SYSTEM AND METHOD FOR MANUFACTURING PLURALITY OF INTEGRATED CIRCUITS

Abstract

The invention relates to a system for manufacturing a plurality of integrated circuits, IC, mounted on a common support, the system comprising: an input station configured (adapted, arranged) to receive at least one common support; an output station configured (adapted, arranged) to receive at least one common support having a plurality of integrated circuits formed thereon; a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the processing steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the common support; a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween; control means (e.g. a control system, or at least one controller, control unit, or control module) operable to direct the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to at least one processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols; the control means being operable to direct the movement of a common support from the input station to the output station and through one or more of the processing modules independently of any other common support. The invention also relates to a method for manufacturing a plurality of integrated circuits, IC, mounted on a common support.

Claims

1-33. (canceled)

34. A system configured to manufacture a plurality of integrated circuits (ICs) mounted on a common support, the system comprising: an input station configured to receive at least one common support; an output station configured to receive at least one common support having a plurality of integrated circuits formed thereon; a plurality of processing modules each module being configured to perform at least one of processing step for forming an integrated circuit on the at least one common support; a transfer means configured to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween; and at least one controller operable to direct the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to at least one processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols, wherein the control means is further configured to direct the movement of a common support from the input station to the output station and through one or more of the processing modules independently of any other common support.

35. The system according to claim 34, wherein the control means comprises a system controller and a plurality of sub-system controllers operable to direct the system and each of the component stations and modules respectively.

36. The system according to claim 34, wherein the at least one processing protocol comprises a changeable pre-programmed protocol, optionally wherein the at least one processing protocol comprises a plurality of changeable pre-programmed protocols, and/or further optionally wherein the at least one processing protocol comprises a selected one of a plurality of changeable pre-programmed protocols.

37. The system according to claim 36, wherein the control means is operable to select one of the plurality of changeable pre-programmed protocols for the at least one processing protocol.

38. The system according to claim 36, wherein the changeable pre-programmed protocol comprises sequential direction of the, or each, common support to at least a deposition module, a patterning module and an etching module, and/or optionally wherein the changeable pre-programmed protocol includes a repeatable sequence of processing steps for the formation of layers of an integrated circuit on a common support, and/or further optionally wherein the at least one processing protocol comprises at least one dynamic protocol.

39. The system according to claim 34, wherein the transfer means comprises one or more support moving devices.

40. The system according to claim 39, wherein the one or more support moving devices comprise a plurality of robotic arms operable to move at least one common support within a module, from one module to another module, to or from a station and/or to and/or from a buffering station, optionally wherein the plurality of robotic arms are each operable to move a batch loading device configured to receive one or more common supports, or wherein the plurality of robotic arms are each operable to directly move one or more common supports.

41. The system according to claim 34, wherein each processing module comprises one or more sub-modules, optionally wherein each sub-module within a processing module is operable to perform one of the processing steps in the formation of an integrated circuit, and/or further optionally wherein a sub-module is operable to form at least one layer of an integrated circuit on a common support.

42. The system according to claim 41, wherein a processing module comprises a cluster of sub-modules, optionally wherein the cluster of sub-modules are operable to perform one of the processing steps in the formation of an integrated circuit on at least one common support.

43. The system according to claim 41, wherein a processing module comprises a single sub-module, optionally wherein the single sub-module is configured to receive one or more common supports, and/or further optionally wherein each sub-module is operable to perform at least a part of a step in the process of making a plurality of integrated circuits.

44. The system according to claim 34, comprising one or more masks or reticles for each of a plurality of integrated circuit designs.

45. A method of manufacturing a plurality of integrated circuits (ICs) mounted on a common support, the method comprising: providing at least one common support; providing an input station into which the at least one common support is loaded; providing an output station into which the at least one common support having a plurality of integrated circuits mounted thereon is received; providing a plurality of processing modules each module being operable to perform at least one of the step including one or more of deposition, patterning, and/or etching for forming an integrated circuit on the common support; providing a transfer means configured to transfer the at least one common support from the input station to the output station and to one or more of the processing modules; directing each of the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to a processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols; directing the processing steps of each process module; and directing the movement of each common support from the input station to the output station and to one or more of the processing modules independently of any other common support.

46. The method according to claim 45, comprising selecting one changeable pre-programmed protocol from the plurality of changeable pre-programmed protocols.

47. The method according to claim 45, comprising selecting one or more masks or reticles for an integrated circuit design.

48. A central transfer system for a system for manufacturing a plurality of integrated circuits (IC), comprising: a central column assembly having a longitudinal axis; and at least one storage member, mounted operably to and coaxially with said longitudinal axis of said central column assembly, comprising at least one receptacle configured to receive and store at least one common support, wherein said central column assembly is configured to move any one of said a least one storage member rotatably about and/or linearly along said longitudinal axis, so as to provide any one of said at least one receptacle at a predetermined processing port of the system for manufacturing a plurality of integrated circuits (IC).

49. The central transfer system according to claim 48, wherein said central column assembly comprises a turn-table mechanism adapted to move any one of said at least one storage member rotatably about said longitudinal axis, optionally wherein said turn-table mechanism is further adapted to move said central column assembly along said longitudinal axis.

50. The central transfer system according to claim 48, comprising a plurality of said at least one storage member operably stacked along said longitudinal axis, optionally wherein any one of said plurality of at least one storage member is rotatable about said longitudinal axis independently of any adjacent one of said plurality of at least one storage member.

51. The central transfer system according to claim 50, wherein said central column assembly further comprises an internal handling mechanism configured to receive and move said at least one common support along said longitudinal axis to and from any one of said plurality of at least one storage member.

52. The central transfer system according to claim 48, further comprising at least one radial transport mechanism adapted to move said at last one common support to and/or from said at least one receptacle.

53. The central transfer system according to claim 52, wherein said at least one radial transport mechanism is adapted to move said at last one common support between any one of said internal handling mechanism, said at least one receptacle and a processing module.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0236] Embodiments of the present invention will now be described with reference to the accompanying drawings of which:

[0237] FIG. 1 is a diagrammatic representation of a system embodying the invention and suitable for manufacturing a plurality of integrated circuits;

[0238] FIG. 2 is a diagrammatic representation of a further system embodying the invention and suitable for manufacturing a plurality of integrated circuits;

[0239] FIG. 3 is a schematic representation of a system embodying the invention and suitable for manufacturing a plurality of integrated circuits; and

[0240] FIG. 4 is a schematic representation of a yet further system embodying the invention and suitable for manufacturing a plurality of integrated circuits;

[0241] FIGS. 5a-5c are schematic illustrations of (a) a top view and (b) a partial side view of a central transfer system operably integrated within a system for manufacturing a plurality of ICs including four process tools operably interfaced with the central transfer system, (c) shows a schematic illustration of the cassettes (holding, for example, one or more wafers) accessible by a respective process tool;

[0242] FIGS. 6a and 6b are schematic illustrations of (a) a top view and (b) a side view of another embodiment of the central transfer system shown in FIG. 5;

[0243] FIGS. 7a and 7b are schematic illustrations of (a) a top view and (b) a side view of yet another embodiment of the central transfer system shown in FIG. 5.

DETAILED DESCRIPTION

[0244] (i) System(s) and Method(s) with Conveyor Support Transfer

[0245] Referring now to FIG. 1 this shows a system, or apparatus, for manufacturing a plurality of integrated circuits, the system or apparatus embodying an aspect of the present invention.

[0246] The system 1 comprises a programmable controller 7 operably linked to a user interface 9. An input station 11 is connected to a common support transfer means, being conveyor 13, via a buffering station 15. The conveyor 13 is further connected to a deposition processing module 17, an etching processing module 19, a patterning (or masking) processing module 21 via buffering stations 23, 25 and 27. Each of the input station 11, deposition module 17, etching module 19 and patterning module 21 are linked to the adjacent buffering station 15, 23, 25, 27 by a bidirectional interface which allows a flexible polymer support 3 on a rigid carrier 5 to be transferred between the buffering station and the adjacent station or module (11, 17, 19, 21). In turn, each buffering station is linked to the conveyor 13 by a bidirectional interface which allows a flexible polymer support 3 on a rigid carrier 5 to be transferred between the buffering station and the adjacent conveyor 13. In the depicted arrangement, the input station 11 is also an output station 29 for flexible polymer supports 3 on which a plurality of complete integrated circuits have been formed. The input station 11 and the output station 29 comprise a cassette 31, 33 which provides capacity to hold a number of flexible polymer supports 3 each on a rigid carrier 5. A batch (1 or more flexible polymer supports on rigid carriers) of flexible polymer supports/carrier combinations 3, 5 are depicted by reference letters a, b, c, d in inlet cassette 31. The cassette can be a bidirectional cassette. In this way, the flexible polymer supports/carrier combinations 3, 5 can be slotted into the cassette and removed from the cassette from both the front and the rear orientation of the cassette.

[0247] It is envisaged that in certain embodiments (not shown), the buffer station to conveyor transfer is performed by a robotic arm, which is operable to move a common support (e.g. wafer) between a platform mounted on the conveyor and a slot in a cassette (e.g. a loading rack) in the buffer station. The buffer station to module transfer is performed by the robotic arm moving a common support (e.g. wafer) between the cassette in the buffer station and a slot in a movable transfer cassette which can be loaded into the module.

[0248] The conveyor 13 could be any suitable transport system for moving the supports through the system 13 (e.g. robotic arms, rollers, a rail or rails, chains, a continuous loop conveyor or the like).

[0249] In the depicted arrangement a flexible polymer common support 3 is supported on a rigid glass carrier 5 throughout the system. In alternative embodiments, the common support may be a rigid, glass support.

[0250] Each bidirectional interface (37a to 37h), under the direction of controller 7, moves one or more common supports 3 from a module (e.g. a deposition 17, etching 19 or patterning 21 module) or the input station 11 to a buffering station 23, 25, 27, 15. Thereafter, a further bidirectional interface moves one or more common supports 3 from the buffering station 23, 25, 27, 15 to the conveyor 13 for transportation to another module or station.

[0251] The bidirectional interface (37a, 37b, 37c, 37d, 37e, 37f, 37g, 37h) may comprise a robotic arm or arms operable to pick up one or more common supports 3 and to move same to the next module, station or conveyor 13.

[0252] Each module of system 1 is operable to perform one or more processing steps in the formation of layers of an integrated circuit. When each layer is formed, one or more of the modules undertakes its processing step suitable for the formation of a layer of the integrated circuit being formed on the common support 3. During the formation of a complete integrated circuit on a common support 3, each processing module will be active in the formation of one or more layers of the integrated circuit.

[0253] The system 1 is operable to carry out multiple processing steps, in multiple processing modules, on multiple common supports 3, contemporaneously.

[0254] For each layer of the integrated circuit, each module of the system 1 performs a process step on one or more batches (a, b, c, d) of common supports 3, each batch comprising 1 or more common supports 3 (wafers). Each batch in any one module undergoing a process step may be at a different layer in the integrated circuit formation process to any other batch in the same module at the same time. In this way, batches of common supports 3 can be brought together into a temporary batch (a, c in module 17 and b, d in module 21) to undergo the same processing step in the same module at the same time. The temporary batch so formed may then be separated under the direction of the controller 7 to form further temporary batches comprising 1 or more common supports 3. The further temporary batches are then transported, using conveyor 13, to a buffering station 15, 23, 25, 27 in preparation for the next module and processing step or output from the system 1 and output station 29. The further temporary batches may each be formed of the same or different common supports 3 to the previous temporary batch.

[0255] Each module is operated under the direction of controller 7. The controller 7 comprises a processor (e.g. a microprocessor, CPU or the like) which is programmed with scheduling logic providing instructions for a processing protocol. The processing protocol sets out the rules to govern the journey of a common support 3 through the system 1 during the formation of an integrated circuit on the common support 3.

[0256] The processing protocol comprises a sequence of processing steps, together with processing parameters and operating parameters which when implemented by the controller 7 on the system 1, builds one or a plurality of integrated circuits vertically on each common support 3 in the system 1.

[0257] The sequence of processing steps in the processing protocol is pre-programmed to include a sequence of deposition, patterning and etching. The sequence may also include a baking and a cleaning step. The cleaning step in the pre-programmed protocol follows the etching step in the sequence. The baking step in the pre-programmed protocol follows the deposition step in the sequence (see FIG. 2).

[0258] The processor is programmed with a plurality of pre-programmed protocols, each providing instructions for the formation of one or a plurality of integrated circuits vertically on each common support 3 in the system 1. The controller 7 is operable to select one pre-programmed protocol to run on the system, the protocol describing the integrated circuit product to be manufactured. In this way, a range of products can be programmed into the system (that is a number of pre-programmed protocols) at any one time.

[0259] The processing parameters of the processing protocol comprise, for example, one or more recipes for each layer (e.g. semiconductor, insulator, gate, source-drain, electrical interconnection layers) of an integrated circuit, the temperatures and pressures at which each component of the system is operable.

[0260] The operating parameters of the processing protocol comprise, for example, dwell time of a common support 3 in the system, a module or a station, a prioritisation logic allowing one or more common supports to have decreased transit time through the system relative to other common supports in the system, system/module/station population control, module diversion logic to allow the sequence of processing through the system to be changed from the pre-programmed protocol, maximum dwell times and minimum process time for a high priority common support 3. It will be understood that additional operating parameters are envisaged to be set out in a processing protocol and be within the control of controller 7 during implementation of the processing protocol.

[0261] In order to provide the operational flexibility required to efficiently process a high volume of common supports, the processing protocol may comprise a dynamic protocol. In the dynamic protocol the controller 7 is programmed to allow the sequence of processing steps through the system and/or the processing parameters and/or the operating parameters to be changed from the pre-programmed protocol. A dynamic protocol may be initiated for one or more common supports 3 at any one time. More than one dynamic protocol may be initiated for one or more common supports 3 at any one time.

[0262] The controller 7 can initiate a dynamic protocol to override the pre-programmed protocol for any one or more of the common supports 3 in the system 1. A dynamic protocol can be initiated in response to feedback and/or monitoring in the system. Such feedback or monitoring can be provided by tracking the one or more of the common supports 3 in the system 1 to monitor one or more of the operating and processing parameters applicable to the one or more of the common supports 3. For example, if a common support 3 is monitored for transit time in the system and same is deemed to exceed the required time, a dynamic protocol can be initiated by the controller 7 for that common support 3 to prioritise it above all other common supports 3 in the system 1. In this way, the system is operable to change the processing steps and/or operating and/or processing parameters applicable to the one or more of the common supports 3 at any time under the direction of the controller 7. In this way, the transit of each common support 3 through the system 1 can be dynamically controlled independently of any other common support in the system. In addition, batches of 1 or more common supports 3 may be processed according to one or more dynamic protocols during transit through the system 1. Each batch may be temporarily formed, may undergo a dynamic protocol, before being separated. Thereafter, each common support 3 of that temporary batch, may form one or more further temporary batches.

[0263] In operation of the system 1, controller 7 is programmed with a pre-programmed protocol setting out a sequence of processing steps, together with processing parameters and operating parameters which when run, control the components of the system 1 during the formation of a plurality of integrated circuits on the or each common support 3 in the system 1. At any time during its transit through system 1, the controller 7 is operable to override the pre-programmed protocol and to initiate a dynamic protocol for handling (i.e. processing) the common support 3 for at least a part of the remaining transit through the system. The controller may initiate one or more dynamic protocols at any time during the transit of a common support through the system 1. Each common support 3 is allocated a place in the system 1 which it retains as it is transported through the system 1 and processed according to a processing protocol comprising a pre-programmed protocol and one or more dynamic protocols. In this way, the processing protocol for a common support 3 as it transits through the system 1 will comprise a series of protocols (pre-programmed and dynamic). The controller 7 (i.e. the process control system) knows where a common support 3 is at all times in the system 1 and can prioritise its processing according to the relevant processing protocol comprising a pre-programmed protocol and one or more dynamic protocols. The processing protocol controls, for example, whether the common support 3 is moved to a buffering station 15, 23, 25, 27, to another module (11, 17, 19, 21) or to the output station 29 to exit the system 1.

[0264] The controller 7 is programmed with software encoding a processing protocol which when executed initiates a processing protocol (a set of processing steps, operating parameters and processing parameters) for one or more common supports 3 in the system 1 at any one time. A primary level of system priority control is provided by the controller 7 being programmed with a master job schedule which sets out at least a structure of the integrated circuits to be formed on the common support 3. The master job schedule will also include a changeable pre-programmed protocol which, when initiated by the controller 7 sets the instructions for each of the components of the system 1 to form the integrated circuit design set in the master job schedule. According to the changeable pre-programmed protocol, one or more common supports 3 are transported through the system 1, 100 according to a predetermined series of processing steps in the processing modules and according to a pre-determined set of operating and processing parameters in each system component so as to form a plurality of integrated circuits on the common support 3.

[0265] In the embodiment depicted in FIGS. 1, 2 and 3, the controller 7, 107, 307 is operably linked to a series of sub controllers 35, 135. Each sub controller 35, 135 in turn is operable to initiate the pre-programmed protocol (instructions) as it relates to the module/station with which it is operably linked. Each sub-controller 35, 135 comprises a processor (microprocessor or the like) operable to relay the operating and processing conditions of the module/station to which it is linked, back to the controller 7, 107, 307. In a second level of priority control, the controller 7, 107, 307 and sub-controllers 35, 135 are operable to initiate one or more dynamic protocols in which one or more processing or operating parameters of the module/station is changed from the pre-programmed protocol in response to the operating and processing conditions of the module/station.

[0266] Initiation of a dynamic protocol by the controller 7, 107, 307 and sub-controllers 35, 135 overrides the pre-programmed protocol to initiate a change in one or more operating or processing parameters. Examples of those parameters include: module dwell time, system dwell time, next module transfer, buffering station dwell time, system population, module population, buffering station population, output station population, and input station population.

[0267] A dynamic protocol may be initiated and/or run by one or more sub-controllers 35 under the direction of controller 7 for one or more common supports 3. At each station/module point, a common support will have different secondary priority depending on different parameters from other common supports in the system. In this way, each common support 3 can be processed independently of any other common support 3 in the system 1. For example, one common support 3 may be processed urgently according to a dynamic protocol in which system transit time is reduced compared to the system transit time of the pre-programmed protocol which governs the transit time of other common supports 3 in the system 1 at the same time.

[0268] In the depicted example, the common support is a flexible polymer. The system 1 is operable according to a processing protocol which defines the processing instructions and the operating and process parameters for the system and its components according to which protocol a plurality of integrated circuits (ICs) are vertically layered onto a common support 3 deposited on a rigid glass carrier 5. The system 1 operates according to the processing protocol to form layers of a plurality of integrated circuits on the common support 3 until a plurality of complete ICs are formed thereon. The ICs may be plastic film-based ICs, initially provided in a flat array of such devices on a glass carrier plate or common support.

[0269] If the system 1 is populated with common supports 3 upon which different circuit designs are to be layered to form different integrated circuits, the sub-controller 35 of the patterning module 21, for example, directs the module to select the correct pattern for a batch of common supports 3 loaded into the patterning module 21. Following processing according to the selected pattern, the batch of common supports 3 are transported back to the conveyor 13 before a further batch of common supports is loaded into the patterning module 21 and processing according to a further pattern (different from the first) is initiated by sub-controller 35. The controller 7 knows the location of each common support 3 in the system 1 and can, therefore, direct the correct common support(s) 3 to the patterning module 21 at the right time to receive the correct circuit pattern. Similar control may be performed over other modules in the system, for example the deposition and/or etching modules.

[0270] The controller 7 is operable to direct each common support 3 in the system 1 and to instruct the system 1 to move the common support 3 to a station or module according to the processing protocol applicable to that common support. During its transit through the system 1, each common support 3 can form part of multiple batches (e.g. groups of 1 or more common supports). A temporary batch of common supports can be formed at the direction of the controller at each station and/or module in the system. Each temporary batch can vary in size and composition at one or more stages in the process.

[0271] As shown in FIG. 2, the system 100 comprises patterning 121, deposition 117a, 117b, etching 119a, 119b and baking 140 modules, a combined input/output station 111, 129, a common support transport means 113 formed of conveyor 112 (e.g. rollers, a rail or rails, chains, a continuous loop conveyor or the like) and sliding carriages 114 each carriage 114 being slidable with respect to conveyor 112 and configured to carry a flexible common support 3 on a carrier 5, and buffer stations 115, 123a, 123b, 125a, 125b, 127, 142.

[0272] In the depicted embodiment, etching modules 119a and 119b may provide enhanced etching capabilities over single etching module 19. For example the multiple etching modules may provide additional capacity or throughput, or a greater range of etching techniques. Etching modules 119a and/or 119b may each perform wet and/or dry (plasma) etching, or other techniques known in the art. Deposition modules 117a and 117b may provide enhanced deposition capabilities over single deposition module 17. For example the multiple deposition modules may provide additional capacity or throughput, or a greater range of deposition techniques. Deposition modules 117a and/or 117b may each perform physical vapour deposition (PVD), chemical vapour deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE), atomic layer deposition (ALD), printing, and/or other techniques known in the art. The patterning module 121 may, for example, be a combined CBD (coat, bake, develop) and photolithography (exposure) module which comprises two sub-units within one module 121, one for CBD and the other for photolithography. Alternatively multiple patterning modules may be employed, analogously to the etching and deposition modules described above. Other patterning techniques may be provided by patterning module 121 or by further patterning modules, for example electron beam lithography, x-ray lithography, ion beam lithography, printing, and/or other techniques known in the art.

[0273] The baking module 140 is an oven that can be used to anneal at one or more particular steps of the process sequence. This could optionally include other treatments such as IR heating, photonic treatment (e.g. UV) or rapid thermal annealing. In the depicted embodiment the baking module is shown as a separate module. Alternatively, or additionally, such baking or other thermal or photonic treatments may be performed within one or more of the other modules in the system.

[0274] The Input/Output station 111/129 is a combination common support 3 loading, unloading station with an identification reader module (not shown) that may also contain an alignment and measuring inspection unit.

[0275] In the depicted embodiment, the common support transfer means is a conveyor module 112 comprising a rail. Carriages 114 are mounted on and slidable relative to the rail 112 and carry a flexible polymer support 3 on a rigid glass carrier 5. In alternative arrangements, not shown, each carriage 114 may transport a cassette of common supports along rail 112 to any one of the buffering stations 115, 123a, 123b, 125a, 125b, 127, and 142. In embodiments, not shown, the conveyor 112 can comprise rollers, a rail or rails, chains, a continuous loop conveyor or the like.

[0276] Common supports 3 are transferred from the carriages 114 to the buffering stations 115, 123a, 123b, 125a, 125b, 127, 142 by any suitable bidirectional interface, such as for example a robotic arm or the like. The buffering stations 115, 123a, 123b, 125a, 125b, 127, 142 are transit stations for common supports 3 moving between the carriages 114 and the modules 111, 117a, 117b, 119a, 119b, 121, 140 and 129.

[0277] FIG. 3 shows a system 300 for manufacturing a plurality of integrated circuits, the system or apparatus embodying an aspect of the present invention.

[0278] The system 300 is similar to the system depicted in FIG. 2 in that it comprises a combined input and output station 311/329 and a conveyor 312 forming a transfer means for flexible polymer supports (not shown) loaded into and moved through the system 300 on rigid glass carriers (not shown). The conveyor 312 could be any suitable transport system for moving the supports through the system 300 (e.g. rollers, a rail or rails, chains, a continuous loop conveyor or the like).

[0279] Buffering stations 315, 323b, 323a, 325a, 325b, 327 and 342 connect input/output station 311/329, deposition modules 317b, 317a, etching modules 319a, 319b, patterning module 321 and baking module 340 respectively with the transfer conveyor 312. In this way, flexible polymer supports can be moved into and out of the stations and modules and along conveyor 312 under the direction of controller 307 with user interface 309. In the depicted arrangement, a further user interface 309a is provided at the opposite side of the system 300 such that the user 351 has no need to work around the system 300 to interact with the user interface. Both user interfaces 309, 309a are operably linked to controller 307.

[0280] Deposition module 317a and etching module 319b each comprise a cluster of sub-modules. Each sub-module within the deposition module 317a may be operable to deposit a single material layer onto the common supports. Similarly, each sub-module within the etching processing module 319b is operable to etch one or more layers of the integrated circuits to be formed on the common supports.

[0281] Each cluster of sub-modules (317a, 319b) comprises a plurality of robotic arms (not shown) to move common supports between sub-modules and into and out of the processing modules (317a, 319b) onto the transfer conveyor 312.

[0282] User 351 inputs a processing protocol comprising a master job schedule and a pre-programmed protocol into controller 307 using user interface 309, 309a. Controller 307 is operable to initiate a processing protocol for a flexible polymer support (not shown) loaded into input station 311 according to the instructions provided in the master job schedule and the pre-programmed protocol. The controller 307 tracks the flexible polymer support through system 300 and is operable to initiate one or more dynamic protocols to override the pre-programmed protocol in respect of that flexible polymer support to change one or more of: the sequence of processing steps, processing parameters and operating parameters applicable to the common support. In this way, any one flexible polymer support in system 300 is directed through the system 300 by the controller 307 according to a processing protocol (set of processing instructions) comprising a pre-programmed protocol and at least one dynamic protocol.

[0283] The flexible polymer support is repetitively cycled through elements of the system 300 in order to vertically build layers of a plurality of integrated circuits in each cycle until the complete integrated circuits are formed on the flexible polymer support, according to a design set out in the master job schedule.

(ii) System and Method Utilising a Central Column Support Transfer

[0284] Despite the advantages of the conveyor belt system(s) 1, 100, 300, wafer transfer on such a linear racetrack may not pass or overtake each other when transported between process tools (such as modules 17, 19, 21). Some process tools, for example those which process multiple wafers (e.g. common supports 3, in batches) may take a significant amount of time to unload onto the racetrack (e.g. conveyor 13, 113, 312), during which time the other wafers on the track cannot be moved. These issues can decrease the efficiency of the manufacturing process due to accumulated time delays. Such linear conveyors (e.g. 13, 113, 312) also consume considerable amounts of electrical power, therefore increasing IC production costs. Furthermore, the relatively large physical size of the racetrack may require a proportionally large volume of clean air in which to operate, which in turn demands a larger, more costly clean air system.

[0285] Consequently, an alternative embodiment to systems having a linear racetrack (i.e. system embodiments 1, 100, 300) may utilise a central column or carousel of buffer cassettes (or other wafer-holding receptacles) having locations for supporting wafers on multiple levels.

[0286] FIG. 4 shows a system 200 for manufacturing a plurality of integrated circuits, the system 200 or apparatus embodying an aspect of the present invention. The depicted arrangement is similar to the system illustrated in FIG. 1 with the exception that the conveyor 13 is replaced by a central carousel 213. The carousel 213 is connected to buffering stations 215, 223, 225, 227 by bidirectional interfaces (e.g. robotic arms) 237b, 237d, 237f and 237h, respectively, such that flexible polymer supports (not shown) on glass carriers (not shown) (e.g. wafers) loaded into input station 211 are transferrable to and from the carousel 213 by the bidirectional interfaces (e.g. robotic arms). Further bidirectional interfaces (e.g. robotic arms) 237a, 237c, 237e, 237g are operable to transfer the rigid glass carriers supporting the flexible polymer supports (not shown) from the buffering stations 215, 223, 225, 227 to a deposition module 217, an etching module 219 and a patterning module 221 respectively.

[0287] The central carousel 213 provides for a further buffering station in which one or more common supports (e.g. wafers) may be temporarily resident before the controller (not shown) directs same to one of the buffering stations 215, 223, 225, 227.

[0288] In particular, and as illustrated in FIGS. 5, 6 and 7, the column or carousel 213 may be attached to a turn-table (not shown) and the tools (e.g. a processing module, such as, any one of modules 211, 217, 219, 221) are mounted around the outside of the column or carousel 213. An interface robot 237 may be provided to transfer wafers 203 or cassettes between each tool 211, 217, 219, 221 and the buffer cassette or buffer 230. As wafers 203 need to progress to the next tool 211, 217, 219, 221, the turn-table indexes around. Each interface robot 237 will need a larger vertical (i.e. Z) motion than what is required with the racetrack (i.e. conveyor 13, 113, 312) in order to reach all levels 232 of the column 213. The buffer's 230 capacity is distributed among buffer receptacles such as cassettes, each having one or more locations for supporting the wafers. For example, there may be as many as fifty locations within each cassette, and cassettes may be arranged in one or more vertical storeys, such as, for example, buffer levels 232. The interface robots 237 transport wafers 203, or cassettes containing one or more wafers 203, between the buffer 230 and the process tools 211, 217, 219, 221 via transfer ports in the tools 211, 217, 219, 221. A single interface robot 237 may transfer wafers 203 between the column 213 and more than one process tool 211, 217, 219, 221. The one or more process tools 211, 217, 219, 221 may comprise additional internal buffer capacity.

[0289] A further enhancement to the carousel 213 would be to have each buffer (cassette) level 232 operable on its own rotation mechanism, so that a cassette full of wafers 203 can proceed around to the next tool (e.g. any one of process tools 211, 217, 219, 221). This possibly becomes most manageable by having a level 232 or shelf assigned to each layer of the IC stack and as wafers 203 finish one IC stack layer they move up to the next level (shelf) etc. This approach may limit the Z-axis translation distance (i.e. vertical movement) required of some tool transfer robots, since they may only need to address two neighbouring levels of the column of buffer levels 232. However, it may reduce potential time delays in the handling system. For example, as illustrated in FIG. 5 (c), wafers 203 may be arranged in cassettes (e.g. 1, 2, 3) that are accessible by a first processing tool (e.g. tool 1) and cassettes (e.g. 4, 5, 6) that are accessible by a second processing tool (e.g. tool 2). After some processing time, wafers 203 in cassette 2 may be finished on tool 1, and wafers 203 in cassette 5 may be finished on tool 2. The handler is adapted to move respective cassettes (i.e. buffers) around to the next location (e.g. swap process tools 1 and 2).

[0290] Referring now to FIG. 6, an alternative to the enhanced carousel 213 illustrated in FIG. 5 may be to introduce an internal wafer handling system 235 into the column (i.e. carousel 213). The internal wafer handling system 235 is configured to transport wafers 203 (or cassettes comprising one or more wafers 203) to and from the carousel 213 via the tool interface robots 237 at one or more transfer levels 234 of the column 213. In the event that the vertical positions (i.e. heights) of all process tool transfer ports 236 are equal or at least similar, then only a single transfer level 234 may be required. However, a varying range of the process tool transfer port 236 heights may necessitate more than one transfer level 234, which may either be adjacent to each other or be separated by one or more buffer levels 232. During use, upon reception of a wafer 203 (or cassette comprising one or more wafers 203) by a slot on a transfer level 234, the column's 213 internal handling system 235 moves the wafer 203 to a buffer level 232 whilst it awaits transfer to another process tool 211, 217, 219, 221. At a predetermined time, the wafer 203 may be moved within the column 213 to a slot on a predetermined transfer level 234, from where it may be picked up by a respective interface robot 237. The internal handling system 235 may further comprise at least one vertical and/or radial transport mechanism 238 adapted to transport one or more wafers 203 at a time. In order to position respective wafers 203 for pick-up by a corresponding interface robot 237, the wafers may be moved about the column 213 by either one of:

[0291] (i) Rotation of the or each transfer level 234 of the column 213, and/or

[0292] (ii) Rotation of the internal handling system 235.

[0293] FIG. 7 shows an alternative implementation to the embodiment illustrated in FIG. 6 (i.e. including an internal handling system 235) may provide for a reduced number of interface robots 237 to be used. In fact, the alternative embodiment may be configured so as to eliminate the need for any interface robots 237. For example, the carousel's 213 internal handling system 235 may be adapted to provide extended radial reach, therefore, allowing direct wafer exchange (i.e. carriers) with at least some or all of the process tools 211, 217, 219, 221. Such wafer exchanges may take place on one or more transfer levels 234 depending on the vertical positions of the process tool transfer ports 236. Suitable internal wafer handling systems 235 are known in the art (e.g. employing robotic arms) and are therefore not discussed in any more detail.

[0294] A system 200 with a central rotational column (i.e. carousel) 213 may provide at least some advantages over a system utilising, for example, race-track type conveyor transport system. The advantages may be: [0295] Potential reduction of buffer unit footprint space per tool by having a centralised system. [0296] Race-track conveyor is replaced by a turn-table mechanism; [0297] Potential reduction of footprint of the overall system due to the more compact circular format, this may also reduce installation costs, since the supply routing between tools can be made shorter. [0298] Movement by cassette may increase batch production efficiency, for example, a stack of wafers may be moved on to the next tool as a whole, as opposed to individual wafers that are moved via the conveyor system. This may also improve cleanliness potentially having an impact on the requirements of the clean air system. [0299] Complexity of scheduling systems may be reduced (especially photolithography loading and the recording of wafers in buffers). [0300] System wafer capacity may be increased without increasing the system footprint, for example, the column may simply be made taller and/or the spacing between wafers may be reduced to increase number of wafers that can be accessed.
(iii) System(s) and Method(s) for Other Products:

[0301] Although the systems and methods are described herein in the context of the manufacture of ICs, the same systems and methods are equally applicable to the manufacture of a range of products. For example, the same cycle of deposition, patterning and etching may be employed to manufacture electronic components, such as capacitors, resistors, inductors, transistors, diodes etc., in discrete or other forms that would not be considered integrated circuits. One specific example is a thin film capacitor, formed by precision lithographic techniques using appropriate process tools. Such precision capacitors, which may be formed at low temperature on flexible substrates, have many potential applications, for example in wearable electronics, health monitoring and medical devices. One or more common supports may be inserted into the system and components may be formed upon those common supports alongside other common supports upon which ICs are being formed. In one process tool one or more component common supports may be processed at the same time and/or under the same conditions as one or more IC common supports. Component common supports may be prioritised differently from IC common supports in order to optimise tool population control or utilisation, transit time through the system, system efficiency, etc. Alternatively, both components and ICs may be formed on the same common support, which may be prioritised accordingly.

[0302] The term Integrated Circuit (IC) used in this disclosure may be interpreted very broadly, and the nature of ICs and other products manufactured by the systems and methods described may be extremely diverse. Any item comprising an electronic component and exhibiting some electronic activity is in scope. ICs may include but are not limited to digital ICs, analogue ICs, mixed-signal ICs, microprocessors, digital signal processors (DSPs), logic ICs, microcontrollers, interface ICs, programmable logic devices, application-specific ICs (ASICs), RFID ICs, RF ICs, memory ICs, sensors, power management circuits, operational amplifiers, data acquisition ICs, clock/timing ICs, etc.

[0303] A common support may be in the form of a partially-manufactured substrate, as an alternative to the plain glass or silicon wafers previously mentioned. Examples may include a partially-manufactured silicon wafer comprising a plurality of partially-manufactured silicon ICs. Further steps in the manufacture of those silicon ICs may be performed flexibly in the systems, or using the methods, described. Other examples include partially-manufactured displays, batteries or sensors. One or more such partially-manufactured substrates, or common supports, may be inserted into the system whilst it is also manufacturing ICs or other products onto plain glass common supports. The partially-manufactured common supports may be processed at the same time and/or under the same conditions as one or more IC common supports. Partially-manufactured common supports may be prioritised differently from IC common supports in order to optimise tool population control or utilisation, transit time through the system, system efficiency, etc., or simply to run trials of one product type at the same time as mass production of a second product type.

[0304] More complex products may also be manufactured. For example, hybrid systems, in which components manufactured by other processes and ICs, manufactured in the present system and/or by other processes, are incorporated.

(iv) Supplemental Information

[0305] It should be understood that in certain embodiments of systems 1, 100, 200 and 300, one or more of the buffering stations can be removed to provide for direct transfer of the, or each, common support for the transfer means to a module and/or the input/output station.

[0306] It should be further understood that the input and output stations can be separate stations in any of the systems 1, 100, 200, 300 depicted herein.

[0307] The system 1, 100, 200, 300 may optionally be enclosed in a microenvironment (not shown). In this way, the temperature, humidity and airborne particulate count, for example, of the system environment can be monitored and controlled.

[0308] The transfer means (e.g. conveyor 13, pair of rails 113, 212a, 212b carousel 213) may operate at up to 5 ms.sup.1.

[0309] The controller 7, 107, 307 is operable to provide automated common support transfer through the system 1. This allows the system 1 to operate with minimal or no human intervention other than with the user interface 9, 109, 309, which may be positioned at a location remote from the other components of system 1.

[0310] It is envisaged that the system provides for a so-called hot swap of processing modules. In a hot swap condition, the system comprises an additional module space. More specifically, the spare module space allows a new module to be introduced or faulty or maintenance-due modules to be replaced without halting production. The controller is operable to direct the at least one common support to a processing module (or sub-module) in the spare module position as required.

[0311] Below, there is provided a non-exhaustive list of non-limiting aspects. Any one or more of the features of these examples may be combined with any one or more features of another aspect, embodiment or aspect described herein.

Aspects

[0312] 1. A system for manufacturing a plurality of integrated circuits, IC, mounted on a common support, the system comprising:

[0313] an input station configured (adapted, arranged) to receive at least one common support;

[0314] an output station configured (adapted, arranged) to receive at least one common support having a plurality of integrated circuits formed thereon;

[0315] a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the processing steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the at least one common support;

[0316] a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween;

[0317] control means (e.g. a control system, or at least one controller, control unit, or control module) operable to direct the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to at least one processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols;

[0318] the control means being operable to direct the movement of a common support from the input station to the output station and through one or more of the processing modules independently of any other common support.

2. A system according to aspect 1, wherein the control means comprises a system controller (e.g. control unit, control module) and a plurality of sub-system controllers (e.g. control unit, control module) operable to direct the system and each of the component stations and modules respectively.
3. A system according to aspect 1 or aspect 2, wherein the at least one processing protocol comprises a changeable pre-programmed protocol.
4. A system according to aspect 3, wherein the at least one processing protocol comprises a plurality of changeable pre-programmed protocols.
5. A system according to aspect 3 or aspect 4, wherein the at least one processing protocol comprises a selected one of a plurality of changeable pre-programmed protocols.
6. A system according to aspect 4 or aspect 5, wherein the control means is operable to select one of the plurality of changeable pre-programmed protocols for the at least one processing protocol.
7. A system according to any one of aspects 3 to 6, wherein the changeable pre-programmed protocol comprises sequential direction of the, or each, common support to at least a deposition module, a patterning module and an etching module.
8. A system according to any one of aspects 3 to 7, wherein the changeable pre-programmed protocol includes a repeatable sequence of processing steps for the formation of layers of an integrated circuit on a common support.
9. A system according to any one of aspects 3 to 8, wherein the at least one processing protocol comprises at least one dynamic protocol.
10. A system according to any one of the preceding aspects, wherein the transfer means comprises one or more support moving devices.
11. A system according to aspect 10, wherein the one or more support moving devices comprise a plurality of robotic arms operable to move at least one common support within a module, from one module to another module, to or from a station and/or to and/or from a buffering station.
12. A system according to aspect 11, wherein the plurality of robotic arms are each operable to move a batch loading device configured to receive one or more common supports.
13. A system according to aspect 11, wherein the plurality of robotic arms are each operable to directly move one or more common supports.
14. A system according to any one of the preceding aspects, wherein each processing module comprises one or more sub-modules.
15. A system according to aspect 14, wherein each sub-module within a processing module is operable to perform one of the processing steps in the formation of an integrated circuit.
16. A system according to aspect 14 or aspect 15, wherein a sub-module is operable to form at least one layer of an integrated circuit on a common support.
17. A system according to any one of aspects 14 to 16, wherein a processing module comprises a cluster of sub-modules.
18. A system according to aspect 17, wherein the cluster of sub-modules are operable to perform one of the processing steps in the formation of an integrated circuit on at least one common support.
19. A system according to any one of aspects 14 to 16, wherein a processing module comprises a single sub-module.
20. A system according to aspect 19, wherein the single sub-module is configured (arranged, adapted) to receive one or more common supports.
21. A system according to aspect 19 or aspect 20, wherein each sub-module is operable to perform at least a part of a step in the process of making a plurality of integrated circuits.
22. A system according to any one of the preceding aspects, comprising one or more masks (or reticles) for each of a plurality of integrated circuit designs.
23. A method of manufacturing a plurality of integrated circuits, IC, mounted on a common support, the method comprising:

[0319] providing (e.g. manufacturing) at least one common support;

[0320] providing an input station into which the at least one common support is loaded;

[0321] providing an output station into which the at least one common support having a plurality of integrated circuits mounted thereon is received;

[0322] providing a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the common support;

[0323] providing a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules;

[0324] directing each of the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to a processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols;

[0325] directing the processing steps of each process module; and

[0326] directing the movement of each common support from the input station to the output station and to one or more of the processing modules independently of any other common support.

24. A method according to aspect 23, comprising selecting one changeable pre-programmed protocol from the plurality of changeable pre-programmed protocols.
25. A method according to aspect 23 or aspect 24, comprising selecting one or more masks (or reticles) for an integrated circuit design.
26. A central transfer system for a system for manufacturing a plurality of integrated circuits (IC), comprising:

[0327] a central column assembly having a longitudinal axis;

[0328] at least one storage member, mounted operably to and coaxially with said longitudinal axis of said central column assembly, comprising at least one receptacle configured to receive and store at least one common support; and

wherein said central column assembly is configured to move any one of said a least one storage member rotatably about and/or linearly along said longitudinal axis, so as to provide any one of said at least one receptacle at a predetermined processing module [port] of the system for manufacturing a plurality of integrated circuits (IC).
27. A central transfer system according to aspect 26, wherein said central column assembly comprises a turn-table mechanism adapted to move any one of said at least one storage member rotatably about said longitudinal axis.
28. A central transfer system according to aspect 27, wherein said turn-table mechanism is further adapted to move said central column assembly along said longitudinal axis.
29. A central transfer system according to any one of aspects 26 to 28, comprising a plurality of said at least one storage member operably stacked along said longitudinal axis.
30. A central transfer system according to aspect 29, wherein any one of said plurality of at least one storage member is rotatable about said longitudinal axis independently of any adjacent one of said plurality of at least one storage member.
31. A central transfer system according to any one of aspects 29 and 30, wherein said central column assembly further comprises an internal handling mechanism configured to receive and move said at least one common support along said longitudinal axis to and from any one of said plurality of at least one storage member.
32. A central transfer system according to any one of aspects 26 to 31, further comprising at least one radial transport mechanism adapted to move said at last one common support to and/or from said at least one receptacle.
33. A central transfer system according to aspect 32, when dependent on aspect 31, wherein said at least one radial transport mechanism is adapted to move said at last one common support between any one of said internal handling mechanism, said at least one receptacle and a processing module.

[0329] Throughout the description and claims of this specification, the words comprise and contain and variations of them mean including but not limited to, and they are not intended to (and do not) exclude other moieties, additives, components, integers or steps. Throughout the description and claims of this specification, the singular encompasses the plural unless the context otherwise requires. In particular, where the indefinite article is used, the specification is to be understood as contemplating plurality as well as singularity, unless the context requires otherwise.

[0330] Features, integers, characteristics, compounds, chemical moieties or groups described in conjunction with a particular aspect, embodiment or example of the invention are to be understood to be applicable to any other aspect, embodiment or example described herein unless incompatible therewith. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. The invention is not restricted to the details of any foregoing embodiments. The invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed.

[0331] The reader's attention is directed to all papers and documents which are filed concurrently with or previous to this specification in connection with this application and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference.