WOOD PARTICLE BOARDS

Abstract

A non-carbohydrate polyhydroxy component(s) is used in a binder composition to facilitate manufacture of wood particle boards.

Claims

1-14. (canceled)

15. A method of manufacturing a wood particle board comprising: a) mixing wood particles with a binder composition having a dry weight comprising at least 40% by weight (wt. %) of the binder composition to produce resinated wood particles comprising wood particles coated with the binder composition; b) forming a resinated mat comprising the resinated wood particles arranged in the form of a mat of loosely arranged resinated wood particles; and forming a wood particle board by curing the binder composition while subjecting the resinated mat to pressure; wherein the binder composition comprises 0.1-25 wt. % of at least one non-carbohydrate polyhydroxy component for reducing or eliminating resinated wood particle clumping.

16. The method of claim 15, wherein the at least one non-carbohydrate polyhydroxy component is selected from the group consisting of glycerol, a polyalkylene glycol, polyethylene glycol, polypropylene glycol, trimethylolpropane, pentaerythritol, polyvinyl alcohol, partially hydrolyzed polyvinyl acetate, fully hydrolyzed polyvinyl acetate and mixtures thereof.

17. The method of claim 15, wherein the at least one non-carbohydrate polyhydroxy component comprises 1-20 wt. % of the binder composition.

18. The method of claim 15, wherein the at least one non-carbohydrate polyhydroxy component comprises 2-18 wt. % of the binder composition.

19. The method of claim 15, wherein the at least one non-carbohydrate polyhydroxy component comprises 5-10 wt. % of the binder composition.

20. The method of claim 15, wherein the binder composition comprises at least 30% by dry weight of a carbohydrate reactant.

21. The method of claim 15, wherein the binder composition comprises (a) at least one reducing sugar reactant and at least one nitrogen-comprising reactant; and/or (b) at least one curable reaction product of at least one reducing sugar reactant and at least one nitrogen-comprising reactant; wherein the combined weight of (a) and (b) comprises at least 30% by dry weight of the binder composition.

22. The method of claim 21, wherein the at least one reducing sugar reactant is selected from the group consisting of monosaccharides, disaccharides, polysaccharides and combinations thereof.

23. The method of claim 21, wherein the at least one nitrogen-comprising reactant is selected from the group consisting of NH.sub.3, an inorganic amine, an organic amine comprising at least one primary amine group, a salt thereof and combinations thereof.

24. The method of claim 21, wherein the at least one nitrogen-comprising reactant comprises a polyamine comprising the general chemical structure H.sub.2N-Q-NH.sub.2, wherein Q is an alkanediyl selected from the group consisting of a C.sub.2-C.sub.24 group, a C.sub.6-alkanediyl group, a cycloalkanediyl group, a cyclohexanediyl group, a cyclopentanediyl group, a cyclobutanediyl group, a heteroalkanediyl group, a cycloheteroalkanediyl group, chemically substituted variants thereof and combinations thereof.

25. The method of claim 24, wherein the polyamine is selected from a polyether-polyamine, a polymeric polyamine and combinations thereof.

26. The method of claim 24, wherein the polyamine is selected from 1,6-diaminohexane (hexamethylenediamine (HMDA)), 1,5-diamino-2-methylpentane (2-methyl-pentamethylenediamine) and combinations thereof.

27. The method of claim 24, wherein Q comprises a divalent benzyl radical.

28. A wood particle board produced in accordance with the method of claim 15.

29. The wood particle board of claim 28, comprising wood particles held together by a cured, thermoset binder, wherein the wood particle board comprises at least 0.05 wt. % of at least one non-carbohydrate polyhydroxy component.

30. The wood particle board of claim 28, comprising a multilayer wood particle board comprising wood particles held together by a cured, thermoset binder, wherein at least one layer of the wood particle board comprises at least 0.05 wt. % of at least one non-carbohydrate polyhydroxy component.

Description

[0047] FIG. 1 is a representation of a wood particle board made in accordance with the invention; and

[0048] FIG. 2 is a representation of a comparative example.

[0049] Example 1. Two wood particle boards, samples A1 and A2, of length and width 300300 mm having a thickness of 16 mm and a target density of 650 kg/m.sup.3 were prepared. Once dried to a residual moisture content of about 3.5 wt % (based on oven dried wood weight) the wood particles were sprayed with the binder composition and thoroughly mixed by tumbling: Both wood particleboards were three layer particle boards and were made with Urea Formaldehyde (UF) resinated core chips at a 62:38 ratio of core:surface wood chip mass. The UF was 95.5 parts by weight (66.72 g, 66% solid) of UF resin and 4.5 parts by weight (3.81 g, 52% solid) ammonium nitrate catalyst.

[0050] Surface layer binder composition of Sample A1: According to the invention 43.5 parts by weight (19.2 g) of dextrose monohydrate (DMH 90.9 wt % dextrose and 9.1 wt % water of crystallisation), 43.5 parts by weight (17.45 g, 100% solid) of fructose, 13.00 parts by weight (7.45 g, 70 wt % in H.sub.2O) of HMDA (hexamethylenediamine, 1,6-hexanediamine) and addition of 5 parts by weight (2.91 g, 69% solid) glycerol. The solid content was 69 wt %.

[0051] Surface layer binder composition of Sample A2: Comparative example. 43.5 parts by weight (19.2 g) of dextrose monohydrate (DMH 90.9 wt % dextrose and 9.1 wt % water of crystallisation), 43.5 parts by weight (17.45 g, 100% solid) of fructose, 13.00 parts by weight (7.45 g, 70 wt % in H.sub.2O) of HMDA (hexamethylenediamine, 1,6-hexanediamine) The solid content was 69 wt %. A mass of coated wood particles adapted to achieve a target board density of 650 kg/m.sup.3 was transferred into a forming box in order to form board samples of 30030016 mm. The loading of the binder composition is of 10% on surface chips and 7.5% on core chips. Board samples were pressed under 56 bar, to a thickness of 16 mm using metal stops, at a target platen temperature of 230 C. for a given time period such as to reach a press factors of 7 s per mm thickness for a 16 mm thick board.

[0052] FIG. 1 shows the particle board of sample A1.

[0053] FIG. 2 shows the particle board of sample A2.

[0054] The comparative example of Sample A2 in FIG. 2 shows that several spots are clearly visible. These spots are believed to be clumpings of the wood particles with binder due to poor binder distribution. Such clumping can lead to non-homogeneous properties of the wood particle board, notably affecting bond strength and/or breaking resistance.

[0055] FIG. 1 shows reduced presence of spots.