IMPLANT
20210038367 ยท 2021-02-11
Inventors
Cpc classification
International classification
Abstract
An implant comprising a shell, a core within the shell, and a conductive layer between the core and the shell; wherein the implant additionally comprises a sensor for detecting a change in one or more electrical properties of the conductive layer. A kit for use in detection of rupture an implant comprising the implant, a method of detecting rupture and a method of manufacture of an implant
Claims
1. An implant comprising a shell, a core within the shell, and a conductive layer between the core and the shell; wherein the implant additionally comprises a sensor for detecting a change in one or more electrical properties of the conductive layer.
2. An implant according to claim 1, wherein the core comprises a gel-fill biomaterial.
3. An implant according to claim 2, wherein the gel-fill biomaterial is selected from silicone, saline or a combination thereof.
4. (canceled)
5. An implant according to claim 1, wherein the conductive layer is adhered to the shell and comprises a coating on an innermost surface of the shell.
6. (canceled)
7. (canceled)
8. An implant according to claim 1, wherein the conductive layer substantially covers the innermost surface of the shell.
9. An implant according to claim 1, wherein the conductive layer partially covers the innermost surface of the shell and wherein the conductive layer comprises at least one conductive strip; and further comprising conductive strips embedded within the shell, wherein the further conductive strips are radially aligned with the conductive strip of the conductive layer.
10. (canceled)
11. An implant according to claim 1, wherein the conductive layer comprises conducting material which is a nanoparticulate selected from gold, silver, copper, graphite or a combination thereof.
12.-13. (canceled)
14. An implant according to claim 1, wherein the conductive layer is in electrical communication with the sensor.
15. An implant according to claim 14, wherein the conductive layer is connected to the sensor, wherein connection of the sensor to the conductive layer is either direct or via a tether.
16. (canceled)
17. An implant according to claim 1, wherein the sensor is powered by induction charging.
18. An implant according to claim 1, wherein the electrical property is electrical impedance and/or alternating current across the conductive layer.
19.-20. (canceled)
21. An implant according to claim 1, wherein the implant further comprises a temperature and/or pressure sensor.
22. A kit for use in detection of rupture an implant comprising: an implant according to claim 1; and a receiving device; wherein the receiving device is configured to communicate with the implant.
23. A kit according to claim 22, wherein the receiving device is hand-held, wherein the conductive layer and/or sensor is configured to receive power from the hand-held receiving device and wherein the receiving device is configured to generate a small alternating current across the conductive layer and/or the sensor.
24. A kit according to claim 22, wherein the receiving device is a passive energy source.
25. A kit according to any of claim 22, wherein communication of the receiving device with the implant comprises a request for data from the sensor, the receipt of information from a sensor within the implant, and optionally requests for correlation of data.
26. A kit according to any of claim 22, wherein communication of the receiving device with the implant comprises powering of the implant, wherein the conductive layer and/or sensor is configured to receive power from the hand-held receiving device.
27.-33. (canceled)
34. A method of detecting rupture of an implant comprising using the kit of claim 22 in the steps of: (i) placement of the receiving device within communication distance of the implant; (ii) measuring an electrical property of the conductive layer of the implant; (iii) transmittal of the measurement to the receiving device.
35.-41. (canceled)
42. A method of manufacture of an implant according to claim 1, comprising the steps of: (i) forming an implant shell; (ii) providing a conductive layer; (iii) providing a sensor; (iv) filling the implant; and (v) sealing the implant.
43. A method according to claim 42, comprising providing the conductive layer as a coating in an inner surface of the shell wherein the conductive layer is adhered to the inner surface of the shell using a layer of uncured silicone.
44.-47. (canceled)
Description
[0082] In order that the invention may be more readily understood, it will be described further with reference to the figures and to the specific examples hereinafter.
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[0090] It would be appreciated that the apparatus and methods of the invention are capable of being implemented in a variety of ways, only a few of which have been illustrated and described above.