Method for Mechanically Connecting and Arranging Electronic Components

Abstract

A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.

Claims

1. A method for mechanically connecting a first electronic component to a second electronic component comprising: arranging and aligning, in a first direction, a first electronic component, which includes a first through-opening extending in the first direction, over a second electronic component, which includes one of a second through-opening and a blind hole extending in the first direction, in such a way that the one of the second through-opening and the blind hole is arranged at least partially below the first through-opening in the first direction; introducing an encapsulation compound into the first through-opening and into the one of the second through-opening and the blind hole; and curing the encapsulation compound in order to fix the first electronic component in relation to the second electronic component.

2. The method as claimed in claim 1, further comprising: arranging the first electronic component above the second electronic component in the first direction in such a way the one of the second through-opening or and the blind hole is arranged fully below the first through-opening in the first direction, or in such a way that the first through-opening is arranged fully above the one of the second through-opening and the blind hole in the first direction.

3. The method as claimed in claim 1, wherein: a first cross section of the first through-opening perpendicular to the first direction is elliptical or circular; a second cross section of the one of the second through-opening and the blind hole perpendicular to the first direction is elliptical or circular; and the arranging and aligning of the first electronic component includes aligning the first electronic component with respect to the second electronic component in such a way that the first through-opening is aligned coaxially with the one of the second through-opening and the blind hole.

4. The method as claimed in claim 1, further comprising: electrically connecting the first electronic component to the second electronic component at a position located at most 0.75 mm away from at least one of the first through-opening and the one of the second through-opening and the blind hole.

5. The method as claimed in claim 1, further comprising: applying a dam material, which extends around the first through-opening, onto a first side of the first electronic component, the first side facing away from the second electronic component ; and applying a fill material as an encapsulation compound onto a first part of the first side of the first electronic component which is enclosed by the dam material in such a way that the fill material is introduced into the first through-opening and into the second through-opening or into the blind hole.

6. An arrangement of electronic components, comprising: a first electronic component including a first through-opening extending in a first direction; a second electronic component including one of a second through-opening and a blind hole extending in the first direction and arranged below the first electronic component in the first direction in such a way that the one of the second through-opening and the blind hole is arranged at least partially below the first through-opening in the first direction; and a monobloc encapsulation compound connecting the first electronic component to the second electronic component, the encapsulation compound arranged in the first through-opening and in the second through-opening or the blind hole.

7. The arrangement as claimed in claim 6, wherein: the one of the second through-opening and the blind hole is arranged fully below the first through-opening in the first direction; or the first through-opening is arranged fully above the one of the second through-opening and the blind hole in the first direction.

8. The arrangement as claimed in claim 6, wherein a part of the encapsulation compound is arranged on a side of the second electronic component facing away from the first electronic component.

9. The arrangement as claimed in claim 6, wherein: a first cross section of the first through-opening perpendicular to the first direction is elliptical or circular; a second cross section of the one of the second through-opening and the blind hole perpendicular to the first direction is elliptical or circular; and the first through-opening is aligned coaxially with the one of the second through-opening and the blind hole.

10. The arrangement as claimed in claim 6, wherein the encapsulation compound is arranged partially between the first electronic component and the second electronic component so as to form a surface connection between the first electronic component and the second electronic component.

11. The method as claimed in claim 1, wherein: the first electronic component is a first printed circuit board element; and the second electronic component is a second printed circuit board element.

12. The method as claimed in claim 4, wherein the position is located at most 0.55 mm away from at least one of the first through-opening and the one of the second through-opening and the blind hole.

13. The method as claimed in claim 6, wherein: the first electronic component is a first printed circuit board element; and the second electronic component is a second printed circuit board element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Embodiments of the invention will be described below with reference to the appended drawings, neither the drawings nor the description being intended to be interpreted as restricting the invention.

[0021] FIG. 1 shows a cross-sectional view of a first embodiment of the arrangement according to the invention of electronic components;

[0022] FIG. 2 shows a cross-sectional view of a second embodiment of the arrangement according to the invention of electronic components;

[0023] FIG. 3 shows a cross-sectional view of a third embodiment of the arrangement according to the invention of electronic components; and

[0024] FIG. 4 shows a cross-sectional view of a fourth embodiment of the arrangement according to the invention of electronic components.

[0025] The figures are merely schematic and not to scale. The same references denote features which are the same or have the same effect in the figures.

EMBODIMENTS OF THE INVENTION

[0026] FIG. 1 shows a cross-sectional view of a first embodiment of the arrangement 10 according to the invention of electronic components 20, 30. The arrangement 10 comprises a first electronic component 20, namely a first printed circuit board element, and a second electronic component 30, namely a second printed circuit board element. The first and second printed circuit board elements may respectively be a rigid printed circuit board (PCB), a flexible printed circuit board (PCB), a flex PCB, direct bonded copper (DBC), a flexible printed circuit board (FPC), a sensor or a sensor dome, or the like.

[0027] The first printed circuit board is electrically connected by means of two solder positions 80, 81 to the second printed circuit board. It is also conceivable for the two printed circuit board elements to be electrically connected to one another by means of only one solder position, three solder positions or more than three solder positions. The first printed circuit board comprises a first through-opening 25. The first through-opening 25 extends in the first direction 90. The first direction 90 runs from the bottom upwards in FIG. 1. The second printed circuit board comprises a second through-opening 35. The second through-opening 35 likewise extends in the first direction 90. The two through-openings 25, 35 have an equally large cross section perpendicularly to the first direction 90. It is also conceivable for the cross sections to be of different sizes. The cross section perpendicularly to the first direction 90 may be elliptical, in particular circular, rectangular, in particular square. Other cross sections may also be envisioned.

[0028] The first printed circuit board element is arranged above the second printed circuit board element in the first direction 90. The first printed circuit board element is arranged on a centrally arranged projection of a heat sink 70 (so-called cooling balcony 75). The second printed circuit board element is located on a part of the encapsulation compound 50, which is in turn partially located on the heat sink 70.

[0029] The printed circuit board elements are aligned with respect to one another in such a way that the first through-opening 25 is located above the second through-opening 35. What is essential is that the second through-opening 35 is located at least partially below the first through-opening 25, so that encapsulation compound 50 can pass from the first through-opening 25 along the first direction 90 into the second through-opening 35.

[0030] The direction of gravity is usually from the top downward in FIG. 1.

[0031] The encapsulation material is applied onto part of a first side 21 of the first printed circuit board element. The first side 21 of the first printed circuit board element faces away from the second printed circuit board element. In FIG. 2, the first side 21 of the first printed circuit board element is the upper side.

[0032] The encapsulation material is flowable. The encapsulation material therefore penetrates into the first through-opening 25, or is introduced into it, and consequently into the second through-opening 35. In the embodiment shown in FIG. 1, the encapsulation compound 50 fully covers the first side 21 of the first printed circuit board element. The further elements arranged on the first side 21 of the first printed circuit board element are insulated from the environment by the encapsulation compound 50. The solder position 80 between the outer-lying metallization 85 of the first printed circuit board element and the second printed circuit board element for electrical connection of the two printed circuit board elements is also fully covered by the encapsulation compound 50. The encapsulation compound 50 is likewise partially located between the second printed circuit board element and the heat sink 70. As a result, a height difference between the second printed circuit board element and the heat sink 70 is compensated for. In addition, as a result the second printed circuit board element is fastened on the heat sink 70.

[0033] Application-specific printed circuit board element may be selected and combined with one another, for example a locally required printed circuit board with 8 layers, while the main printed circuit board has only 4 layers and is therefore more economical.

[0034] Different thicknesses of the printed circuit board elements may also be compensated for by the encapsulation compound 50. For instance, printed circuit board elements usually have a thickness of about 1.6 mm0.15 mm.

[0035] Different heights of the copper tracks may also be compensated for by the encapsulation compound 50. For example, a main printed circuit board may have 35 m copper tracks and has a high-current printed circuit board adhesively bonded on 105 m copper tracks. Likewise, gaps between the first printed circuit board element and the second printed circuit board may be filled with the encapsulation compound 50.

[0036] The encapsulation compound 50 may be or comprise epoxy resin, polyurethane, acrylate and/or silicone.

[0037] After the encapsulation compound 50 has reached into the second through-opening 35 and to further desired positions, the encapsulation compound 50 is cured. This is, for example, carried out by warming or heating.

[0038] The first through-opening 25 is aligned flush with the second through-opening 35. It is also conceivable for the first through-opening 25 to have a (small) offset with respect to the second through-opening 35. The first through-opening 25 and the second through-opening 35 are respectively filled fully with encapsulation compound 50.

[0039] FIG. 2 shows a cross-sectional view of a second embodiment of the arrangement 10 according to the invention of electronic components 20, 30. In this case, the first electronic component 20, namely the first printed circuit board element, has a smaller width (extending from the left to the right in FIG. 2) than the second electronic component 30, namely the second printed circuit board element. The two printed circuit board elements are connected to one another by means of two first through-openings 25, 26 and two second through-openings 35, 36. The encapsulation compound 50 is present as a continuous encapsulation compound in all the through-openings 25, 26, 35, 36. All the through-openings 25, 26, 35, 36 are filled fully with encapsulation compound 50, or the encapsulation material. The second printed circuit board element does not bear directly, or immediately, on the heat sink 70, but rather a part of the encapsulation compound 50 is located between them.

[0040] A layer of dam material 60 extending around the two first through-openings 25, 26, or the two upper openings of the two first through-openings 25, 26, is initially partially applied onto the first side 21 of the first printed circuit board element. The dam material 60 is essentially not flowable and remains at the applied position. Subsequently, a fill material, which is flowable before curing, is applied as an encapsulation material onto that part of the first side 21 of the first printed circuit board element which is enclosed by the dam material 60. The flowable fill material flows into the first through-openings 25, 26 (as an alternative, it may also be applied directly into them) and into the second through-openings 35, 36. Partially, it also flows into the region between the first printed circuit board element and the second printed circuit board element. Likewise, it flows into the region between the second printed circuit board element and the heat sink 70.

[0041] Besides the dam material 60 on the first side 21 of the first printed circuit board element, FIG. 2 does not show any flow-limiting devices which prevent the fill material or encapsulation material from spreading or flowing further than as shown in FIG. 2.

[0042] Arranged between the two first through-holes or the second through-holes, there are two solder positions 80, for electrical connection of the two printed circuit board elements to one another. The first through-openings 25, 26 are respectively aligned flush with the respective second through-opening 35, 36.

[0043] FIG. 3 shows a cross-sectional view of a third embodiment of the arrangement 10 according to the invention of electronic components 20, 30. In this case, the two electronic components 20, 30, or printed circuit board elements, are of equal width and are arranged above one another while being offset with respect to one another in the first direction 90. The first through-opening 25 has, in cross section perpendicularly to the first direction 90, the same diameter as the second through-opening 35 in cross section perpendicularly to the first direction 90. The first through-opening 25 is aligned flush with the second through-opening 35.

[0044] In the overlap region between the two printed circuit board elements, a part of the encapsulation compound 50 is arranged between the two printed circuit board elements. In addition, a part of the encapsulation compound 50 is arranged in the entire region between the second printed circuit board element and the heat sink 70.

[0045] Besides the dam material 60 on the first side 21 of the first printed circuit board element, FIG. 3 does not show any flow-limiting devices which prevent the fill material or encapsulation material from spreading or flowing further than as shown in FIG. 3.

[0046] FIG. 4 shows a cross-sectional view of a fourth embodiment of the arrangement 10 according to the invention of electronic components 20, 30. The first electronic component 20 is in this case a sensor dome. The second electronic component 30 is a second printed circuit board element. The sensor dome comprises a solder pin 97, which is fitted into the second printed circuit board element. The solder pin 97 is electrically connected by means of a solder position 80, 81 to the second printed circuit board element (in this case a printed circuit board; PCB).

[0047] A part of the encapsulation compound 50 is arranged between the second printed circuit board element and the heat sink 70. A dam material 60 is applied around the inlet opening of the first through-opening 25 on a first side 21 of the sensor dome, which side faces away from the second printed circuit board element. The encapsulation compound 50, or the fill material, is subsequently applied onto that part of the first side 21 of the sensor dome which is enclosed by the dam material 60. The fill material flows through the first through-opening 25 into the second through-opening 35 and onto that side 21 of the second printed circuit board element which faces away from the sensor dome.

[0048] Besides the dam material 60 on the first side 21 of the first printed circuit board element, FIG. 4 does not show any flow-limiting devices which prevent the fill material or encapsulation material from spreading or flowing further than as shown in FIG. 4.

[0049] The sensor dome, or the electrical connections of the sensor dome, are electrically insulated by the encapsulation compound 50 below the second printed circuit board element from the heat sink 70.

[0050] Instead of a second through-opening 35, 36, in all embodiments presented the second electronic component 20, 30, or the second printed circuit board element, may comprise a blind hole which is open upward, or in the direction of the first electronic component 20, or of the first printed circuit board element, or of the first through-opening 25.

[0051] In conclusion, it should be pointed out that terms such as having, comprising, etc. do not exclude other elements or steps, and terms such as one or an do not exclude a plurality. References in the claims are not to be regarded as restricting.