Circuit device, method for manufacturing circuit device and connector
10973137 ยท 2021-04-06
Assignee
- AUTONETWORKS TECHNOLOGIES, LTD. (JP)
- Sumitomo Wiring Systems, Ltd. (JP)
- Sumitomo Electric Industries, Ltd. (JP)
Inventors
- Hirokazu KOMORI (Mie, JP)
- Naomichi KAWASHIMA (Mie, JP)
- Hiroki Hirai (Mie, JP)
- Makoto HIGASHIKOZONO (Mie, JP)
- Masanori MORIYASU (Mie, JP)
Cpc classification
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01L23/28
ELECTRICITY
H05K1/18
ELECTRICITY
International classification
Abstract
An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.
Claims
1. A circuit device, comprising: a circuit board; a connector fixed to the circuit board; and a resin portion covering the circuit board and the connector, wherein: the connector includes a housing body and a cut-off receiving portion projecting from the housing body, and the cut-off receiving portion includes a projecting portion projecting outward from the housing body and an inclined wall extending from the projecting portion and the inclined wall having a tip spaced from the projecting portion, the inclined wall being inclined to be closer to the housing body toward the tip of the inclined wall and a part of the inclined wall is embedded in the resin portion.
2. The circuit device of claim 1, wherein: the housing body includes a tubular receptacle capable of accommodating a mating connector inside, and the cut-off receiving portion is continuous from the receptacle.
3. The circuit device of claim 2, wherein the cut-off receiving portion is arranged over an entire periphery of the housing body.
4. The circuit device of claim 1, wherein the cut-off receiving portion is arranged over an entire periphery of the housing body.
5. The circuit device of claim 1, wherein the projecting portion of the connector extends transverse to the circuit board.
6. The circuit device of claim 1, wherein the connector includes a terminal fitting with a tab, the projecting portion extending transverse to the tab.
7. A method for manufacturing a circuit device, comprising: a setting step of setting a circuit board and a connector fixed to the circuit board in a mold; and a resin portion forming step of forming a resin portion covering the circuit board and the connector by pouring molten resin into the mold and curing the molten resin, wherein: the mold includes a cut-off portion for cutting off a flow of the resin to outside of the mold between the mold and the connector by pressing the connector, the connector includes a housing body and a cut-off receiving portion projecting from the housing body, the cut-off receiving portion includes a projecting portion projecting outward from the housing body and a flexible wall extending from the projecting portion and deflectable toward the housing body, and the cut-off portion presses the flexible wall in the resin portion forming step.
8. A connector, comprising: a housing body formed from a synthetic resin; and a cut-off receiving portion formed continuously with the housing body and projecting from the housing body, wherein the cut-off receiving portion includes a projecting portion projecting outward from the housing body and a flexible wall extending from the projecting portion and the flexible wall having a tip spaced from the projecting portion, the flexible wall being deflectable toward the housing body and into an inclined posture where the tip of the flexible wall is closer to the housing body than an end of the flexible wall that extends from the projecting portion.
9. The connector of claim 8, wherein the cut-off receiving portion is arranged over an entire periphery of the housing body.
10. The connector of claim 8, further including a terminal fitting with a tab, the projecting portion extending transverse to the tab.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
DETAILED DESCRIPTION
(8) An embodiment is described with reference to
(9) The circuit board 10 is a member having a known configuration in which conductive paths (not shown) are formed by a printed wiring technique and electronic components (not shown) are mounted on one or both surfaces of an insulating plate made of an insulating material.
(10) As shown in
(11) The connector housing 21 is made of synthetic resin and includes, as shown in
(12) As shown in
(13) As shown in
(14) As shown in
(15) As shown in
(16) Each of the two fixing brackets 31 is formed by press-working a metal plate material and, as shown in
(17) As shown in
(18) Each of the terminal fittings 41 is formed by bending an elongated plate material made of metal and, as shown in
(19) With the connector 20 assembled with the circuit board 10, a part of the receptacle 24 where the cut-off receiving portion 27 is provided and a part thereof closer to the opening 24A than the former part project outward (rightward of
(20) As shown in
(21) The ECU 1 configured as described above is manufactured, for example, in the following procedure.
(22) First, the terminal fittings 41 and the fixing brackets 31 are mounted into the connector housing 21.
(23) Subsequently, the connector 20 is fixed to the circuit board 10 by reflow soldering. First, solder is applied in advance to each part of the one surface of the circuit board 10 where soldering is planned. Subsequently, the connector 20 is placed on the one surface of the circuit board 10. At this time, the part of the receptacle 24 where the cut-off receiving portion 27 is provided and the part thereof closer to the opening 24A than the former part project from the end edge of the circuit board 10, and the remaining part is arranged along the one surface of the circuit board 10. With the connector 20 placed on the circuit board 10, the board connecting portion 44 of each terminal fitting 41 is placed on the solder and the mounting portion 33 of each fixing bracket 31 also similarly is placed on the solder. Subsequently, the circuit board 10 having the connector 20 placed thereon is caused to travel in an unillustrated reflow furnace to melt the solder.
(24) Subsequently, the circuit board 10 having the connector 20 placed thereon is caused to travel in an unillustrated reflow furnace to melt the solder. The solder is cooled and hardened thereafter. Thus, the board connecting portion 44 of each terminal fitting 41 is fixed to the corresponding conductive path to establish conduction and the mounting portion 33 of each fixing bracket 31 is fixed to the circuit board 10.
(25) Subsequently, the resin portion 50 is formed by molding. As shown in
(26) The circuit board 10 having the connector 20 fixed thereto is set in the lower mold 62 and covered with the upper mold 61 from above, and the mold 60 is closed (setting step). The upper mold 61 is provided with an upper mold cut-off portion 61A (cut-off portion), the lower mold 62 is provided with a lower mold cut-off portion 62A (cut-off portion), and the connector housing 21 is sandwiched firmly by the upper mold 61 and the lower mold 62 with the upper mold cut-off portion 61A and the lower mold cut-off portion 62A held in contact with the flexible wall 29 over the entire periphery. The flexible wall 29 is pressed by the upper mold cut-off portion 61A and the lower mold cut-off portion 61A to be deflected toward the receptacle 24. The upper mold cut-off portion 61A and the lower mold cut-off portion 62A are pressed strongly against the flexible wall 29 by a restoring force of the flexible wall 29. Contact pressures of the upper mold cut-off portion 61A and the lower mold cut-off portion 62A are not received directly by the receptacle 24, but are received by the flexible wall 29 in this way. Thus, the deformation of the receptacle 24 can be suppressed.
(27) Subsequently, molten resin is poured into the cavity 63 formed in the mold 60 (resin portion forming step). At this time, a flow of the resin to the outside of the mold 60 is cut off (resin cut-off) between the upper mold cut-off portion 61A, the lower mold cut-off portion 62A and the flexible wall 29 since the upper mold cut-off portion 61A and the lower mold cut-off portion 62A are strongly pressed against the flexible wall 29.
(28) When the inside of the mold 60 is filled with the resin, the resin is cooled and cured. In this way, the resin portion 50 is formed.
(29) When the resin is cured, the mold 60 is opened in the vertical direction and the completed ECU 1 is taken out from the mold. In the resin portion forming step, the molten resin is poured and cured with the flexible wall 29 deflected by the upper mold cut-off portion 61A and the lower mold cut-off portion 62A. Thus, in the completed ECU 1, the flexible wall 29 is inclined so that the free end 29B is closer to the receptacle 24 than the base end 29A and constitutes an inclined wall. The free end 29B is embedded in the resin portion 50 and the remaining part including the base end 29A (part in contact with the upper mold cut-off portion 61A and the lower mold cut-off portion 62A at the time of molding) is exposed to outside from the resin portion 50.
(30) As described above, the ECU 1 of this embodiment includes the circuit board 10, the connector 20 fixed to the circuit board 10 and the resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes the housing body 22 and the cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes the flange 28 projecting out from the housing body 22 and the flexible wall 29 extending from the flange 28 and inclined to be closer to the housing body 22 toward the tip, and a part of the flexible wall 29 is embedded in the resin portion 50.
(31) Further, a method for manufacturing the ECU 1 of this embodiment includes the setting step of setting the circuit board 10 and the connector 20 fixed to the circuit board 10 in the mold 60 and the resin portion forming step of pouring the molten resin into the mold 60 and curing the molten resin. The mold 60 includes the upper mold cut-off portion 61A and the lower mold cut-off portion 62A for cutting off the flow of the resin to the outside of the mold 60 between the connector 20 and the mold 60 by pressing the connector 20. The connector 20 includes the housing body 22 and the cut-off receiving portion 27 projecting from the housing body 22, and the cut-off receiving portion 27 includes the flange 28 projecting out from the housing body 22 and the flexible wall 29 extending from the flange 28 and deflectable toward the housing body 22. In the resin portion forming step, the upper mold cut-off portion 61A and the lower mold cut-off portion 62A press the flexible wall 29.
(32) According to the above configuration, pressing forces from the upper mold cut-off portion 61A and the lower mold cut-off portion 62A provided in the mold 60 can be received by the flexible wall 29 in the step of molding the resin portion 50. Thus, the deformation of the housing body 22 can be avoided.
(33) Further, the housing body 22 includes the tubular receptacle 24 capable of accommodating the mating connector inside, and the cut-off receiving portion 27 is continuous from the receptacle 24.
(34) Since the receptacle 24 is hollow inside, the receptacle 24 may be deformed if directly receiving the pressing forces by the upper mold cut-off portion 61A and the lower mold cut-off portion 62A. Since the cut-off receiving portion 27 is continuous from the receptacle in this embodiment, the deformation of the receptacle 24 can be suppressed.
(35) Further, since the cut-off receiving portion 27 is arranged over the entire periphery of the housing body 22, the deformation of the housing body 22 can be avoided.
(36) The invention is not limited to the above described and illustrated embodiment. For example, the following various modes also are included.
(37) Although the flexible wall 29 extends in the direction toward the terminal holding wall 23 (leftward direction of
(38) Although the cut-off receiving portion 27 extends from the receptacle 24 in the above embodiment, a cut-off receiving portion may be continuous from a part of the housing body 22 different from the receptacle 24.
(39) The cut-off receiving portion 27 is arranged over the entire periphery of the housing body 22 in the above embodiment. However, even if a cut-off receiving portion is arranged only on a part of the housing body 22, a certain effect of suppressing the deformation of the housing body 22 is exhibited.
LIST OF REFERENCE SIGNS
(40) 1: ECU (circuit device) 10: circuit board 20: connector 22: housing body 24: receptacle 27: cut-off receiving portion 28: flange portion (projecting portion) 29: flexible wall (inclined wall) 50: resin portion 60: mold 61A: upper mold cut-off portion (cut-off portion) 62A: lower mold cut-off portion (cut-off portion)