LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, AND ILLUMINATING APPARATUS
20210083162 ยท 2021-03-18
Inventors
Cpc classification
H01L33/62
ELECTRICITY
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
H01L33/62
ELECTRICITY
Abstract
A light emitting device includes a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection portion includes at least an opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the LED structures. The connection port is adapted to be coupled to other device through the opening. A light emitting module and an illuminating apparatus are also provided.
Claims
1-10. (canceled)
11. A light-emitting apparatus, comprising: a lamp holder; a plurality of light-emitting modules, arranged on the lamp holder, each of the plurality of light-emitting modules comprising: a substrate, having a first surface and a second surface opposite to the first surface; a first group of light-emitting diode structures, disposed on the first surface; and a connection port; a connecting device, connected to the connecting port; a lamp cap, arranged on the lamp holder, defining an accommodating space with the lamp holder, and the plurality of light-emitting modules arranged in the accommodating space; and a bracket, arranged on the lamp holder and connected to the connecting device; wherein the plurality of light-emitting modules has different angles with the bracket.
12. The light-emitting apparatus of claim 11, wherein the connecting port is arranged on the first surface of the substrate and a side of the first group of light emitting diode structures.
13. The light-emitting apparatus of claim 11, wherein the connecting port is arranged on the second surface of the substrate and comprises a plurality of conductive vias penetrating the substrate, and a first connecting pad and a second connecting pad electrically connected to the first group of light-emitting diode structures through the plurality of conductive vias.
14. The light-emitting apparatus of claim 13, wherein the first connecting pad and the second connecting pad have a same electrical property.
15. The light-emitting apparatus of claim 14, wherein each of the plurality of light-emitting modules further comprises a common connecting pad arranged on the substrate, and the common connecting pad and the first connecting pad have different electrical properties.
16. The light-emitting apparatus of claim 14, wherein the substrate is transparent to light from the plurality of light-emitting modules.
17. The light-emitting apparatus of claim 11, wherein each of the plurality of light emitting modules further comprises a second group of light-emitting diode structures arranged on the first surface; and a wavelength converting layer covering the first group of light-emitting diode structures and the second group of light-emitting diode structures; wherein the wavelength converting layer has portions with different phosphor compositions, the portions respectively correspond to the first group of light-emitting diode structures and the second group of light-emitting diode structures.
18. The light emitting apparatus of claim 11, wherein each of the plurality of light-emitting modules is arranged to engage with the connecting device through the connection port, and the connection port comprises a first connecting pad and a second connecting pad bonded to the connection device.
19. The light-emitting apparatus of claim 11, wherein each of the plurality of light-emitting modules is configured to emit light in omni-directions.
20. The light-emitting apparatus of claim 11, wherein each of the plurality of light-emitting modules further comprises a second group of light-emitting diode structures arranged on the first surface, and the first group of light-emitting diode structures and the second group of light-emitting diode structures are configured to emit different color lights.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
[0014]
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[0025]
DESCRIPTION OF THE EMBODIMENTS
[0026] Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
[0027]
[0028] In this embodiment, the LED structures may be connected in series or in parallel in the first group or the second group of LED structures 120/130, and the first connection pad 146 and the second connection pad 148 are respectively electrically connected to at least two electrodes of the first group of LED structures 120 and at least two electrodes of the second group of LED structures 130. The electrical property of the first connection pad 146 is different from the electrical property of the second connection pad 148. For example, one of the first connection pad 146 and the second connection pad 148 is a positive electrode pad, and the other of the first connection pad 146 and the second connection pad 148 is a negative electrode pad.
[0029] In this embodiment, the light emitting device 100 further includes a wavelength conversion layer 150. The wavelength conversion layer 150 is disposed on the substrate 110 for receiving at least a part of light emitted from the first and second groups of LED structures 120 and 130, and exposes the connection port 140 to form the top and side openings 142 and 144. In this embodiment, the thickness T of the wavelength conversion layer 150 is preferably greater than 30 m. Furthermore, the wavelength conversion layer 150 is disposed on at least a part of the first surface 112 of the substrate 110 and covers the first and second groups of LED structures 120 and 130. A part of the wavelength conversion layer 150 which covers the first group of LED structures 120 and another part of the wavelength conversion layer 150 which covers the second group of LED structures 130 may respectively include the same or different phosphor compositions, which means, for example, the material, element, concentration or distribution of the phosphor in the wavelength conversion layers 150 disposed on different positions may be the same or different, so that the lighting effects, like color, brightness or intensity, induced by the first group of LED structures 120 and the second group of LED structures 130 may be the same or different. Besides, a wavelength conversion layer 150 could be disposed on the second surface 114 of the substrate 110.
[0030] In this embodiment, the shape of the first surface 112 is rectangular, and each of the first group and the second group of the LED structures 120 and 130 is arranged along a direction parallel to a side of the first surface 112. The quantity of the LED structures 122 in the first group of LED structures 120 could be the same as or different from the quantity of the LED structures 132 in the second group of LED structures 130. The color of light emitted from the first group of LED structures 120 could be the same 10 as or different from the color of light emitted from the second group of LED structures 130. The intensity of light emitted from the first group of LED structures 120 could be the same as or different from the intensity of light emitted from the second group of LED structures 130.
[0031] In this embodiment, the light emitting device 100 may serve as a lamp filament. In the light emitting device 100, the connection port 140 is between the first group of LED structures 120 and the second group of LED structures 130, so that the light emitting device 100 is easy to be assembled through the opening of the connection port 140. In this way, the light emitting device 100 may be automatically assembled by a machine, so that the mass production and high yield may be achieved. In addition, the light emitting device 100 has an upper wavelength conversion layer 150 and a lower wavelength conversion layer 150, so that the color temperature of the light emitting device 100 may be flexibly adjusted by adjusting the coefficients of the upper wavelength conversion layer 150 and the lower wavelength conversion layer 150, so as to mix the color temperature due to the upper wavelength conversion layer 150 and the color temperature due to the lower wavelength conversion layer 150 to form the color temperature of the light emitting device 100.
[0032]
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[0035]
[0036] In this embodiment, the quantity of the light emitting device 100 is more than one, and the connection device 210 includes a plurality of segments 211 having bonding surfaces 212 to engage with the light emitting devices 100, respectively. The light emitting devices 100 are engaged with the connection device 210 as a plurality of crosses, and an angle is formed between each light emitting device 100 and the connection device 210. The angles between the light emitting devices 100 and the connection device 210 could be the same or different. The degree of angles could be equal to or less than 90 degree. The light emitting devices 100 could be engaged with the connection device 210 and extend along the same direction or respectively extend along a plurality of different directions.
[0037] In this embodiment, the connection device 210 is formed as a ring by connecting the segments 211 end to end. The quantity of the segments 211 could be three, and the connection device 210 is formed as a polygon-ring. The connection device 210 further includes folding junctions 213 between every two adjacent segments 211, so that the connection device 210 is foldable.
[0038]
[0039] In this embodiment, the connection device 210a includes another bonding surface 212, and the light emitting devices 100 are respectively disposed on the bonding surfaces 212 opposite to each other, so that the light emitting devices 100 can be coupled to each other. The light emitting devices 100 could be engaged with the connection device 210a and extend along the same direction or respectively extend along a plurality of different directions.
[0040]
[0041] In conclusion, in the light emitting device, the light emitting module, and the illuminating apparatus according to the embodiments of the invention, the connection port is between the first group of LED structures and the second group of LED structures, so that the light emitting device is easy to be assembled through the connection port. In this way, the light emitting device may be automatically assembled by a machine, so that the mass production and high yield may be achieved.
[0042] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention covers modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.