. The spacer 150 surrounds the internal conductor 140 and in this way ensures that the internal conductor 140 is kept at a desired distance from the side walls, the bottom wall and the top wall of the housing.

(30) In FIG. 4, the spacer 150 is drawn such that a small distance from the walls of the housing 130 can be seen. However, this is done only for reasons of clarity. In actual fact, the spacer 150 at least bears against some of the walls of the housing.

(31) Even though individual spacers 150 which are spaced apart from one another are shown in FIGS. 2 to 4, an individual spacer which surrounds a major portion or the entire length of the internal conductor and is fixed in the housing can also be provided. It is conceivable, for example, that the internal conductor is arranged in the housing and then the interior of the housing is filled with a foam or another flowable or shapeable material which then cures and as a result holds the internal conductor in the original position.

(32) The spacer is electrically insulating and can be, in particular, a plastic, a polyether ketone (PEK) or a polytetrafluoroethylene (PTFE, also available under trade names, such as FLUOROLOY® and TEFLON®).

(33) In addition, the internal conductor 140 does not require a further insulating layer which directly surrounds it. Therefore, the internal conductor may be one or more non-insulated metal bars. The internal conductor can be referred to as a “cable” or a “line”.

(34) FIG. 5 shows an illustration of the connecting unit 100 in which a radio-frequency component 170 is provided in the housing 130 and, in addition, the internal conductor is provided with a branch 148.

(35) The radio-frequency component 170 can be a power amplifier which is based on semiconductor elements. The semiconductor elements of the power amplifier 174 are arranged on a printed circuit board 172. Electrically conductive strips or conductor tracks which allow the power amplifier 174 to be electrically connected to the internal conductor are located on the printed circuit board 172. The first section 142 of the internal conductor is electrically connected to the conductor tracks in a joining region 180. These conductor tracks establish an electrical connection between the first section 142 and the power amplifier 174. On the other side, the power amplifier 174 is electrically connected to the second section 144 likewise by means of conductor tracks, wherein this connection likewise takes place in a joining region 180.

(36) Furthermore, FIG. 5 shows that the second section 144 is routed in a branch 148 to the third section 146. The branch 148 can be referred to as a T-shaped branch because, starting from the second section 144, two possible signal taps are provided by means of the third section 146. Reference symbols 120A, 120B show two interfaces at which a signal can be output.

(37) A connection 145 which can be a connection as described above is provided at the branch 148.

(38) The power amplifier 174 can also be referred to as an “output stage” or an “amplifier output stage”. A network for power combination based on the described technology can be fitted at the output of the amplifier output stages. The network can then be connected to further modules, or can be provided with a transition to coaxial plugs or waveguides in order to provide a desired interface.

(39) If output stages with a power distributor network at the input and output are used, the part (a preamplifier) which is connected to the input and the part (a waveguide transition/insulator) which is connected to the output can remain unchanged. The output power can be changed by exchanging the output stage modules, without the other components which are involved having to be changed. In these cases, the internal conductor can be divided into a plurality of parts for better integration and can be recombined by plug-in or screw connections.

(40) Instead of a direct power combination at the output (for example 4-to-1 connection), each output stage can also be routed to a waveguide transition and insulator (with a 1-to-1 connection using the described connection technology) and then the outputs of the insulators can be combined by means of power combination to form a waveguide network.

(41) FIG. 6 shows an isometric illustration of a half-shell 136 for the housing 130. This half-shell has a U-shaped form and the internal conductor (not shown) extends through the interior of the half-shell. A second half-shell (not shown) of the same form is provided and can be positioned, for example as a cover, onto the half-shell shown in order to render the housing in a closed form. The edge of the half-shell, which is connected to the second half-shell, can be referred to as a joint or joining edge 137. The two half-shells can be connected to one another by means of releasable or non-releasable connections. For example, it is possible to connect the two half-shells to one another by means of click connections or snap-action connections. It is also possible to connect the half-shells to one another by means of material-bonding connections, provided that these connections are suitable for the intended use of the connecting unit.

(42) FIG. 7 shows a radio-frequency unit 10 comprising a bottom plate 15 and two radio-frequency components 20, 30 which are arranged on the bottom plate 15. The two radio-frequency components 20, 30 are connected to a connecting unit 100 as described above and in the description which follows. FIG. 11 schematically shows the connecting unit 100 connecting a first radio-frequency component in the form of a preamplifier 1210 and a second radio-frequency component in the form of a power amplifier 1220.

(43) The radio-frequency component 20 is mounted horizontally on the bottom plate 15 and the radio-frequency component 30 is mounted vertically on the bottom plate 15. One reason for this different manner of mounting can be that a higher thermal load has to be dissipated by the radio-frequency component 20. Since the radio-frequency component 20 is mounted on the bottom plate 15 by way of the largest outer face thereof, a higher amount of thermal energy can be dissipated from the radio-frequency component 20 into the bottom plate 15 by means of thermal conduction into solid bodies. This may be advantageous or even necessary, in particular, when used in a vacuum. In comparison to this, the radio-frequency component 30 requires a lower amount of heat dissipation, and therefore the radio-frequency component 30 is mounted vertically. As a result, the surface of the bottom plate 15 can be utilized more efficiently and more effectively. The connecting unit 100 allows radio-frequency components to be connected to one another independently of the spatial arrangement thereof.

(44) The mechanical or thermal requirements of the respective device 20, 30 can render specific positioning necessary. Devices with a high level of power loss generally have to be accommodated flat or horizontally on the mounting face or bottom plate (in order to thermally dissipate lost power). Devices with a low level of power loss are placed in an elevated manner horizontally or in a second plane, that is to say above the radio-frequency component 20 in order to save surface area.

(45) The housing of the connecting unit 100 described in this document can be mechanically and thermally connected to the housing of the radio-frequency components to be connected. In addition, the connecting unit is distinguished by low losses and flexible configuration of the shape of the housing, so that components which are arranged in any desired manner in principle can be connected to one another. Branches are also possible.

(46) FIG. 8 shows a schematic illustration of a satellite 1. A radio-frequency unit 10 is arranged in the satellite 1. The radio-frequency unit 10 can be a constituent part of a signal transmission path. For example, the radio-frequency unit 10 can be part of a control unit or the signal-processing arrangement for a transmission unit 2, wherein the transmission unit 2 is, for example, an antenna.

(47) It should also be noted that the terms “comprising” or “having” do not rule out any other elements or steps and the terms “one” or “a” do not rule out a greater number. In addition, it should be noted that features or steps which have been described with reference to one of the above exemplary embodiments can also be used in combination with other features or steps of other above-described exemplary embodiments. The reference symbols in the claims should not be considered as any form of restriction.

LIST OF REFERENCE SYMBOLS

(48) 1 Satellite 2 Transmission unit, antenna 10 Radio-frequency unit 15 Bottom plate 20 First component 30 Second component 100 Connecting unit 110 First interface 120 Second interface 130 Housing 132 Side wall 134 Bottom wall 136 Half-shell 137 Joint, joining edge 140 Internal conductor 142 First section 143 Connection 144 Second section 145 Connection 146 Third section 148 Branch 150 Spacer 152 Distance 170 Radio-frequency component 172 Printed circuit board 174 Power amplifier 180 Joining region

(49) While at least one exemplary embodiment of the present invention(s) is disclosed herein, it should be understood that modifications, substitutions and alternatives may be apparent to one of ordinary skill in the art and can be made without departing from the scope of this disclosure. This disclosure is intended to cover any adaptations or variations of the exemplary embodiment(s). In addition, in this disclosure, the terms “comprise” or “comprising” do not exclude other elements or steps, the terms “a” or “one” do not exclude a plural number, and the term “or” means either or both. Furthermore, characteristics or steps which have been described may also be used in combination with other characteristics or steps and in any order unless the disclosure or context suggests otherwise. This disclosure hereby incorporates by reference the complete disclosure of any patent or application from which it claims benefit or priority.