Glitter framed poster board

Abstract

A glitter framed poster board having relatively large size glitter chips. A rectangular frame is laminated onto peripheral regions of a poster board. The rectangular frame includes four strips of paper arranged to form the frame. Each strip is coated on one side to adhere thereto the large size glitter chips that fully cover the strips. Each of the strips preferably has ends shaped into triangular patterns. A pair of diagonals from adjacent triangular patterns are in respective corners of the rectangular frame.

Claims

1. A method of forming a glitter framed poster board, comprising: laminating glitter chips to a coated side of paper to form a decorative lamination, the glitter chips having a sparkly characteristic and being arranged to cover an entirety of the coated side; cutting the decorative lamination into strips; arranging the strips into a shape of a rectangular frame; and laminating the rectangular frame onto peripheral regions of a poster board with glue such that the rectangular frame bounds a central region of the poster board and thereby forms the glitter framed poster board, the poster board being made of cardboard selected from the group consisting of paperboard, corrugated fiberboard, cardstock and any combination thereof, wherein an overall amount of shedding of the glitter chips present in the central region of the poster board is independent of a size of the glitter chips, wherein the laminating of the glitter chips to the coated side of paper with the adhesive includes depositing the glitter chips onto the coated side of the paper and applying heat and pressure to press the deposited glitter chips into the adhesive on the coated side of the paper to thereby strengthen bonding characteristics of the adhesive because of the applied heat and pressure, wherein the heat applied is at a temperature of at least 400 degrees Fahrenheit for at least three seconds.

2. The method of claim 1, further comprising: configuring respective ends of the strips into triangular shapes that have diagonals; arranging the strips relative to each other to define the rectangular frame so that neighboring ones of the strips each have the respective ends located at the corners of the rectangular frame; and arranging one diagonal of each pair of neighboring ones of the triangular shapes adjacent each other at the corners of the frame.

3. The method of claim 2, wherein each of the glitter chips being at least 0.042 inches in size.

4. The method of claim 1, wherein the glitter chips each have a size that is at least 0.042 inches.

5. The method of claim 1, wherein the overall amount of shedding of the glitter chips within 24 hours from a time of the laminating the rectangular frame is at least five times less than arises during a 24 hour period from a further time that further glitter chips are deposited onto glue on a poster board to form a same size rectangular frame in accordance with a silk screen application that deposits the further glitter chips onto the glue.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

(1) For a better understanding of the present invention, reference is made to the following description and accompanying drawings, while the scope of the invention is set forth in the appended claims. The patent or application file contains at least one drawing executed in color. Copies of this patent with color drawings will be provided by the Office upon request and payment of the necessary fee.

(2) FIG. 1 is an isometric view of a conventional coating machine.

(3) FIG. 2 is a top view of a decorative lamination sheet in accordance with the invention.

(4) FIG. 3 is a top view of four strips cut from the decorative lamination sheet of FIG. 2.

(5) FIG. 4 is a top view of a glitter framed poster board with the four strips of FIG. 3 arranged into a frame and laminated onto peripheral regions of the poster board.

(6) FIG. 5 is a schematic flow diagram of assembly stations arranged in succession for producing the glitter framed poster board of FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

(7) Turning to the drawings, FIG. 1 depicts a conventional coating machine is to be used to coat C1S paper with an adhesive. C1S paper is paper that is coated on one side with an adhesive. The conventional coating machine may be that of a ceramic coating machine from Shenzhen Xinjiatuo of China, product model KCDM650-9/12 KCDM1200-12/15. Large size glitter chips are deposited onto the C1S paper and subjected to pressure and heat. Any excess glitter chips are vacuumed away.

(8) FIG. 2 shows a decorative lamination 10, which is a sheet of the C1S paper whose coated side is entirely covered by the glitter chips 12 that have been pressed into the adhesive under heat and pressure from a hot press (such as a heated roller) of the conventional coating machine of FIG. 1. The glitter chips 12 are sparkly from light shining onto them. Preferably, the glitter chips are each at least 0.04 inches in size.

(9) FIG. 3 shows four strips 14 that are cut from the decorative lamination of FIG. 2. Each of the strips 14 preferably have opposite ends that are cut to form triangular patterns with diagonals 16 as shown. Each of the strips 14 have the glitter chips 12 that entirely cover the upper surface of the strips 14.

(10) FIG. 4 shows a glitter framed poster board in accordance with the invention whose strips 14 are arranged to form a frame 18 and are adhered to peripheral regions of a conventional poster board. As a consequence, the frame bounds the central region 20 of the poster board. The diagonals 16 from a respective pair of neighboring triangular patterns are in each of the corners of the frame 18 and placed adjacent each other as shown. Although portions of the peripheral region of the poster board can be seen between the adjacent diagonals in FIG. 4, it is preferable for the diagonals to abut each other and thus completely cover the peripheral portions of the poster board that is underneath.

(11) FIG. 5 shows the stations arranged in succession that may be used to assemble the glitter framed poster board of the present invention. The first station a C1S paper coating station 30 where the C1S paper is coated with an adhesive.

(12) The second station is a depositing glitter chip station 32 for depositing glitter chips onto the coated side of the C1S paper.

(13) The third station is a decorative lamination formation station 34 where a decorative lamination is formed after heat and pressure are applied by a hot press or heated roller to press the glitter chips into the adhesive on the coated side of the C1S paper. The adhesive responds to the pressure and heat to strengthen its bond between the glitter chips and the C1S paper. The applied heat and pressure that is acceptable for achieving such desired results is at a temperature of at least 400 degrees Fahrenheit under a pressure of at least 8500 pounds for at least three seconds. One can expect the adhesive to take on a uniform thickness over the C1S paper as a result. Any excess glitter chips that were deposited by were not adhered are then vacuumed away with any conventional vacuum source.

(14) The fourth station is a decorative lamination cutting station 36 where the decorative lamination is cut into strips whose ends have triangular patterns. Preferably, there is no plastic covering the glitter chips so they can be touched directly. The adhered glitter chips have an uneven upper surface texture (e.g., non-smooth) across the length of the strips, but not sharp.

(15) The fifth station is a further lamination station 38 where the strips are arranged to form a rectangular frame shape and adhered to peripheral regions of a conventional poster board with glue. Unlike the first-fourth stations that are carried out with machine operation, the further lamination that is performed at the fifth station may be manually performed. That is, the posterboard is glued on the edges by hand, and then the decorative laminated strips are applied by hand onto the glue on the posterboard. One might also expect that the thickness of the glue is thicker than that of the adhesive in the decorative lamination because only the adhesive in the decorative lamination is subjected to heat and pressure from a hot stamping press or heated roller.

(16) There is no reason for there to be any glitter chip shedding at the further lamination station 38 where the further lamination takes place, because the glitter chips have already been adhered onto the C1S paper that has been cut into strips. If there is any shedding subsequently because of how the glitter framed poster board is handled, the overall amount of such shedding is relatively small and cannot be considered to create a mess. Indeed, the overall amount of shedding of the glitter chips that become present in the central region of the poster board is independent of the size of the glitter in accordance with the invention, unlike the case when silk screening is used to apply the glitter chips to glue on the poster board since in that case there is much more shedding of larger size glitter chips (0.42 inches or larger) than there is shedding of smaller size glitter chips (smaller than 0.42 inches).

(17) In accordance with the invention, there is less of a reason to cover the glitter chips at the further lamination station 38 with a coating of clear gloss spray paint, clear gloss spray lacquer, gloss modge podge, clear nail polish, spray sealant or decoupage medium. The reason is because shedding of the glitter chips that occurs during handling appears to be independent of the size of the glitter chips and amounts to a relatively small quantity.

(18) A comparison test was undertaken by the supplier of the framed poster boards from Oct. 31, 2020 to Nov. 1, 2020 that determined over a 24 hour time period that there was in effect no difference in the amount of shedding that occurred when using the method of application according to the present invention as between the use of relatively small glitter chips and the use of relatively large glitter chips (both small and large size glitter chips had between 0-10 glitter chips shedding). However, for the conventional silk screen application, the results show there is a difference in the amount of shedding of the glitter chips depending on the size of the glitter chips. For smaller glitter chips, the amount of shedding was 50-100 smaller glitter chips shed when using the conventional silk screen application. However, for larger glitter chips, the amount of shedding was at least twice to four times as much as for the smaller glitter chips, i.e., between 100 and 200 larger glitter chips shed when using the conventional silk screen application. Thus, one can conclude that the amount of glitter shedding that occurs using the conventional silk screen application is dependent upon the size of the glitter chips. Not so with the method of application according to the present inventionthe amount of glitter chip shedding is independent of the glitter chip size and is considerably much less than with the silk screen application by a factor of at least five.

(19) While there may be some shedding of the glitter chips during handling of the glitter framed poster board subsequently, the amount of shedding is independent of the size of the glitter chips. That is, the amount of shedding is at a commercially acceptable level that would not be considered to be messy in contrast to the shedding of larger size glitter chips (0.042 inches or larger) in a glitter framed poster board applied via silk screening. With silk screening, the larger size glitter chips shed to a much greater extent than the smaller size glitter chips after the glitter chips have been deposited onto glue on the poster board to form a frame.

(20) While the foregoing description and drawings represent the preferred embodiments of the present invention, it will be understood that various changes and modifications may be made without departing from the scope of the present invention.