Photodiode and photosensitive device

Abstract

Provided is a semiconductor photodiode which has an electrode structure having not only high adhesion to a Mg.sub.2Si material but also improved overall performance including photosensitivity. A photodiode comprising: a pn junction of a magnesium silicide crystal; an electrode comprising a material that is in contact with p-type magnesium silicide; and an electrode comprising a material that is in contact with n-type magnesium silicide, wherein the material that is in contact with p-type magnesium silicide is a material which has a work function of 4.81 eV or more and reacts with silicon to form a silicide or form an alloy with magnesium.

Claims

1. A photodiode comprising: a pn junction of a magnesium silicide crystal; an electrode comprising a material that is in contact with p-type magnesium silicide; and an electrode comprising a material that is in contact with n-type magnesium silicide, wherein the material that is in contact with p-type magnesium silicide is a material which has a work function of 4.81 eV or more and is capable of reacting with silicon to form a silicide or form an alloy with magnesium, and the material that is in contact with p-type magnesium silicide is at least one metal selected from the group consisting of nickel, cobalt, platinum, palladium, iridium, rhenium, rhodium, beryllium, selenium, and tellurium, or at least one alloy thereof, wherein the electrode comprising the material that is in contact with p-type magnesium silicide comprises: the material that is in contact with p-type magnesium silicide; and other material that is in contact with the former material, and the other material is at least one metal selected from the group consisting of gold, palladium and platinum or at least one alloy thereof, except for the metal selected as the material that is in contact with p-type magnesium silicide.

2. The photodiode according to claim 1, wherein the material that is in contact with n-type magnesium silicide is a material which has a work function of less than 4.81 eV and is capable of reacting with silicon to form a silicide or form an alloy with magnesium.

3. The photodiode according to claim 1, wherein the material that is in contact with n-type magnesium silicide is at least one metal selected from the group consisting of aluminum, gallium, indium, arsenic, antimony, bismuth, silver, copper, zinc, cadmium, titanium, vanadium, chromium, manganese, iron, yttrium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten, or at least one alloy thereof.

4. The photodiode according to claim 1, wherein the material that is in contact with p-type magnesium silicide is in a form of a thin film having a thickness of from 1 to 1000 nm.

5. The photodiode according to claim 1, wherein the p-type magnesium silicide is magnesium silicide doped with silver.

6. The photodiode according to claim 1, wherein at least one of the electrodes is a ring-shaped electrode having an opening on its inner side.

7. A photosensitive device comprising the photodiode according to claim 1.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 shows a basic structure of an Mg.sub.2Si photodiode.

(2) FIG. 2 shows an energy level diagram for a conventional Ti electrode.

(3) FIG. 3 shows an energy level diagram in the technique of the present disclosure.

(4) FIG. 4 shows spectral sensitivity spectra of Example 1 and Comparative Example 1.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

(5) A photodiode according to the technique of the present disclosure basically includes: a pn junction of Mg.sub.2Si crystal; an electrode containing a material that is in contact with p-type Mg.sub.2Si; and an electrode containing a material that is in contact with n-type Mg.sub.2Si. Preferably, the Mg.sub.2Si is composed of a crystalline material and is single crystal. Non-doped Mg.sub.2Si generally exhibits n-type conductivity, and the Mg.sub.2Si having the pn junction of Mg.sub.2Si formed such as by introducing a p-type impurity into a part of the Mg.sub.2Si is regarded as a main structure for the diode, and the main structure is provided with electrodes for extracting photocurrent to make the photodiode of the present disclosure.

(6) The photodiode according to the present disclosure is characterized in that a material of the electrode that is in direct contact with p-type Mg.sub.2Si has a work function of 4.81 eV or more, and reacts with Si to form a silicide or form an alloy with magnesium. As described above, the electron affinity for Mg.sub.2Si is 4.51 eV, and its work function varies depending on the carrier concentration and is between 4.51 and 4.81 eV for n-type Mg.sub.2Si and between 4.81 and 5.11 eV for p-type Mg.sub.2Si. Therefore, if the material of the electrode that is in contact with p-type Mg.sub.2Si has a work function of 4.81 eV or more, an energy barrier can be eliminated at an interface between the p-type Mg.sub.2Si and the electrode for electron holes to be transported to the electrode, among electron hole pairs of photo carriers formed in a depletion layer and a diffusion region of the pn junction, or an impact of the energy barrier can be reduced to such an extent that causes no practical problems, so that a collection efficiency of carriers can be significantly improved.

(7) The material of the electrode that is in direct contact with p-type Mg.sub.2Si has a work function of 4.81 eV or more as described above, and reacts with Si to form a silicide or forms an alloy with magnesium. Thus, when the material of the electrode that is in direct contact with Mg.sub.2Si is the material that reacts with Si to form a silicide or an alloy with magnesium, a part of Si in Mg.sub.2Si can be allowed to react with the electrode material at the interface where Mg.sub.2Si is in contact with a part of the electrode material to form a strong bond, resulting in higher adhesion of p-type Mg.sub.2Si to the electrode enough to withstand the use as a practical device.

(8) In the photodiode according to the present disclosure, examples of the electrode material that is in direct contact with p-type Mg.sub.2Si, which has a work function of 4.81 eV or more and reacts with Si to form a silicide or form an alloy with magnesium, includes, at least one metal selected from the group consisting of nickel (Ni), cobalt (Co), platinum (Pt), palladium (Pd), iridium (Ir), rhenium (Re), rhodium (Rh), beryllium (Be), selenium (Se), and tellurium (Te), or at least one alloy thereof. The use of such a metal material as the electrode material that is in direct contact with p-type Mg.sub.2Si can lead to improved adhesion at the interface between the metals in the case of an electrode structure where the metal material is further provided with other metal material.

(9) As described above, the energy barrier formed at the interface between p-type Mg.sub.2Si and the electrode that is in direct contact with p-type Mg.sub.2Si is problematic in the prior arts, but the same problem is caused at the interface between n-type Mg.sub.2Si and the electrode that is in direct contact with the n-type Mg.sub.2Si. Since majority carriers will be electrons at the interface between n-type Mg.sub.2Si and the electrode, the work function of the electrode material that is in direct contact with n-type Mg.sub.2Si should be 4.81 eV or less which is the work function of n-type Mg.sub.2Si, in order to prevent formation of the energy barrier for electrons transported to the electrode at the interface. Moreover, the electrode material is formed as a material that reacts with silicon to form a silicide or form an alloy with magnesium, whereby good adhesion to Mg.sub.2Si can be obtained.

(10) As described above, examples of the material that has a work function of 4.81 eV or less and reacts with Si to form a silicide or form an alloy with magnesium include at least one metal selected from the group consisting of aluminum (Al), silver (Ag), titanium (Ti), gallium, indium, arsenic, antimony, bismuth, copper, zinc, cadmium, vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), yttrium (Y), zirconium (Zr), niobium (Nb), molybdenum (Mo), hafnium (Hf), tantalum (Ta) and tungsten (W), or at least one alloy thereof. In the prior art Non-Patent Document 3, Ag having a work function of 4.26 eV is used as an electrode material that is in direct contact with n-type Mg.sub.2Si.

(11) In the photodiode according to the present disclosure, the electrode that is in contact with p-type Mg.sub.2Si may be an electrode having a structure including: a material that is in direct contact with p-type Mg.sub.2Si; and other material that is in contact with the material. Such a structure can allow characteristics of the entire electrode to be changed to desired characteristics to further improve the characteristics, as compared with a case where the electrode material is made of only one material that is in direct contact with p-type Mg.sub.2Si. For example, electrical properties, durability and weather resistance of the entire electrode can be improved by using an electrode formed by combining materials having higher conductivity than the material that is in direct contact with p-type Mg.sub.2Si or combining materials having high chemical stability.

(12) Examples of such materials include at least one metal selected from the group consisting of Au, Pd, and Pt or at least one alloy thereof. A structure formed such that only Au or Pd or its alloy portion of the electrodes is exposed by means of an appropriate passivation treatment can allow prevention of the electrode material that is in direct contact with p-type Mg.sub.2Si from being degraded to achieve a photodiode having high durability and weather resistance, even if the electrode material is a material easily degraded by oxidation or the like.

(13) Further, in the photodiode according to the present disclosure, a specific arrangement form and the like of the material that is in direct contact with p-type Mg.sub.2Si is not particularly limited, including, as a specific aspect, a thin film having a thickness of from 1 to 1000 nm. If the thickness is less than 1 nm, any sufficient adhesion to p-type Mg.sub.2Si may not be obtained. If the thickness is more than 1000 nm, the electrode may be easily separated, or the electrical resistance of the electrode may be increased, which may cause a decrease in photocurrent. The thickness can be 5 nm or more, or 8 nm or more, and 500 nm or less, or 100 nm or less.

(14) As described above, the pn junction of Mg.sub.2Si crystal, which is the main structure of the photodiode according to the present disclosure, can be formed by doping a part of non-doped Mg.sub.2Si crystal that will generally be of n-type, with an impurity that will be of p-type, as described above. Such a dopant impurity includes Ag. Ag is an element which diffuses into the interior of the Mg.sub.2Si crystal by a heat treatment to form relatively easily a Mg.sub.2Si structure locally doped with Ag.

(15) Furthermore, in the photodiode according to the present disclosure, a specific structure, shape and the like of the electrode are not particularly limited, and examples of the structure and the like include, in a specific embodiment, a ring-shaped electrode having an opening on its inner side, as an electrode on at least one side. As described above, when the ring-shaped electrode having an opening in its inner side is formed on a surface on at least one side of the structure where the pn junction is formed at a predetermined position in a depth direction from the surface of Mg.sub.2Si, a light passing through the opening can excite photo carriers in a wide range of pn junctions, so that a photodiode having high photosensitivity can be realized.

(16) In addition, the structure of FIG. 1 shows that the electrode on the side that is in contact with p-type Mg.sub.2Si is in the ring shape, but the present disclosure is not limited to this structure, and the electrode on a side that is in contact with n-type Mg.sub.2Si may be in the ring shape or the electrodes on both sides may be in the ring shape. Further, as used herein, the “ring shape” is not limited to a circular shape, and means an annular shape including oval and polygonal shapes.

(17) Various photosensitive devices such as a photodetectors and imaging devices can be formed by using the Mg.sub.2Si photodiode having the structure as described above as a basic element structure. In particular, the Mg.sub.2Si photodiode according to the present disclosure has good sensitivity characteristics for infrared light in a wavelength range of from 900 to 1900 nm, among the short wavelength infrared ranges, and can be suitably used for a photosensitive device assuming the use in such a wavelength range.

(18) A method for producing the photodiode according to the present disclosure is not particularly limited, and the photodiode according to the present invention may be produced by a method including any means as long as the above structure of the photodiode can be realized. Hereinafter, an example of the production method and technical means relating to the production which can be used to embody the structure of the photodiode according to the present disclosure are shown, although not limited thereto.

(19) First, to form the pn junction of Mg.sub.2Si crystal, which will be a main structure of the photodiode according to the present disclosure, a crystalline material of Mg.sub.2Si is prepared. The single crystal material of Mg.sub.2Si is preferable as the crystalline material of Mg.sub.2Si as described above, and the single crystal material of Mg.sub.2Si can be obtained by a known method as disclosed in, for example, Non-Patent Document 1. In order to form the photodiode according to the present disclosure, it is preferable that the Mg.sub.2Si crystalline material is formed into a plate-shaped substrate having a thickness of from about 0.1 to 5 mm in advance, and is then used after polishing its surface, in terms of the process.

(20) A part of the Mg.sub.2Si crystalline material prepared according to the above process is doped with a p-type impurity to form a pn junction of Mg.sub.2Si. Since non-doped Mg.sub.2Si exhibits n-type conductivity, the doping of the part of non-doped Mg.sub.2Si with the p-type impurity to change a partial region of the crystalline material of Mg.sub.2Si to p-type Mg.sub.2Si will result in formation of pn junction at an interface between the doped region and the non-doped region.

(21) The means for doping a part of the crystalline material of Mg.sub.2Si with the p-type impurity and the p-type impurity species (dopant) are not particularly limited, and desired means and dopants may be used. Herein, the use of Ag as a dopant and a doping method by thermal diffusion are given as an example. Ag is disposed as a diffusion source on the surface of the crystalline material of Mg.sub.2Si, and heated in an inert atmosphere to diffuse thermally Ag from the surface of the crystalline material of Mg.sub.2Si to the interior. Ag as a diffusion source can be arranged and formed on the surface of the crystalline material of Mg.sub.2Si by vacuum deposition, sputtering or the like, in an amount required for thermal diffusion to the interior. The conditions of the heat treatment as described above can be adjusted and set in view of a diffusion rate and a depth of a diffusion region to be formed, i.e., a position where the pn junction is formed. For example, the heat treatment temperature may be set to 400 to 550° C., and the heat treatment time may be set within a range of from 30 seconds to 30 minutes.

(22) An Electrode required for extracting and detecting photocurrent is then formed in each of the p-type and n-type regions of the Mg.sub.2Si crystal in which the pn junction is formed. A specific means for forming the electrode on the surface of the Mg.sub.2Si crystal in each of the p-type and n-type regions is not particularly limited, and the electrode may be formed by using known methods such as vacuum evaporation, sputtering and plating depending on the electrode material and the like. In this case, a masking or photolithographic technique may also be used to form a ring-shaped electrode or a desired electrode pattern, as disclosed in Non-Patent Documents 2 and 3.

(23) In addition to the foregoing, further operation may be additionally carried out as needed which forms a multilayer electrode by carrying out electrode formation with other material, or forms a protective layer, or performing etching or polishing to remove a part of an unnecessary structure. The means and conditions specifically mentioned above are merely by way of example, and other means and conditions may be applied as long as the essential structure of the Mg.sub.2Si photodiode according to the present disclosure can be obtained.

EXAMPLES

(24) The technical contents of the present disclosure will be specifically described below based on Example and Comparative Example. The following Example and Comparative Example are merely specific examples for better understanding of the technical contents of the present disclosure, and the scope of the present invention is not limited by these specific examples.

Example 1

(25) A single crystal material of n-type Mg.sub.2Si grown by a vertical Bridgman method according to the method disclosed in Non-Patent Document 1 was prepared as a crystalline material of Mg.sub.2Si, and the single crystal material was cut out at a (110) plane to mirror-polish both sides. After polishing, the material was washed to obtain a Mg.sub.2Si single crystal substrate having a thickness of 1 mm. The carrier concentration of the substrate is 6×10.sup.15 cm.sup.−3. An Ag layer having a diameter of 800 μm serving as a diffusion source was formed on a part of one surface of the substrate by a vacuum deposition method, and then thermally diffused from one surface of the Mg.sub.2Si substrate in the depth direction by carrying out a heat treatment in an argon (Ar) atmosphere at 450° C. for 10 minutes to form a p-type Mg.sub.2Si layer in a partial region of the n-type Mg.sub.2Si crystal.

(26) Then, on the surface of the formed p-type Mg.sub.2Si layer, a circular ring-shaped Ni layer having an inner diameter of 500 μm, a width of 75 μm, and a thickness of 10 nm was formed by sputtering. An Au layer having a thickness of 300 nm and the same size as that of the Ni layer was then formed directly on the formed Ni layer by vacuum evaporation. In this example, in the pn junction of Mg.sub.2Si crystal, the material that is in direct contact with p-type Mg.sub.2Si is Ni having a work function of 5.15 eV, and the structure including the Ni layer and the Au layer formed directly thereon is an electrode on the p-type Mg.sub.2Si side. Further, an Al layer having a work function of 4.28 eV was formed so as to have a thickness of 300 nm by vacuum deposition over the entire surface of the n-type Mg.sub.2Si on the opposite side of the substrate, which was regarded as an electrode on the n-type Mg.sub.2Si side. It should be noted that the carrier concentration in the p-type region is 1×10.sup.19 cm.sup.−3 from the above diffusion conditions, and the work function of p-type Mg.sub.2Si at this time is estimated to be about 5.09 eV, and the work function of n-type Mg.sub.2Si is estimated to be about 4.62 eV, from the carrier concentrations in the p-type and n-type regions.

(27) The spectral sensitivity characteristics of the Mg.sub.2Si photodiode thus produced were evaluated by measuring spectral sensitivity spectrum. The measurement was carried out by diffracting a light from a halogen lamp by a spectrometer and allowing the light to be incident from the opening side of the ring-shaped electrode to the photodiode formed as described above, and amplifying the resulting photocurrent by a circuit using an operational amplifier, and detecting the photocurrent using a lock-in amplifier.

(28) FIG. 4 (the solid line) shows a spectral sensitivity spectrum at a wavelength of 1300 to 2200 nm. It was confirmed from the spectrum that the spectral sensitivity had a peak at a wavelength of 1350 nm, and its maximum value was about 0.14 NW. The adhesion of the electrodes was evaluated by a tape test method according to JIS H 8504, indicating that the electrodes adhering to the tape were 5% or less of the electrode area for both pn sides, and no problem of the adhesion of the electrodes was observed.

Comparative Example 1

(29) A photodiode was produced by the same method as that of Example 1, with the exception that the material of the electrode layer that was in direct contact with the surface of the p-type Mg.sub.2Si layer was Ti. That is, in this Example, the material that is in direct contact with p-type Mg.sub.2Si is a layer of Ti having a work function of 4.33 eV, and the structure including the Ti layer and an Au layer formed directly on the Ti layer is an electrode on the p-type Mg.sub.2Si side in the pn junction of Mg.sub.2Si crystal. An electrode that is in contact with the entire surface of the opposing n-type Mg.sub.2Si is Al as in Example 1. In this example, the spectral sensitivity characteristics were also evaluated by the same means and conditions as those of Example 1. In addition, as with Example 1, the work function of p-type Mg.sub.2Si at this time is estimated to be about 5.09 eV, and the work function of n-type Mg.sub.2Si is estimated to be about 4.62 eV from the carrier concentrations in the p-type and n-type regions.

(30) FIG. 4 (the dotted line) also shows a spectral sensitivity spectrum at wavelength of 1300 to 2200 nm. The shape of the spectrum is approximately similar to that of Example 1. However, it was confirmed that the maximum value of the spectral sensitivity at the peak position was less than about 0.08 NW, which was less than about 57% of the maximum value in Example 1. In this example, the evaluation result of the adhesion of the electrode by the tape test method according to JIS H 8504 also indicated that the electrodes on both pn sides were 5% or less of the electrode area, and no problem of the adhesion of the electrode was observed.

(31) These results are summarized in Table 1 below.

(32) TABLE-US-00001 TABLE 1 Electrode in contact with Electrode in contact with p-type Mg.sub.2Si n-type Mg.sub.2Si Spectral Sensitivity Material Work Function (eV) Adhesion Material Work Function (eV) Adhesion Maximum Value Example 1 Ni 5.15 ◯ Al 4.28 ◯ 0.14 Comparative Example 1 Ti 4.33 ◯ Al 4.28 ◯ 0.08

(33) As can be seen from the above results, no significant problem is recognized in both Examples in relation to the adhesion of the electrodes to Mg.sub.2Si. This would be because both materials that are in direct contact with Mg.sub.2Si react with Si to form a silicide. However, for the values of the spectral sensitivities, a significant difference was observed between Example and Comparative Example. It is believed that, in Example 1 where the material that is in direct contact with p-type Mg.sub.2Si is Ni having a work function of 5.15 eV, no energy barrier for transportation of electron holes is formed at the interface between p-type Mg.sub.2Si and Ni electrode layer, so that the electron holes as majority carriers can effectively reach the electrodes.

(34) On the other hand, it is believed that, in Comparative Example 1 where the material that is in direct contact with p-type Mg.sub.2Si is Ti having a work function of 4.33 eV, even if photo carriers are generated by light incidence, a part of the electron holes is prevented from transported to the electrode due to the energy barrier formed at the interface between the p-type Mg.sub.2Si and the Ti electrode layer, so that the photo carriers are not effectively detected as photoelectric current. In view of these, it has been found that it is highly effective to select and adjust appropriately the work function of the material that is in direct contact with p-type Mg.sub.2Si based on the technical idea according to the present disclosure, in order to improve the performance of the Mg.sub.2Si photodiode significantly.

INDUSTRIAL APPLICABILITY

(35) According to the technique of the present disclosure, in the photodiode using the pn junction of Mg.sub.2Si, the light sensitivity can be significantly improved as compared with the prior arts. Therefore, it is possible to improve dramatically the performance of various devices for sensing and imaging in the infrared regions at short wavelengths (approximately from 0.9 to 2.5 μm) assumed by photodiodes using Mg.sub.2Si. Accordingly, a significant contribution can also be expected to techniques of various image analysis and image diagnosis in those wavelength ranges, and further automatic monitoring and automatic control techniques using them, as well as industrial fields using these techniques.

DESCRIPTION OF REFERENCE NUMERALS

(36) 104 other material electrode that is in contact with material that is in direct contact with p-type Mg.sub.2Si 301 depletion layer and diffusion length 302 electron 303 electron holes