Silyl Pseudohalides For Silicon Containing Films

Abstract

Silyl pseudohalides having a general formula of R.sub.4nSiX.sub.n, where n is a range of 1-4, each R is independently selected from H, alkyl, alkenyl, aryl, amino, alkyl amino, alkoxide, and phosphine groups, and each X is a pseudohalide selected from nitrile, cyanate, isocyanate, thiocyanate, isothiocyanate, selenocyanate and isoselenocyanate are disclosed. Further, some embodiments of the disclosure provide methods for depositing silicon-containing films using silyl pseudohalides.

Claims

1. A method of depositing a silicon-containing film, the method comprising exposing a substrate to a silyl pseudohalide and a reagent to deposit a silicon-containing film, the silyl pseudohalide has a general formula of R.sub.4nSiX.sub.n, wherein n is a range of 1-3, each R is independently selected from H, alkyl, alkenyl, aryl, amino, alkylamino, alkoxide, and phosphine groups, and each X is a pseudohalide selected from nitrile, cyanate, isocyanate, thiocyanate, isothiocyanate, selenocyanate and isoselenocyanate.

2. The method of claim 1, wherein the silicon-containing film comprises SiO and the reagent comprises one or more of oxygen gas, ozone, water, alcohols, peroxide or plasmas thereof.

3. The method of claim 1, wherein the silicon-containing film comprises SiN and the reagent comprises one or more of amines, alkylamines, hydrazine, alkylhydrazines, allylhydrazines and plasmas thereof.

4. The method of claim 3, wherein the reagent further comprises a plasma of He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof.

5. The method of claim 1, wherein the silicon-containing film comprises SiCON and the reagent comprises one or more of alcohols, peroxide, amines, alkyl amines, hydrazine, alkylhydrazines, allylhydrazines and plasmas thereof.

6. The method of claim 5, wherein the reagent further comprises a plasma of CO, O.sub.2, N.sub.2O, He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof.

7. A method of depositing a SiO-containing film, the method comprising exposing a substrate to a silyl pseudohalide and an oxidizing agent to deposit the SiO-containing film, provided that the silyl pseudohalide is not Si(NCO).sub.4 or CH.sub.3OSi(NCO).sub.3.

8. The method of claim 7, wherein the silyl pseudohalide has a general formula of R.sub.4nSiX.sub.n, wherein n is a range of 1-4, each R is independently selected from H, alkyl, alkenyl, aryl, amino, alkyl amino, alkoxide, and phosphine groups, and each X is a pseudohalide selected from nitrile, cyanate, isocyanate, thiocyanate, isothiocyanate, selenocyanate and isoselenocyanate.

9. The method of claim 8, wherein n is not 4.

10. The method of claim 7, wherein the oxidizing agent comprises one or more of oxygen gas, ozone, water, alcohols, peroxide or plasmas thereof.

11. A method of depositing a SiN-containing film, the method comprising exposing a substrate to a silyl pseudohalide and a nitridating agent to deposit the SiN-containing film.

12. The method of claim 11, wherein the silyl pseudohalide has a general formula of R.sub.4nSiX.sub.n, wherein n is a range of 1-4, each R is independently selected from H, alkyl, alkenyl, aryl, amino, alkyl amino, alkoxide, and phosphine groups, and each X is a pseudohalide selected from nitrile, cyanate, isocyanate, thiocyanate, isothiocyanate, selenocyanate and isoselenocyanate.

13. The method of claim 12, wherein n is not 4.

14. The method of claim 11, wherein the nitridating agent comprises one or more of amines, alkylamines, hydrazine, alkylhydrazines, allylhydrazines and plasmas thereof.

15. The method of claim 14, wherein the nitridating agent further comprises a plasma of He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof.

16. (canceled)

17. (canceled)

18. The method of claim 22, wherein n is not 4.

19. The method of claim 22, wherein the reactant comprises one or more of alcohols, water, peroxide, amines, alkyl amines, hydrazine, alkylhydrazines, allylhydrazines and plasmas thereof.

20. The method of claim 19, wherein the reactant further comprises a plasma of CO, O.sub.2, N.sub.2O, He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof.

21. The method of claim 1, wherein the silicon-containing film comprises carbon.

22. The method of claim 21, wherein the silicon-containing film comprises SiCON.

Description

DETAILED DESCRIPTION

[0008] Before describing several exemplary embodiments of the disclosure, it is to be understood that the disclosure is not limited to the details of construction or process steps set forth in the following description. The disclosure is capable of other embodiments and of being practiced or being carried out in various ways.

[0009] As used in this specification and the appended claims, the term substrate refers to a surface, or portion of a surface, upon which a process acts. It will also be understood by those skilled in the art that reference to a substrate can also refer to only a portion of the substrate, unless the context clearly indicates otherwise. Additionally, reference to depositing on a substrate can mean both a bare substrate and a substrate with one or more films or features deposited or formed thereon

[0010] A substrate as used herein, refers to any substrate or material surface formed on a substrate upon which film processing is performed during a fabrication process. For example, a substrate surface on which processing can be performed include materials such as silicon, silicon oxide, strained silicon, silicon on insulator (SOI), carbon doped silicon oxides, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, metal silicides and other conductive materials, depending on the application. Substrates include, without limitation, semiconductor wafers. Substrates may be exposed to a pretreatment process to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure and/or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in the present disclosure, any of the film processing steps disclosed may also be performed on an underlayer formed on the substrate as disclosed in more detail below, and the term substrate surface is intended to include such underlayer as the context indicates. Thus for example, where a film/layer or partial film/layer has been deposited onto a substrate surface, the exposed surface of the newly deposited film/layer becomes the substrate surface.

[0011] Embodiments of the present disclosure relate to silyl pseudohalides and uses thereof for the deposition of silicon containing films. Some embodiments of the disclosure relate to silyl psedohalides. Some embodiments of the disclosure relate to methods for depositing silicon-containing films, including but not limited to SiO-containing, SiN-containing and SiCON-containing films.

[0012] As used in this regard, Si-containing films is an open ended term to denote films which comprise silicon. A Si-containing film may also contain one or more other elements, including but not limited to oxygen, nitrogen and carbon. Similarly, a SiO-containing film comprises silicon and oxygen, and may also contain nitrogen and/or carbon.

[0013] Some embodiments of the disclosure provide for the use of silyl pseudohalides in place of silyl halides for the deposition of similar materials. The inventors have found that pseudohalogen functional groups have similar reactivity and are good/stable leaving groups. The pseudohalogen functional groups are also less corrosive/oxidizing. A non-exhaustive list of pseudohalogen leaving groups and the oxidizing power thereof is provided below:

F.sup.>Cl.sup.>Br.sup.>CN.sup.>SCN.sup.>I.sup.>(SCSN.sub.3).sup.>SeCN.sup.

[0014] Some embodiments of this disclosure relate to novel silyl pseudohalides. In some embodiments, the silyl pseudohalide has a general formula of R.sub.4nSiX.sub.n, where n is 1-4, each R is independently selected from H, alkyl, alkenyl, aryl, amino, alkylamino, alkoxide, and phosphine groups, and each X is a pseudohalide selected from nitrile (CN), cyanate (OCN), isocyanate (NCO), thiocyanate (SCN), isothiocyanate (NCS), selenocyanate (SeCN) and isoselenocyanate (NCSe). For the avoidance of doubt, the atom closest to the dash () is the atom bonded to the silicon atom.

[0015] As used in this disclosure and the appended claims, the following terms are provided with the definitions outlined below. Alkyl is any saturated carbon chain containing 1-6 carbon atoms. In some embodiments, an alkyl group may be branched or linear. In some embodiments, an alkyl group may be cyclic.

[0016] Alkenyl is an unsaturated carbon chain containing 2-6 carbon atoms. In some embodiments, an alkenyl group may be branched or linear. In some embodiments, an alkenyl group may contain a double bond. In some embodiments, an alkenyl group may be cyclic.

[0017] Aryl is any aromatic cyclic structure. In some embodiments, an aryl group may contain 4-8 atoms. In some embodiments, an aryl group may contain heteroatoms (e.g., N or O).

[0018] Amino is group with a nitrogen atom and associated hydrogen atoms bonded to the silicon atom.

[0019] Alkylamino is a group with at least one alkyl group (as defined above) bonded to a nitrogen atom which is bonded to the silicon atom.

[0020] Alkoxide is a group with an alkyl group (as defined above) bonded to an oxygen atom which is bonded to the silicon atom.

[0021] Phosphine is a group with a phosphorous atom and associated hydrogen atoms bonded to the silicon atom.

[0022] In some embodiments, the silyl pseudohalide comprises at least one R. Stated differently, in some embodiments, n is 1-3. In some embodiments, the silyl pseudo halide is not Si(NCO).sub.4. In some embodiments, when R is hydrogen, methyl, ethyl or methoxy, X is not NCO for any n. In some embodiments, the silyl pseudohalide is not (C.sub.4H.sub.9)Si(NCO).sub.3. In some embodiments, when R is hydrogen, alkyl or aryl, X is not NCSe when n is 1. In some embodiments, the silyl pseudo halide is not Si(NCS).sub.4. In some embodiments, when R is methyl, X is not NCS for any n. In some embodiments, when R is alkyl, alkoxy or aryl, X is not NCS when n is 1. In some embodiments, when R.sub.3 consists of (CH.sub.3)H.sub.2, X is not CN, NCO, NCS or NCSe.

[0023] Some embodiments of this disclosure relate to methods for depositing silicon-containing films using the silyl pseudohalides disclosed above. The method of depositing a silicon-containing film comprises exposing a substrate to a silyl pseudohalide and a reagent to deposit a silicon-containing film.

[0024] In some embodiments, the exposing the substrate to the silyl pseudohalide and exposing the substrate to the reagent is performed simultaneously. Stated differently, in some embodiments, the silicon-containing film is deposit by a chemical vapor deposition (CVD) type method.

[0025] In some embodiments, the exposing the substrate to the silyl pseudohalide and exposing the substrate to the reagent is performed separately. Stated differently, in some embodiments, the silicon-containing film is deposit by an atomic layer deposition (ALD) type method. In some embodiments, the exposures may be separated by time in a time-domain ALD type method. In some embodiments, the exposures may be spatially separated by a physical partition or gas curtain. These embodiments may be known as a spatial ALD type method.

[0026] In some embodiments, the silyl pseudohalide does not contain 4 pseudohalide groups. Stated differently, in some embodiments, n is 1-3 or when n is 1-4, n is not 4.

[0027] In some embodiments, the silicon-containing film is a SiO-containing film and the reagent comprises one or more of oxygen gas (O.sub.2), ozone (O.sub.3), water (H.sub.2O), alcohols (e.g., methanol, ethanol, isopropyl alcohol, t-butanol), peroxide (H.sub.2O.sub.2) or plasmas thereof. In some embodiments, the reagent may be referred to as an oxidizing agent. In some embodiments, the silyl pseudohalide is not Si(NCO).sub.4. In some embodiments, the silyl pseuohalide is not CH.sub.3OSi(NCO).sub.3.

[0028] In some embodiments, the silicon-containing film is a SiN-containing film and the reagent comprises one or more of amines, alkylamines, hydrazine (N.sub.2H.sub.4), alkylhydrazines, allylhydrazines and plasmas thereof. In some embodiments, the reagent further comprises a plasma of He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof. In some embodiments, the reagent is referred to as a nitridating agent.

[0029] In some embodiments, the silicon-containing film is a SiCON-containing film and the reagent comprises one or more of alcohols, peroxide, amines, alkyl amines, hydrazine, alkylhydrazines, allylhydrazines and plasmas thereof. In some embodiments, the reagent further comprises a plasma of CO, O.sub.2, N.sub.2O, He, NH.sub.3, N.sub.2, Ar, H.sub.2 or a combination thereof. In some embodiments, the reagent may be referred to as a reactant.

[0030] Some embodiments of the disclosure relate to methods for depositing a SiON film. The method comprises exposing a substrate to a silyl pseudohalide in a processing chamber, purging the processing chamber, exposing the substrate to a plasma of N.sub.2 or NH.sub.3, and purging the processing chamber.

[0031] In some embodiments, the silyl pseudohalide is Si(NCO).sub.4. In some embodiments, the substrate is exposed to a pulse of ammonia and a purge of the processing chamber before exposure to a N.sub.2 plasma.

[0032] In some embodiments, the atomic percentage of oxygen in the deposited film is higher than a SiON film deposited by a similar process using SiH.sub.2I.sub.2. In some embodiments, the deposited film has an oxygen content greater than or equal to about 5 atomic percent, greater than or equal to about 8 atomic percent, greater than or equal to about 10 atomic percent, greater than or equal to about 15 atomic percent, greater than or equal to about 20 atomic percent or greater than or equal to about 25 atomic percent.

[0033] In some embodiments, the atomic percentage of nitrogen in the deposited film is higher than a SiON film deposited by a similar process using SiH.sub.2I.sub.2. In some embodiments, the deposited film has an oxygen content less than or equal to about 50 atomic percent, than or equal to about 45 atomic percent, than or equal to about 40 atomic percent, or than or equal to about 35 atomic percent.

[0034] In some embodiments, the etch rate of the deposited film is higher than a SiON film deposited by a similar process using SiH.sub.2I.sub.2 or SiI.sub.4. In some embodiments, the deposited film has an etch rate in 100:1 DHF which is greater than or equal to about 10 /min, greater than or equal to about 15 /min, greater than or equal to about 20 /min, greater than or equal to about 30 /min, greater than or equal to about 40 /min, greater than or equal to about 50 /min, greater than or equal to about 60 /min, greater than or equal to about 70 /min, greater than or equal to about 80 /min, or greater than or equal to about 90 /min.

[0035] In some embodiments, the etch rate of the deposited film is greater than a SiON film deposited by a similar process using SiH.sub.2I.sub.2 by a factor of greater than or equal to 3, greater than or equal to 5, greater than or equal to 8, greater than or equal to 10, greater than or equal to 12, or greater than or equal to 15.

[0036] Reference throughout this specification to one embodiment, certain embodiments, one or more embodiments or an embodiment means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of the phrases such as in one or more embodiments, in certain embodiments, in one embodiment or in an embodiment in various places throughout this specification are not necessarily referring to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0037] Although the disclosure herein has been described with reference to particular embodiments, those skilled in the art will understand that the embodiments described are merely illustrative of the principles and applications of the present disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the method and apparatus of the present disclosure without departing from the spirit and scope of the disclosure. Thus, the present disclosure can include modifications and variations that are within the scope of the appended claims and their equivalents.