Transducer vibrating diaphragm structure, flat panel speaker and earphone therewith

Abstract

An earphone comprising a transducer vibrating diaphragm structure is described herein. The transducer vibrating diaphragm structure comprises a diaphragm including a first surface and a second surface opposite the first surface, a first frame and a second frame disposed at two sides of the diaphragm and coupled to a periphery of the diaphragm, a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively. A total area of the diaphragm is less than or equal to 120 square millimeters and a sensitivity of the diaphragm is greater than 105 dB.

Claims

1. A transducer vibrating diaphragm structure, comprising: a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB; a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame; and a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively.

2. The transducer vibrating diaphragm structure of claim 1, wherein a second coil circuit is provided on the second surface of the diaphragm via vapor deposition or liquid deposition, and wherein the second coil circuit and the first coil circuit are connected in series or in parallel.

3. The transducer vibrating diaphragm structure of claim 2, wherein a first projection of the first coil circuit on the first surface and a second projection of the second coil circuit on the second surface of the diaphragm do not overlap each other, or an overlap of the first projection and the second projection is less than or equal to 20%.

4. The transducer vibrating diaphragm structure of claim 2, wherein a wiring of the first coil circuit or the second coil circuit has a shape of a triangle, a nested triangle, a circle, a nested circle, a ring, a nested ring, a screw shape, a polygon, a nested polygon, a five-pointed star, or a nested five-pointed star.

5. The transducer vibrating diaphragm structure of claim 2, wherein the conductive material of the first coil circuit and the second coil circuit comprises gold, platinum, copper or iron, wherein the first magnetic element and the second magnetic element comprise permanent magnets, electromagnets, or artificial magnets, and wherein the first magnetic element or the second magnetic element comprises one or more bar magnets in a range of numbers from 1 to 50, the one or more bar magnets being arranged symmetrically and in parallel or arranged staggeredly and in parallel.

6. The transducer vibrating diaphragm structure of claim 1, wherein a shape of the diaphragm comprises a triangle, a quadrangle, a circle, an oval, or an irregular zigzag shape.

7. The transducer vibrating diaphragm structure of claim 1, wherein the periphery of the diaphragm is coupled to the first frame and the second frame by a flexible connection, rivet connection, glue connection, soldering, bonding, electrostatic connection, or laser welding.

8. The transducer vibrating diaphragm structure of claim 1, wherein the diaphragm is integrally formed with the first frame and the second frame.

9. The transducer vibrating diaphragm structure of claim 2, wherein series or parallel circuits formed by the first coil circuit and the second coil circuit comprise one or more layers in a range of numbers from 1 to 100.

10. The transducer vibrating diaphragm structure of claim 1, wherein the diaphragm has a rectangular shape.

11. The transducer vibrating diaphragm structure of claim 1, wherein the diaphragm has a circular shape, wherein a diameter of the circular diaphragm is less than or equal to 12 mm.

12. The transducer vibrating diaphragm structure of claim 2, wherein a thickness of the first coil circuit or the second coil circuit is in a range from 50 nm to 10 μm, and wherein a thickness of the diaphragm is in a range from 100 nm to 20 μm.

13. A flat panel speaker, comprising: a transducer vibrating diaphragm structure, wherein the transducer vibrating diaphragm structure comprises: a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB, a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame, and a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively; and a support frame configured to provide a rigid support to the transducer vibrating diaphragm structure, the transducer vibrating diaphragm structure being mounted on the support frame.

14. The flat panel speaker of claim 13, wherein a second coil circuit is provided on the second surface of the diaphragm via vapor deposition or liquid deposition, and wherein the second coil circuit and the first coil circuit are connected in series or in parallel.

15. The flat panel speaker of claim 14, wherein a first projection of the first coil circuit on the first surface and a second projection of the second coil circuit on the second surface of the diaphragm do not overlap each other, or an overlap of the first projection and the second projection is less than or equal to 20%.

16. The flat panel speaker of claim 13, wherein the diaphragm has a rectangular shape.

17. The flat panel speaker of claim 13, wherein the diaphragm has a circular shape, wherein a diameter of the circular diaphragm is less than or equal to 12 mm.

18. An earphone, comprising: a transducer vibrating diaphragm structure, wherein the transducer vibrating diaphragm structure comprises: a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB, a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame, and a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively; and a housing configured to contain the transducer vibrating diaphragm structure.

19. The earphone of claim 18, wherein a second coil circuit is provided on the second surface of the diaphragm via vapor deposition or liquid deposition, and wherein the second coil circuit and the first coil circuit are connected in series or in parallel.

20. The earphone of claim 19, wherein a first projection of the first coil circuit on the first surface and a second projection of the second coil circuit on the second surface of the diaphragm do not overlap each other, or an overlap of the first projection and the second projection is less than or equal to 20%.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The following detailed description may be better understood when read in conjunction with the appended drawings. For the purposes of illustration, there are shown in the drawings example embodiments of various aspects of the disclosure; however, the invention is not limited to the specific methods and instrumentalities disclosed.

(2) FIG. 1 is a schematic diagram illustrating conventional moving-coil earphone.

(3) FIG. 2 is a schematic diagram illustrating conventional electrostatic earphone.

(4) FIG. 3 is a schematic diagram illustrating conventional flat panel earphone.

(5) FIG. 4 is a schematic diagram of perspective view illustrating example vibrating diaphragm structure in accordance with the present disclosure.

(6) FIG. 5 is a schematic diagram of plane view illustrating example vibrating diaphragm structure in accordance with the present disclosure.

(7) FIG. 6 is a decomposition diagram illustrating example vibrating diaphragm structure in accordance with the present disclosure.

(8) FIG. 7 is an exploded diagram illustrating example vibrating diaphragm structure in accordance with the present disclosure.

(9) FIG. 8 is an exploded diagram illustrating example earphone in accordance with the present disclosure.

(10) FIG. 9 is a curve diagram illustrating sensitivity test result of example rectangular vibrating diaphragm structure in accordance with the present disclosure.

DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(11) Hereinafter a further detailed description of the present invention will be provided in connection with the appended drawings, so as to facilitate understanding for those skilled in the same field:

(12) As shown in FIGS. 4-7, reference signs respectively represent: fastening screws 1, outer support frame 2, first magnetic element 3, first magnetic frame 4, first coil frame 5, diaphragm 6, second coil frame 7, second magnetic element 8, second magnetic frame 9, fixing plate 10, and coil circuit 11.

EXAMPLE 1

(13) As shown in FIG. 7, FIG. 7 is an exploded diagram of the vibrating diaphragm structure in one embodiment of the present disclosure. Firstly, the Example provides a transducer vibrating diaphragm structure of a miniature flat panel speaker, comprising the vibrating diaphragm 6 having a plane shape and a periphery of the diaphragm 6 fixed on the first coil frame 5 and the second coil frame 7, the vibrating diaphragm 6 comprising a first surface and a second surface opposite the first surface. The vibrating diaphragm 6 is a rectangular vibrating diaphragm with a shape of rectangle, and a dimension of 10 mm*12 mm. According to actual needs of work, the dimension may be further set to different dimensions from 1 mm*12 mm to 10 mm*1 mm, such as, dimensions no more than 120 square millimeters including 5 mm*8 mm, 2 mm*3 mm, 4 mm*7 mm, and the like. The periphery of the vibrating diaphragm 6 is fixed onto the frame by the fastening screws 1 that pass through the outer support frame 2, and then connected to the fixing plate 10.

(14) The vibrating diaphragm 6 is laid with a first coil circuit (corresponding to a first coil) and a second coil circuit (corresponding to a second coil) on the first surface and the second surface of the diaphragm 6, respectively. The first magnetic element 3 and the second magnetic element 8 are disposed at two sides of the vibrating diaphragm 6 through the first magnetic frame 4 and the second magnetic frame 9. The first coil circuit and the second coil circuit are deposited on the first surface and the second surface of the vibrating diaphragm 6 via vapor deposition or liquid deposition. The first coil circuit and the second coil circuit are connected in series or in parallel.

(15) The first coil and the second coil are formed of a conductive material in a regular wiring, and are disposed at a center position of the vibrating diaphragm 6. It can be further adjusted to an arrangement way of having coils on a single surface, or an arrangement way of having coils on both surfaces according to designed sensitivity. The first coil and the second coil are formed in a shape of tortuous helixor reciprocating staggered structure. The first coil and the second coil are provided on two sides of the diaphragm, respectively. A first projection of the first coil circuit and a second projection of the second coil circuit on the plane of the vibrating diaphragm do not overlap each other, and the first and second coil circuit are uniformly arranged on the vibrating diaphragm 6. Alternatively, an overlap of the first projection and the second projection is less than or equal to 20%. Meanwhile, a voice coil assembly consisting of the first coil and the second coil is rotationally symmetrical around a center of the vibrating diaphragm.

(16) The above Example is an ideal earphone fabrication structure that is finally found to balance a dimension of the vibrating diaphragm less than 120 square millimeters and a sensitivity greater than 105 dB after the applicant have made theoretical correction of innovation and long-term research. Please refer to a curve diagram of sensitivity test as illustrated in FIG. 9 after the rectangular vibrating diaphragm structure is on the machine. Further, on the premise of ensuring sufficient stability in a vibration state and also reducing the coil mass as much as possible, the first sub-coil or the second sub-coil has a thickness of 50 nm to 10 μm, and the vibrating diaphragm has a thickness of 100 nm to 20 μm. Preferably, a total thickness of the diaphragm including the first and second coils is approximately in a range from 50 nm to 1 μm.

(17) The bar magnets in the magnetic element 3 use neodymium iron boron bar magnets in an interlocking arrangement. In addition, since sensitivity of the vibrating diaphragm is not dramatically reduced in the case of reducing the dimension of the vibrating diaphragm in the present disclosure, on the premise of ensuring a certain degree of total harmonic distortion, ferrite magnets can be further used to replace the neodymium iron boron magnets to reduce costs.

(18) Preferably, the length of the first coil is m-th power times of 10 of the length of the second coil, wherein 0≤m≤5, the projection area of the first coil is s-th power times of 10 of the projection area of the second coil, wherein −3≤s≤6, and the mass of the first coil having the same projection area is n-th power times of 10 of a mass of the second coil, wherein −3≤n≤5, and wherein m, s and n are dimensionless parameters.

(19) As for the electrical connection structure, based on the available connection way of the coils and wires, it is commonly known technology for those skilled in the art, so no repetition here.

EXAMPLE 2

(20) The Example provides another transducer vibrating diaphragm structure, and it differs from Example 1 in that the vibrating diaphragm is a circular vibrating diaphragm with a diameter of 12 mm, and also may be further set to other diameters no more than 12 mm, such as, 1 mm, 2 mm, 5 mm, 10 mm, 11 mm and the like, and the magnets are annular magnets, circular magnets or helical magnets. Relative to the structure in Example 2, the rectangular vibrating diaphragm in Example 1 is simpler in fabrication process, and relatively lower in costs, and it is a preferable scheme.

EXAMPLE 3

(21) The Example provides an earphone having the transducer vibrating diaphragm in Example 1 or Example 2, and the structure is shown in FIG. 8. FIG. 8 is an exploded diagram of earplug application of a speaker structure in one embodiment of the present disclosure. The Example provides a flat panel earplug having earphone cables, an earplug housing and a built-in flat panel vibrating diaphragm unit, wherein the flat panel vibrating diaphragm unit is described as the contents in Example 1 and Example 2, and no repetition here.

(22) Embodiments of the present disclosure are explicitly explained through the above examples. However, those ordinary in the art shall understand that the above examples are merely one of preferable examples of the present disclosure. Due to limitation of length of the article, it is impossible to list all embodiments, and any implementation that can embody the technical solution of the claims of the present disclosure is within the extent of protection of the present disclosure.

(23) It shall be noted that the above contents are further detailed description of the present invention in connection with the detailed embodiments, and cannot be regarded that the detailed embodiments of the present invention are limited thereto. Under the guidance of the above Examples, those skilled in the art can make various modifications and variations on the basis of the above Examples, and these modifications or variations fall into the extent of protection of the present invention.