A MEMS MICROPHONE, A MANUFACTURING METHOD THEREOF AND AN ELECTRONIC APPARATUS

Abstract

A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

Claims

1. A MEMS microphone, comprising: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

2. The MEMS microphone according to claim 1, wherein the MEMS microphone chip includes a first substrate, at least one backplate and at least one diaphragm, and the mesh membrane is formed on a second substrate; and wherein the mesh membrane and the second substrate are bonded to the first substrate.

3. The MEMS microphone according to claim 1, wherein the mesh membrane and the second substrate are bonded to the first substrate by at least one of wafer bonding, fusion bonding and intermediate layer bonding.

4. The MEMS microphone according to claim 1, wherein the housing includes a package substrate and a lid, which form a housing cavity, and the acoustic port is in the package substrate.

5. The MEMS microphone according to claim 1, wherein the mesh membrane has a perforation hole size of 1-10 um, and the mesh membrane has a thickness in range of 0.1-10 um.

6. The MEMS microphone according to claim 1, wherein a hole array in the mesh membrane is 60deg placed.

7. The MEMS microphone according to claim 1, wherein a material of the mesh membrane is at least one of SixNy, polySi, metal, alloy and polymer.

8. A method for manufacturing a MEMS microphone, including: preparing a MEMS microphone wafer, wherein the sacrificial layer between a diaphragm and a backplate of the MEMS microphone wafer are not released; preparing a mesh wafer, wherein a mesh membrane is formed on the mesh wafer; bonding the MEMS microphone wafer with the mesh wafer; forming a back hole for the mesh membrane in the mesh wafer; etching the sacrificial layer in the MEMS microphone wafer to release the diaphragm and the back plate; singulating the MEMS microphone wafer and the mesh wafer to form a MEMS microphone device including a MEMS microphone chip and a monolithically integrated mesh membrane; and mounting the MEMS microphone device in a housing, wherein the housing has an acoustic port, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

9. The method according to claim 8, wherein preparing a mesh wafer further includes: placing a bonding layer on the mesh membrane, and wherein the MEMS microphone wafer is bonded with the mesh wafer via the bonding layer, and forming a back hole for the mesh membrane in the mesh wafer further includes: etching the bonding layer to release the mesh membrane.

10. An electronic apparatus, which comprises a MEMS microphone according to claim 1.

11. An electronic apparatus, which comprises a MEMS microphone manufactured by using the method according to claim 8.

Description

BRIEF DISCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description thereof, serve to explain the principles of the invention.

[0026] FIG. 1 shows a schematic diagram of a MEMS microphone according to an embodiment.

[0027] FIG. 2 shows a schematic bottom view of a MEMS microphone device with a monolithically integrated mesh membrane filter according to an embodiment.

[0028] FIG. 3 shows a schematic cross-sectional view of a monolithically integrated mesh membrane filter according to an embodiment.

[0029] FIGS. 4-8 show schematic arrangements of hole arrays for a monolithically integrated mesh membrane filter according to an embodiment.

[0030] FIG. 9 shows a schematic cross-sectional view of a MEMS microphone device according to an embodiment.

[0031] FIG. 10 shows a schematic cross-sectional view of a MEMS microphone device according to another embodiment.

[0032] FIGS. 11-16 show processes of manufacturing a MEMS microphone according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0035] Techniques, methods and apparatus as known by one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

[0036] In all of the examples illustrated and discussed herein, any specific values should be interpreted to be illustrative only and non-limiting. Thus, other examples of the exemplary embodiments could have different values.

[0037] Notice that similar reference numerals and letters refer to similar items in the following figures, and thus once an item is defined in one figure, it is possible that it need not be further discussed for following figures.

[0038] Examples and embodiments will be described with reference to the drawings.

[0039] FIG. 1 shows a schematic diagram of a MEMS microphone according to an embodiment.

[0040] As shown in FIG. 1, the MEMS microphone comprises a MEMS microphone device and a housing.

[0041] The MEMS microphone device includes a MEMS microphone chip and a mesh membrane 402. The mesh membrane 402 is monolithically integrated with the MEMS microphone chip. For example, the MEMS microphone chip may include a first substrate 403, at least one backplate 405 and at least one diaphragm 404. The mesh membrane 402 is formed on a second substrate 401. The mesh membrane 402 and the second substrate 401 are bonded to the first substrate 403, to form a monolithic integration.

[0042] For example, the mesh membrane 402 is bonded to the second substrate 401 via a dielectric layer 406 and is bonded to the first substrate 402 via an intermediate bonding layer 407 such as an adhesive, metal, alloy, solder or glass frit. Alternatively, a direct bonding between the mesh membrane 402, the second substrate 401 and the first substrate 403 is also possible.

[0043] The housing includes an acoustic port 413. The MEMS microphone device is mounted in the housing. The housing may include a package substrate 411 and a lid 412. The package substrate 411 and a lid 412 form a housing cavity. Generally, the acoustic port is arranged in the package substrate. For example, the

[0044] As shown in FIG. 1, the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

[0045] The MEMS microphone may further include an ASIC 409. The MEMS microphone device is connected with the ASIC 409 via wire 410.

[0046] FIG. 2 shows a schematic bottom view of a MEMS microphone device 101 with a monolithically integrated mesh membrane filter 102 according to an embodiment. The MEMS microphone device 101 may be that described in FIG. 1. As shown in FIG. 1, the MEMS microphone device 101 may include a mesh membrane filter 102. The mesh membrane filter 102 may include the mesh membrane 402 of FIG. 1. Although it is not shown, the MEMS microphone device 101 may further include a MEMS microphone chip. The mesh membrane 102 is monolithically integrated with the MEMS microphone chip.

[0047] FIG. 3 shows a schematic cross-sectional view of a monolithically integrated mesh membrane filter according to an embodiment. As shown in FIG. 3, the mesh membrane filter may include a substrate 401 and a mesh membrane 402.

[0048] FIG. 3 also shows that dimension of the mesh membrane 402. D is the perforation hole size (diameter) of holes in the mesh membrane 402. The perforation hole size D is 1-10 m, and preferably, 3-5 m, in order to prevent killer particles from entering the air gap of the MEMS microphone device. S is the space between two adjacent holes. T is the thickness of the mesh membrane 402. The thickness T is in range of 0.1-10 m and preferably, 0.3-1 m, so as to provide a balance between filtering and performance. H is the height of the mesh membrane filter including the mesh membrane and the substrate 401. L is the diameter of the

[0049] The material of the mesh membrane 402 may be selected from at least one of SixNy, polySi, metal, alloy and polymer. A person skilled in art will be able to choose appropriate x and y for SixNy, under the teaching of this description.

[0050] In an example, a hole array in the mesh membrane 402 is 60deg placed, so as to provide a maximum perforation rate. FIGS. 4-8 show schematic arrangements of hole arrays for a monolithically integrated mesh membrane filter according to an embodiment.

[0051] FIG. 4 shows an array of round holes. FIG. 5. shows an array of square holes. FIG. 6. shows an array of hexagon holes. FIG. 7 shows an array of slit holes. FIG. 8 shows an array of cross holes.

[0052] The mesh membrane 402 and the second substrate 401 can be bonded to the first substrate 403 by at least one of wafer bonding, fusion bonding and intermediate layer bonding.

[0053] FIG. 9 shows that the mesh membrane 402 and the second substrate 401 are bonded to the first substrate 403 by direct wafer bonding or fusion bonding.

[0054] FIG. 10 shows that the mesh membrane 402 and the second substrate 401 are bonded to the first substrate 403 by intermediate layer bonding. As shown in FIG. 10, the mesh membrane 402 is bonded to the second substrate 401 via a dielectric layer 406. The mesh membrane 402 and the second substrate 401 are bonded with the first substrate 403 via a bonding layer 407. For example, the intermediate bonding layer may be an adhesive, metal, alloy, solder or glass frit layer, or an other layer which can be conceived by a person skilled in the art.

[0055] FIGS. 11-16 show processes of manufacturing a MEMS microphone according to an embodiment.

[0056] As shown in FIG. 11, a MEMS microphone wafer 403 is prepared, wherein the sacrificial layer 408 between a diaphragm 404 and a backplate 405 of the MEMS microphone wafer are not released. In this regard, the diaphragm and backplate can be supported and protected by the sacrificial layer. This may improve the yield of the final products. The sacrificial layer can be SiO.

[0057] As show in FIG. 12, a mesh wafer 401 is prepared. A mesh membrane 402 is formed on the mesh wafer.

[0058] For example, the dielectric layer 406 of SiO.sub.2 may first be deposited on the mesh wafer 401. Then, a mesh layer 402 is formed on the dielectric layer 406. The material of the mesh layer 402 may be polySi, SixNy, metal, alloy, or polymer. Next, the mesh layer 402 is patterned to form holes therein.

[0059] For example, a bonding layer 407 is placed on the mesh membrane 402. The bonding layer 407 can be deposited or coated. The bonding layer 407 may be SiO.sub.2, or polymer such as BCB/PI/PBO/photoresist. Here, an intermediate bonding layer is used to bond the filter with the MEMS microphone chip. As described above, a direct wafer bonding is also possible. For example, if the bonding layer 407 may be SiO.sub.2, it can directly be bonded with the MEMS microphone wafer 403 of Si.

[0060] As shown in FIG. 13, the MEMS microphone wafer 403 is bonded with the mesh wafer 401 (including the mesh membrane 402). For example, the MEMS microphone wafer 403 is bonded with the mesh wafer 401 via the bonding layer 407.

[0061] As shown in FIGS. 14, 15, a back hole for the mesh membrane 402 is formed in the mesh wafer 401. As shown in FIG. 14, the mesh wafer 401 may first be thinned. As shown in FIG. 15, the back hole is formed in the mesh wafer 401 for the mesh membrane 402.

[0062] Optionally, scribe streets may also be formed in the mesh wafer 401.

[0063] As shown in FIG. 16, the sacrificial layer 408 in the MEMS microphone wafer 403 is etched to release the diaphragm 404 and the back plate 405.

[0064] Here, the bonding layers 406, 407 may also be etched to release the mesh membrane 402. In some cases, the bonding layer 406, 407 may be omitted, and thus this etching step may omitted, too.

[0065] Next, the MEMS microphone wafer 403 and the mesh wafer 401 are singulated to form a MEMS microphone device. The MEMS microphone device includes a MEMS microphone chip and a monolithically integrated mesh membrane. For example, the MEMS microphone device may be that shown in FIG. 1, the MEMS microphone wafer 403 forms the first substrate and the mesh wafer 401 forms the second substrate.

[0066] Finally, the MEMS microphone device is mounted in a housing, to finish a MEMS microphone. The MEMS microphone may be that shown in FIG. 1. The housing has an acoustic port 413, and the mesh membrane 402 is arranged between the MEMS microphone chip and the acoustic port 413 as a particle filter for the MEMS microphone chip.

[0067] Generally, SNR will drop as the thickness of the filter increases. A thick membrane of a filter will cause a significant SNR degradation. In the prior art, a mesh membrane is manufactured directly in a Si substrate or is manufactured during a packaging or PCB process. It is very difficult to provide a thin mesh membrane with reasonable yield, cost and/or reliability.

[0068] In the embodiments, the mesh membrane is manufactured through wafer micromachining, and it monolithically integrated with the MEMS microphone chip. So, it may relieve the problems at least in one aspect.

[0069] In addition, the overall size of the MEMS microphone may be reduced because the particle filter is manufactured at wafer level.

[0070] In another embodiment, an electronic apparatus is provided, which comprises a MEMS microphone as described above or manufactured by using the method as described above. The electronic apparatus can be a mobile phone, pad, computer and so on.

[0071] Although some specific embodiments of the present invention have been demonstrated in detail with examples, it should be understood by a person skilled in the art that the above examples are only intended to be illustrative but not to limit the scope of the present invention.