METHODS OF FORMING A FIELD EMISSION CATHODE

Abstract

A method for fabricating a field emission cathode, the field emission cathode including a substrate having a field emission layer engaged therewith, where the field emission layer includes a plurality of purified carbon nanotubes. The carbon nanotubes are purified via a graphitization or annealing process.

Claims

1. A method of forming a field emission cathode, comprising: depositing a field emission material on to a substrate, the field emission material comprising a plurality of purified carbon nanotubes, wherein the purified carbon nanotubes are obtained via a graphitization process.

2. The method of claim 1, wherein the graphitization process comprises exposing a plurality of carbon nanotubes to a temperature of at least 1500 C. under a vacuum for a predetermined length of time to purify the plurality of carbon nanotubes.

3. The method of claim 2, wherein exposing the plurality of carbon nanotubes comprises exposing the plurality of carbon nanotubes to a temperature of between 1500 C. and 3000 C.

4. The method of claim 2, wherein exposing a plurality of carbon nanotubes comprises exposing the plurality of carbon nanotubes to a vacuum of about 110.sup.3 torr to about 110.sup.8 torr during exposure of the plurality of carbon nanotubes to the temperature.

5. The method of claim 2, wherein exposing a plurality of carbon nanotubes comprises exposing a plurality of carbon nanotubes to the temperature under the vacuum, with the predetermined length of time ranging from about 12 hours to about 72 hours.

6. The method of claim 2, comprising forming the plurality of carbon nanotubes by a chemical vapor deposition process, a laser ablation process, or an arc discharge process.

7. The method of claim 1, wherein depositing the field emission material comprises depositing the field emission material on to the substrate comprising a metal, an alloy, a glass, or a ceramic.

8. The method of claim 1, wherein depositing the field emission material comprising the plurality of purified carbon nanotubes comprises depositing the field emission material on to the substrate via spray coating, ink jet printing, screen printing, dip coating, electrophoresis or combinations thereof.

9. The method of claim 1, further comprising exposing the cathode to a post-deposition process.

10. A method of forming a field emission cathode, comprising: purifying a plurality of carbon nanotubes via a graphitization process to obtain a plurality of purified carbon nanotubes; and depositing a field emission material comprising the plurality of purified carbon nanotubes on to a substrate to form the cathode.

11. The method of claim 10, comprising forming the plurality of carbon nanotubes by a chemical vapor deposition process, a laser ablation process, or an arc discharge process.

12. The method of claim 10, wherein the graphitization process comprises exposing the plurality of carbon nanotubes to a temperature of about 1500 C. to about 3000 C. under a vacuum of about 110.sup.3 torr to about 110.sup.8 torr for a length of time of about 12 hours to about 72 hours.

13. The method of claim 10, wherein depositing the field emission material comprises depositing the field emission material on to the substrate comprising a metal, an alloy, a glass, or a ceramic.

14. The method of claim 10, wherein depositing the field emission material comprises depositing the field emission material comprising the plurality of purified carbon nanotubes on to the substrate via spray coating, ink jet printing, screen printing, dip coating, electrophoresis, or combinations thereof.

15. The method of claim 10, further comprising exposing the cathode to a post-deposition process.

16. A method of forming a field emission cathode, comprising: depositing a field emission material comprising a plurality of carbon nanotubes on to a substrate to form the cathode; and exposing the cathode to a graphitization process to purify the plurality of carbon nanotubes.

17. (canceled)

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0029] Having thus described the disclosure in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

[0030] FIG. 1 schematically illustrates an example of a field emission cathode and the nature of the field emission material deposition layer engaged with the cathode substrate;

[0031] FIG. 2 illustrates one example of a method of forming a field emission cathode device, according to one or more aspects of the present disclosure; and

[0032] FIG. 3 illustrates another example of a method of forming a field emission cathode device, according to one or more aspects of the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

[0033] The present disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all aspects of the disclosure are shown. Indeed, the disclosure may be embodied in many different forms and should not be construed as limited to the aspects set forth herein; rather, these aspects are provided so that this disclosure will satisfy applicable legal requirements. Like numbers refer to like elements throughout.

[0034] FIG. 1 illustrates one example of a field emission cathode 100 that includes a substrate 102 and a layer of a field emission material 104 disposed on the substrate 102, and, if necessary, an additional layer of an adhesion material (not shown) disposed between the substrate 102 and the field emission material 104. The substrate 102 may be made of an electrically conductive material, such as a metallic material, such as a solid metal or alloy (e.g., stainless steel, doped silicon), conductive glass (e.g., Indium Tin Oxide (ITO) coated glass or other fused glass having a conductive coating on the surface); or a conductive ceramic (e.g., a metalized ceramic, such as aluminum oxide, beryllium oxide, and aluminum nitride). The layer 104 is formed via deposition of a field emission material comprising a plurality of, for example, nanotubes, nanowires, graphene, or combinations thereof on to the substrate 102.

[0035] FIGS. 2 and 3 illustrate various methods 200, 300 of using carbon nanotubes in the fabrication of field emission cathodes. Typical as-prepared carbon nanotubes, such as those manufactured by a floating catalyst chemical vapor deposition (FCCVD) method, contain numerous impurities such as catalyst particles, amorphous carbon and other graphitic particles, and intrinsic microstructural defects due to the relatively low processing temperature. Field emission characteristics of cathodes using typical carbon nanotubes as emitters are constrained by not only the purity and defects of carbon nanotubes, but also their susceptibility to damage in one or more fabrication steps of manufacturing a field emission device.

[0036] In one aspect of the method (200 in FIG. 2), a substrate, such as those described hereinabove, is provided to a deposition process (step 210), for example, manually or via a robotic material handling system. During the deposition step (step 240), a plurality of purified carbon nanotubes is deposited on to the substrate via the deposition of the field emission material, which may include other components as well, such as, for example, a material to improve adhesion of the field emission material to the substrate. The field emission material comprising the purified carbon nanotubes can be deposited on to the substrate via one or more different processes, such as, for example, spray coating, dip coating, ink jet printing, screen printing, or electrophoresis. The carbon nanotubes are purified via a graphitization or annealing process (step 235). The carbon nanotubes may be purified prior to deposition or provided to the process in a purified form and present in the field emission material.

[0037] The graphitization process 235 comprises a vacuum high-temperature annealing process. The process 235 removes both impurities, such as catalyst particles, etc. and microstructural defects within the carbon nanotubes. The graphitization process is a more efficient purification method than acid treatment and may provide significant structural improvements to the carbon nanotubes. In some aspects, the process 235 begins with introducing a plurality of carbon nanotubes (e.g., carbon nanotubes manufactured by a chemical vapor deposition process, a laser ablation process, and/or an arc discharge method) to a chamber or similar structure and exposing the carbon nanotubes to a high temperature of about 1500 C. to about 3000 C. under vacuum, such as 110.sup.3 torr to 110.sup.8 torr, for a predetermined amount of time. In certain aspects, the predetermined amount of time ranges from about 12 hours to about 72 hours. Exposing the carbon nanotubes to the graphitization process 235 results in high purity graphitized carbon nanotubes with far fewer defects. The purified carbon nanotubes are then deposited onto the substrate. After the vacuum firing and activating process, a field emission cathode that has high emitter density and large emission current is obtained. The field emission devices using such field emission cathodes have significantly improved lifetimes.

[0038] In another aspect of the method (300 in FIG. 3), a substrate, such as those described hereinabove, is provided to a deposition process (step 310). For example, a single substrate or a plurality of substrates is loaded into a build chamber of a piece of deposition equipment. In step 320, a plurality of carbon nanotubes is provided. In some cases, the deposition equipment may include the necessary equipment to carry out a purification process (step 330) (i.e., graphitization) on the plurality of carbon nanotubes; while in other cases, the carbon nanotubes may be purified via a separate graphitization process (step 335).

[0039] Once the purified carbon nanotubes have been obtained and incorporated into the field emission material, the field emission material is introduced to the deposition equipment and the deposition step (step 240) may begin. The field emission material comprising the plurality of purified carbon nanotubes may be deposited on to the substrate via one or more different processes, such as, for example, spray coating, dip coating, ink jet printing, screen printing, or electrophoresis. In some cases, the graphitization process 235 may take place after the carbon nanotubes have been deposited on to the substrate. For example, the deposition equipment may include the capability to expose the cathode to a high temperature of about 1500 C. to about 3000 C. under vacuum, such as 110.sup.3 torr to 110.sup.8 torr, for a predetermined amount of time, such as about 12 hours to about 72 hours. The field emission material may be subjected to one or more other processes (such as drying, annealing, and/or activating) after deposition on the substrate, then the finished product is a field emission cathode. The substrate may be made of a metal, an alloy, a conductive glass, or a metalized ceramic. The substrate may be provided to the appropriate equipment via, for example, a robotic material handling system or manually by a user.

[0040] Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these disclosed embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that embodiments of the invention are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the invention. Moreover, although the foregoing descriptions and the associated drawings describe example embodiments in the context of certain example combinations of elements and/or functions, it should be appreciated that different combinations of elements and/or functions may be provided by alternative embodiments without departing from the scope of the disclosure. In this regard, for example, different combinations of elements and/or functions than those explicitly described above are also contemplated within the scope of the disclosure. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

[0041] It should be understood that although the terms first, second, etc. may be used herein to describe various steps or calculations, these steps or calculations should not be limited by these terms. These terms are only used to distinguish one operation or calculation from another. For example, a first calculation may be termed a second calculation, and, similarly, a second step may be termed a first step, without departing from the scope of this disclosure. As used herein, the term and/or and the I symbol includes any and all combinations of one or more of the associated listed items.

[0042] As used herein, the singular forms a, an and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises, comprising, includes, and/or including, when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Therefore, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.