DUAL LASER OPTIC MODULE OF TURNTABLE TYPE PROBE PIN BONDING APPARATUS

Abstract

The present invention relates to a turntable-type probe pin laser bonding apparatus. More particularly, a dual laser optic module of the turntable-type probe pin bonding apparatus of the present invention provides an integrated dual laser optic module that is overlappingly irradiated on a co-focus by improving the conventional first and second laser optic modules that have been completely separated and arranged independently with different focal points. During laser bonding of probe pins, which are getting miniaturized day by day, the power and density of the first and second laser beams overlappingly irradiated from the integrated dual laser optic module can be precisely controlled so that a turntable-type probe pin laser bonding apparatus of the present invention can significantly improve the bonding defect rate, as well as contribute to high integration and high precision of the apparatus.

Claims

1. A dual laser optic module of a turntable-type probe pin laser bonding apparatus comprising: a pickup unit that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper consisting of a pair of clamps; a dipping unit applies solder paste to the probe pin transferred by the pickup unit; and a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam respectively onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit, wherein a body unit of a circular or polygonal shape with an empty interior; a first laser connection unit connected in a first direction toward the inside of the body part to which a first laser beam of a specific wavelength band is incident; a second laser connection unit connected in a second direction orthogonal to the first direction toward the inside of the body part to receive a second laser beam of a specific wavelength band; a laser filter unit equipped inside the body part and overlapping the first laser beam and the second laser beam that meet inside the body part to have a co-focus by being transmitted or reflected, respectively; and an overlapping laser emitting unit emitting the overlapped laser beam in a third direction of the body part to have a co-focus by the laser filter part.

2. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 1, wherein the first and second laser connection units are vertically or horizontally divided around the body unit so that the first and second laser beams having different wavelength bands are vertically incident into the body unit.

3. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 2, wherein the laser filter unit is installed to be inclined toward the first and second laser connection units inside the body unit.

4. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 1, wherein the first and second laser connection units each have a collimation lens therein, and any one of the first and second laser connection units is further equipped with a diffractive optical element (DOE) lens therein.

5. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 1, wherein the overlapping laser emitting unit is equipped with a focusing lens therein.

6. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 1, wherein the first and second laser beams emitted from the overlapping laser emitting unit have different wavelengths and different areas.

7. The dual laser optic module of a turntable-type probe pin laser bonding apparatus of claim 1, wherein the wavelengths of the first and second laser beams are 980 nm and 808 nm, respectively.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0050] FIG. 1 is a plan view showing the configuration of a conventional turntable-type probe pin laser bonding apparatus according to some embodiments.

[0051] FIG. 2 is a perspective view showing the pickup unit of FIG. 1 separated.

[0052] FIG. 3 is an exemplary view schematically illustrating a laser bonding process of a conventional turntable-type probe pin laser bonding apparatus.

[0053] FIG. 4 is an full front view of the dual laser optic module of the turntable-type probe pin laser bonding apparatus of the present invention according to some embodiments.

[0054] FIG. 5 is a state diagram in which a dual laser beam is emitted in FIG. 4.

[0055] FIG. 6 is an actual image in which the dual laser beam of FIG. 5 is overlappingly irradiated on a plane.

[0056] FIG. 7 is a transmittance (T) graph of the laser filter unit according to the present invention.

MODE(S) FOR CARRYING OUT THE INVENTION

[0057] The terminology herein describes particular embodiments only and is not intended to be limiting. As used herein, the singular forms a, an, and the are intended to include the plural forms, including at least one, unless the content clearly indicates otherwise. It will be further understood that the terms comprises, comprising, includes, and/or including, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0058] Unless otherwise defined in this specification, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art.

[0059] It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an ideal or excessively formal sense unless clearly defined in the present specification.

[0060] Hereinafter, the co-focal dual laser optic module of the turntable-type probe pin laser bonding apparatus, according to some embodiments of the present invention, will be described in detail with reference to the accompanying FIGS. 4 to 7 as follows.

[0061] As described above with reference to FIGS. 1 and 3, a turntable-type probe pin laser bonding apparatus of the present invention comprising: a pickup unit (110) that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper (112) consisting of a pair of clamps; a dipping unit (120) applies solder paste to the probe pin transferred by the pickup unit (110); and a laser bonding unit (130) bonds the probe pins to the probe card by irradiating two laser beams respectively onto the solder paste of the probe pins transferred from the dipping unit (120) by the pickup unit (110).

[0062] In particular, the present invention relates to a dual laser optic module (1300) for forming co-focus overlapping laser beams (LB1+LB2) included in the laser bonding unit (130).

[0063] Without having two laser optic modules (131, 132, refer to FIG. 3), respectively, as conventionally, the dual laser optic module (1300) includes a co-focus dual laser optic module (1300) integrated into one body unit (1310) so that the first and second laser connection units (1320)(1330) have a co-focus.

[0064] FIG. 4 is an full front view showing the dual laser optic module of the turntable-type probe pin laser bonding apparatus of the present invention according to some embodiments; FIG. 5 is a state diagram in which a dual laser beam is emitted in FIG. 4; FIG. 6 is an actual image in which the dual laser beam of FIG. 5 is overlappingly irradiated on a plane; and FIG. 7 is a transmittance (T) graph of the laser filter unit according to the present invention.

[0065] Referring to the figures, the dual laser optic module (1300) for forming a co-focus overlapping laser beam is equipped with the body unit (1310) having a circular or polygonal shape with an empty interior, according to an exemplary embodiment of the present invention.

[0066] In addition, it is equipped with the first laser connection unit (1320) connected in a first direction toward the inside of the body unit (1310) to which the first laser beam (LB1) of a specific wavelength band is incident.

[0067] In addition, it is equipped with the second laser connection unit (1330) connected in a second direction (e.g., horizontal direction) orthogonal to the first direction (e.g., vertical direction) toward the inside of the body unit (1310) to which the second laser beam (LB2) of a specific wavelength band is incident (refer to FIG. 5).

[0068] According to an exemplary embodiment, the first and second laser connection units (1320, 1330) allow the first and second laser beams (LB1, LB2) having different wavelength bands to be perpendicular to each other in the body unit (1310). In order to be incident perpendicularly to each other, the body portion (1310) is divided and connected in a vertical or horizontal direction.

[0069] In addition, the first and second laser connection units (1320, 1330) are equipped with collimation lenses (1321, 1331) therein, respectively. Any one of the first and second laser connection units (1320, 1330) is further equipped with a diffractive optical element (DOE) lens (1322) therein.

[0070] Here, the collimation lenses (1321, 1331) convert the incident laser beams (LB1, LB2) into parallel light, and the diffractive optical element lens (1322) performs a function of uniformly distributing the energy of the planar laser beam.

[0071] In addition, the inside of the body unit (1310) is equipped with the laser filter unit (1340) that overlaps the two laser beams (LB1, LB2) to have a co-focus as the first laser beam LB1 and the second laser beam LB2 that meet inside the body unit 1310 are transmitted or reflected, respectively.

[0072] That is, two laser beams (LB1, LB2) of different wavelengths are vertically incident in the laser filter unit (1340) through a first laser connection unit (1320) and a second laser connection unit (1330) that are vertically or horizontally coupled to the body unit (1310). Then, a single overlapping laser beam (LB1+LB2) is formed by being transmitted or reflected by the laser filter unit (1340).

[0073] More specifically, the laser filter unit (1340) overlaps each other by matching the optical paths of the two laser beams (LB1, LB2), and the one overlapping laser beam (LB1+LB2) is emitted downward through the focusing lens (1351) of the overlapping laser emitting unit (1350). (Refer to FIG. 5).

[0074] For this, the laser filter unit (1340) is installed in the body unit (1310) to be inclined toward the first and second laser connection units (1320, 1330).

[0075] In addition, it is equipped with an overlapping laser emitting unit for emitting the overlapped laser beams (LB1+JB2) to have a co-focus by the laser filter unit (1340) in a third direction (e.g., downward) of the body unit (1310). (Refer to FIG. 5).

[0076] In this case, a single focusing lens (1351) is equipped inside the overlapping laser emitting unit (1350).

[0077] Referring to FIG. 6, the first and second laser beams emitted from the overlapping laser emitting unit (1350) have different wavelengths and areas.

[0078] For example, the first laser beam (LB1) may be linear, and the second laser beam may be a laser beam (LB2) having a larger area and a square shape, including the linear first laser beam (LB1).

[0079] The overlapping laser beams (LB1+LB2) having different wavelengths, i.e., having the same focus as above, emitted in the same path is, for example, to be irradiated in a form in which the first laser beam (LB1) having a size of 0.2 mm0.9 mm (LB1) is overlapped inside the second laser beam (LB2) having a size of 2 mm2 mm. In this case, the wavelengths of the overlapping first and second laser beams (LB1+LB2) may be 980 nm and 808 nm, respectively, and in the overlapping state, the wavelengths are maintained the same.

[0080] In addition, in the region where the first and second laser beams (LB1, LB2) are irradiated overlappingly, the first or second laser beams (LB1, LB2) form a higher temperature than the region irradiated alone. Accordingly, the substrate is heated to a higher temperature in the region where the two laser beams (LB1, LB2) overlap and irradiate.

[0081] Referring to FIG. 7, according to an embodiment, when the wavelengths of the first and second laser beams (LB1, LB2) are respectively formed at 980 nm and 808 nm, the first laser beam (LB1), having a wavelength of 980 nm passes through the laser filter unit (1340) by the laser filter unit (1340) and the second laser beam (LB2) having a wavelength of 808 nm is reflected by the laser filter unit (1340). And the overlapped laser beams (LB1+LB2) having co-focus are emitted downward.

[0082] That is, the overlapping dual laser beams (LB1+LB2), as described above, are emitted on the lower substrate (not shown) through the focusing lens (1351) of the overlapping laser emitting unit (1350).

[0083] Accordingly, as described above, the present invention provides an integrated dual laser optic module (1300) that is irradiated on the co-focus so that during laser bonding of a probe pin, which is being miniaturized day by day, it is possible to precisely control the power and density of the first and second laser beams (LB1, LB2) overlappingly irradiated from the integrated dual laser optic module (1300), respectively.

[0084] In addition, the present invention integrates two optical systems separated by conventional first and second laser optic modules into one dual laser optic module. Therefore, there is an effect that can contribute to high integration and precision of the apparatus because many space restrictions are eliminated in disposing or interacting with the laser optic module and other components, even in designing and manufacturing equipment.

[0085] Therefore, the present invention is not limited only by the embodiments described above. It is possible to create the same effect even if the apparatus's detailed configuration or number and layout structure are changed, or the detailed steps are changed and added. It is possible to add, delete, and modify various configurations within the scope of the technical spirit of the present invention by those of ordinary skill in the art.

DESCRIPTION OF THE NUMERALS

[0086] 1300: dual laser optic module [0087] 1310: body unit [0088] 1320: first laser connection unit [0089] 1321, 1331: collimation lenses [0090] 1322: diffractive optical element (DOE) lens [0091] 1330: second laser connection unit [0092] 1340: laser filter unit [0093] 1350: overlapping laser emitting unit [0094] 1351: focusing lens [0095] LB1, LB2: first laser beam, second laser beam [0096] LB1+LB2: co-focus overlapping laser beams